diff --git "a/data/train.json" "b/data/train.json" new file mode 100644--- /dev/null +++ "b/data/train.json" @@ -0,0 +1,44568 @@ +[ + { + "bol_metadata": { + "bol_description": "H2 IND PLT - COP", + "origin_country": "FR", + "shipper": "air liquide singapore pte ltd" + }, + "boundary_note": "Heading 2804 turns on element identity and purity: hydrogen (2804.10), oxygen (2804.40), and silicon containing by weight not less than 99.99 % of silicon (2804.61).", + "candidate_set": { + "codes": [ + "280440", + "280461", + "280410", + "284430" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "2804_gas_purity" + ], + "frozen_id": "v2.0.train.0001", + "hs2_label": "28", + "hs4_label": "2804", + "hs6_label": "280410", + "id": "SH-0001", + "justification_text": "Hydrogen gas is elemental hydrogen and falls under heading 2804, subheading 2804.10. Classified under HS 2804.10.", + "reference_ruling_ids": [ + "EBTI-DE-DE18254/15-1", + "EBTI-SK-SK9769/2006-5219/56", + "EBTI-SK-SK9770/2006-5219/55" + ], + "segment": "material", + "split": "train", + "tier1_description": "Compressed industrial-grade hydrogen gas. Hydrogen is a colourless, odourless, highly flammable elemental gas used as a reducing and carrier gas in heat treatment, metallurgy, chemical synthesis, float-glass production and electronics manufacturing atmospheres", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Air Liquide", + "part_name": "H2 IND PLT - COP" + } + }, + { + "bol_metadata": { + "bol_description": "X HYDROGEN", + "origin_country": "FR", + "shipper": "air liquide singapore pte ltd" + }, + "boundary_note": "Heading 2804 turns on element identity and purity: hydrogen (2804.10), oxygen (2804.40), and silicon containing by weight not less than 99.99 % of silicon (2804.61).", + "candidate_set": { + "codes": [ + "280440", + "282619", + "280410", + "280461" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "2804_gas_purity" + ], + "frozen_id": "v2.0.train.0002", + "hs2_label": "28", + "hs4_label": "2804", + "hs6_label": "280410", + "id": "SH-0002", + "justification_text": "Hydrogen gas is elemental hydrogen and falls under heading 2804, subheading 2804.10. Classified under HS 2804.10.", + "reference_ruling_ids": [ + "EBTI-DE-DE18254/15-1", + "EBTI-SK-SK9769/2006-5219/56", + "EBTI-SK-SK9770/2006-5219/55" + ], + "segment": "material", + "split": "train", + "tier1_description": "Compressed hydrogen gas. Hydrogen is a colourless, odourless, highly flammable elemental gas; industrial hydrogen of this volume is typically used as a reducing gas for heat treatment and brazing, a carrier gas for laboratory instruments, and a process gas in electronics and chemical manufacturing", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Air Liquide", + "part_name": "X hydrogen" + } + }, + { + "bol_metadata": { + "bol_description": "99.999% Pure H2 Gas - (H2) 100% New", + "origin_country": "DE", + "shipper": "cty tnhh khi cong nghiep messer hai phong- cn yen binh thai nguyen" + }, + "boundary_note": "Heading 2804 turns on element identity and purity: hydrogen (2804.10), oxygen (2804.40), and silicon containing by weight not less than 99.99 % of silicon (2804.61).", + "candidate_set": { + "codes": [ + "280461", + "280410", + "280440", + "280530" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "2804_gas_purity" + ], + "frozen_id": "v2.0.train.0003", + "hs2_label": "28", + "hs4_label": "2804", + "hs6_label": "280410", + "id": "SH-0003", + "justification_text": "Hydrogen gas is elemental hydrogen and falls under heading 2804, subheading 2804.10. Classified under HS 2804.10.", + "reference_ruling_ids": [ + "EBTI-DE-DE18254/15-1", + "EBTI-SK-SK9769/2006-5219/56", + "EBTI-SK-SK9770/2006-5219/55" + ], + "segment": "material", + "split": "train", + "tier1_description": "High-purity hydrogen gas of 99.999 percent purity (grade 5.0). Hydrogen is a colourless, odourless, highly flammable elemental gas; at this purity it serves as a carrier gas for gas chromatography, a reducing atmosphere for semiconductor and metal processing, and a process gas in laboratory and electronics applications", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Messer", + "part_name": "99.999% Pure H2 Gas - (H2) 100% New" + } + }, + { + "bol_metadata": { + "bol_description": "HYDROGEN, COMPRESSED", + "origin_country": "GB", + "shipper": "linde gas singapore" + }, + "boundary_note": "Heading 2804 turns on element identity and purity: hydrogen (2804.10), oxygen (2804.40), and silicon containing by weight not less than 99.99 % of silicon (2804.61).", + "candidate_set": { + "codes": [ + "280461", + "280410", + "280440", + "285000" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "2804_gas_purity" + ], + "frozen_id": "v2.0.train.0004", + "hs2_label": "28", + "hs4_label": "2804", + "hs6_label": "280410", + "id": "SH-0004", + "justification_text": "Hydrogen gas is elemental hydrogen and falls under heading 2804, subheading 2804.10. Classified under HS 2804.10.", + "reference_ruling_ids": [ + "EBTI-DE-DE18254/15-1", + "EBTI-SK-SK9769/2006-5219/56", + "EBTI-SK-SK9770/2006-5219/55" + ], + "segment": "material", + "split": "train", + "tier1_description": "Compressed hydrogen gas. Hydrogen is a colourless, odourless, highly flammable elemental gas produced by steam reforming or electrolysis and supplied at filling pressures of typically 150 to 300 bar. Industrial hydrogen is used as a reducing gas in metals processing, a carrier gas for analytical instruments, and a process gas in chemicals and electronics", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Linde", + "part_name": "hydrogen compressed" + } + }, + { + "bol_metadata": { + "bol_description": "Oxygen gas, capacity: /tank (O2 > 99.5%) creates a clean vacuum environment for plasma rays to clean the product surface, 100% new", + "origin_country": "France", + "shipper": "cong ty tnhh air liquide viet nam" + }, + "boundary_note": "Heading 2804 turns on element identity and purity: hydrogen (2804.10), oxygen (2804.40), and silicon containing by weight not less than 99.99 % of silicon (2804.61).", + "candidate_set": { + "codes": [ + "280440", + "285000", + "280461", + "280410" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "2804_gas_purity" + ], + "frozen_id": "v2.0.train.0005", + "hs2_label": "28", + "hs4_label": "2804", + "hs6_label": "280440", + "id": "SH-0005", + "justification_text": "Pure oxygen gas or liquid oxygen is elemental oxygen under heading 2804, subheading 2804.40. Classified under HS 2804.40.", + "reference_ruling_ids": [ + "EBTI-CZ-CZBTI31/223029/2024-580000-04/01", + "EBTI-DE-DEK/952/04-1", + "EBTI-FR-FR-RTC-2015-005077", + "EBTI-SK-SKBTI338769/24/155" + ], + "segment": "material", + "split": "train", + "tier1_description": "Compressed oxygen gas of at least 99.5 percent purity. Oxygen is a colourless, odourless oxidising elemental gas; in electronics production it feeds plasma cleaning chambers, where an oxygen plasma generated under vacuum removes organic residues from component surfaces before bonding, and it is also widely used in combustion, metal cutting and chemical processes", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Air Liquide", + "part_name": "Oxygen gas capacity: /tank (O2 99.5%)" + } + }, + { + "bol_metadata": { + "bol_description": "Industrial liquid oxygen. 100% new", + "origin_country": "France", + "shipper": "cong ty tnhh air liquide viet nam" + }, + "boundary_note": "Heading 2804 turns on element identity and purity: hydrogen (2804.10), oxygen (2804.40), and silicon containing by weight not less than 99.99 % of silicon (2804.61).", + "candidate_set": { + "codes": [ + "280440", + "282612", + "280410", + "280461" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "2804_gas_purity" + ], + "frozen_id": "v2.0.train.0006", + "hs2_label": "28", + "hs4_label": "2804", + "hs6_label": "280440", + "id": "SH-0006", + "justification_text": "Pure oxygen gas or liquid oxygen is elemental oxygen under heading 2804, subheading 2804.40. Classified under HS 2804.40.", + "reference_ruling_ids": [ + "EBTI-CZ-CZBTI31/223029/2024-580000-04/01", + "EBTI-DE-DEK/952/04-1", + "EBTI-FR-FR-RTC-2015-005077", + "EBTI-SK-SKBTI338769/24/155" + ], + "segment": "material", + "split": "train", + "tier1_description": "Industrial-grade oxygen in refrigerated liquid form, transported at about minus 183 degrees Celsius. Liquid oxygen of roughly 99.5 percent purity is vaporised at the point of use to supply oxidising gas for steelmaking, metal cutting and welding, glass production, water treatment and chemical oxidation, providing a compact supply mode for high-volume users", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Air Liquide", + "part_name": "Industrial liquid oxygen. 100% new" + } + }, + { + "bol_metadata": { + "bol_description": "X OXYGEN UHP", + "origin_country": "FR", + "shipper": "air liquide singapore pte ltd" + }, + "boundary_note": "Heading 2804 turns on element identity and purity: hydrogen (2804.10), oxygen (2804.40), and silicon containing by weight not less than 99.99 % of silicon (2804.61).", + "candidate_set": { + "codes": [ + "280410", + "280461", + "284430", + "280440" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "2804_gas_purity" + ], + "frozen_id": "v2.0.train.0007", + "hs2_label": "28", + "hs4_label": "2804", + "hs6_label": "280440", + "id": "SH-0007", + "justification_text": "Pure oxygen gas or liquid oxygen is elemental oxygen under heading 2804, subheading 2804.40. Classified under HS 2804.40.", + "reference_ruling_ids": [ + "EBTI-CZ-CZBTI31/223029/2024-580000-04/01", + "EBTI-DE-DEK/952/04-1", + "EBTI-FR-FR-RTC-2015-005077", + "EBTI-SK-SKBTI338769/24/155" + ], + "segment": "material", + "split": "train", + "tier1_description": "Ultra-high-purity compressed oxygen gas, equivalent to a filled to about 200 bar. The oxygen is purified to laboratory grade with parts-per-million impurity limits and is used as an oxidant and process gas in analytical instruments, semiconductor processing and other applications requiring contamination-free oxidising atmospheres", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Air Liquide", + "part_name": "X oxygen UHP" + } + }, + { + "bol_metadata": { + "bol_description": "BULK LIQUID OXYGEN", + "origin_country": "US", + "shipper": "air product singapore industrial" + }, + "boundary_note": "Heading 2804 turns on element identity and purity: hydrogen (2804.10), oxygen (2804.40), and silicon containing by weight not less than 99.99 % of silicon (2804.61).", + "candidate_set": { + "codes": [ + "280440", + "282619", + "280461", + "280410" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "2804_gas_purity" + ], + "frozen_id": "v2.0.train.0008", + "hs2_label": "28", + "hs4_label": "2804", + "hs6_label": "280440", + "id": "SH-0008", + "justification_text": "Pure oxygen gas or liquid oxygen is elemental oxygen under heading 2804, subheading 2804.40. Classified under HS 2804.40.", + "reference_ruling_ids": [ + "EBTI-CZ-CZBTI31/223029/2024-580000-04/01", + "EBTI-DE-DEK/952/04-1", + "EBTI-SK-SKBTI338769/24/155", + "EBTI-FR-FR-RTC-2015-005077" + ], + "segment": "material", + "split": "train", + "tier1_description": "Bulk liquid oxygen, a cryogenic liquefied gas produced by air separation and transported in insulated tanker quantities. The liquid is stored at approximately minus 183 degrees Celsius and vaporised on site to supply gaseous oxygen for steelmaking, glass production, chemical oxidation, wastewater treatment and combustion-enhancement processes that require large continuous volumes of oxygen", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Air Products", + "part_name": "bulk liquid oxygen" + } + }, + { + "bol_metadata": { + "bol_description": "PR OXYGEN ULTRA PURE - X50S 200B", + "origin_country": "US", + "shipper": "air products singapore industrial" + }, + "boundary_note": "Heading 2804 turns on element identity and purity: hydrogen (2804.10), oxygen (2804.40), and silicon containing by weight not less than 99.99 % of silicon (2804.61).", + "candidate_set": { + "codes": [ + "280410", + "282619", + "280440", + "280461" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "2804_gas_purity" + ], + "frozen_id": "v2.0.train.0009", + "hs2_label": "28", + "hs4_label": "2804", + "hs6_label": "280440", + "id": "SH-0009", + "justification_text": "Pure oxygen gas or liquid oxygen is elemental oxygen under heading 2804, subheading 2804.40. Classified under HS 2804.40.", + "reference_ruling_ids": [ + "EBTI-CZ-CZBTI31/223029/2024-580000-04/01", + "EBTI-DE-DEK/952/04-1", + "EBTI-FR-FR-RTC-2015-005077", + "EBTI-SK-SKBTI338769/24/155" + ], + "segment": "material", + "split": "train", + "tier1_description": "Ultra-pure compressed oxygen gas of 99.9995 percent or higher purity, to 200 bar, holding roughly of gas. Trace moisture, hydrocarbon and other impurities are held to low parts-per-million or parts-per-billion levels for use in gas chromatography, analytical instrumentation and semiconductor and optical-fibre manufacturing", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Air Products", + "part_name": "PR oxygen ultra pure - X50S 200B" + } + }, + { + "bol_metadata": { + "bol_description": "Liquid Oxygen 99.6%, used for Laser cutting machines, contained in capacity tank. 100% new product", + "origin_country": "JP", + "shipper": "iwatani vietnam company limited" + }, + "boundary_note": "Heading 2804 turns on element identity and purity: hydrogen (2804.10), oxygen (2804.40), and silicon containing by weight not less than 99.99 % of silicon (2804.61).", + "candidate_set": { + "codes": [ + "282619", + "280410", + "280461", + "280440" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "2804_gas_purity" + ], + "frozen_id": "v2.0.train.0010", + "hs2_label": "28", + "hs4_label": "2804", + "hs6_label": "280440", + "id": "SH-0010", + "justification_text": "Pure oxygen gas or liquid oxygen is elemental oxygen under heading 2804, subheading 2804.40. Classified under HS 2804.40.", + "reference_ruling_ids": [ + "EBTI-CZ-CZBTI31/223029/2024-580000-04/01", + "EBTI-DE-DEK/952/04-1", + "EBTI-SK-SKBTI338769/24/155", + "EBTI-FR-FR-RTC-2015-005077" + ], + "segment": "material", + "split": "train", + "tier1_description": "Liquid oxygen of 99.6 percent purity, a cryogenic liquefied gas delivered in a vacuum-insulated portable tank. After vaporisation it supplies high-pressure gaseous oxygen used as an assist gas for laser cutting machines, where the oxygen reacts exothermically with the workpiece metal to increase cutting speed in mild and carbon steel", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Iwatani", + "part_name": "Liquid Oxygen 99.6% used for Laser" + } + }, + { + "bol_metadata": { + "bol_description": "99.999% pure liquid oxygen (O2). 100% new product", + "origin_country": "DE", + "shipper": "cong ty tnhh khi cong nghiep messer hai phong- cn yen binh thai nguyen" + }, + "boundary_note": "Heading 2804 turns on element identity and purity: hydrogen (2804.10), oxygen (2804.40), and silicon containing by weight not less than 99.99 % of silicon (2804.61).", + "candidate_set": { + "codes": [ + "280410", + "280461", + "280440", + "282612" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "2804_gas_purity" + ], + "frozen_id": "v2.0.train.0011", + "hs2_label": "28", + "hs4_label": "2804", + "hs6_label": "280440", + "id": "SH-0011", + "justification_text": "Pure oxygen gas or liquid oxygen is elemental oxygen under heading 2804, subheading 2804.40. Classified under HS 2804.40.", + "reference_ruling_ids": [ + "EBTI-CZ-CZBTI31/223029/2024-580000-04/01", + "EBTI-DE-DEK/952/04-1", + "EBTI-SK-SKBTI338769/24/155", + "EBTI-FR-FR-RTC-2015-005077" + ], + "segment": "material", + "split": "train", + "tier1_description": "Liquid oxygen of 99.999 percent purity, a cryogenic liquefied gas produced by air separation and. Impurities such as moisture, hydrocarbons, carbon dioxide, nitrogen and argon are limited to a few parts per million, making the product suitable for electronics manufacturing, laboratory work and other high-purity oxidising applications", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Messer", + "part_name": "99.999% pure liquid oxygen (O2). 100%" + } + }, + { + "bol_metadata": { + "bol_description": "Oxygen gas (industrial cluster", + "origin_country": "DE", + "shipper": "cong ty tnhh khi cong nghiep messer viet nam" + }, + "boundary_note": "Heading 2804 turns on element identity and purity: hydrogen (2804.10), oxygen (2804.40), and silicon containing by weight not less than 99.99 % of silicon (2804.61).", + "candidate_set": { + "codes": [ + "280461", + "280410", + "280440", + "285000" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "2804_gas_purity" + ], + "frozen_id": "v2.0.train.0012", + "hs2_label": "28", + "hs4_label": "2804", + "hs6_label": "280440", + "id": "SH-0012", + "justification_text": "Pure oxygen gas or liquid oxygen is elemental oxygen under heading 2804, subheading 2804.40. Classified under HS 2804.40.", + "reference_ruling_ids": [ + "EBTI-CZ-CZBTI31/223029/2024-580000-04/01", + "EBTI-DE-DEK/952/04-1", + "EBTI-FR-FR-RTC-2015-005077", + "EBTI-SK-SKBTI338769/24/155" + ], + "segment": "material", + "split": "train", + "tier1_description": "Compressed industrial oxygen gas. The bundled are connected to a common outlet for high-volume withdrawal and supply oxygen for metal cutting, welding, combustion enhancement and other industrial processes requiring sustained gaseous oxygen flow", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Messer", + "part_name": "Oxygen gas (industrial cluster" + } + }, + { + "bol_metadata": { + "bol_description": "Liquid oxygen (O2) gas 99.999% (cas code 7782-44-7), used in the production of solar panels. 100% new", + "origin_country": "DE", + "shipper": "cong ty tnhh khi cong nghiep messer hai phong- cn yen binh thai nguyen" + }, + "boundary_note": "Heading 2804 turns on element identity and purity: hydrogen (2804.10), oxygen (2804.40), and silicon containing by weight not less than 99.99 % of silicon (2804.61).", + "candidate_set": { + "codes": [ + "280440", + "285000", + "280410", + "280461" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "2804_gas_purity" + ], + "frozen_id": "v2.0.train.0013", + "hs2_label": "28", + "hs4_label": "2804", + "hs6_label": "280440", + "id": "SH-0013", + "justification_text": "Pure oxygen gas or liquid oxygen is elemental oxygen under heading 2804, subheading 2804.40. Classified under HS 2804.40.", + "reference_ruling_ids": [ + "EBTI-CZ-CZBTI31/223029/2024-580000-04/01", + "EBTI-DE-DEK/952/04-1", + "EBTI-SK-SKBTI338769/24/155", + "EBTI-FR-FR-RTC-2015-005077" + ], + "segment": "material", + "split": "train", + "tier1_description": "Liquid oxygen of 99.999 percent purity (CAS 7782-44-7), a cryogenic liquefied gas. The high-purity product with parts-per-million impurity limits, is vaporised for use as a process and oxidation gas in the manufacture of solar panels and other electronics, where contaminant-free oxidising atmospheres are required for thermal oxidation steps", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Messer", + "part_name": "Liquid oxygen (O2) gas 99.999% (cas" + } + }, + { + "bol_metadata": { + "bol_description": "Oxygen Gas 5.0 (O2 >= 99.999%), capacity /1UNA. 100% new", + "origin_country": "DE", + "shipper": "cong ty tnhh khi cong nghiep messer hai phong-cn yen binh thai nguyen" + }, + "boundary_note": "Heading 2804 turns on element identity and purity: hydrogen (2804.10), oxygen (2804.40), and silicon containing by weight not less than 99.99 % of silicon (2804.61).", + "candidate_set": { + "codes": [ + "285000", + "280410", + "280440", + "280461" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "2804_gas_purity" + ], + "frozen_id": "v2.0.train.0014", + "hs2_label": "28", + "hs4_label": "2804", + "hs6_label": "280440", + "id": "SH-0014", + "justification_text": "Pure oxygen gas or liquid oxygen is elemental oxygen under heading 2804, subheading 2804.40. Classified under HS 2804.40.", + "reference_ruling_ids": [ + "EBTI-CZ-CZBTI31/223029/2024-580000-04/01", + "EBTI-DE-DEK/952/04-1", + "EBTI-FR-FR-RTC-2015-005077", + "EBTI-SK-SKBTI338769/24/155" + ], + "segment": "material", + "split": "train", + "tier1_description": "Compressed oxygen gas of grade 5.0 quality, containing at least 99.999 percent oxygen. Impurities including moisture, hydrocarbons and carbon dioxide are restricted to parts-per-million levels, suiting the gas for laboratory analysis, instrument calibration, electronics processing and other applications requiring a high-purity oxidant gas", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Messer", + "part_name": "Oxygen Gas 5.0 (O2 = 99.999%) capacity" + } + }, + { + "bol_metadata": { + "bol_description": "OXYGEN99.9995% COMPRESSED, [5.1] [2 ]", + "origin_country": "Germany/Ireland", + "shipper": "linde gas singapore pte ltd" + }, + "boundary_note": "Heading 2804 turns on element identity and purity: hydrogen (2804.10), oxygen (2804.40), and silicon containing by weight not less than 99.99 % of silicon (2804.61).", + "candidate_set": { + "codes": [ + "280440", + "280410", + "280461", + "282619" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "2804_gas_purity" + ], + "frozen_id": "v2.0.train.0015", + "hs2_label": "28", + "hs4_label": "2804", + "hs6_label": "280440", + "id": "SH-0015", + "justification_text": "Pure oxygen gas or liquid oxygen is elemental oxygen under heading 2804, subheading 2804.40. Classified under HS 2804.40.", + "reference_ruling_ids": [ + "EBTI-CZ-CZBTI31/223029/2024-580000-04/01", + "EBTI-DE-DEK/952/04-1", + "EBTI-FR-FR-RTC-2015-005077", + "EBTI-SK-SKBTI338769/24/155" + ], + "segment": "material", + "split": "train", + "tier1_description": "Compressed oxygen gas of 99.9995 percent purity, transport class 2.2 with oxidiser subsidiary risk 5.1. This electronic-grade oxygen with very low moisture and hydrocarbon impurity levels, serves semiconductor fabrication, optical-fibre production and analytical laboratory applications", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Linde", + "part_name": "OXYGEN99.9995% compressed [5.1] [2 ]" + } + }, + { + "bol_metadata": { + "bol_description": "Oxygen Gas 5.0, 99.999% (O2) (used in semiconductor manufacturing). 