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| import os | |
| import chromadb | |
| from chromadb.config import Settings | |
| # Engineering knowledge base regarding semiconductor wafer defects | |
| KNOWLEDGE_BASE = [ | |
| { | |
| "id": "defect_edge_ring", | |
| "title": "Edge-Ring Defect Troubleshooting", | |
| "content": "Edge-Ring defects typically appear as a continuous ring of failing dies around the outer edge of the wafer. Common Root Causes: 1. Uneven gas distribution in the etching chamber. 2. Non-uniform chuck temperature during deposition or etching. 3. Edge-bead removal issues during photolithography. Recommended Action: Inspect gas flow regulators and recalibrate chuck temperature sensors. Schedule maintenance for edge-bead removal module." | |
| }, | |
| { | |
| "id": "defect_center", | |
| "title": "Center Defect Troubleshooting", | |
| "content": "Center defects are concentrated in the middle of the wafer. Common Root Causes: 1. Poor spin-coating uniformity (photoresist pooling in the center). 2. Center-heavy deposition profile. 3. Excessive center heating on the electrostatic chuck. Recommended Action: Verify spin speed and acceleration in the coating track. Check gas showerhead for clogging in the center region." | |
| }, | |
| { | |
| "id": "defect_scratch", | |
| "title": "Scratch Defect Troubleshooting", | |
| "content": "Scratch defects manifest as linear patterns of failing dies, often crossing the wafer. Common Root Causes: 1. Mechanical handling damage by robotic arms or end-effectors. 2. Particulate contamination causing dragging during CMP (Chemical Mechanical Polishing). 3. Cassette or FOUP abrasion. Recommended Action: Check robot alignment and end-effector cleanliness. Inspect CMP pad conditioning and slurry filtration system." | |
| }, | |
| { | |
| "id": "defect_donut", | |
| "title": "Donut Defect Troubleshooting", | |
| "content": "Donut defects appear as a ring, but not at the very edge (like Edge-Ring), leaving the center and extreme edge relatively clean. Common Root Causes: 1. Radially dependent temperature non-uniformity during rapid thermal processing (RTP). 2. Specific gas flow dynamics creating standing waves or depletion zones in the chamber. Recommended Action: Recalibrate RTP lamp zones. Inspect gas showerhead and exhaust pumping symmetry." | |
| }, | |
| { | |
| "id": "general_forecast_strategy", | |
| "title": "Material Forecast & Yield Strategy", | |
| "content": "When the predicted material waste percentage rises above 5%, the factory must proactively increase raw material orders (wafers, photoresist, precursor gases) for the next quarter to compensate for the lower yield. High fail rates typically necessitate a temporary slow-down of production throughput to allow for deep tool maintenance and recalibration." | |
| } | |
| ] | |
| def ingest_data(): | |
| print("Initializing ChromaDB Persistent Client...") | |
| db_path = os.path.join(os.path.dirname(__file__), "chroma_db") | |
| client = chromadb.PersistentClient(path=db_path) | |
| # Create or get collection | |
| collection = client.get_or_create_collection( | |
| name="semiconductor_knowledge", | |
| metadata={"hnsw:space": "cosine"} | |
| ) | |
| # Clear existing data if any (for idempotency) | |
| existing_ids = collection.get()['ids'] | |
| if existing_ids: | |
| collection.delete(ids=existing_ids) | |
| # Prepare data for insertion | |
| ids = [item['id'] for item in KNOWLEDGE_BASE] | |
| documents = [item['content'] for item in KNOWLEDGE_BASE] | |
| metadatas = [{"title": item['title']} for item in KNOWLEDGE_BASE] | |
| print(f"Adding {len(documents)} documents to the knowledge base...") | |
| collection.add( | |
| documents=documents, | |
| metadatas=metadatas, | |
| ids=ids | |
| ) | |
| print("Ingestion complete. ChromaDB is ready.") | |
| if __name__ == "__main__": | |
| ingest_data() | |