Linear thermal expansion coefficient (at temperatures from 130 to 800 K) of borosilicate glasses applicable for coupling with silicon in microelectronics

Processing results of measurements of linear thermal expansion coefficients and linear thermal expansion of two brands of borosilicate glasses --- LK5 and Borofloat 33 --- are presented. The linear thermal expansion of glass samples have been determined in the temperature range 130 to 800 K (minus 143 to 526 °C) using thermomechanical analyzer TMA7100. Relative imprecision of indirectly measured linear thermal expansion coefficients and linear thermal expansion of both glass brands is less than pm5 % and pm3 % respectively. Polynomial equations, approximating temperature dependence of obtained measurements, are presented. The results will facilitate the modeling of the characteristics of the devices which are used in microsystems engineering and fabricated by anodic bonding of silicon to glass, they can also be used to optimize the temperature regime of silicon to glass bonding process. Keywords: linear expansion, thermal expansion coefficient, thermomechanical analysis, borosilicate glass.