100% new product", + "origin_country": "DE", + "shipper": "messer hai phong industrial gases co., ltd" + }, + "boundary_note": "Heading 2804 turns on element identity and purity: hydrogen (2804.10), oxygen (2804.40), and silicon containing by weight not less than 99.99 % of silicon (2804.61).", + "candidate_set": { + "codes": [ + "280461", + "280440", + "280410", + "282619" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "2804_gas_purity" + ], + "frozen_id": "v2.0.train.0016", + "hs2_label": "28", + "hs4_label": "2804", + "hs6_label": "280440", + "id": "SH-0016", + "justification_text": "Pure oxygen gas or liquid oxygen is elemental oxygen under heading 2804, subheading 2804.40. Classified under HS 2804.40.", + "reference_ruling_ids": [ + "EBTI-CZ-CZBTI31/223029/2024-580000-04/01", + "EBTI-DE-DEK/952/04-1", + "EBTI-FR-FR-RTC-2015-005077", + "EBTI-SK-SKBTI338769/24/155" + ], + "segment": "material", + "split": "train", + "tier1_description": "Compressed oxygen gas of grade 5.0, purity 99.999 percent. This ultra-high-purity oxidant is used in semiconductor fabrication processes such as thermal oxidation of silicon wafers, chemical vapour deposition and chamber treatment, where trace impurities including moisture and hydrocarbons must be held to parts-per-million levels", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Messer", + "part_name": "Oxygen Gas 5.0 99.999% (O2) (used in" + } + }, + { + "bol_metadata": { + "bol_description": "Industrial Oxygen Gas 99.5% - (O2). 100% New Product", + "origin_country": "DE", + "shipper": "messer hai phong industrial gases co, ltd" + }, + "boundary_note": "Heading 2804 turns on element identity and purity: hydrogen (2804.10), oxygen (2804.40), and silicon containing by weight not less than 99.99 % of silicon (2804.61).", + "candidate_set": { + "codes": [ + "280440", + "280410", + "284430", + "280461" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "2804_gas_purity" + ], + "frozen_id": "v2.0.train.0017", + "hs2_label": "28", + "hs4_label": "2804", + "hs6_label": "280440", + "id": "SH-0017", + "justification_text": "Pure oxygen gas or liquid oxygen is elemental oxygen under heading 2804, subheading 2804.40. Classified under HS 2804.40.", + "reference_ruling_ids": [ + "EBTI-CZ-CZBTI31/223029/2024-580000-04/01", + "EBTI-DE-DEK/952/04-1", + "EBTI-FR-FR-RTC-2015-005077", + "EBTI-SK-SKBTI338769/24/155" + ], + "segment": "material", + "split": "train", + "tier1_description": "Compressed industrial-grade oxygen gas with a purity of 99.5 percent. Oxygen is a colourless, odourless oxidising gas produced by cryogenic air separation; at this grade it serves general industrial duties such as oxy-fuel cutting and welding, combustion enrichment and plant utility supply at manufacturing sites", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Messer", + "part_name": "Industrial Oxygen Gas 99.5% - (O2)" + } + }, + { + "bol_metadata": { + "bol_description": "Oxygen Gas (Gas Oxygen-GO2), purity 99.9995%, /. 100% new", + "origin_country": "JP", + "shipper": "cong ty co phan nippon sanso viet nam - chi nhanh ha noi" + }, + "boundary_note": "Heading 2804 turns on element identity and purity: hydrogen (2804.10), oxygen (2804.40), and silicon containing by weight not less than 99.99 % of silicon (2804.61).", + "candidate_set": { + "codes": [ + "280461", + "280530", + "280410", + "280440" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "2804_gas_purity" + ], + "frozen_id": "v2.0.train.0018", + "hs2_label": "28", + "hs4_label": "2804", + "hs6_label": "280440", + "id": "SH-0018", + "justification_text": "Pure oxygen gas or liquid oxygen is elemental oxygen under heading 2804, subheading 2804.40. Classified under HS 2804.40.", + "reference_ruling_ids": [ + "EBTI-CZ-CZBTI31/223029/2024-580000-04/01", + "EBTI-DE-DEK/952/04-1", + "EBTI-FR-FR-RTC-2015-005077", + "EBTI-SK-SKBTI338769/24/155" + ], + "segment": "material", + "split": "train", + "tier1_description": "Compressed oxygen gas of 99.9995 percent purity (grade 5.5). At this ultra-high-purity level the gas is intended for electronics and semiconductor processing, including thermal oxidation and deposition steps, as well as demanding laboratory and instrumentation uses where sub-ppm impurity control is required", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Nippon Sanso", + "part_name": "Oxygen Gas (Gas Oxygen-GO2) purity" + } + }, + { + "bol_metadata": { + "bol_description": "Oxygen Gas (Gas Oxygen -GO2) 99.6%, /, 100% new", + "origin_country": "JP", + "shipper": "cong ty co phan nippon sanso viet nam- chi nhanh ha noi" + }, + "boundary_note": "Heading 2804 turns on element identity and purity: hydrogen (2804.10), oxygen (2804.40), and silicon containing by weight not less than 99.99 % of silicon (2804.61).", + "candidate_set": { + "codes": [ + "280461", + "280440", + "282612", + "280410" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "2804_gas_purity" + ], + "frozen_id": "v2.0.train.0019", + "hs2_label": "28", + "hs4_label": "2804", + "hs6_label": "280440", + "id": "SH-0019", + "justification_text": "Pure oxygen gas or liquid oxygen is elemental oxygen under heading 2804, subheading 2804.40. Classified under HS 2804.40.", + "reference_ruling_ids": [ + "EBTI-CZ-CZBTI31/223029/2024-580000-04/01", + "EBTI-DE-DEK/952/04-1", + "EBTI-FR-FR-RTC-2015-005077", + "EBTI-SK-SKBTI338769/24/155" + ], + "segment": "material", + "split": "train", + "tier1_description": "Compressed oxygen gas with a purity of 99.6 percent. This standard industrial grade of oxygen, produced by cryogenic separation of air, is used for oxy-fuel cutting and welding, combustion support and general process duties in manufacturing plants, and as a utility gas in factory operations", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Nippon Sanso", + "part_name": "Oxygen Gas (Gas Oxygen -GO2) 99.6%" + } + }, + { + "bol_metadata": { + "bol_description": "Silicon for solar panel production (content > 99.99% by weight, CAS code: 7440-21-3), type PV SGBL, 100% new", + "origin_country": "USA", + "shipper": "hemlock semiconductor operations llc" + }, + "boundary_note": "Heading 2804 turns on element identity and purity: hydrogen (2804.10), oxygen (2804.40), and silicon containing by weight not less than 99.99 % of silicon (2804.61). Doped vs undoped material: chemical elements doped for use in electronics (3818.00) vs high-purity elemental silicon (2804.61) vs nitrides and silicides such as GaN (2850.00); doping and intended electronic use decide.", + "candidate_set": { + "codes": [ + "280410", + "285000", + "280461", + "280440" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "2804_gas_purity", + "doped_vs_undoped" + ], + "frozen_id": "v2.0.train.0020", + "hs2_label": "28", + "hs4_label": "2804", + "hs6_label": "280461", + "id": "SH-0020", + "justification_text": "High-purity silicon containing at least 99.99% silicon by weight is classified under 2804.61. Classified under HS 2804.61.", + "reference_ruling_ids": [ + "CROSS-A88881", + "CROSS-N013411", + "CROSS-N306470", + "EBTI-EN-IEBTIIENEN004-2025-BTI263", + "EBTI-DE-DE12785/16-1", + "EBTI-EN-0114" + ], + "segment": "material", + "split": "train", + "tier1_description": "Solar-grade polycrystalline silicon for photovoltaic manufacturing, containing more than 99.99 percent silicon by weight (CAS 7440-21-3), supplied new as chunk material designated for ingot growth. Produced by the chemical vapor deposition (Siemens) process, it is melted to grow monocrystalline or multicrystalline silicon that is subsequently sliced into wafers for solar cells", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Hemlock Semiconductor", + "part_name": "Silicon for solar panel production" + } + }, + { + "bol_metadata": { + "bol_description": "HIGH-PURITY SILICON HTS", + "origin_country": "USA/Germany", + "shipper": "materion advanced materials germany" + }, + "boundary_note": "Heading 2804 turns on element identity and purity: hydrogen (2804.10), oxygen (2804.40), and silicon containing by weight not less than 99.99 % of silicon (2804.61).", + "candidate_set": { + "codes": [ + "280440", + "280410", + "282612", + "280461" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "2804_gas_purity" + ], + "frozen_id": "v2.0.train.0021", + "hs2_label": "28", + "hs4_label": "2804", + "hs6_label": "280461", + "id": "SH-0021", + "justification_text": "High-purity silicon containing at least 99.99% silicon by weight is classified under 2804.61. Classified under HS 2804.61.", + "reference_ruling_ids": [ + "EBTI-EN-IEBTIIENEN004-2025-BTI263", + "CROSS-N306470", + "CROSS-A88881", + "CROSS-N013411", + "EBTI-DE-DE12785/16-1", + "EBTI-EN-0114" + ], + "segment": "material", + "split": "train", + "tier1_description": "High-purity elemental silicon supplied as pieces, slugs, or granules for physical vapor deposition and other electronic materials applications. Deposition-grade silicon of this kind is typically 99.999 percent pure or better with low gas and metallic impurity levels, and is used as an evaporation or sputtering source material to form silicon-bearing thin films in semiconductor, optical coating, and display manufacturing", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Materion", + "part_name": "high-purity silicon HTS" + } + }, + { + "bol_metadata": { + "bol_description": "Polysilicon(Polycrystalline silicon in lump form),(CAS no.7440-21-3),Si content not less than 99. % by weight, /,size 20-120mm,used in the production of single crystal silicon and semiconductor wafers", + "origin_country": "CN", + "shipper": "ningxia runergy silicon material technology co.,ltd" + }, + "boundary_note": "Heading 2804 turns on element identity and purity: hydrogen (2804.10), oxygen (2804.40), and silicon containing by weight not less than 99.99 % of silicon (2804.61).", + "candidate_set": { + "codes": [ + "282619", + "280410", + "280440", + "280461" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "2804_gas_purity" + ], + "frozen_id": "v2.0.train.0022", + "hs2_label": "28", + "hs4_label": "2804", + "hs6_label": "280461", + "id": "SH-0022", + "justification_text": "High-purity silicon containing at least 99.99% silicon by weight is classified under 2804.61. Classified under HS 2804.61.", + "reference_ruling_ids": [ + "CROSS-N013411", + "CROSS-A88881", + "EBTI-EN-IEBTIIENEN004-2025-BTI263", + "CROSS-N306470", + "EBTI-DE-DE12785/16-1", + "EBTI-EN-0114" + ], + "segment": "material", + "split": "train", + "tier1_description": "Polycrystalline silicon in lump form (CAS 7440-21-3) with silicon content of at least 99.99999 percent by weight with lump sizes of 20 to 120 mm. The chunks are produced by chemical vapor deposition and used as melt feedstock for growing single-crystal silicon ingots that are processed into semiconductor and photovoltaic wafers", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Runergy", + "part_name": "Polysilicon(Polycrystalline silicon in" + } + }, + { + "bol_metadata": { + "bol_description": "POLY CRYSTALLINE SILICON", + "origin_country": "KR", + "shipper": "oci company ltd" + }, + "boundary_note": "Heading 2804 turns on element identity and purity: hydrogen (2804.10), oxygen (2804.40), and silicon containing by weight not less than 99.99 % of silicon (2804.61). Doped vs undoped material: chemical elements doped for use in electronics (3818.00) vs high-purity elemental silicon (2804.61) vs nitrides and silicides such as GaN (2850.00); doping and intended electronic use decide.", + "candidate_set": { + "codes": [ + "280461", + "280410", + "280530", + "280440" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "2804_gas_purity", + "doped_vs_undoped" + ], + "frozen_id": "v2.0.train.0023", + "hs2_label": "28", + "hs4_label": "2804", + "hs6_label": "280461", + "id": "SH-0023", + "justification_text": "High-purity silicon containing at least 99.99% silicon by weight is classified under 2804.61. Classified under HS 2804.61.", + "reference_ruling_ids": [ + "EBTI-DE-DE12785/16-1", + "CROSS-A88881", + "CROSS-N013411", + "CROSS-N306470", + "EBTI-EN-IEBTIIENEN004-2025-BTI263", + "EBTI-EN-0114" + ], + "segment": "material", + "split": "train", + "tier1_description": "Polycrystalline silicon produced by the trichlorosilane chemical vapor deposition process, supplied as high-purity chunks or rod sections. Grades in this product line reach 99.99999999 percent purity for solar applications and higher for semiconductor use. The material serves as feedstock for pulling monocrystalline ingots and casting multicrystalline blocks that are sliced into photovoltaic and semiconductor wafers", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "OCI", + "part_name": "poly crystalline silicon" + } + }, + { + "bol_metadata": { + "bol_description": "Polysilicon(Polycrystalline silicon in lump form),(CAS:7440-21-3),Si content not less than 99.9999% by weight,size 10-50mm,used to produce single crystal Si, Semiconductor Disc,exported from account", + "origin_country": "CN", + "shipper": "runergy pv technology company limited" + }, + "boundary_note": "Heading 2804 turns on element identity and purity: hydrogen (2804.10), oxygen (2804.40), and silicon containing by weight not less than 99.99 % of silicon (2804.61).", + "candidate_set": { + "codes": [ + "280410", + "280440", + "280461", + "282612" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "2804_gas_purity" + ], + "frozen_id": "v2.0.train.0024", + "hs2_label": "28", + "hs4_label": "2804", + "hs6_label": "280461", + "id": "SH-0024", + "justification_text": "High-purity silicon containing at least 99.99% silicon by weight is classified under 2804.61. Classified under HS 2804.61.", + "reference_ruling_ids": [ + "CROSS-N013411", + "CROSS-A88881", + "EBTI-EN-IEBTIIENEN004-2025-BTI263", + "CROSS-N306470", + "EBTI-DE-DE12785/16-1", + "EBTI-EN-0114" + ], + "segment": "material", + "split": "train", + "tier1_description": "Polycrystalline silicon in lump form (CAS 7440-21-3) with silicon content of at least 99.9999 percent by weight and lump sizes of 10 to 50 mm. The high-purity chunks are used as melt feedstock to produce single-crystal silicon ingots and semiconductor discs (wafers), and as charge material in photovoltaic ingot production", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Runergy", + "part_name": "Polysilicon(Polycrystalline silicon in" + } + }, + { + "bol_metadata": { + "bol_description": "PIECE OF SCANDIUM SPUTTERING TARGET PART/N.SC5N0 PURITY:99.999% (5N)LOT.SC5N0241012-TARGET FOR RESEARCH PURPOSEPIEC", + "origin_country": "US", + "shipper": "american gmg inc" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "285000", + "280530", + "280410", + "282612" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0025", + "hs2_label": "28", + "hs4_label": "2805", + "hs6_label": "280530", + "id": "SH-0025", + "justification_text": "Rare-earth metals, scandium and yttrium, including target or metal forms, fall under 2805.30. Classified under HS 2805.30.", + "reference_ruling_ids": [ + "CROSS-A81512", + "CROSS-B82541", + "CROSS-B82857", + "CROSS-D88314", + "CROSS-801877", + "CROSS-892107", + "CROSS-852899" + ], + "segment": "material", + "split": "train", + "tier1_description": "Scandium metal sputtering target, a machined disc or piece of 99.999 percent (5N) pure scandium intended for physical vapor deposition in research applications. The target is eroded by ion bombardment in a sputtering system to deposit scandium-bearing thin films, for example aluminum-scandium-nitride piezoelectric layers, optical coatings, and experimental electronic device structures", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "American GMG", + "part_name": "piece of scandium sputtering target" + } + }, + { + "bol_metadata": { + "bol_description": "Rare earth metal ND (Neodymium Metal) (High grade). New 100%", + "origin_country": "CN", + "shipper": "china northern rare earth group high-tech co.,ltd" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "284430", + "280530", + "285000", + "280440" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0026", + "hs2_label": "28", + "hs4_label": "2805", + "hs6_label": "280530", + "id": "SH-0026", + "justification_text": "Rare-earth metals, scandium and yttrium, including target or metal forms, fall under 2805.30. Classified under HS 2805.30.", + "reference_ruling_ids": [ + "CROSS-A81512", + "CROSS-892107", + "CROSS-B82541", + "CROSS-B82857", + "CROSS-D88314", + "CROSS-801877", + "CROSS-852899" + ], + "segment": "material", + "split": "train", + "tier1_description": "Neodymium metal of grade, a soft, silvery light - element normally supplied as cast ingots, blocks, or pieces of about 99 percent purity or better, packed under inert protection because it oxidizes in air. Its principal use is as the key constituent of neodymium-iron-boron permanent magnet alloys; it also serves in laser crystals and as an alloying additive", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "China Northern Rare Earth Group", + "part_name": "metal ND (Neodymium Metal) (High" + } + }, + { + "bol_metadata": { + "bol_description": "CERIUM METAL", + "origin_country": "CN", + "shipper": "leshan shenghe rare co., ltd" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "280530", + "284430", + "282619", + "280461" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0027", + "hs2_label": "28", + "hs4_label": "2805", + "hs6_label": "280530", + "id": "SH-0027", + "justification_text": "Rare-earth metals, scandium and yttrium, including target or metal forms, fall under 2805.30. Classified under HS 2805.30.", + "reference_ruling_ids": [ + "CROSS-B82541", + "CROSS-B82857", + "CROSS-D88314", + "CROSS-801877", + "CROSS-892107", + "CROSS-852899", + "CROSS-A81512" + ], + "segment": "material", + "split": "train", + "tier1_description": "Cerium metal, a ductile, silvery-grey -earth element typically supplied as cast ingots, lumps, or pieces of roughly 99 percent purity, stored under oil or inert gas because it tarnishes and can ignite when abraded. It is used in misch-metal and lighter-flint alloys, as an alloying additive in steel and aluminum, in getters, and as a metallurgical reductant", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Shenghe Resources", + "part_name": "cerium metal" + } + }, + { + "bol_metadata": { + "bol_description": "NEODYMIUM METAL", + "origin_country": "GB", + "shipper": "less common metals ltd" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "285000", + "280440", + "282619", + "280530" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0028", + "hs2_label": "28", + "hs4_label": "2805", + "hs6_label": "280530", + "id": "SH-0028", + "justification_text": "Rare-earth metals, scandium and yttrium, including target or metal forms, fall under 2805.30. Classified under HS 2805.30.", + "reference_ruling_ids": [ + "CROSS-892107", + "CROSS-A81512", + "CROSS-B82541", + "CROSS-B82857", + "CROSS-D88314", + "CROSS-801877", + "CROSS-852899" + ], + "segment": "material", + "split": "train", + "tier1_description": "Neodymium metal, a soft silvery rare-earth element supplied in bulk unwrought form such as ingots or pieces, typically 99% minimum purity. It oxidizes readily in air and is stored under protective packaging. The metal serves as a primary feedstock for neodymium-iron-boron permanent magnet alloys and as an alloying addition in specialty alloys for motors, generators and electronic devices", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Less Common Metals", + "part_name": "neodymium metal" + } + }, + { + "bol_metadata": { + "bol_description": "POTASSIUM ALUMINIUM FLUORIDE (PAF OR POTASSIUM FLUOROALUMINATE", + "origin_country": "CN", + "shipper": "hainan fortune-rock new material technology co ltd" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "280410", + "282619", + "282612", + "285000" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0029", + "hs2_label": "28", + "hs4_label": "2826", + "hs6_label": "282612", + "id": "SH-0029", + "justification_text": "Potassium aluminium fluoride is a fluoroaluminate-type salt under other fluorides/fluoroaluminates of 2826.90, not aluminium fluoride of 2826.12. Classified under HS 2826.12.", + "reference_ruling_ids": [ + "CROSS-C80688" + ], + "segment": "material", + "split": "train", + "tier1_description": "Potassium aluminium fluoride (potassium fluoroaluminate, KAlF4), a white to grey-white crystalline inorganic salt supplied as powder in various mesh sizes with a melting range of roughly 557-580 degrees Celsius. It is used as a flux for brazing aluminium and removing magnesium from aluminium melts, and as an active filler that improves cutting performance in resin-bonded abrasive products", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Hainan Fortune-Rock New Material", + "part_name": "potassium aluminium fluoride (PAF or" + } + }, + { + "bol_metadata": { + "bol_description": "CALCIUM FLUORIDE, 99%, ANHYDROUS, PURE", + "origin_country": "BE", + "shipper": "acros organics bvba" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "280461", + "282612", + "284430", + "282619" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0030", + "hs2_label": "28", + "hs4_label": "2826", + "hs6_label": "282619", + "id": "SH-0030", + "justification_text": "Fluoride salts not separately named as ammonium, sodium or aluminium fluorides fall in other fluorides under 2826.19. Classified under HS 2826.19.", + "reference_ruling_ids": [ + "CROSS-G81625", + "CROSS-K89465", + "CROSS-N006288", + "CROSS-N306449", + "CROSS-R03023" + ], + "segment": "material", + "split": "train", + "tier1_description": "Anhydrous calcium fluoride of 99 percent purity, a laboratory reagent. The compound is practically insoluble in water, melts near 1,418 degrees C, and is used in optical component manufacture, metallurgical fluxes, glass and enamel formulations, and as a fluorine source in laboratory synthesis", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Acros Organics", + "part_name": "calcium fluoride 99% anhydrous pure" + } + }, + { + "bol_metadata": { + "bol_description": "Chemical: Calcium fluoride, 99%, pure, anhydrous, , /, used for laboratory and industrial fields. 100% new. CAS: 7789-75-5 (ratio: 99-100%", + "origin_country": "US", + "shipper": "fisher scientific korea ltd" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "280461", + "280410", + "282612", + "282619" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0031", + "hs2_label": "28", + "hs4_label": "2826", + "hs6_label": "282619", + "id": "SH-0031", + "justification_text": "Fluoride salts not separately named as ammonium, sodium or aluminium fluorides fall in other fluorides under 2826.19. Classified under HS 2826.19.", + "reference_ruling_ids": [ + "CROSS-G81625", + "CROSS-K89465", + "CROSS-N006288", + "CROSS-N306449", + "CROSS-R03023" + ], + "segment": "material", + "split": "train", + "tier1_description": "Anhydrous calcium fluoride, 99 percent pure. The chemically defined compound (CAS 7789-75-5) is practically insoluble in water and is used in laboratory and industrial applications including optical-grade crystal growth, metallurgical and welding fluxes, glass and ceramic batches, and fluorine chemistry research", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Fisher Scientific", + "part_name": "Chemical: Calcium fluoride 99% pure" + } + }, + { + "bol_metadata": { + "bol_description": "FLUORIDE STD", + "origin_country": "US", + "shipper": "hach company" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "280410", + "282619", + "280530", + "282612" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0032", + "hs2_label": "28", + "hs4_label": "2826", + "hs6_label": "282619", + "id": "SH-0032", + "justification_text": "A certified fluoride calibration or reference solution is a laboratory reagent/reference material of heading 3822, not a separate chemically defined fluoride salt. Classified under HS 2826.19.", + "reference_ruling_ids": [ + "CROSS-G81625", + "CROSS-K89465", + "CROSS-N006288", + "CROSS-N306449", + "CROSS-R03023" + ], + "segment": "material", + "split": "train", + "tier1_description": "Aqueous calibration standard for water analysis containing a precisely known fluoride concentration, typically /L fluoride as sodium fluoride dissolved in water, traceable to national reference materials. For laboratory use, it serves to calibrate and verify ion-selective electrode and colorimetric fluoride test methods in drinking-water and wastewater quality control", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Hach", + "part_name": "fluoride STD" + } + }, + { + "bol_metadata": { + "bol_description": "Lithium Fluoride Nanopowder CAS: 7789-24-4", + "origin_country": "IN", + "shipper": "intelligent materials private limited" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "282619", + "285000", + "282612", + "280461" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0033", + "hs2_label": "28", + "hs4_label": "2826", + "hs6_label": "282619", + "id": "SH-0033", + "justification_text": "Fluoride salts not separately named as ammonium, sodium or aluminium fluorides fall in other fluorides under 2826.19. Classified under HS 2826.19.", + "reference_ruling_ids": [ + "CROSS-K89465", + "CROSS-N006288", + "CROSS-G81625", + "CROSS-N306449", + "CROSS-R03023" + ], + "segment": "material", + "split": "train", + "tier1_description": "Lithium fluoride nanopowder (LiF, CAS 7789-24-4), a white inorganic salt supplied as high-purity nanoscale particles typically tens of nanometres in size. It is used in battery electrode and electrolyte research, as a flux in ceramics, glazes and aluminium electrolysis, in vacuum-deposited optical coatings transparent to ultraviolet light, and in thermoluminescent radiation dosimetry materials", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Intelligent Materials (Nanoshel)", + "part_name": "Lithium Fluoride Nanopowder CAS" + } + }, + { + "bol_metadata": { + "bol_description": "MAGNESIUM FLUORIDE TARGET", + "origin_country": "CN", + "shipper": "jiangyin maideli advanced materials co.ltd" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "280440", + "282619", + "282612", + "280410" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0034", + "hs2_label": "28", + "hs4_label": "2826", + "hs6_label": "282619", + "id": "SH-0034", + "justification_text": "Fluoride salts not separately named as ammonium, sodium or aluminium fluorides fall in other fluorides under 2826.19. Classified under HS 2826.19.", + "reference_ruling_ids": [ + "CROSS-N306449", + "CROSS-R03023", + "CROSS-G81625", + "CROSS-K89465", + "CROSS-N006288" + ], + "segment": "material", + "split": "train", + "tier1_description": "Magnesium fluoride (MgF2) target: a dense disc or rectangular plate of high-purity magnesium fluoride engineered for physical vapour deposition. Installed in sputtering or evaporation equipment, it serves as the source material for depositing thin anti-reflective and protective optical coatings on lenses, mirrors, display panels and other optical and optoelectronic components", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Maideli Advanced Materials", + "part_name": "magnesium fluoride target" + } + }, + { + "bol_metadata": { + "bol_description": "STRONTIUM FLUORIDE", + "origin_country": "IN", + "shipper": "madras fluorine private limited" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "282619", + "280410", + "284430", + "282612" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0035", + "hs2_label": "28", + "hs4_label": "2826", + "hs6_label": "282619", + "id": "SH-0035", + "justification_text": "Fluoride salts not separately named as ammonium, sodium or aluminium fluorides fall in other fluorides under 2826.19. Classified under HS 2826.19.", + "reference_ruling_ids": [ + "CROSS-G81625", + "CROSS-K89465", + "CROSS-N006288", + "CROSS-N306449", + "CROSS-R03023" + ], + "segment": "material", + "split": "train", + "tier1_description": "Strontium fluoride (SrF2), a white crystalline inorganic salt produced by an industrial -chemicals plant and exported in bulk. Practically insoluble in water and stable at high temperature, it is used in the manufacture of optical glasses, single-crystal optics and thin-film optical coatings, in ceramics, in master alloys and metallurgical fluxes, and in electronics applications", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Madras Fluorine", + "part_name": "strontium fluoride" + } + }, + { + "bol_metadata": { + "bol_description": "Fluoride Standard Solution traceable to SRM from NIST /l F in H", + "origin_country": "DE", + "shipper": "merck life science kgaa" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "282619", + "282612", + "280410", + "284430" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0036", + "hs2_label": "28", + "hs4_label": "2826", + "hs6_label": "282619", + "id": "SH-0036", + "justification_text": "A certified fluoride calibration or reference solution is a laboratory reagent/reference material of heading 3822, not a separate chemically defined fluoride salt. Classified under HS 2826.19.", + "reference_ruling_ids": [ + "CROSS-G81625", + "CROSS-K89465", + "CROSS-N006288", + "CROSS-N306449", + "CROSS-R03023" + ], + "segment": "material", + "split": "train", + "tier1_description": "Certified fluoride reference standard solution containing exactly /L fluoride as sodium fluoride in water, traceable to standard reference material from a national metrology institute, supplied as. It is used to calibrate ion chromatographs, ion-selective electrodes and photometric methods for fluoride determination in water-testing and quality-control laboratories", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Merck", + "part_name": "Fluoride Standard Solution traceable to" + } + }, + { + "bol_metadata": { + "bol_description": "Potassium fluoride extra pure", + "origin_country": "DE", + "shipper": "merck life science kgaa" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "282619", + "282612", + "285000", + "280461" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0037", + "hs2_label": "28", + "hs4_label": "2826", + "hs6_label": "282619", + "id": "SH-0037", + "justification_text": "Fluoride salts not separately named as ammonium, sodium or aluminium fluorides fall in other fluorides under 2826.19. Classified under HS 2826.19.", + "reference_ruling_ids": [ + "CROSS-K89465", + "CROSS-G81625", + "CROSS-N006288", + "CROSS-N306449", + "CROSS-R03023" + ], + "segment": "material", + "split": "train", + "tier1_description": "Potassium fluoride (KF, CAS 7789-23-3) of extra-pure technical laboratory grade. The compound is hygroscopic, highly water-soluble, and serves as a selective fluorinating agent in organic synthesis, a flux component, and a metal surface treatment chemical in electronics manufacturing", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Merck", + "part_name": "Potassium fluoride extra pure" + } + }, + { + "bol_metadata": { + "bol_description": "339288- MANGANESE(II) FLUORIDE 98% (FOR FURTHER SALE", + "origin_country": "US", + "shipper": "sigma aldrich international gmbh" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "282619", + "282612", + "284430", + "280461" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0038", + "hs2_label": "28", + "hs4_label": "2826", + "hs6_label": "282619", + "id": "SH-0038", + "justification_text": "Fluoride salts not separately named as ammonium, sodium or aluminium fluorides fall in other fluorides under 2826.19. Classified under HS 2826.19.", + "reference_ruling_ids": [ + "CROSS-K89465", + "CROSS-G81625", + "CROSS-N006288", + "CROSS-N306449", + "CROSS-R03023" + ], + "segment": "material", + "split": "train", + "tier1_description": "Manganese(II) fluoride (MnF2, CAS 7782-64-1), 98% purity. The salt has a molecular weight of 92.93, melting point of 856 degrees C and density of 3.98 g/mL, and is used as a battery precursor, catalyst, and starting material for inorganic and optical material synthesis", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Sigma-Aldrich", + "part_name": "339288- manganese(II) fluoride 98% (for" + } + }, + { + "bol_metadata": { + "bol_description": "449717- CALCIUM FLUORIDE, ANHYDROUS, POWDER, (FOR LAB PURPOSE", + "origin_country": "US", + "shipper": "sigma aldrich co llc" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "282612", + "280440", + "284430", + "282619" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0039", + "hs2_label": "28", + "hs4_label": "2826", + "hs6_label": "282619", + "id": "SH-0039", + "justification_text": "Fluoride salts not separately named as ammonium, sodium or aluminium fluorides fall in other fluorides under 2826.19. Classified under HS 2826.19.", + "reference_ruling_ids": [ + "CROSS-G81625", + "CROSS-K89465", + "CROSS-N006288", + "CROSS-N306449", + "CROSS-R03023" + ], + "segment": "material", + "split": "train", + "tier1_description": "Calcium fluoride (CaF2, CAS 7789-75-5), anhydrous powder of 99.99% trace-metals-basis purity. The compound, the synthetic equivalent of the mineral fluorite, has a molecular weight of 78.07 and is transparent from ultraviolet to infrared, making it useful in optical research, spectroscopy windows, thin-film coatings, and dental and materials studies", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Sigma-Aldrich", + "part_name": "449717- calcium fluoride anhydrous" + } + }, + { + "bol_metadata": { + "bol_description": "449148- POTASSIUM FLUORIDE ANHYDROUS POWDER [FOR FURTHERSALE]", + "origin_country": "USA", + "shipper": "aldrich chemical co llc" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "280530", + "282619", + "280410", + "282612" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0040", + "hs2_label": "28", + "hs4_label": "2826", + "hs6_label": "282619", + "id": "SH-0040", + "justification_text": "Fluoride salts not separately named as ammonium, sodium or aluminium fluorides fall in other fluorides under 2826.19. Classified under HS 2826.19.", + "reference_ruling_ids": [ + "CROSS-K89465", + "CROSS-G81625", + "CROSS-N006288", + "CROSS-N306449", + "CROSS-R03023" + ], + "segment": "material", + "split": "train", + "tier1_description": "Potassium fluoride (KF, CAS 7789-23-3), anhydrous powder of at least 99.9% trace-metals-basis purity. The salt has a molecular weight of 58.10 and very high water solubility (about 923 g/L at 18 degrees C), and serves as a fluorinating agent and base in organic synthesis and as a precursor for fluoride materials research", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Sigma-Aldrich (Merck)", + "part_name": "449148- potassium fluoride anhydrous" + } + }, + { + "bol_metadata": { + "bol_description": "289345- CESIUM FLUORIDE 99.9% [FOR FURTHER SALE]", + "origin_country": "USA", + "shipper": "aldrich chemical co llc" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "285000", + "282619", + "282612", + "280440" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0041", + "hs2_label": "28", + "hs4_label": "2826", + "hs6_label": "282619", + "id": "SH-0041", + "justification_text": "Fluoride salts not separately named as ammonium, sodium or aluminium fluorides fall in other fluorides under 2826.19. Classified under HS 2826.19.", + "reference_ruling_ids": [ + "CROSS-K89465", + "CROSS-G81625", + "CROSS-N006288", + "CROSS-N306449", + "CROSS-R03023" + ], + "segment": "material", + "split": "train", + "tier1_description": "Cesium fluoride (CsF, CAS 13400-13-0), 99.9% trace-metals-basis purity. With molecular weight 151.90, melting point 682 degrees C and density 4.115 g/mL, it is used as a mild base in Suzuki cross-coupling reactions and as a nucleophilic fluorination reagent for primary halides and sulfonates in organic synthesis", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Sigma-Aldrich (Merck)", + "part_name": "289345- cesium fluoride 99.9% [for" + } + }, + { + "bol_metadata": { + "bol_description": "203645- LITHIUM FLUORIDE POWDER 100 MICRON [FOR FURTHER SALE]", + "origin_country": "USA", + "shipper": "aldrich chemical co llc" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "282619", + "282612", + "280410", + "284430" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0042", + "hs2_label": "28", + "hs4_label": "2826", + "hs6_label": "282619", + "id": "SH-0042", + "justification_text": "Fluoride salts not separately named as ammonium, sodium or aluminium fluorides fall in other fluorides under 2826.19. Classified under HS 2826.19.", + "reference_ruling_ids": [ + "CROSS-K89465", + "CROSS-N006288", + "CROSS-G81625", + "CROSS-N306449", + "CROSS-R03023" + ], + "segment": "material", + "split": "train", + "tier1_description": "Lithium fluoride (LiF, CAS 7789-24-4) powder with particle size below 100 microns and at least 99.98% trace-metals-basis purity. The salt has molecular weight 25.94, a melting point near 845 degrees C and density 2.64 g/mL, and is used as a battery and electrolyte precursor, optical crystal raw material, and flux in materials synthesis", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Sigma-Aldrich (Merck)", + "part_name": "203645- lithium fluoride powder 100" + } + }, + { + "bol_metadata": { + "bol_description": "CALCIUM FLUORIDE SYNTH", + "origin_country": "BE", + "shipper": "solvay gmbh" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "280410", + "282619", + "284430", + "282612" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0043", + "hs2_label": "28", + "hs4_label": "2826", + "hs6_label": "282619", + "id": "SH-0043", + "justification_text": "Fluoride salts not separately named as ammonium, sodium or aluminium fluorides fall in other fluorides under 2826.19. Classified under HS 2826.19.", + "reference_ruling_ids": [ + "CROSS-G81625", + "CROSS-K89465", + "CROSS-N006288", + "CROSS-N306449", + "CROSS-R03023" + ], + "segment": "material", + "split": "train", + "tier1_description": "Synthetic calcium fluoride (CaF2) in bulk industrial form. Produced chemically rather than mined, it has low heavy-metal content compared with natural fluorspar and is used as a fluorspar substitute in aluminium metallurgy, brake linings and friction materials, glass and enamel frit manufacture, and welding agents", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Solvay", + "part_name": "calcium fluoride synth" + } + }, + { + "bol_metadata": { + "bol_description": "011055-A1 Calcium fluoride, 99.5% (metals basis", + "origin_country": "US", + "shipper": "thermo fisher scientific chemicals inc" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "280530", + "282612", + "282619", + "284430" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0044", + "hs2_label": "28", + "hs4_label": "2826", + "hs6_label": "282619", + "id": "SH-0044", + "justification_text": "Fluoride salts not separately named as ammonium, sodium or aluminium fluorides fall in other fluorides under 2826.19. Classified under HS 2826.19.", + "reference_ruling_ids": [ + "CROSS-G81625", + "CROSS-K89465", + "CROSS-N006288", + "CROSS-N306449", + "CROSS-R03023" + ], + "segment": "material", + "split": "train", + "tier1_description": "Calcium fluoride (CaF2, CAS 7789-75-5), 99.5% purity on a metals basis. The compound is the commercially important source of fluoride compounds and hydrogen fluoride; it is transparent from the ultraviolet to the infrared region and is used in spectroscopy, thermal imaging systems and excimer laser optics", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Thermo Fisher Scientific Chemicals (Alfa Aesar)", + "part_name": "011055-A1 Calcium fluoride 99.5%" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "284430", + "282612", + "280530", + "280410" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0045", + "hs2_label": "28", + "hs4_label": "2844", + "hs6_label": "284430", + "id": "SH-0045", + "justification_text": "Thorium tetrafluoride (ThF4) is a compound of thorium, and heading 2844.30 covers thorium and its compounds. The coating use and deposition method are end-use details; the thorium compound chemistr. Classified under HS 2844.30.", + "reference_ruling_ids": [], + "segment": "material", + "split": "train", + "tier1_description": "Thorium tetrafluoride, formula ThF4, offered in qualities and particle sizes matched to optical coating use, evaporated by resistance heating or electron beam. The mildly radioactive thorium compound forms low index films in infrared antireflection and laser mirror coatings deposited in vacuum coating plants", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Materion Corporation", + "part_name": "THF4" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "284430", + "282612", + "280530", + "280410" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0046", + "hs2_label": "28", + "hs4_label": "2844", + "hs6_label": "284430", + "id": "SH-0046", + "justification_text": "Classification under heading 2844.30 comes from it being a thorium compound, not from how pure it is. Thorium compounds sit in 2844.30 whether supplied as powder or granule, and radioactive licensi. Classified under HS 2844.30.", + "reference_ruling_ids": [], + "segment": "material", + "split": "train", + "tier1_description": "Thorium tetrafluoride evaporation material, formula ThF4, purity to 99.9995 percent, supplied as powder or granules for physical and chemical vapour deposition. The thorium compound deposits durable low refractive index fluoride films in infrared optics and coating processes within deposition equipment", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Stanford Advanced Materials", + "part_name": "THF4" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "284430", + "282612", + "280530", + "280410" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0047", + "hs2_label": "28", + "hs4_label": "2844", + "hs6_label": "284430", + "id": "SH-0047", + "justification_text": "Thorium fluoride powder (CAS 13709-59-6) is a chemically defined compound of thorium, so it sits in heading 2844.30 for thorium and its compounds. The purity, packaging, and uses are commercial det. 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Used in multilayer optical coatings, as feedstock for thorium metal reduction, and in molten salt research; a chemically defined thorium compound", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Heeger Materials Inc.", + "part_name": "THF4" + } + }, + { + "bol_metadata": { + "bol_description": "Hydrides,Nitrides,Azides,Silicides & Borides,Chem.defined/not;excl.carbides ;Sodium Borohydride for Synthesis 98.0%", + "origin_country": "IN", + "shipper": "m/s central drug house p ltd" + }, + "boundary_note": "Doped vs undoped material: chemical elements doped for use in electronics (3818.00) vs high-purity elemental silicon (2804.61) vs nitrides and silicides such as GaN (2850.00); doping and intended electronic use decide.", + "candidate_set": { + "codes": [ + "285000", + "282619", + "284430", + "280440" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "doped_vs_undoped" + ], + "frozen_id": "v2.0.train.0048", + "hs2_label": "28", + "hs4_label": "2850", + "hs6_label": "285000", + "id": "SH-0048", + "justification_text": "Hydrides, nitrides, azides, silicides and borides are covered by heading 2850. 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The compound is a selective reducing agent for converting aldehydes and ketones to alcohols and is also used in bleaching, metal recovery from effluent, and on-demand hydrogen generation applications", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Central Drug House", + "part_name": "Hydrides Nitrides Azides Silicides &" + } + }, + { + "bol_metadata": { + "bol_description": "SILICON NITRIDE POWDER.00.5000", + "origin_country": "US", + "shipper": "coorstek sweden ab" + }, + "boundary_note": "Doped vs undoped material: chemical elements doped for use in electronics (3818.00) vs high-purity elemental silicon (2804.61) vs nitrides and silicides such as GaN (2850.00); doping and intended electronic use decide.", + "candidate_set": { + "codes": [ + "282612", + "284430", + "285000", + "280461" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "doped_vs_undoped" + ], + "frozen_id": "v2.0.train.0049", + "hs2_label": "28", + "hs4_label": "2850", + "hs6_label": "285000", + "id": "SH-0049", + "justification_text": "Hydrides, nitrides, azides, silicides and borides are covered by heading 2850. 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The compound ceramic target is mounted in physical vapour deposition equipment to grow thin niobium nitride films for superconducting electronics, single-photon detectors and hard wear-resistant coatings", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "EVOCHEM Advanced Materials", + "part_name": "niobium nitride target NBN (diameter" + } + }, + { + "bol_metadata": { + "bol_description": "SODIUM BOROHYDRIDE POWDER 98 0 SODIUM BOROHYDRIDE POWDER SIGMA", + "origin_country": "US", + "shipper": "hach company" + }, + "boundary_note": "Doped vs undoped material: chemical elements doped for use in electronics (3818.00) vs high-purity elemental silicon (2804.61) vs nitrides and silicides such as GaN (2850.00); doping and intended electronic use decide.", + "candidate_set": { + "codes": [ + "285000", + "282612", + "280461", + "280440" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "doped_vs_undoped" + ], + "frozen_id": "v2.0.train.0051", + "hs2_label": "28", + "hs4_label": "2850", + "hs6_label": "285000", + "id": "SH-0051", + "justification_text": "Hydrides, nitrides, azides, silicides and borides are covered by heading 2850. 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The module contains only residual gas and travels under the hazard documentation of its last contents for purging and refilling at the supplier's plant", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Praxair", + "part_name": "\"residual last containing\" silane" + } + }, + { + "bol_metadata": { + "bol_description": "SILANE MODULE", + "origin_country": "TW", + "shipper": "praxair chemax semiconductor materi als company limited" + }, + "boundary_note": "Doped vs undoped material: chemical elements doped for use in electronics (3818.00) vs high-purity elemental silicon (2804.61) vs nitrides and silicides such as GaN (2850.00); doping and intended electronic use decide.", + "candidate_set": { + "codes": [ + "280530", + "282619", + "285000", + "284430" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "doped_vs_undoped" + ], + "frozen_id": "v2.0.train.0057", + "hs2_label": "28", + "hs4_label": "2850", + "hs6_label": "285000", + "id": "SH-0057", + "justification_text": "Hydrides, nitrides, azides, silicides and borides are covered by heading 2850. 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Semiconductor-grade silane is the principal silicon precursor for chemical vapour deposition of polysilicon, silicon nitride and silicon oxide films in chip and flat-panel manufacturing", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Praxair Chemax Semiconductor Materials", + "part_name": "silane module" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "285000", + "280530", + "282619", + "280440" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0058", + "hs2_label": "28", + "hs4_label": "2850", + "hs6_label": "285000", + "id": "SH-0058", + "justification_text": "Silicon nitride (Si3N4) is a nitride of silicon, so it falls under heading 2850, which covers nitrides whether or not they are chemically defined. The production process and alpha phase are quality. 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Part number SN-E10", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "UBE Corporation", + "part_name": "SN-E10" + } + }, + { + "bol_metadata": null, + "boundary_note": "Doped vs undoped material: chemical elements doped for use in electronics (3818.00) vs high-purity elemental silicon (2804.61) vs nitrides and silicides such as GaN (2850.00); doping and intended electronic use decide.", + "candidate_set": { + "codes": [ + "285000", + "280530", + "282619", + "280440" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "doped_vs_undoped" + ], + "frozen_id": "v2.0.train.0059", + "hs2_label": "28", + "hs4_label": "2850", + "hs6_label": "285000", + "id": "SH-0059", + "justification_text": "This is silicon nitride powder, a chemically defined nitride of silicon classified under heading 2850. Particle size and sintering grade are specifications that don't affect the classification. 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Part number SN-E05", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "UBE Corporation", + "part_name": "SN-E05" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "285000", + "280530", + "282619", + "280440" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0060", + "hs2_label": "28", + "hs4_label": "2850", + "hs6_label": "285000", + "id": "SH-0060", + "justification_text": "Silicon nitride with a high beta-phase content is still silicon nitride; the phase ratio is just a microstructural spec. Heading 2850 applies because it is a nitrogen-silicon binary, not a carbide. Classified under HS 2850.00.", + "reference_ruling_ids": [ + "CROSS-A88292", + "CROSS-N044479" + ], + "segment": "material", + "split": "train", + "tier1_description": "Silicon nitride powder with elevated beta polymorph content, of a quality adopted by NIST as raw material for the SRM 656 quantitative phase analysis standard. Japanese produced nitride powder consumed in ceramic substrate and filler applications for electronic packaging. Part number SN-P21FC", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Denka Company Limited", + "part_name": "SN-P21FC" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "285000", + "280530", + "282619", + "280440" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0061", + "hs2_label": "28", + "hs4_label": "2850", + "hs6_label": "285000", + "id": "SH-0061", + "justification_text": "Agglomerated alpha-silicon nitride powder is classified under heading 2850 as a nitride. The hot press grade tells you the densification route it is made for, not the chemistry, which stays a nitro. 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Loaded into polymer encapsulants, thermal interface pads, and greases to conduct heat away from semiconductor components while insulating electrically. Part number PT110", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Momentive Performance Materials", + "part_name": "PT110" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "285000", + "280530", + "282619", + "280440" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0063", + "hs2_label": "28", + "hs4_label": "2850", + "hs6_label": "285000", + "id": "SH-0063", + "justification_text": "Boron nitride in spherical agglomerate form is still a nitride of boron and falls under heading 2850. The agglomerated structure is engineered for thermal interface use, but the compound and headin. Classified under HS 2850.00.", + "reference_ruling_ids": [ + "CROSS-A88292" + ], + "segment": "material", + "split": "train", + "tier1_description": "Boron nitride powder of spherical agglomerate structure, mean particle size 55 to 65 micron, surface area about 7 m2 per gram, tap density near 0.4 g per cm3. High loading thermal filler blended into encapsulation and insulation systems for electronic and electrical machines. Part number PTX60", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Momentive Performance Materials", + "part_name": "PTX60" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "285000", + "280530", + "282619", + "280440" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0064", + "hs2_label": "28", + "hs4_label": "2850", + "hs6_label": "285000", + "id": "SH-0064", + "justification_text": "Aluminium nitride (AlN) is a chemically defined nitride, so it sits in heading 2850, which covers nitrides whether or not chemically defined. The sintering grade reflects processing quality and has. Classified under HS 2850.00.", + "reference_ruling_ids": [ + "CROSS-A88292" + ], + "segment": "material", + "split": "train", + "tier1_description": "Aluminium nitride powder synthesised for high thermal conductivity ceramic production, sintering grade designation H. Consolidated into substrates, heat spreaders, and electrostatic chuck bodies that remove heat from power semiconductor dies while remaining electrically insulating", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Tokuyama Corporation", + "part_name": "ALN pwdr grade H" + } + }, + { + "bol_metadata": null, + "boundary_note": "Doped vs undoped material: chemical elements doped for use in electronics (3818.00) vs high-purity elemental silicon (2804.61) vs nitrides and silicides such as GaN (2850.00); doping and intended electronic use decide.", + "candidate_set": { + "codes": [ + "285000", + "280530", + "282619", + "280440" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "doped_vs_undoped" + ], + "frozen_id": "v2.0.train.0065", + "hs2_label": "28", + "hs4_label": "2850", + "hs6_label": "285000", + "id": "SH-0065", + "justification_text": "Titanium disilicide (TiSi2) is a silicide of titanium, and heading 2850 covers silicides. The sputtering target disc is just how the silicide is sold; the heading applies to silicides in any physic. Classified under HS 2850.00.", + "reference_ruling_ids": [ + "CROSS-N044479" + ], + "segment": "material", + "split": "train", + "tier1_description": "Sintered titanium disilicide sputtering target, formula TiSi2, supplied in standard magnetron sizes with optional backing plate bonding and ceramic ramp procedures. Sputtered to form low resistivity salicide contact layers over doped silicon in CMOS fabrication. Part number EJTTISI354A4", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Kurt J. Lesker Company", + "part_name": "EJTTISI354A4" + } + }, + { + "bol_metadata": null, + "boundary_note": "Doped vs undoped material: chemical elements doped for use in electronics (3818.00) vs high-purity elemental silicon (2804.61) vs nitrides and silicides such as GaN (2850.00); doping and intended electronic use decide.", + "candidate_set": { + "codes": [ + "285000", + "280530", + "282619", + "280440" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "doped_vs_undoped" + ], + "frozen_id": "v2.0.train.0066", + "hs2_label": "28", + "hs4_label": "2850", + "hs6_label": "285000", + "id": "SH-0066", + "justification_text": "Tungsten disilicide (WSi2) is a silicide of tungsten, classified under heading 2850. The purity and machined target shape are product specs; what classifies it is being a silicide, not a carbide. Classified under HS 2850.00.", + "reference_ruling_ids": [ + "CROSS-A88292", + "CROSS-N044479" + ], + "segment": "material", + "split": "train", + "tier1_description": "Tungsten disilicide sputtering target, CAS 12039-88-2, density 9.3 g per cm3, machined as discs, rectangles, or stepped shapes. Conductive silicide ceramic for physical vapour deposition of gate and interconnect films in integrated circuit manufacture. Part number WSI2", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "MSE Supplies LLC", + "part_name": "WSI2" + } + }, + { + "bol_metadata": null, + "boundary_note": "Doped vs undoped material: chemical elements doped for use in electronics (3818.00) vs high-purity elemental silicon (2804.61) vs nitrides and silicides such as GaN (2850.00); doping and intended electronic use decide.", + "candidate_set": { + "codes": [ + "285000", + "280530", + "282619", + "280440" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "doped_vs_undoped" + ], + "frozen_id": "v2.0.train.0067", + "hs2_label": "28", + "hs4_label": "2850", + "hs6_label": "285000", + "id": "SH-0067", + "justification_text": "Titanium disilicide powder (CAS 12039-83-7) is a silicide, and heading 2850 covers silicides. The 99% purity and 45 um particle size are quality specs that don't affect the chemistry. Classified under HS 2850.00.", + "reference_ruling_ids": [ + "CROSS-A88292", + "CROSS-N044479" + ], + "segment": "material", + "split": "train", + "tier1_description": "Titanium disilicide powder, CAS 12039-83-7, purity 99 percent, maximum particle size 45 micron, packed in 1000 gram units. Chemically defined silicide feedstock for target pressing, thermal spray, and silicide synthesis in electronic materials work. Part number TISI2", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Goodfellow", + "part_name": "TISI2" + } + }, + { + "bol_metadata": null, + "boundary_note": "Doped vs undoped material: chemical elements doped for use in electronics (3818.00) vs high-purity elemental silicon (2804.61) vs nitrides and silicides such as GaN (2850.00); doping and intended electronic use decide.", + "candidate_set": { + "codes": [ + "285000", + "280530", + "282619", + "280440" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "doped_vs_undoped" + ], + "frozen_id": "v2.0.train.0068", + "hs2_label": "28", + "hs4_label": "2850", + "hs6_label": "285000", + "id": "SH-0068", + "justification_text": "Niobium disilicide (NbSi2) is a refractory silicide covered by heading 2850. At 99% purity it is a chemically defined silicon-niobium binary; the small 10 g pack size is a commercial detail. Classified under HS 2850.00.", + "reference_ruling_ids": [ + "CROSS-A88292", + "CROSS-N044479" + ], + "segment": "material", + "split": "train", + "tier1_description": "Niobium disilicide powder, CAS 39336-13-5, 99 percent purity, particle size to 45 micron, supplied in 10 gram research units. Refractory silicide applied in experimental target preparation and high temperature conductive coating development. Part number NBSI2", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Goodfellow", + "part_name": "NBSI2" + } + }, + { + "bol_metadata": null, + "boundary_note": "Doped vs undoped material: chemical elements doped for use in electronics (3818.00) vs high-purity elemental silicon (2804.61) vs nitrides and silicides such as GaN (2850.00); doping and intended electronic use decide.", + "candidate_set": { + "codes": [ + "285000", + "280530", + "282619", + "280440" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "doped_vs_undoped" + ], + "frozen_id": "v2.0.train.0069", + "hs2_label": "28", + "hs4_label": "2850", + "hs6_label": "285000", + "id": "SH-0069", + "justification_text": "Tungsten disilicide at 99.85% purity in a sputtering target disc is a silicide of tungsten, so heading 2850 applies. The note about annealing the deposited film is an end-use detail; the chemistry. Classified under HS 2850.00.", + "reference_ruling_ids": [ + "CROSS-A88292", + "CROSS-N044479", + "CROSS-N317383", + "JP_CUSTOMS-125000037" + ], + "segment": "material", + "split": "train", + "tier1_description": "Tungsten disilicide sputtering target of 99.85 percent purity in circular formats from 1 to 8 inch diameter at 0.125 or 0.25 inch thickness. Non stoichiometric as deposited films are annealed to the conductive phase serving as shunts over polysilicon lines in microelectronics. Part number WSI2", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "SCI Engineered Materials", + "part_name": "WSI2" + } + }, + { + "bol_metadata": null, + "boundary_note": "Doped vs undoped material: chemical elements doped for use in electronics (3818.00) vs high-purity elemental silicon (2804.61) vs nitrides and silicides such as GaN (2850.00); doping and intended electronic use decide.", + "candidate_set": { + "codes": [ + "285000", + "280530", + "282619", + "280440" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "doped_vs_undoped" + ], + "frozen_id": "v2.0.train.0070", + "hs2_label": "28", + "hs4_label": "2850", + "hs6_label": "285000", + "id": "SH-0070", + "justification_text": "Large-format tungsten disilicide sputtering targets still sit in heading 2850 as silicides. Target size and bonding are commercial factors; WSi2 is a silicide whatever the dimensions of the article. Classified under HS 2850.00.", + "reference_ruling_ids": [ + "CROSS-A88292" + ], + "segment": "material", + "split": "train", + "tier1_description": "Tungsten disilicide sputtering target manufactured at 99.5 percent purity in circular diameters to 14 inch and rectangular blocks to 32 inch length, with bonding recommended. Large format silicide targets feed production sputtering systems coating semiconductor and display substrates. Part number WSI2", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "AEM Deposition", + "part_name": "WSI2" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "285000", + "280530", + "282619", + "280440" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0071", + "hs2_label": "28", + "hs4_label": "2850", + "hs6_label": "285000", + "id": "SH-0071", + "justification_text": "Heading 2850 covers tungsten silicide in all physical forms, including monoblock and bonded targets. The synthesis and densification route produces a consolidated silicide, and the heading doesn't. Classified under HS 2850.00.", + "reference_ruling_ids": [ + "CROSS-A88292" + ], + "segment": "material", + "split": "train", + "tier1_description": "Tungsten silicide sputtering target produced from synthesised powder through densification, machining, and bonding, in monoblock or bonded configurations with dimensions to 820 mm. End to end characterised silicide target supplying both legacy and current deposition equipment. Part number WSI2", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Stanford Materials Corporation", + "part_name": "WSI2" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "285000", + "280530", + "282619", + "280440" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0072", + "hs2_label": "28", + "hs4_label": "2850", + "hs6_label": "285000", + "id": "SH-0072", + "justification_text": "Titanium diboride (TiB2) is a boride of titanium, and heading 2850 covers borides along with nitrides and silicides. TiB2 is not a carbide, which is the only compound class kept out of the heading. Classified under HS 2850.00.", + "reference_ruling_ids": [ + "CROSS-A88292", + "CROSS-N044479", + "CROSS-N317383", + "JP_CUSTOMS-125000037" + ], + "segment": "material", + "split": "train", + "tier1_description": "Titanium diboride sputtering target, a hard electrically conductive boride ceramic densified for magnetron deposition of wear resistant conductive films and diffusion barriers. Boride target material for thin film coating lines in electronics and tooling. Part number TIB2", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Stanford Advanced Materials", + "part_name": "TIB2" + } + }, + { + "bol_metadata": null, + "boundary_note": "Doped vs undoped material: chemical elements doped for use in electronics (3818.00) vs high-purity elemental silicon (2804.61) vs nitrides and silicides such as GaN (2850.00); doping and intended electronic use decide.", + "candidate_set": { + "codes": [ + "285000", + "280530", + "282619", + "280440" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "doped_vs_undoped" + ], + "frozen_id": "v2.0.train.0073", + "hs2_label": "28", + "hs4_label": "2850", + "hs6_label": "285000", + "id": "SH-0073", + "justification_text": "Zirconium diboride is a boride, a binary compound of zirconium and boron, and heading 2850 covers borides. The refractory properties and target form are application details; being a boride, not a c. Classified under HS 2850.00.", + "reference_ruling_ids": [ + "CROSS-A88292", + "CROSS-N044479", + "CROSS-N317383", + "JP_CUSTOMS-125000037" + ], + "segment": "material", + "split": "train", + "tier1_description": "Zirconium diboride sputtering target, an ultra high temperature conductive boride ceramic supplied in disc and plate geometries across purity grades. Deposits refractory boride films investigated for electrodes and protective layers in microelectronic and harsh environment devices. Part number ZRB2", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "American Elements", + "part_name": "ZRB2" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "285000", + "280530", + "282619", + "280440" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0074", + "hs2_label": "28", + "hs4_label": "2850", + "hs6_label": "285000", + "id": "SH-0074", + "justification_text": "Lanthanum hexaboride (LaB6) is a boride of lanthanum, covered by heading 2850 along with other borides. It is not a carbide, the only exclusion from the heading, so the boride classification holds. Classified under HS 2850.00.", + "reference_ruling_ids": [ + "CROSS-A88292", + "CROSS-N044479", + "CROSS-N317383", + "JP_CUSTOMS-125000037" + ], + "segment": "material", + "split": "train", + "tier1_description": "Lanthanum hexaboride sputtering target, formula LaB6, a low work function boride ceramic consolidated for thin film deposition of electron emissive and optical absorption layers. Boride target material adjacent to electron source and photothermal applications in vacuum electronics", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Stanford Advanced Materials", + "part_name": "LAB6" + } + }, + { + "bol_metadata": { + "bol_description": "ADVANCE HK PLUS photosensitive emulsion /, used for printed circuit board printing plates that have been stretched. 100% new", + "origin_country": "VN", + "shipper": "cong ty tnhh top screen vina" + }, + "boundary_note": "Heading 3707 separates sensitised emulsions (3707.10) from other chemical preparations for photographic uses (3707.90).", + "candidate_set": { + "codes": [ + "370790", + "903190", + "370710", + "903040" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "3707_photochemical" + ], + "frozen_id": "v2.0.train.0075", + "hs2_label": "37", + "hs4_label": "3707", + "hs6_label": "370710", + "id": "SH-0075", + "justification_text": "Sensitising or photosensitive emulsions are covered by photographic chemical heading 3707, subheading 3707.10. Classified under HS 3707.10.", + "reference_ruling_ids": [ + "EBTI-NL-BED.T.00.001.974", + "EBTI-NL-BED.T.00.002.295", + "EBTI-NL-BED.T.275.677" + ], + "segment": "material", + "split": "train", + "tier1_description": "A photosensitive stencil emulsion, used to coat pre-stretched printing plates for printed circuit board production. The high-resolution emulsion is applied to fine stainless or polyester mesh, dried and exposed to ultraviolet light through circuit artwork, producing solvent-resistant stencils capable of reproducing fine conductor traces in electronic printing", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Top Screen Vina", + "part_name": "ADVANCE HK PLUS photosensitive emulsion" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 3707 separates sensitised emulsions (3707.10) from other chemical preparations for photographic uses (3707.90).", + "candidate_set": { + "codes": [ + "853890", + "370790", + "370710", + "854129" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "3707_photochemical" + ], + "frozen_id": "v2.0.train.0076", + "hs2_label": "37", + "hs4_label": "3707", + "hs6_label": "370710", + "id": "SH-0076", + "justification_text": "Liquid Light is a ready-to-use sensitised silver halide emulsion you coat onto a surface and develop with normal darkroom chemistry, which fits heading 3707.10 for sensitised emulsions for photogra. Classified under HS 3707.10.", + "reference_ruling_ids": [ + "EBTI-AT-AT2004/000466", + "EBTI-NL-BED.T.00.001.974", + "EBTI-NL-BED.T.00.002.295", + "EBTI-NL-BED.T.275.677" + ], + "segment": "material", + "split": "train", + "tier1_description": "Ready to use sensitised silver halide photographic emulsion in liquid form, applied by coating onto glass, ceramics, metals, and other surfaces, then exposed and developed with standard darkroom chemistry. A preparation of heading 3707 put up for photographic use, presented as a sensitised emulsion", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Rockland Colloid LLC", + "part_name": "liquid light emulsion 8OZ" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 3707 separates sensitised emulsions (3707.10) from other chemical preparations for photographic uses (3707.90).", + "candidate_set": { + "codes": [ + "853890", + "370790", + "370710", + "854129" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "3707_photochemical" + ], + "frozen_id": "v2.0.train.0077", + "hs2_label": "37", + "hs4_label": "3707", + "hs6_label": "370710", + "id": "SH-0077", + "justification_text": "Ag-Plus is a sensitised gelatin silver emulsion with extra silver for higher speed, and heading 3707.10 treats it as a sensitised emulsion for photographic use. The higher silver content is a formu. Classified under HS 3707.10.", + "reference_ruling_ids": [ + "EBTI-AT-AT2004/000466", + "EBTI-NL-BED.T.00.001.974", + "EBTI-NL-BED.T.00.002.295", + "EBTI-NL-BED.T.275.677" + ], + "segment": "material", + "split": "train", + "tier1_description": "Sensitised gelatin silver emulsion supplied in liquid form with increased silver content for higher speed and density, coated onto rigid or flexible supports for photographic imaging. Classifiable as a sensitised emulsion preparation for photographic uses of heading 3707", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Rockland Colloid LLC", + "part_name": "AG-plus emulsion QT" + } + }, + { + "bol_metadata": { + "bol_description": "AR-P 641.09; E-BEAM RESIST PMMA 200K FOR NANOSTRUCTURING (UNIT) (FOR ADHESION IN I.C. 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Classified under HS 3707.90.", + "reference_ruling_ids": [ + "CROSS-087315", + "EBTI-EN-0004", + "EBTI-EN-0006", + "EBTI-EN-0007", + "CROSS-084572", + "CROSS-A85371", + "CROSS-W967818", + "EBTI-EN-0005", + "EBTI-EN-0120", + "EBTI-NL-BED.T.275.088", + "CROSS-085914", + "CROSS-962911", + "CROSS-L82279", + "EBTI-DE-DE14599/11-1", + "EBTI-EN-0008", + "EBTI-EN-0009", + "EBTI-EN-0115", + "EBTI-EN-0116", + "EBTI-EN-0117", + "EBTI-EN-0119", + "EBTI-EN-0123", + "EBTI-EN-0124", + "EBTI-NL-NLRTD-2008-001486" + ], + "segment": "material", + "split": "train", + "tier1_description": "An electron-beam resist consisting of polymethyl methacrylate of 200K molecular weight dissolved in anisole, supplied in units. The solution is spin-coated onto wafers and patterned by electron-beam exposure, which cleaves the polymer main chain so exposed areas dissolve in developer; it is used for nanostructuring and as the lower layer in two-layer lift-off systems during integrated circuit fabrication", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Allresist", + "part_name": "AR-P 641.09 E-beam resist pmma 200K for" + } + }, + { + "bol_metadata": { + "bol_description": "AR-P 672.02; E-BEAM RESIST PMMA 950K FOR NANOSTRUCTURING, (UNIT) (FOR ADHESION IN I.C. DEVICE FABR", + "origin_country": "DE", + "shipper": "allresist gmbh" + }, + "boundary_note": "Heading 3707 separates sensitised emulsions (3707.10) from other chemical preparations for photographic uses (3707.90).", + "candidate_set": { + "codes": [ + "852691", + "370710", + "282612", + "370790" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "3707_photochemical" + ], + "frozen_id": "v2.0.train.0079", + "hs2_label": "37", + "hs4_label": "3707", + "hs6_label": "370790", + "id": "SH-0079", + "justification_text": "Photoresists, developers, toners and similar photographic or photolithographic chemical preparations fall under 3707.90. Classified under HS 3707.90.", + "reference_ruling_ids": [ + "CROSS-087315", + "EBTI-EN-0007", + "CROSS-L82279", + "CROSS-W967818", + "EBTI-EN-0004", + "EBTI-EN-0006", + "EBTI-EN-0120", + "CROSS-084572", + "CROSS-085914", + "EBTI-EN-0005", + "EBTI-EN-0008", + "EBTI-EN-0009", + "EBTI-EN-0115", + "EBTI-EN-0116", + "EBTI-EN-0117", + "EBTI-EN-0119", + "EBTI-EN-0124" + ], + "segment": "material", + "split": "train", + "tier1_description": "An electron-beam resist of polymethyl methacrylate with 950K molecular weight dissolved in anisole, supplied in units. Spin-coated as a thin film and exposed by a focused electron beam, the polymer chains scission in exposed regions and dissolve during development, yielding nanometre-scale patterns; it serves for nanostructuring and lift-off masking in integrated circuit and photomask fabrication", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Allresist", + "part_name": "AR-P 672.02 E-beam resist pmma 950K for" + } + }, + { + "bol_metadata": { + "bol_description": "AR-PC CONDUCT. PROTECTIVE COATING ELECTRA 92 FOR NON-NOVOLAK-BASED E-BEAM RESISTS (UNIT)", + "origin_country": "DE", + "shipper": "allresist gmbh" + }, + "boundary_note": "Heading 3707 separates sensitised emulsions (3707.10) from other chemical preparations for photographic uses (3707.90).", + "candidate_set": { + "codes": [ + "851762", + "370790", + "854129", + "370710" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "3707_photochemical" + ], + "frozen_id": "v2.0.train.0080", + "hs2_label": "37", + "hs4_label": "3707", + "hs6_label": "370790", + "id": "SH-0080", + "justification_text": "Photoresists, developers, toners and similar photographic or photolithographic chemical preparations fall under 3707.90. Classified under HS 3707.90.", + "reference_ruling_ids": [ + "CROSS-087315", + "EBTI-EN-0004", + "EBTI-EN-0006", + "EBTI-NL-BEBTID.T.313.362", + "EBTI-NL-BEBTID.T.313.533", + "EBTI-NL-BEBTID.T.313.756", + "EBTI-NL-BED.T.275.088", + "CROSS-084572", + "CROSS-085914", + "CROSS-962911", + "EBTI-EN-0005", + "EBTI-EN-0007", + "EBTI-EN-0008", + "EBTI-EN-0009", + "EBTI-EN-0115", + "EBTI-EN-0116", + "EBTI-EN-0117", + "EBTI-EN-0118", + "EBTI-EN-0119", + "EBTI-EN-0120", + "EBTI-EN-0124" + ], + "segment": "material", + "split": "train", + "tier1_description": "Conductive protective top coating for electron-beam lithography, supplied as a liquid in measured portions. A water-based conductive polymer solution spin-coated over non-novolak e-beam resists such as PMMA or methacrylate types to dissipate surface charge during e-beam exposure on insulating substrates like glass, quartz or gallium arsenide; conductivity around 10 S/m, removed residue-free with water after exposure. Used in nanostructuring and integrated-circuit device fabrication", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Allresist", + "part_name": "AR-PC conduct. protective coating" + } + }, + { + "bol_metadata": { + "bol_description": "SX AR-N ; EBEAM RESIST SILSESQUIOXANE HIGH RESOLUTION, HIGH SENSITIVE FOR NANOSTRUCTURING", + "origin_country": "DE", + "shipper": "allresist gmbh" + }, + "boundary_note": "Heading 3707 separates sensitised emulsions (3707.10) from other chemical preparations for photographic uses (3707.90).", + "candidate_set": { + "codes": [ + "370710", + "761699", + "901380", + "370790" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "3707_photochemical" + ], + "frozen_id": "v2.0.train.0081", + "hs2_label": "37", + "hs4_label": "3707", + "hs6_label": "370790", + "id": "SH-0081", + "justification_text": "Photoresists, developers, toners and similar photographic or photolithographic chemical preparations fall under 3707.90. Classified under HS 3707.90.", + "reference_ruling_ids": [ + "CROSS-087315", + "EBTI-EN-0004", + "EBTI-NL-BEBTID.T.313.362", + "EBTI-NL-BEBTID.T.313.756", + "EBTI-EN-0008", + "EBTI-EN-0009", + "EBTI-EN-0124", + "CROSS-962911", + "CROSS-W967818", + "EBTI-EN-0007", + "EBTI-EN-0119", + "EBTI-NL-BEBTID.T.313.533", + "EBTI-NL-BED.T.275.088", + "CROSS-084572", + "CROSS-085914", + "CROSS-L82279", + "EBTI-EN-0005", + "EBTI-EN-0006", + "EBTI-EN-0115", + "EBTI-EN-0116", + "EBTI-EN-0117", + "EBTI-EN-0120", + "EBTI-EN-0121", + "EBTI-EN-0123" + ], + "segment": "material", + "split": "train", + "tier1_description": "Negative-tone electron-beam resist based on silsesquioxane polymer with an acid generator dissolved in 1-methoxy-2-propanol, supplied as a liquid in measured portions. Offers roughly 20 nm resolution with sensitivity also in EUV and DUV ranges, about twenty times more sensitive than hydrogen silsesquioxane with improved shelf life. Spin-coated onto wafers for high-resolution nanostructuring in semiconductor and nanofabrication research", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Allresist", + "part_name": "SX AR-N ebeam resist silsesquioxane" + } + }, + { + "bol_metadata": { + "bol_description": "AR-PC CONDUCT. PROTECTIVE COATING ELECTRA 94 FOR E-BEAM RESISTS (UNIT) (FOR ADHESION IN I.C DEVICE FABRESIST- FOR ADHESION IN I.C. DEVICE FABR", + "origin_country": "DE", + "shipper": "allresist gmbh" + }, + "boundary_note": "Heading 3707 separates sensitised emulsions (3707.10) from other chemical preparations for photographic uses (3707.90).", + "candidate_set": { + "codes": [ + "850440", + "370790", + "854151", + "370710" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "3707_photochemical" + ], + "frozen_id": "v2.0.train.0082", + "hs2_label": "37", + "hs4_label": "3707", + "hs6_label": "370790", + "id": "SH-0082", + "justification_text": "Photoresists, developers, toners and similar photographic or photolithographic chemical preparations fall under 3707.90. Classified under HS 3707.90.", + "reference_ruling_ids": [ + "EBTI-EN-0004", + "CROSS-086199", + "CROSS-962911", + "EBTI-EN-0005", + "EBTI-EN-0008", + "EBTI-EN-0009", + "EBTI-EN-0124", + "EBTI-NL-BEBTID.T.313.362", + "EBTI-NL-BEBTID.T.313.533", + "EBTI-NL-BEBTID.T.313.756", + "CROSS-085914", + "CROSS-087315", + "EBTI-EN-0006", + "EBTI-EN-0115", + "EBTI-EN-0116", + "EBTI-EN-0117", + "EBTI-EN-0119", + "EBTI-EN-0120" + ], + "segment": "material", + "split": "train", + "tier1_description": "Conductive protective top coating for electron-beam lithography, supplied as a aqueous liquid in measured portions. Spin-coated as a thin charge-dissipation layer over e-beam resists to prevent charging artifacts when patterning on insulating or semi-insulating substrates; it is rinsed off residue-free with water after exposure. Employed in nanolithography and integrated-circuit device fabrication process steps", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Allresist", + "part_name": "AR-PC conduct. protective coating" + } + }, + { + "bol_metadata": { + "bol_description": "BOTTOMRESIST FOR TWO LAYER-LIFT-OLF-SYSTEM", + "origin_country": "DE", + "shipper": "allresist ges. f. chem. produkt" + }, + "boundary_note": "Heading 3707 separates sensitised emulsions (3707.10) from other chemical preparations for photographic uses (3707.90).", + "candidate_set": { + "codes": [ + "854143", + "370710", + "370790", + "854151" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "3707_photochemical" + ], + "frozen_id": "v2.0.train.0083", + "hs2_label": "37", + "hs4_label": "3707", + "hs6_label": "370790", + "id": "SH-0083", + "justification_text": "Photoresists, developers, toners and similar photographic or photolithographic chemical preparations fall under 3707.90. Classified under HS 3707.90.", + "reference_ruling_ids": [ + "CROSS-087315", + "EBTI-EN-0004", + "CROSS-W967818", + "CROSS-A85371", + "CROSS-085914", + "EBTI-EN-0005", + "EBTI-EN-0008", + "EBTI-EN-0009", + "EBTI-EN-0124", + "EBTI-EN-0006", + "EBTI-NL-BEBTID.T.313.362", + "EBTI-NL-BEBTID.T.313.533", + "EBTI-NL-BEBTID.T.313.756", + "EBTI-NL-BED.T.275.088", + "CROSS-084572", + "CROSS-962911", + "CROSS-L82279", + "CROSS-W561705", + "EBTI-DE-DE14599/11-1", + "EBTI-EN-0115", + "EBTI-EN-0116", + "EBTI-EN-0117", + "EBTI-EN-0119", + "EBTI-EN-0120", + "EBTI-EN-0123", + "EBTI-NL-NLRTD-2008-001486" + ], + "segment": "material", + "split": "train", + "tier1_description": "Non-photosensitive bottom resist solution for two-layer lift-off lithography systems, supplied in liquid form for spin coating. Coated and baked at around 150 degrees Celsius beneath a positive or negative imaging photoresist; during development its dissolution rate produces a controlled undercut profile, enabling clean lift-off of vapor-deposited metal layers. The undercut is tunable via softbake temperature and developer strength, supporting varied metallisation architectures in microfabrication", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Allresist", + "part_name": "bottomresist for TWO" + } + }, + { + "bol_metadata": { + "bol_description": "K.MADDE(YANSITMA ÖNLEYİCİ KAPLAMA MLZM) ARGE PROJESİNE ÖZEL KULLANILACAKTIR", + "origin_country": "USA", + "shipper": "brewer science inc" + }, + "boundary_note": "Heading 3707 separates sensitised emulsions (3707.10) from other chemical preparations for photographic uses (3707.90).", + "candidate_set": { + "codes": [ + "370790", + "370710", + "854232", + "847330" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "3707_photochemical" + ], + "frozen_id": "v2.0.train.0084", + "hs2_label": "37", + "hs4_label": "3707", + "hs6_label": "370790", + "id": "SH-0084", + "justification_text": "Photoresists, developers, toners and similar photographic or photolithographic chemical preparations fall under 3707.90. Classified under HS 3707.90.", + "reference_ruling_ids": [ + "CROSS-087315", + "CROSS-W967818", + "EBTI-DE-DEF/3208/07-1", + "EBTI-NL-BEBTID.T.313.362", + "EBTI-NL-BEBTID.T.313.756", + "EBTI-NL-BED.T.275.088", + "CROSS-A85371", + "EBTI-EN-0004", + "EBTI-EN-0005", + "EBTI-EN-0006", + "EBTI-EN-0008", + "EBTI-EN-0009", + "EBTI-EN-0124", + "CROSS-085914", + "EBTI-EN-0120", + "EBTI-NL-BEBTID.T.313.533", + "CROSS-084572", + "CROSS-962911", + "EBTI-EN-0007", + "EBTI-EN-0115", + "EBTI-EN-0116", + "EBTI-EN-0117", + "EBTI-EN-0119", + "EBTI-EN-0123" + ], + "segment": "material", + "split": "train", + "tier1_description": "Anti-reflective coating material supplied as a chemical raw material for a research and development project (BOL text translated from Turkish: 'raw material, anti-reflective coating material, to be used exclusively for an R&D project'). Such products are organic polymer solutions spin-coated beneath or above photoresist layers to suppress substrate reflections and standing-wave effects during photolithographic exposure, improving pattern fidelity in semiconductor device fabrication", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Brewer Science", + "part_name": "K.madde(yansitma ÖnleyİCİ kaplama mlzm)" + } + }, + { + "bol_metadata": { + "bol_description": "B94618-22 DUV42S-6 AICELLO WITH GLASS NECK THREADS (RESEARCH PURPOSE ONLY", + "origin_country": "USA", + "shipper": "brewer science inc" + }, + "boundary_note": "Heading 3707 separates sensitised emulsions (3707.10) from other chemical preparations for photographic uses (3707.90).", + "candidate_set": { + "codes": [ + "854233", + "854159", + "370710", + "370790" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "3707_photochemical" + ], + "frozen_id": "v2.0.train.0085", + "hs2_label": "37", + "hs4_label": "3707", + "hs6_label": "370790", + "id": "SH-0085", + "justification_text": "Photoresists, developers, toners and similar photographic or photolithographic chemical preparations fall under 3707.90. Classified under HS 3707.90.", + "reference_ruling_ids": [ + "CROSS-087315", + "EBTI-EN-0004", + "EBTI-NL-BED.T.275.088", + "CROSS-W967818", + "EBTI-EN-0006", + "CROSS-085914", + "CROSS-A85371", + "EBTI-EN-0008", + "EBTI-EN-0009", + "EBTI-EN-0124", + "EBTI-NL-BEBTID.T.313.362", + "EBTI-NL-BEBTID.T.313.756", + "CROSS-084572", + "CROSS-L82279", + "EBTI-EN-0007", + "EBTI-EN-0120", + "EBTI-EN-0123" + ], + "segment": "material", + "split": "train", + "tier1_description": "Bottom anti-reflective coating solution for deep-ultraviolet (248 nm) photolithography with glass-thread neck, for research use. The organic polymer solution is spin-coated onto wafers beneath photoresist to absorb exposure light and suppress substrate reflections and standing waves, improving critical-dimension control; the cured film offers conformal coverage and fast dry-etch removal in semiconductor patterning", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Brewer Science", + "part_name": "B94618-22 DUV42S-6 aicello with glass" + } + }, + { + "bol_metadata": { + "bol_description": "1. ФОТОРЕЗИСТОР, DSAM-3020,;1 ГАЛЛОН", + "origin_country": "KR", + "shipper": "dongjin semichem co.,ltd" + }, + "boundary_note": "Heading 3707 separates sensitised emulsions (3707.10) from other chemical preparations for photographic uses (3707.90).", + "candidate_set": { + "codes": [ + "851680", + "370790", + "903039", + "370710" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "3707_photochemical" + ], + "frozen_id": "v2.0.train.0086", + "hs2_label": "37", + "hs4_label": "3707", + "hs6_label": "370790", + "id": "SH-0086", + "justification_text": "Photoresists, developers, toners and similar photographic or photolithographic chemical preparations fall under 3707.90. Classified under HS 3707.90.", + "reference_ruling_ids": [ + "CROSS-087315", + "CROSS-W967818", + "EBTI-EN-0004", + "EBTI-NL-BEBTID.T.313.362", + "EBTI-NL-BEBTID.T.313.756", + "EBTI-NL-BED.T.275.088", + "EBTI-EN-0008", + "EBTI-EN-0009", + "EBTI-EN-0124", + "CROSS-085914", + "CROSS-A85371", + "EBTI-NL-BEBTID.T.313.533", + "CROSS-084572", + "CROSS-962911", + "EBTI-EN-0006", + "EBTI-EN-0123" + ], + "segment": "material", + "split": "train", + "tier1_description": "Positive-tone liquid photoresist of the 3000-series with a viscosity of 20 cP. The light-sensitive resin solution is spin-coated onto semiconductor wafers and exposed in projection exposure systems and steppers requiring especially high resolution for IC, LSI and VLSI device patterning, then developed to form the etch mask for subsequent processing", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Dongjin Semichem", + "part_name": "1. ФОТОРЕЗИСТОР dsam-3020 1 ГАЛЛОН" + } + }, + { + "bol_metadata": { + "bol_description": "D15421002 CY_CHM_FLEXOSOL-I (5200 LT)", + "origin_country": "US", + "shipper": "dupont de nemours deutschland gmbh" + }, + "boundary_note": "Heading 3707 separates sensitised emulsions (3707.10) from other chemical preparations for photographic uses (3707.90).", + "candidate_set": { + "codes": [ + "370710", + "370790", + "284430", + "847150" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "3707_photochemical" + ], + "frozen_id": "v2.0.train.0087", + "hs2_label": "37", + "hs4_label": "3707", + "hs6_label": "370790", + "id": "SH-0087", + "justification_text": "Photoresists, developers, toners and similar photographic or photolithographic chemical preparations fall under 3707.90. Classified under HS 3707.90.", + "reference_ruling_ids": [ + "CROSS-087315", + "EBTI-DE-DEF/3208/07-1", + "EBTI-EN-0004", + "EBTI-EN-0006", + "CROSS-085914", + "CROSS-W967818", + "EBTI-EN-0007", + "EBTI-NL-BED.T.275.088", + "EBTI-PL-PLPL-WIT-2011-01241", + "CROSS-084572", + "CROSS-962911", + "EBTI-EN-0003", + "EBTI-EN-0005", + "EBTI-EN-0008", + "EBTI-EN-0120", + "EBTI-EN-0122", + "EBTI-EN-0123" + ], + "segment": "material", + "split": "train", + "tier1_description": "Washout solvent for flexographic photopolymer printing-plate processing. The blended organic solvent dissolves and removes the unexposed, non-crosslinked polymer areas of exposed photopolymer relief plates during plate development, leaving the cured printing image; the solvent is distillable and routinely recovered and recycled in plate-room solvent reclamation units", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "DuPont", + "part_name": "D15421002 CY_CHM_flexosol-I (5200 LT" + } + }, + { + "bol_metadata": { + "bol_description": "UV(TM) -2.5 POSITIVE DUV PHOTORESIST 1 GA COR", + "origin_country": "USA", + "shipper": "dupont specialty materials s p/l" + }, + "boundary_note": "Heading 3707 separates sensitised emulsions (3707.10) from other chemical preparations for photographic uses (3707.90).", + "candidate_set": { + "codes": [ + "902519", + "370790", + "370710", + "848640" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "3707_photochemical" + ], + "frozen_id": "v2.0.train.0088", + "hs2_label": "37", + "hs4_label": "3707", + "hs6_label": "370790", + "id": "SH-0088", + "justification_text": "Photoresists, developers, toners and similar photographic or photolithographic chemical preparations fall under 3707.90. Classified under HS 3707.90.", + "reference_ruling_ids": [ + "CROSS-087315", + "CROSS-W967818", + "EBTI-NL-BED.T.275.088", + "CROSS-084572", + "CROSS-086199", + "EBTI-DE-DE14599/11-1", + "EBTI-EN-0004", + "EBTI-EN-0008", + "EBTI-EN-0009", + "EBTI-EN-0124", + "CROSS-085914", + "CROSS-A85371", + "EBTI-FR-FR-RTC-2014-008498", + "EBTI-NL-BEBTID.T.313.362", + "EBTI-NL-BEBTID.T.313.756", + "CROSS-L82279", + "EBTI-EN-0005", + "EBTI-EN-0006" + ], + "segment": "material", + "split": "train", + "tier1_description": "Positive-tone deep-UV (248 nm) photoresist. The low-viscosity, chemically amplified resist solution permits reduced dispense volume and uniform spin-coated films of roughly 1.1 to 3.0 micrometers with thermal stability to about 150 degrees C. It is used for deep-implant and other semiconductor lithography steps and is processed with standard aqueous alkaline developers and edge-bead removers", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "DuPont", + "part_name": "UV(TM) -2.5 positive DUV photoresist 1" + } + }, + { + "bol_metadata": { + "bol_description": "MEGAPOSIT(TM) SPR(TM) 3617 POSTIVE PHOTORESIST 4 GA COR 4X1", + "origin_country": "USA", + "shipper": "dupont specialty materials s p/l" + }, + "boundary_note": "Heading 3707 separates sensitised emulsions (3707.10) from other chemical preparations for photographic uses (3707.90).", + "candidate_set": { + "codes": [ + "854239", + "370790", + "370710", + "902710" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "3707_photochemical" + ], + "frozen_id": "v2.0.train.0089", + "hs2_label": "37", + "hs4_label": "3707", + "hs6_label": "370790", + "id": "SH-0089", + "justification_text": "Photoresists, developers, toners and similar photographic or photolithographic chemical preparations fall under 3707.90. Classified under HS 3707.90.", + "reference_ruling_ids": [ + "CROSS-087315", + "CROSS-W967818", + "CROSS-A85371", + "EBTI-EN-0004", + "EBTI-NL-BED.T.275.088", + "CROSS-084572", + "CROSS-085914", + "EBTI-EN-0008", + "EBTI-EN-0009", + "EBTI-EN-0123", + "EBTI-EN-0124", + "EBTI-NL-BEBTID.T.313.362", + "EBTI-NL-BEBTID.T.313.756", + "CROSS-962911", + "EBTI-DE-DE14599/11-1", + "EBTI-EN-0005", + "EBTI-EN-0006", + "EBTI-EN-0117", + "EBTI-EN-0119", + "EBTI-EN-0120", + "EBTI-NL-NLRTD-2008-001486" + ], + "segment": "material", + "split": "train", + "tier1_description": "Positive-tone photoresist of a 3000-series product line. The light-sensitive novolak-based resin solution is spin-coated onto wafers and exposed with i-line or broadband UV steppers and aligners, then developed in aqueous alkaline developer to produce sub-micron patterns used as etch and implant masks in semiconductor and microelectronics fabrication", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "DuPont", + "part_name": "megaposit(TM) SPR(TM) 3617 postive" + } + }, + { + "bol_metadata": { + "bol_description": "EAGLE 2005 DEVELOPER PLASTIC", + "origin_country": "US", + "shipper": "dupont specialty materials hong kong limited" + }, + "boundary_note": "Heading 3707 separates sensitised emulsions (3707.10) from other chemical preparations for photographic uses (3707.90).", + "candidate_set": { + "codes": [ + "854110", + "370710", + "370790", + "852491" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "3707_photochemical" + ], + "frozen_id": "v2.0.train.0090", + "hs2_label": "37", + "hs4_label": "3707", + "hs6_label": "370790", + "id": "SH-0090", + "justification_text": "Photoresists, developers, toners and similar photographic or photolithographic chemical preparations fall under 3707.90. Classified under HS 3707.90.", + "reference_ruling_ids": [ + "CROSS-087315", + "EBTI-EN-0004", + "CROSS-A85371", + "CROSS-W967818", + "EBTI-EN-0008", + "EBTI-EN-0009", + "EBTI-EN-0124", + "CROSS-962911", + "CROSS-L82279", + "EBTI-EN-0005", + "EBTI-EN-0119", + "EBTI-EN-0120", + "EBTI-NL-BEBTID.T.313.362", + "EBTI-NL-BEBTID.T.313.533", + "EBTI-NL-BEBTID.T.313.756", + "EBTI-NL-BED.T.275.088", + "CROSS-084572", + "CROSS-085914", + "EBTI-DE-DE14599/11-1", + "EBTI-EN-0006", + "EBTI-EN-0117", + "EBTI-EN-0121", + "EBTI-EN-0123", + "EBTI-NL-NLRTD-2008-001486" + ], + "segment": "material", + "split": "train", + "tier1_description": "Liquid developer concentrate for photoresist processing. The aqueous alkaline working solution selectively dissolves the soluble areas of exposed photoresist film on printed circuit boards or similar substrates during the development step, revealing the patterned copper for subsequent etching or plating while the resist image remains as a protective mask", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "DuPont", + "part_name": "eagle 2005 developer plastic" + } + }, + { + "bol_metadata": { + "bol_description": "MICROLAP 305E-350", + "origin_country": "US", + "shipper": "entegris" + }, + "boundary_note": "Heading 3707 separates sensitised emulsions (3707.10) from other chemical preparations for photographic uses (3707.90).", + "candidate_set": { + "codes": [ + "370790", + "854370", + "850440", + "370710" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "3707_photochemical" + ], + "frozen_id": "v2.0.train.0091", + "hs2_label": "37", + "hs4_label": "3707", + "hs6_label": "370790", + "id": "SH-0091", + "justification_text": "Photoresists, developers, toners and similar photographic or photolithographic chemical preparations fall under 3707.90. Classified under HS 3707.90.", + "reference_ruling_ids": [ + "EBTI-EN-0004", + "EBTI-EN-0118", + "EBTI-FR-FR-RTC-2017-000604", + "CROSS-087315", + "EBTI-DE-DE14599/11-1", + "EBTI-EN-0006", + "EBTI-EN-0007" + ], + "segment": "material", + "split": "train", + "tier1_description": "Water-based diamond lapping and polishing slurry, grade 305E-350, containing fine synthetic diamond abrasive particles suspended in an aqueous carrier with corrosion inhibitors and suspension agents. It is used for bulk polishing of magnetic recording heads and similar precision components, providing high stock-removal rates while achieving low surface roughness with minimal diamond embedding in the workpiece", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Entegris", + "part_name": "microlap 305E-350" + } + }, + { + "bol_metadata": { + "bol_description": "FN-6S 5LX2(PHOTOGRAPHIC CHEMICALS)", + "origin_country": "JP", + "shipper": "fujifilm asia pacific pte ltd" + }, + "boundary_note": "Heading 3707 separates sensitised emulsions (3707.10) from other chemical preparations for photographic uses (3707.90).", + "candidate_set": { + "codes": [ + "370790", + "370710", + "854143", + "902710" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "3707_photochemical" + ], + "frozen_id": "v2.0.train.0092", + "hs2_label": "37", + "hs4_label": "3707", + "hs6_label": "370790", + "id": "SH-0092", + "justification_text": "Photoresists, developers, toners and similar photographic or photolithographic chemical preparations fall under 3707.90. Classified under HS 3707.90.", + "reference_ruling_ids": [ + "EBTI-EN-0004", + "CROSS-087315", + "EBTI-DE-DEF/3208/07-1", + "CROSS-W967818", + "EBTI-EN-0006", + "EBTI-FR-FR-RTC-2017-000604", + "EBTI-NL-BED.T.275.088", + "EBTI-PL-PLPL-WIT-2011-01241", + "CROSS-962911", + "CROSS-A85371", + "EBTI-EN-0003", + "EBTI-EN-0007", + "EBTI-EN-0118", + "EBTI-EN-0122" + ], + "segment": "material", + "split": "train", + "tier1_description": "Plate finishing gum solution for lithographic printing plates. The aqueous preparation of modified starches (hydroxypropyl starch and starch phosphate), gum arabic, benzyl alcohol and glycol is applied to developed offset plates as a protective finisher, desensitising the non-image areas and shielding the plate surface from oxidation and handling damage before press use", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "FUJIFILM", + "part_name": "FN-6S 5LX2(photographic chemicals)" + } + }, + { + "bol_metadata": { + "bol_description": "CP3R (4X100L)(PHOTOGRAPHIC CHEMICALS)", + "origin_country": "JP", + "shipper": "fujifilm asia pacific pte ltd" + }, + "boundary_note": "Heading 3707 separates sensitised emulsions (3707.10) from other chemical preparations for photographic uses (3707.90).", + "candidate_set": { + "codes": [ + "370790", + "847130", + "370710", + "847330" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "3707_photochemical" + ], + "frozen_id": "v2.0.train.0093", + "hs2_label": "37", + "hs4_label": "3707", + "hs6_label": "370790", + "id": "SH-0093", + "justification_text": "Photoresists, developers, toners and similar photographic or photolithographic chemical preparations fall under 3707.90. Classified under HS 3707.90.", + "reference_ruling_ids": [ + "EBTI-DE-DEF/3208/07-1", + "CROSS-087315", + "CROSS-962911", + "EBTI-EN-0005", + "CROSS-A85371", + "CROSS-W967818", + "CROSS-086199", + "EBTI-EN-0004", + "EBTI-EN-0008", + "EBTI-EN-0009", + "EBTI-EN-0124", + "EBTI-FR-FR-RTC-2017-000604", + "EBTI-NL-BEBTID.T.313.362", + "EBTI-NL-BEBTID.T.313.533", + "EBTI-NL-BEBTID.T.313.756", + "CROSS-084572", + "CROSS-L82279", + "EBTI-DE-DE14599/11-1", + "EBTI-EN-0007", + "EBTI-EN-0115", + "EBTI-EN-0116", + "EBTI-EN-0117", + "EBTI-EN-0119", + "EBTI-EN-0120", + "EBTI-EN-0123", + "EBTI-NL-NLRTD-2008-001486" + ], + "segment": "material", + "split": "train", + "tier1_description": "Photographic processing chemical, supplied as a replenisher-type preparation for graphic-arts or photofinishing process lines. Preparations of this kind are aqueous working solutions or concentrates, such as developer, fixer or rinse replenishers, dosed automatically into film, paper or printing-plate processors to maintain consistent processing activity across high-volume production runs", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "FUJIFILM", + "part_name": "CP3R (4X100L)(photographic chemicals)" + } + }, + { + "bol_metadata": { + "bol_description": "UNIPACK 90 2 X (PHOTOGRAPHIC CHEMICALS)", + "origin_country": "JP", + "shipper": "fujifilm asia pacific pte ltd" + }, + "boundary_note": "Heading 3707 separates sensitised emulsions (3707.10) from other chemical preparations for photographic uses (3707.90).", + "candidate_set": { + "codes": [ + "370790", + "370710", + "854142", + "854233" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "3707_photochemical" + ], + "frozen_id": "v2.0.train.0094", + "hs2_label": "37", + "hs4_label": "3707", + "hs6_label": "370790", + "id": "SH-0094", + "justification_text": "Photoresists, developers, toners and similar photographic or photolithographic chemical preparations fall under 3707.90. Classified under HS 3707.90.", + "reference_ruling_ids": [ + "CROSS-087315", + "EBTI-DE-DEF/3208/07-1", + "CROSS-962911", + "EBTI-EN-0004", + "CROSS-A85371", + "CROSS-W967818", + "EBTI-EN-0005", + "EBTI-EN-0007", + "EBTI-FR-FR-RTC-2017-000604", + "EBTI-NL-BEBTID.T.313.362", + "EBTI-NL-BEBTID.T.313.533", + "EBTI-NL-BEBTID.T.313.756", + "EBTI-PL-PLPL-WIT-2011-01241", + "CROSS-084572", + "CROSS-085914", + "CROSS-L82279", + "EBTI-DE-DE14599/11-1", + "EBTI-EN-0003", + "EBTI-EN-0008", + "EBTI-EN-0009", + "EBTI-EN-0115", + "EBTI-EN-0116", + "EBTI-EN-0117", + "EBTI-EN-0119", + "EBTI-EN-0120", + "EBTI-EN-0122", + "EBTI-EN-0123", + "EBTI-EN-0124", + "EBTI-NL-NLRTD-2008-001486" + ], + "segment": "material", + "split": "train", + "tier1_description": "One- photographic processing chemical supplied as, part of a single-component developer/replenisher series for graphic-arts processing. The aqueous alkaline preparation is dosed into automatic processors to develop exposed photosensitive film or printing plates, the unified single-part format simplifying mixing and replenishment while maintaining stable processing activity in high-volume prepress operations", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "FUJIFILM", + "part_name": "unipack 90 2 X (photographic chemicals)" + } + }, + { + "bol_metadata": { + "bol_description": "LH-D2RWS (PHOTOGRAPHIC CHEMICALS)", + "origin_country": "JP", + "shipper": "fujifilm asia pacific pte ltd" + }, + "boundary_note": "Heading 3707 separates sensitised emulsions (3707.10) from other chemical preparations for photographic uses (3707.90).", + "candidate_set": { + "codes": [ + "370710", + "370790", + "285000", + "854151" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "3707_photochemical" + ], + "frozen_id": "v2.0.train.0095", + "hs2_label": "37", + "hs4_label": "3707", + "hs6_label": "370790", + "id": "SH-0095", + "justification_text": "Photoresists, developers, toners and similar photographic or photolithographic chemical preparations fall under 3707.90. Classified under HS 3707.90.", + "reference_ruling_ids": [ + "CROSS-W967818", + "EBTI-DE-DEF/3208/07-1", + "CROSS-087315", + "EBTI-EN-0004", + "CROSS-A85371", + "EBTI-EN-0005", + "CROSS-962911", + "EBTI-FR-FR-RTC-2017-000604", + "EBTI-NL-BED.T.275.088", + "EBTI-PL-PLPL-WIT-2011-01241", + "CROSS-084572", + "EBTI-DE-DE14599/11-1", + "EBTI-EN-0003", + "EBTI-EN-0006", + "EBTI-EN-0122", + "EBTI-EN-0123", + "EBTI-NL-NLRTD-2008-001486" + ], + "segment": "material", + "split": "train", + "tier1_description": "Ready-to-use digital plate developer replenisher. The corrosive aqueous alkaline solution replenishes the working developer in processors for thermal computer-to-plate lithographic printing plates, maintaining consistent development activity while reducing chemistry consumption, processor maintenance and waste generation. It is used together with the corresponding ready-to-use working-tank developer for positive-working thermal plates", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "FUJIFILM", + "part_name": "LH-D2RWS (photographic chemicals)(216 DR" + } + }, + { + "bol_metadata": { + "bol_description": "SUPER 108 P1R 4 X (PHOTOGRAPHIC CHEMICALS)", + "origin_country": "JP", + "shipper": "fujifilm asia pacific pte ltd" + }, + "boundary_note": "Heading 3707 separates sensitised emulsions (3707.10) from other chemical preparations for photographic uses (3707.90).", + "candidate_set": { + "codes": [ + "903190", + "370790", + "370710", + "280530" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "3707_photochemical" + ], + "frozen_id": "v2.0.train.0096", + "hs2_label": "37", + "hs4_label": "3707", + "hs6_label": "370790", + "id": "SH-0096", + "justification_text": "Photoresists, developers, toners and similar photographic or photolithographic chemical preparations fall under 3707.90. Classified under HS 3707.90.", + "reference_ruling_ids": [ + "CROSS-087315", + "CROSS-W967818", + "EBTI-EN-0004", + "EBTI-EN-0005", + "CROSS-962911", + "CROSS-A85371", + "EBTI-DE-DEF/3208/07-1", + "EBTI-FR-FR-RTC-2017-000604", + "EBTI-NL-BED.T.275.088", + "CROSS-084572", + "EBTI-DE-DE14599/11-1", + "EBTI-EN-0006", + "EBTI-EN-0007", + "EBTI-EN-0121", + "EBTI-EN-0123", + "EBTI-NL-NLRTD-2008-001486" + ], + "segment": "material", + "split": "train", + "tier1_description": "Color paper developer replenisher concentrate, packed to make four batches of working solution. The single-part preparation replenishes the developer stage of RA-4 type minilab and photofinishing paper processors handling silver-halide color photographic paper, restoring developing-agent activity and pH so that print density and color balance remain consistent in average-to-high volume print production", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "FUJIFILM", + "part_name": "super 108 P1R 4 X (photographic" + } + }, + { + "bol_metadata": { + "bol_description": "CP-49HV II PC/ CP-49LR PC X2(PHOTOGRAPHIC CHEMICALS)", + "origin_country": "JP", + "shipper": "fujifilm asia pacific pte ltd" + }, + "boundary_note": "Heading 3707 separates sensitised emulsions (3707.10) from other chemical preparations for photographic uses (3707.90).", + "candidate_set": { + "codes": [ + "370710", + "853890", + "844332", + "370790" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "3707_photochemical" + ], + "frozen_id": "v2.0.train.0097", + "hs2_label": "37", + "hs4_label": "3707", + "hs6_label": "370790", + "id": "SH-0097", + "justification_text": "Photoresists, developers, toners and similar photographic or photolithographic chemical preparations fall under 3707.90. Classified under HS 3707.90.", + "reference_ruling_ids": [ + "CROSS-962911", + "EBTI-DE-DEF/3208/07-1", + "EBTI-EN-0005", + "EBTI-IT-ITIT-2012-0219M-277100", + "EBTI-NL-NLRTD-2008-001486", + "CROSS-087315", + "CROSS-W561705", + "CROSS-A85371", + "CROSS-W967818", + "EBTI-DE-DE14599/11-1", + "EBTI-DE-DEF/4321/07-1", + "EBTI-EN-0123", + "CROSS-084572", + "EBTI-CZ-CZ35-0277-2013", + "EBTI-EN-0002", + "EBTI-EN-0004", + "EBTI-EN-0115", + "EBTI-EN-0116", + "EBTI-EN-0117", + "EBTI-EN-0119", + "EBTI-EN-0120", + "EBTI-FR-FR-RTC-2014-008498", + "EBTI-FR-FR-RTC-2017-000604", + "EBTI-IT-ITIT-2013-0196M-084100", + "EBTI-NL-BED.T.275.088", + "EBTI-PL-PLPL-WIT-2011-01241", + "EBTI-EN-0003", + "EBTI-EN-0008", + "EBTI-EN-0009", + "EBTI-EN-0118", + "EBTI-EN-0121", + "EBTI-EN-0122", + "EBTI-EN-0124" + ], + "segment": "material", + "split": "train", + "tier1_description": "Packaged color-paper processing chemistry kit for photographic minilab printers, supplied as concentrate cartridges (developer, bleach-fix and rinse parts) in a low-replenishment-rate formulation. The aqueous chemical preparations are metered into the printer's processing tanks to develop, bleach-fix and stabilize silver-halide color photographic paper during print production", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "FUJIFILM", + "part_name": "CP-49HV II PC/ CP-49LR PC" + } + }, + { + "bol_metadata": { + "bol_description": "CP-49HV II PC CP-49LR PCX2 (PHOTOGRAPHIC CHEMICAL)", + "origin_country": "JP", + "shipper": "fujifilm asia pacific pte ltd" + }, + "boundary_note": "Heading 3707 separates sensitised emulsions (3707.10) from other chemical preparations for photographic uses (3707.90).", + "candidate_set": { + "codes": [ + "370790", + "903084", + "370710", + "903180" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "3707_photochemical" + ], + "frozen_id": "v2.0.train.0098", + "hs2_label": "37", + "hs4_label": "3707", + "hs6_label": "370790", + "id": "SH-0098", + "justification_text": "Photoresists, developers, toners and similar photographic or photolithographic chemical preparations fall under 3707.90. Classified under HS 3707.90.", + "reference_ruling_ids": [ + "CROSS-962911", + "EBTI-DE-DEF/3208/07-1", + "EBTI-EN-0005", + "EBTI-NL-NLRTD-2008-001486", + "CROSS-087315", + "CROSS-A85371", + "CROSS-W967818", + "EBTI-IT-ITIT-2012-0219M-277100", + "CROSS-W561705", + "EBTI-DE-DE14599/11-1", + "EBTI-DE-DEF/4321/07-1", + "EBTI-EN-0004", + "EBTI-EN-0123", + "EBTI-CZ-CZ35-0277-2013", + "EBTI-EN-0002", + "EBTI-FR-FR-RTC-2014-008498", + "EBTI-FR-FR-RTC-2017-000604", + "EBTI-IT-ITIT-2013-0196M-084100", + "EBTI-NL-BEBTID.T.313.362", + "EBTI-NL-BEBTID.T.313.533", + "EBTI-NL-BEBTID.T.313.756", + "EBTI-NL-BED.T.275.088", + "EBTI-PL-PLPL-WIT-2011-01241", + "CROSS-084572", + "EBTI-EN-0003", + "EBTI-EN-0007", + "EBTI-EN-0008", + "EBTI-EN-0009", + "EBTI-EN-0117", + "EBTI-EN-0119", + "EBTI-EN-0120", + "EBTI-EN-0122", + "EBTI-EN-0124" + ], + "segment": "material", + "split": "train", + "tier1_description": "Color-paper processing chemical kit for photographic minilab printers, comprising concentrate cartridges of developer, bleach-fix and rinse solutions in a low-replenishment-rate variant. The measured chemical preparations are, where they develop the latent image on silver-halide color paper, remove residual silver compounds and stabilize the finished photographic prints", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "FUJIFILM", + "part_name": "CP-49HV II PC CP-49LR PCX2" + } + }, + { + "bol_metadata": { + "bol_description": "SUPER 108 P1R 4X10L (PHOTOGRAPHIC CHEMICAL)", + "origin_country": "JP", + "shipper": "fujifilm asia pacific pte ltd" + }, + "boundary_note": "Heading 3707 separates sensitised emulsions (3707.10) from other chemical preparations for photographic uses (3707.90).", + "candidate_set": { + "codes": [ + "370710", + "282612", + "370790", + "710499" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "3707_photochemical" + ], + "frozen_id": "v2.0.train.0099", + "hs2_label": "37", + "hs4_label": "3707", + "hs6_label": "370790", + "id": "SH-0099", + "justification_text": "Photoresists, developers, toners and similar photographic or photolithographic chemical preparations fall under 3707.90. Classified under HS 3707.90.", + "reference_ruling_ids": [ + "CROSS-087315", + "CROSS-W967818", + "EBTI-FR-FR-RTC-2017-000604", + "CROSS-962911", + "CROSS-A85371", + "EBTI-EN-0005", + "EBTI-DE-DEF/3208/07-1", + "EBTI-EN-0004", + "EBTI-EN-0007", + "CROSS-084572", + "CROSS-W561705", + "EBTI-DE-DE14599/11-1", + "EBTI-EN-0006", + "EBTI-EN-0123", + "EBTI-NL-NLRTD-2008-001486" + ], + "segment": "material", + "split": "train", + "tier1_description": "Color developer replenisher concentrate for silver-halide color paper processing, packed, formulated for a replenishment rate of about per square metre of paper. The alkaline aqueous preparation containing a para-phenylenediamine developing agent is dosed into the first developer tank of photographic print processors to maintain developer activity", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "FUJIFILM", + "part_name": "super 108 P1R 4X10L (photographic" + } + }, + { + "bol_metadata": { + "bol_description": "CP3R[4X100L (PHOTOGRAPHIC CHEMICAL)", + "origin_country": "JP", + "shipper": "fujifilm asia pacific pte ltd" + }, + "boundary_note": "Heading 3707 separates sensitised emulsions (3707.10) from other chemical preparations for photographic uses (3707.90).", + "candidate_set": { + "codes": [ + "848610", + "854130", + "370710", + "370790" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "3707_photochemical" + ], + "frozen_id": "v2.0.train.0100", + "hs2_label": "37", + "hs4_label": "3707", + "hs6_label": "370790", + "id": "SH-0100", + "justification_text": "Photoresists, developers, toners and similar photographic or photolithographic chemical preparations fall under 3707.90. Classified under HS 3707.90.", + "reference_ruling_ids": [ + "EBTI-EN-0005", + "CROSS-087315", + "CROSS-962911", + "EBTI-DE-DEF/3208/07-1", + "CROSS-A85371", + "CROSS-W967818", + "EBTI-EN-0004", + "EBTI-FR-FR-RTC-2017-000604", + "EBTI-EN-0007", + "EBTI-EN-0008", + "EBTI-EN-0009", + "EBTI-EN-0120", + "EBTI-EN-0124" + ], + "segment": "material", + "split": "train", + "tier1_description": "Replenisher concentrate for the third stage of color photographic paper processing, for high-volume print labs. The aqueous chemical preparation is metered into the rinse or stabilizer tank of paper processors after development and bleach-fixing to wash out residual processing chemicals and stabilize the dye image of finished prints", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "FUJIFILM", + "part_name": "CP3R[4X100L (photographic chemical" + } + }, + { + "bol_metadata": { + "bol_description": "PROPYLENE GLYCOL MONOMETHYL ETHER ACETATE RESIN SOLUTION 1-METHOXY-2-PROPANOL", + "origin_country": "Japan", + "shipper": "jsr corporation" + }, + "boundary_note": "Heading 3707 separates sensitised emulsions (3707.10) from other chemical preparations for photographic uses (3707.90).", + "candidate_set": { + "codes": [ + "280410", + "370790", + "370710", + "851680" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "3707_photochemical" + ], + "frozen_id": "v2.0.train.0101", + "hs2_label": "37", + "hs4_label": "3707", + "hs6_label": "370790", + "id": "SH-0101", + "justification_text": "Photoresists, developers, toners and similar photographic or photolithographic chemical preparations fall under 3707.90. Classified under HS 3707.90.", + "reference_ruling_ids": [ + "CROSS-087315", + "EBTI-NL-BED.T.275.088", + "EBTI-EN-0006", + "CROSS-084572", + "CROSS-085914", + "CROSS-W967818", + "EBTI-EN-0004", + "EBTI-EN-0007", + "EBTI-EN-0008", + "EBTI-NL-BEBTID.T.313.362", + "EBTI-NL-BEBTID.T.313.756", + "CROSS-L82279", + "EBTI-EN-0009", + "EBTI-EN-0123", + "EBTI-EN-0124" + ], + "segment": "material", + "split": "train", + "tier1_description": "Polymer resin solution dissolved in propylene glycol monomethyl ether acetate with 1-methoxy-2-propanol co-solvent, prepared for semiconductor photolithography. The spin-coatable formulation deposits a uniform radiation-sensitive or ancillary resist-process film on silicon wafers, where exposure and development define microcircuit patterns. For cleanroom wafer-fabrication use", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "JSR Corporation", + "part_name": "propylene glycol monomethyl ether" + } + }, + { + "bol_metadata": { + "bol_description": "DIISOPENTYL ETHER RESIN SOLUTION ORGANIC SULFONIUM COMPOUND N-AMYL METHYL KETONE PACKING MATERIAL", + "origin_country": "Japan", + "shipper": "jsr corporation" + }, + "boundary_note": "Heading 3707 separates sensitised emulsions (3707.10) from other chemical preparations for photographic uses (3707.90).", + "candidate_set": { + "codes": [ + "902519", + "370790", + "903039", + "370710" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "3707_photochemical" + ], + "frozen_id": "v2.0.train.0102", + "hs2_label": "37", + "hs4_label": "3707", + "hs6_label": "370790", + "id": "SH-0102", + "justification_text": "Photoresists, developers, toners and similar photographic or photolithographic chemical preparations fall under 3707.90. Classified under HS 3707.90.", + "reference_ruling_ids": [ + "CROSS-087315", + "EBTI-NL-BED.T.275.088", + "EBTI-EN-0004", + "CROSS-W967818", + "EBTI-EN-0006", + "CROSS-085914", + "EBTI-EN-0007", + "EBTI-EN-0123", + "CROSS-084572", + "CROSS-A85371", + "EBTI-EN-0008", + "EBTI-EN-0009", + "EBTI-EN-0120", + "EBTI-EN-0124", + "EBTI-FR-FR-RTC-2017-000604", + "EBTI-NL-BEBTID.T.313.362", + "EBTI-NL-BEBTID.T.313.756", + "EBTI-EN-0005", + "EBTI-EN-0115", + "EBTI-EN-0116", + "EBTI-EN-0117", + "EBTI-EN-0119" + ], + "segment": "material", + "split": "train", + "tier1_description": "Chemically amplified photoresist formulation for semiconductor lithography: a polymer resin solution containing an organic sulfonium-salt photoacid generator with diisopentyl ether and n-amyl methyl ketone solvents, supplied with associated packing material. When spin-coated on wafers and exposed to deep-ultraviolet radiation, the sulfonium compound releases acid that alters resin solubility, enabling development of fine circuit patterns", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "JSR Corporation", + "part_name": "diisopentyl ether resin solution" + } + }, + { + "bol_metadata": { + "bol_description": "200MM SILICON WAFER", + "origin_country": "CN", + "shipper": "chongqing advanced silicon technolo" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "903039", + "903040", + "381800", + "854151" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0103", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0103", + "justification_text": "Doped chemical elements or compounds for electronics, in wafer/disc forms, are covered by heading 3818. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-953265", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-N223365", + "CROSS-880773", + "CROSS-842711", + "CROSS-G86346", + "CROSS-N332099", + "EBTI-DE-DEBTI17180/20-1", + "EBTI-FR-FR-PRO-2010-002956-02" + ], + "segment": "material", + "split": "train", + "tier1_description": "200 mm diameter monocrystalline silicon wafer produced for the semiconductor industry, cut from a Czochralski-grown single-crystal ingot, edge-profiled, polished and doped to controlled resistivity. Wafers of this size are used as substrates for fabricating power devices, analog circuits, microcontrollers and other integrated circuits in 200 mm fabs. Supplied in sealed cassettes under cleanroom conditions", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Chongqing Advanced Silicon Technology", + "part_name": "200MM wafer" + } + }, + { + "bol_metadata": { + "bol_description": "FRGJ-010006-0 C P/N 300-01960 SN WAFER T775S008-12INCH -00", + "origin_country": "Japan", + "shipper": "disco hi-tec singapore pte ltd" + }, + "boundary_note": "Doped vs undoped material: chemical elements doped for use in electronics (3818.00) vs high-purity elemental silicon (2804.61) vs nitrides and silicides such as GaN (2850.00); doping and intended electronic use decide.", + "candidate_set": { + "codes": [ + "850440", + "285000", + "280461", + "381800" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "doped_vs_undoped" + ], + "frozen_id": "v2.0.train.0104", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0104", + "justification_text": "Doped chemical elements or compounds for electronics, in wafer/disc forms, are covered by heading 3818. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-953265", + "CROSS-N223365", + "CROSS-880773", + "CROSS-842711", + "CROSS-G86346", + "CROSS-N332099", + "EBTI-DE-DEBTI17180/20-1", + "EBTI-FR-FR-PRO-2010-002956-02" + ], + "segment": "material", + "split": "train", + "tier1_description": "300 mm (12 inch) silicon wafer supplied as a process and test consumable for semiconductor back-end equipment, identified by internal part and lot numbers. Wafers of this type are used for machine setup, qualification and dicing or grinding trials on wafer-processing tools, and consist of doped monocrystalline silicon polished to standard substrate specifications. Packed individually in protective shippers", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "DISCO Corporation", + "part_name": "frgj-010006-0 C P/N 300-01960 SN wafer" + } + }, + { + "bol_metadata": { + "bol_description": "SIC WAFER", + "origin_country": "TW", + "shipper": "globalwafers co., ltd" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "854231", + "844332", + "381800", + "280410" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0105", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0105", + "justification_text": "Doped chemical elements or compounds for electronics, in wafer/disc forms, are covered by heading 3818. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-953265", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-880773", + "CROSS-G86346", + "CROSS-N223365", + "CROSS-N332099", + "EBTI-DE-DEBTI17180/20-1", + "CROSS-842711", + "EBTI-FR-FR-PRO-2010-002956-02" + ], + "segment": "material", + "split": "train", + "tier1_description": "Silicon carbide single-crystal wafer used as a substrate for wide-bandgap power and radio-frequency semiconductor devices. The wafer is sliced from a grown silicon carbide boule, polished to an epitaxy-ready surface and doped to a defined conductivity type, offering high breakdown field and thermal conductivity for fabricating power MOSFETs, Schottky diodes and RF transistors. Supplied in cleanroom cassettes", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "GlobalWafers", + "part_name": "SIC wafer" + } + }, + { + "bol_metadata": { + "bol_description": "SILICON WAFERS", + "origin_country": "FI", + "shipper": "okmetic oy" + }, + "boundary_note": "Worked synthetic crystal (7104.99) vs element doped for use in electronics (3818.00) vs optical element (9001.90); working, doping and optical function decide.", + "candidate_set": { + "codes": [ + "853610", + "903039", + "851840", + "381800" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "crystal_substrate_boundary" + ], + "frozen_id": "v2.0.train.0106", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0106", + "justification_text": "Doped chemical elements or compounds for electronics, in wafer/disc forms, are covered by heading 3818. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-953265", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-N223365", + "CROSS-880773", + "CROSS-842711", + "CROSS-G86346", + "CROSS-N332099", + "EBTI-DE-DEBTI17180/20-1", + "EBTI-FR-FR-PRO-2010-002956-02" + ], + "segment": "material", + "split": "train", + "tier1_description": "Monocrystalline silicon wafers in 150-200 mm diameters intended for MEMS, sensor, radio-frequency and power device manufacture. Each wafer is sliced from a single-crystal ingot, doped to customer-specified resistivity and crystal orientation, then lapped and polished; variants include double-side polished and bonded silicon-on-insulator constructions. The wafers act as substrates for micromachining and semiconductor device fabrication lines", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Okmetic", + "part_name": "silicon wafers" + } + }, + { + "bol_metadata": { + "bol_description": "DOPED SILICON WAFER", + "origin_country": "US", + "shipper": "on semiconductor cz, s.r.o" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "370790", + "903084", + "850440", + "381800" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0107", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0107", + "justification_text": "Doped chemical elements or compounds for electronics, in wafer/disc forms, are covered by heading 3818. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-953265", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-880773", + "CROSS-G86346", + "CROSS-N223365", + "CROSS-N332099", + "EBTI-DE-DEBTI17180/20-1", + "CROSS-842711", + "EBTI-FR-FR-PRO-2010-002956-02" + ], + "segment": "material", + "split": "train", + "tier1_description": "Doped monocrystalline silicon wafer for semiconductor device production. The wafer is sliced from a single-crystal ingot grown with deliberate dopant addition (such as boron, phosphorus or arsenic) to achieve a defined conductivity type and resistivity, then ground and polished to substrate flatness. It serves as the starting material for fabricating discrete power devices, analog circuits and sensor chips", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "onsemi", + "part_name": "doped silicon wafer" + } + }, + { + "bol_metadata": { + "bol_description": "DOUBLE-POLISHED WAFER", + "origin_country": "KR", + "shipper": "sk siltron co., ltd" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "854190", + "381800", + "851762", + "847130" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0108", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0108", + "justification_text": "Doped chemical elements or compounds for electronics, in wafer/disc forms, are covered by heading 3818. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-953265", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-880773", + "CROSS-G86346", + "CROSS-N223365", + "CROSS-N332099", + "EBTI-DE-DEBTI17180/20-1", + "CROSS-842711", + "EBTI-FR-FR-PRO-2010-002956-02" + ], + "segment": "material", + "split": "train", + "tier1_description": "Double-side polished monocrystalline silicon wafer for semiconductor manufacture. Sliced from high-purity single-crystal silicon doped to a controlled resistivity, the wafer is polished to a mirror finish on both faces, providing the superior flatness and parallelism required for bonding, MEMS processing and advanced lithography. Supplied in sealed cassettes under shipper load and count terms", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "SK Siltron", + "part_name": "double-polished wafer" + } + }, + { + "bol_metadata": { + "bol_description": "POLISHED SILICON WAFER", + "origin_country": "KR", + "shipper": "sk siltron inc" + }, + "boundary_note": "Doped vs undoped material: chemical elements doped for use in electronics (3818.00) vs high-purity elemental silicon (2804.61) vs nitrides and silicides such as GaN (2850.00); doping and intended electronic use decide. Worked synthetic crystal (7104.99) vs element doped for use in electronics (3818.00) vs optical element (9001.90); working, doping and optical function decide.", + "candidate_set": { + "codes": [ + "381800", + "902590", + "903082", + "853669" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "doped_vs_undoped", + "crystal_substrate_boundary" + ], + "frozen_id": "v2.0.train.0109", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0109", + "justification_text": "Doped chemical elements or compounds for electronics, in wafer/disc forms, are covered by heading 3818. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-953265", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-880773", + "CROSS-842711", + "CROSS-G86346", + "CROSS-N223365", + "CROSS-N332099", + "EBTI-DE-DEBTI17180/20-1", + "EBTI-FR-FR-PRO-2010-002956-02" + ], + "segment": "material", + "split": "train", + "tier1_description": "Polished monocrystalline silicon wafer, a thin disc of single-crystal silicon manufactured from high-purity polysilicon through melting, crystal growth, slicing, polishing and cleaning, and doped to a specified resistivity. Produced in 200 mm and 300 mm diameters with mirror-finished surfaces, such wafers are the base substrates for memory chips, logic devices and display driver integrated circuits", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "SK Siltron", + "part_name": "polished silicon wafer" + } + }, + { + "bol_metadata": { + "bol_description": "SILICON WAFER(PP BOXES", + "origin_country": "Japan", + "shipper": "s.e.h malaysia sdn-bhd" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "852351", + "381800", + "854151", + "847150" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0110", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0110", + "justification_text": "Doped chemical elements or compounds for electronics, in wafer/disc forms, are covered by heading 3818. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-953265", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-N223365", + "CROSS-880773", + "CROSS-842711", + "CROSS-G86346", + "CROSS-N332099", + "EBTI-DE-DEBTI17180/20-1", + "EBTI-FR-FR-PRO-2010-002956-02" + ], + "segment": "material", + "split": "train", + "tier1_description": "Monocrystalline silicon wafers for semiconductor device fabrication, supplied as. Each wafer is sliced from a doped single-crystal silicon ingot, edge-profiled and polished to semiconductor substrate specifications, providing the base material on which integrated circuits and discrete devices are built through wafer-fab processing. Produced at a Southeast Asian wafer plant of a major silicon producer", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Shin-Etsu Handotai", + "part_name": "silicon wafer(PP boxes" + } + }, + { + "bol_metadata": { + "bol_description": "SI-WAFER ON", + "origin_country": "DE", + "shipper": "siltronic ag" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "284430", + "854231", + "381800", + "847330" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0111", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0111", + "justification_text": "Doped chemical elements or compounds for electronics, in wafer/disc forms, are covered by heading 3818. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-953265", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-880773", + "CROSS-N223365", + "CROSS-842711", + "CROSS-G86346", + "CROSS-N332099", + "EBTI-DE-DEBTI17180/20-1", + "EBTI-FR-FR-PRO-2010-002956-02" + ], + "segment": "material", + "split": "train", + "tier1_description": "Monocrystalline silicon wafers supplied in bulk on. Each wafer is a thin polished disc sliced from a hyperpure single-crystal silicon ingot grown by the Czochralski or float-zone method and doped with elements such as boron, phosphorus, arsenic or antimony to set its electrical resistivity. The wafers serve as the starting substrate on which integrated circuits and discrete semiconductor devices are fabricated", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Siltronic", + "part_name": "SI-wafer on" + } + }, + { + "bol_metadata": { + "bol_description": "ON S.L.A.C. SILICON WAFER 300MM SCAC SSLL AMS", + "origin_country": "DE", + "shipper": "siltronic ag" + }, + "boundary_note": "Worked synthetic crystal (7104.99) vs element doped for use in electronics (3818.00) vs optical element (9001.90); working, doping and optical function decide.", + "candidate_set": { + "codes": [ + "381800", + "844332", + "851310", + "854130" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "crystal_substrate_boundary" + ], + "frozen_id": "v2.0.train.0112", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0112", + "justification_text": "Doped chemical elements or compounds for electronics, in wafer/disc forms, are covered by heading 3818. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-953265", + "CROSS-880773", + "CROSS-842711", + "CROSS-G86346", + "CROSS-N223365", + "CROSS-N332099", + "EBTI-DE-DEBTI17180/20-1", + "EBTI-FR-FR-PRO-2010-002956-02" + ], + "segment": "material", + "split": "train", + "tier1_description": "Polished 300 mm diameter monocrystalline silicon wafers. The wafers are sliced from hyperpure single-crystal silicon ingots, doped during crystal growth to a specified resistivity, then ground and chemical-mechanically polished to an extremely flat mirror surface. Wafers of this diameter are used in high-volume fabrication of logic and memory integrated circuits, providing the substrate on which device layers are built", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Siltronic", + "part_name": "on S.L.A.C. silicon wafer 300MM scac" + } + }, + { + "bol_metadata": { + "bol_description": "HYPER PURE SILICON, MONO, STANDARD,WAFER, POLISHED", + "origin_country": "DE", + "shipper": "siltronic ag" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "381800", + "761699", + "854110", + "854151" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0113", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0113", + "justification_text": "Doped chemical elements or compounds for electronics, in wafer/disc forms, are covered by heading 3818. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-953265", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-880773", + "CROSS-842711", + "CROSS-G86346", + "CROSS-N223365", + "CROSS-N332099", + "EBTI-DE-DEBTI17180/20-1", + "EBTI-FR-FR-PRO-2010-002956-02" + ], + "segment": "material", + "split": "train", + "tier1_description": "Hyperpure monocrystalline silicon wafers, standard diameter, single-side polished, supplied in a lot. Each wafer is a thin circular slice of single-crystal silicon doped to a controlled resistivity during ingot growth, then lapped, etched and chemical-mechanically polished to a defect-free mirror finish. Such polished wafers are the base substrates for manufacturing integrated circuits, power devices and sensors", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Siltronic", + "part_name": "hyper pure silicon mono standard wafer" + } + }, + { + "bol_metadata": { + "bol_description": "HYPER PURE SILICON, MONO, STANDARDWAFER, POLISHED[ ITEM NO : 71 ]", + "origin_country": "DE", + "shipper": "siltronic ag" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "854231", + "854233", + "381800", + "847130" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0114", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0114", + "justification_text": "Doped chemical elements or compounds for electronics, in wafer/disc forms, are covered by heading 3818. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-N223365", + "CROSS-953265", + "CROSS-880773", + "EBTI-DE-DEBTI17180/20-1", + "CROSS-842711", + "CROSS-G86346", + "CROSS-N332099", + "EBTI-FR-FR-PRO-2010-002956-02" + ], + "segment": "material", + "split": "train", + "tier1_description": "Standard-size hyperpure monocrystalline silicon wafers with a polished surface. The wafers are cut from a dislocation-free single-crystal silicon ingot doped with controlled amounts of boron, phosphorus or other dopants, then edge-rounded, lapped and polished to precise flatness and surface-quality specifications. They are used as starting substrates in semiconductor device fabrication, including logic, memory, analog and power components", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Siltronic", + "part_name": "hyper pure silicon mono standardwafer" + } + }, + { + "bol_metadata": { + "bol_description": "ON S.L.A.C. HYPER PURE SILICON, MONO, LARGE WAFER, POLISHED SCAC SSLL AMS", + "origin_country": "DE", + "shipper": "siltronic ag" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "381800", + "848690", + "903141", + "903033" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0115", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0115", + "justification_text": "Doped chemical elements or compounds for electronics, in wafer/disc forms, are covered by heading 3818. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-953265", + "CROSS-880773", + "CROSS-842711", + "CROSS-G86346", + "CROSS-N223365", + "CROSS-N332099", + "EBTI-DE-DEBTI17180/20-1", + "EBTI-FR-FR-PRO-2010-002956-02" + ], + "segment": "material", + "split": "train", + "tier1_description": "Large-diameter hyperpure monocrystalline silicon wafers, polished, supplied on. Each wafer is a thin disc sliced from a doped single-crystal silicon ingot and finished by chemical-mechanical polishing to a mirror-like, ultraflat surface. Large-format polished wafers of this type, typically 300 mm in diameter, are used as substrates for high-volume production of advanced logic and memory integrated circuits", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Siltronic", + "part_name": "on S.L.A.C. hyper pure silicon mono" + } + }, + { + "bol_metadata": { + "bol_description": "ON S.L.A.C. SI-WAFER SCAC SSLL AMS", + "origin_country": "DE", + "shipper": "siltronic ag" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "850490", + "381800", + "848620", + "844332" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0116", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0116", + "justification_text": "Doped chemical elements or compounds for electronics, in wafer/disc forms, are covered by heading 3818. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-953265", + "CROSS-N223365", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-880773", + "EBTI-DE-DEBTI17180/20-1", + "CROSS-842711", + "CROSS-G86346", + "CROSS-N332099", + "EBTI-FR-FR-PRO-2010-002956-02" + ], + "segment": "material", + "split": "train", + "tier1_description": "Monocrystalline silicon wafers supplied on. The wafers are thin polished discs of hyperpure single-crystal silicon, doped during ingot growth to achieve a specified electrical resistivity and conductivity type. After slicing, the wafers are edge-profiled, lapped, etched and polished. They function as the foundational substrate material on which semiconductor manufacturers fabricate integrated circuits and discrete electronic devices", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Siltronic", + "part_name": "on S.L.A.C. SI-wafer scac ssll AMS" + } + }, + { + "bol_metadata": { + "bol_description": "RECLAIMED WAFERS", + "origin_country": "US", + "shipper": "texas instruments inc" + }, + "boundary_note": "Worked synthetic crystal (7104.99) vs element doped for use in electronics (3818.00) vs optical element (9001.90); working, doping and optical function decide.", + "candidate_set": { + "codes": [ + "280530", + "844332", + "851310", + "381800" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "crystal_substrate_boundary" + ], + "frozen_id": "v2.0.train.0117", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0117", + "justification_text": "Doped chemical elements or compounds for electronics, in wafer/disc forms, are covered by heading 3818. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-N223365", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-880773", + "CROSS-953265", + "CROSS-842711" + ], + "segment": "material", + "split": "train", + "tier1_description": "Reclaimed silicon wafers: used monocrystalline silicon wafers that have been stripped of previously deposited films and patterns, then re-ground, etched and chemical-mechanically re-polished to restore a clean, flat surface. Reclaimed wafers retain their original doping and crystal orientation and are reused in semiconductor fabs as test, monitor and dummy wafers for equipment qualification and process control rather than for production devices", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Texas Instruments", + "part_name": "reclaimed wafers" + } + }, + { + "bol_metadata": { + "bol_description": "ЕЛЕМЕНТИ ХІМІЧНІ ЛЕГОВАНІ, ПРИЗНАЧЕНІ ДЛЯ ВИКОРИСТАННЯ В ЕЛЕКТРОНІЦІ, У ВИГЛЯДІ ДИСКІВ, ПЛАСТИН ТОЩО; ХІМІЧНІ СПОЛУКИ ЛЕГОВАНІ, ПРИЗНАЧЕНІ ДЛЯ ВИКОРИСТАННЯ В ЕЛЕКТРОНІЦІ: - КРЕМНІЙ ЛЕГОВАНИЙ", + "origin_country": "DK", + "shipper": "topsil globalwafers a/s" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "381800", + "854121", + "903090", + "851840" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0118", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0118", + "justification_text": "Doped chemical elements or compounds for electronics, in wafer/disc forms, are covered by heading 3818. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-953265", + "CROSS-880773", + "CROSS-957293", + "CROSS-N332099", + "CROSS-842711", + "CROSS-G86346", + "EBTI-NL-NLRTD-2014-1125", + "EBTI-DE-DEBTI17180/20-1", + "EBTI-FR-FR-PRO-2010-002956-02", + "CROSS-N223365" + ], + "segment": "material", + "split": "train", + "tier1_description": "Doped silicon in wafer form for use in electronics (translated from Ukrainian: doped chemical elements intended for electronics, in the form of discs and plates; doped silicon). The producer specializes in ultra-pure float-zone monocrystalline silicon, doped to precise resistivity and sliced into polished wafers up to 200 mm diameter, used as substrates for power semiconductors, photodetectors and high-voltage devices", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Topsil GlobalWafers", + "part_name": "ЕЛЕМЕНТИ ХІМІЧНІ ЛЕГОВАНІ ПРИЗНАЧЕНІ" + } + }, + { + "bol_metadata": { + "bol_description": "WAFER - (67,783.00", + "origin_country": "Taiwan", + "shipper": "win semiconductors corp" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "847130", + "903090", + "381800", + "902710" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0119", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0119", + "justification_text": "Doped chemical elements or compounds for electronics, in wafer/disc forms, are covered by heading 3818. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-N223365", + "CROSS-953265", + "CROSS-842711", + "EBTI-DE-DEBTI17180/20-1", + "EBTI-FR-FR-PRO-2010-002956-02", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-880773", + "CROSS-G86346", + "CROSS-N332099" + ], + "segment": "material", + "split": "train", + "tier1_description": "Ten compound semiconductor wafers produced by a gallium arsenide foundry. The wafers are 150 mm single-crystal gallium arsenide substrates carrying doped epitaxial layer stacks tailored for high-frequency device structures used in RF front-end and optoelectronic components. Doped wafers of this type are the base material from which microwave and millimeter-wave semiconductor devices are fabricated", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "WIN Semiconductors", + "part_name": "wafer - (67 783" + } + }, + { + "bol_metadata": { + "bol_description": "OTHER DOPER WAFERS", + "origin_country": "USA", + "shipper": "on semiconductors czech" + }, + "boundary_note": "Worked synthetic crystal (7104.99) vs element doped for use in electronics (3818.00) vs optical element (9001.90); working, doping and optical function decide.", + "candidate_set": { + "codes": [ + "381800", + "852691", + "854121", + "710499" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "crystal_substrate_boundary" + ], + "frozen_id": "v2.0.train.0120", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0120", + "justification_text": "Doped chemical elements or compounds for electronics, in wafer/disc forms, are covered by heading 3818. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-953265", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-880773", + "CROSS-N223365", + "CROSS-842711", + "CROSS-G86346", + "CROSS-N332099", + "EBTI-DE-DEBTI17180/20-1", + "EBTI-FR-FR-PRO-2010-002956-02" + ], + "segment": "material", + "split": "train", + "tier1_description": "Doped semiconductor wafers. These are polished discs of single-crystal silicon doped during ingot growth with impurity elements to set conductivity type and resistivity, produced at a facility performing silicon crystal growth, polished wafer and epitaxial wafer manufacturing. The wafers are intended as starting substrates for fabricating power semiconductors and other electronic devices", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "onsemi", + "part_name": "other doper wafers" + } + }, + { + "bol_metadata": null, + "boundary_note": "Doped vs undoped material: chemical elements doped for use in electronics (3818.00) vs high-purity elemental silicon (2804.61) vs nitrides and silicides such as GaN (2850.00); doping and intended electronic use decide.", + "candidate_set": { + "codes": [ + "854232", + "850450", + "381800", + "280410" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "doped_vs_undoped" + ], + "frozen_id": "v2.0.train.0121", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0121", + "justification_text": "The item is a semiconductor wafer, boule, substrate, or doped/compound electronic material in wafer or similar form. Heading 3818 covers such doped electronic elements/compounds, so current 381800. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-953265", + "EBTI-DE-DEBTI17180/20-1", + "EBTI-FR-FR-PRO-2010-002956-02", + "CROSS-842711", + "CROSS-G86346", + "CROSS-N223365", + "CROSS-N332099", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-880773" + ], + "segment": "material", + "split": "train", + "tier1_description": "Free-standing gallium nitride (GaN) single-crystal substrate, Fe-doped semi-insulating, C-plane (0001) orientation, nominal size 10 mm x 10.5 mm. Dislocation density on the order of 1e5/cm2 with usable area exceeding 90%; chemically doped compound-semiconductor wafer for electronic and optoelectronic device fabrication (MPN: WA0220)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "MSE Supplies", + "part_name": "WA0220" + } + }, + { + "bol_metadata": null, + "boundary_note": "Doped vs undoped material: chemical elements doped for use in electronics (3818.00) vs high-purity elemental silicon (2804.61) vs nitrides and silicides such as GaN (2850.00); doping and intended electronic use decide.", + "candidate_set": { + "codes": [ + "854149", + "370710", + "903141", + "381800" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "doped_vs_undoped" + ], + "frozen_id": "v2.0.train.0122", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0122", + "justification_text": "The item is a semiconductor wafer, boule, substrate, or doped/compound electronic material in wafer or similar form. Heading 3818 covers such doped electronic elements/compounds, so current 381800. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-953265", + "CROSS-957293", + "EBTI-DE-DEBTI17180/20-1", + "EBTI-FR-FR-PRO-2010-002956-02", + "CROSS-842711", + "CROSS-G86346", + "CROSS-N223365", + "CROSS-N332099", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-880773" + ], + "segment": "material", + "split": "train", + "tier1_description": "Free-standing gallium nitride (GaN) single-crystal substrate, Ge-doped N-type, C-plane (0001) orientation, nominal size 10 mm x 10.5 mm. Dislocation density on the order of 1e5/cm2 with usable area over 90%; doped compound-semiconductor wafer intended for electronic and optoelectronic device manufacture (MPN: WA0215)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "MSE Supplies", + "part_name": "WA0215" + } + }, + { + "bol_metadata": null, + "boundary_note": "Doped vs undoped material: chemical elements doped for use in electronics (3818.00) vs high-purity elemental silicon (2804.61) vs nitrides and silicides such as GaN (2850.00); doping and intended electronic use decide.", + "candidate_set": { + "codes": [ + "903090", + "853669", + "381800", + "903141" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "doped_vs_undoped" + ], + "frozen_id": "v2.0.train.0123", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0123", + "justification_text": "The item is a semiconductor wafer, boule, substrate, or doped/compound electronic material in wafer or similar form. Heading 3818 covers such doped electronic elements/compounds, so current 381800. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-953265", + "EBTI-FR-FR-PRO-2010-002956-02", + "CROSS-842711", + "CROSS-G86346", + "CROSS-N223365", + "CROSS-N332099", + "EBTI-DE-DEBTI17180/20-1", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-880773" + ], + "segment": "material", + "split": "train", + "tier1_description": "Laser-diode-grade free-standing gallium nitride (GaN) single-crystal substrate, Fe-doped semi-insulating, C-plane (0001), 2 inch (50.8 mm) diameter, thickness 350 +/- 25 um, single-side polished. Resistivity >1e6 ohm-cm, dislocation density <9e5/cm2, usable area >90%; doped compound-semiconductor wafer for optoelectronic devices (MPN: WA0239)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "MSE Supplies", + "part_name": "WA0239" + } + }, + { + "bol_metadata": null, + "boundary_note": "Doped vs undoped material: chemical elements doped for use in electronics (3818.00) vs high-purity elemental silicon (2804.61) vs nitrides and silicides such as GaN (2850.00); doping and intended electronic use decide.", + "candidate_set": { + "codes": [ + "850440", + "903180", + "381800", + "847130" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "doped_vs_undoped" + ], + "frozen_id": "v2.0.train.0124", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0124", + "justification_text": "The item is a semiconductor wafer, boule, substrate, or doped/compound electronic material in wafer or similar form. Heading 3818 covers such doped electronic elements/compounds, so current 381800. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-953265", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-880773", + "CROSS-G86346", + "CROSS-N223365", + "CROSS-N332099", + "EBTI-DE-DEBTI17180/20-1", + "CROSS-842711", + "EBTI-FR-FR-PRO-2010-002956-02" + ], + "segment": "material", + "split": "train", + "tier1_description": "4 inch silicon wafer with PVD-deposited titanium nitride (TiN) thin film; substrate P-type boron-doped, <100> orientation, resistivity 1-100 ohm-cm. Doped semiconductor disc with conductive coating for microelectronic, plasmonic and protective-layer applications (MPN: WA5313)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "MSE Supplies", + "part_name": "WA5313" + } + }, + { + "bol_metadata": null, + "boundary_note": "Doped vs undoped material: chemical elements doped for use in electronics (3818.00) vs high-purity elemental silicon (2804.61) vs nitrides and silicides such as GaN (2850.00); doping and intended electronic use decide.", + "candidate_set": { + "codes": [ + "381800", + "284430", + "902710", + "282612" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "doped_vs_undoped" + ], + "frozen_id": "v2.0.train.0125", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0125", + "justification_text": "The item is a semiconductor wafer, boule, substrate, or doped/compound electronic material in wafer or similar form. Heading 3818 covers such doped electronic elements/compounds, so current 381800. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-953265", + "EBTI-DE-DEBTI17180/20-1", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-880773", + "CROSS-G86346" + ], + "segment": "material", + "split": "train", + "tier1_description": "4 inch high-purity undoped silicon carbide (SiC) semi-insulating substrate, polytype 4H, diameter 100.0 +/- 0.5 mm, thickness 500 +/- 25 um, on-axis <0001> orientation. Electrical resistivity >=1e10 ohm-cm with low micropipe density; compound-semiconductor wafer for high-power and RF electronic devices (MPN: WA0380)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "MSE Supplies", + "part_name": "WA0380" + } + }, + { + "bol_metadata": null, + "boundary_note": "Worked synthetic crystal (7104.99) vs element doped for use in electronics (3818.00) vs optical element (9001.90); working, doping and optical function decide.", + "candidate_set": { + "codes": [ + "381800", + "903040", + "280440", + "710499" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "crystal_substrate_boundary" + ], + "frozen_id": "v2.0.train.0126", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0126", + "justification_text": "The item is a semiconductor wafer, boule, substrate, or doped/compound electronic material in wafer or similar form. Heading 3818 covers such doped electronic elements/compounds, so current 381800. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-953265", + "EBTI-DE-DEBTI17180/20-1", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-880773", + "CROSS-G86346", + "CROSS-N223365", + "CROSS-N332099", + "CROSS-842711", + "EBTI-FR-FR-PRO-2010-002956-02" + ], + "segment": "material", + "split": "train", + "tier1_description": "4 inch silicon wafer with PVD-deposited copper (Cu) thin film; substrate P-type boron-doped, <100> orientation, resistivity 1-100 ohm-cm. 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Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-953265", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-880773", + "CROSS-G86346", + "CROSS-N332099", + "EBTI-DE-DEBTI17180/20-1", + "CROSS-842711", + "EBTI-FR-FR-PRO-2010-002956-02" + ], + "segment": "material", + "split": "train", + "tier1_description": "Single crystal silicon wafer, 6 inch diameter, thickness 0.65 to 0.7 mm, orientation (111), one side polished, boron doped P-type with resistivity of 1 to 10 ohm-cm. Large diameter (111) doped substrate stocked for epitaxy, power device research, and mechanical test work. Part number SIBC152D0675C1R1US5", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "MTI Corporation", + "part_name": "SIBC152D0675C1R1US5" + } + }, + { + "bol_metadata": null, + "boundary_note": "Doped vs undoped material: chemical elements doped for use in electronics (3818.00) vs high-purity elemental silicon (2804.61) vs nitrides and silicides such as GaN (2850.00); doping and intended electronic use decide.", + "candidate_set": { + "codes": [ + "848640", + "850490", + "850431", + "381800" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "doped_vs_undoped" + ], + "frozen_id": "v2.0.train.0141", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0141", + "justification_text": "Heading 3818 applies because this wafer carries an intentional boron dopant that gives it P-type resistivity for device work. A plain undoped silicon disc of the same size would not qualify. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-953265", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-880773", + "CROSS-G86346", + "CROSS-N332099", + "EBTI-DE-DEBTI17180/20-1", + "CROSS-842711", + "EBTI-FR-FR-PRO-2010-002956-02" + ], + "segment": "material", + "split": "train", + "tier1_description": "Monocrystalline silicon wafer, 50.8 mm diameter, 0.28 mm thickness, orientation (111) within 1 degree, single side polished, P-type with boron dopant, resistivity 0.1 to 10 ohm-cm. Compact doped (111) substrate for crystallographically oriented etching and device studies. Part number SIBC50D028C1R01", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "MTI Corporation", + "part_name": "SIBC50D028C1R01" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "848640", + "850490", + "850431", + "381800" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0142", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0142", + "justification_text": "The boron P-type doping is what puts this thinned CZ silicon wafer in heading 3818 rather than a plain silicon material heading. The 200 um thickness and MEMS use are specs that don't change that. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-953265", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-880773", + "CROSS-G86346", + "CROSS-N332099", + "EBTI-DE-DEBTI17180/20-1", + "CROSS-842711", + "EBTI-FR-FR-PRO-2010-002956-02" + ], + "segment": "material", + "split": "train", + "tier1_description": "Prime Czochralski silicon wafer of 4 inch diameter thinned to 200 micron, both sides polished, orientation (100), P-type boron doped, resistivity 1 to 10 ohm-cm, total thickness variation under 5 micron, bow and warp under 30 micron. Thin doped substrate article stocked for MEMS and bonding processes. Part number WSA40200105B1314SNN1", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "MicroChemicals GmbH", + "part_name": "WSA40200105B1314SNN1" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "848640", + "850490", + "850431", + "381800" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0143", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0143", + "justification_text": "Even as a dummy substrate used for tool qualification, this wafer is boron-doped P-type, so it meets heading 3818 for doped silicon in wafer form used in an electronics setting. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-953265", + "CROSS-880773", + "CROSS-842711", + "CROSS-G86346", + "CROSS-N223365", + "CROSS-N332099", + "EBTI-DE-DEBTI17180/20-1", + "EBTI-FR-FR-PRO-2010-002956-02" + ], + "segment": "material", + "split": "train", + "tier1_description": "Dummy grade Czochralski silicon wafer, 300 mm diameter, 775 micron thickness, both sides polished, orientation (100), boron doped P-type, resistivity 1 to 100 ohm-cm, SEMI notch, supplied fifty wafers per box. Doped full diameter dummy substrates feed tool qualification and handling tests in production fabs. Part number 300MM", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "MicroChemicals GmbH", + "part_name": "300MM" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "848640", + "850490", + "850431", + "381800" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0144", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0144", + "justification_text": "This is boron-doped P-type silicon in disc form, which satisfies heading 3818 for chemical elements doped for electronics use. The unusual 2000 um thickness is a design variant and doesn't affect t. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-953265", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-880773", + "CROSS-G86346", + "CROSS-N332099", + "EBTI-DE-DEBTI17180/20-1", + "CROSS-842711", + "EBTI-FR-FR-PRO-2010-002956-02" + ], + "segment": "material", + "split": "train", + "tier1_description": "Prime Czochralski silicon wafer of 2 inch diameter at an unusual 2000 micron thickness, single side polished, orientation (100), P-type boron doped, resistivity 1 to 20 ohm-cm, SEMI standard flat. Extra thick doped silicon discs are chosen for micromachined optics and rigid carrier applications. Part number 2000UM", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "MicroChemicals GmbH", + "part_name": "2000UM" + } + }, + { + "bol_metadata": null, + "boundary_note": "Doped vs undoped material: chemical elements doped for use in electronics (3818.00) vs high-purity elemental silicon (2804.61) vs nitrides and silicides such as GaN (2850.00); doping and intended electronic use decide.", + "candidate_set": { + "codes": [ + "848640", + "850490", + "850431", + "381800" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "doped_vs_undoped" + ], + "frozen_id": "v2.0.train.0145", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0145", + "justification_text": "The underlying article is a boron-doped P-type silicon wafer, so heading 3818 applies. The oxide-nitride coating is extra processing, but the doped silicon substrate is what gives the product its e. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-953265", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-880773", + "CROSS-G86346", + "CROSS-N332099", + "EBTI-DE-DEBTI17180/20-1", + "CROSS-842711", + "EBTI-FR-FR-PRO-2010-002956-02" + ], + "segment": "material", + "split": "train", + "tier1_description": "Prime grade Czochralski silicon wafer, 100 mm diameter, P-type boron doped, orientation (100), resistivity 1 to 20 ohm-cm, thickness 500 to 550 micron, polished and etched finish, carrying an oxide nitride stack. Coated doped substrate sold by the piece for dielectric and membrane process work. Part number SKU1199", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Wafer World Inc.", + "part_name": "SKU1199" + } + }, + { + "bol_metadata": null, + "boundary_note": "Worked synthetic crystal (7104.99) vs element doped for use in electronics (3818.00) vs optical element (9001.90); working, doping and optical function decide.", + "candidate_set": { + "codes": [ + "848640", + "850490", + "850431", + "381800" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "crystal_substrate_boundary" + ], + "frozen_id": "v2.0.train.0146", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0146", + "justification_text": "Doped gallium arsenide in wafer form falls under the second limb of heading 3818, which covers chemical compounds doped for electronics use. The dopant should be confirmed on the spec sheet, since. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-N223365", + "CROSS-953265", + "EBTI-FR-FR-PRO-2010-002956-02", + "CROSS-842711", + "CROSS-G86346", + "CROSS-N332099", + "EBTI-DE-DEBTI17180/20-1", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-880773" + ], + "segment": "material", + "split": "train", + "tier1_description": "Gallium arsenide single crystal wafer offered from distributor stock under a numbered listing, with electrical type and dopant per the published specification sheet. Doped compound semiconductor substrates of this kind feed optoelectronic and radio frequency device fabrication. Part number 5181", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Wafer World Inc.", + "part_name": "5181" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "848640", + "850490", + "850431", + "381800" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0147", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0147", + "justification_text": "This is a boron-doped P-type silicon disc, so it meets the doping and wafer-form tests of heading 3818. The polished front and etched back finish is a quality spec that doesn't change the heading. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-953265", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-880773", + "CROSS-G86346", + "CROSS-N332099", + "EBTI-DE-DEBTI17180/20-1", + "CROSS-842711", + "EBTI-FR-FR-PRO-2010-002956-02" + ], + "segment": "material", + "split": "train", + "tier1_description": "Prime grade Czochralski silicon wafer, 150 mm diameter within 0.2 mm, P-type boron doped, orientation (100) within 0.5 degree, resistivity 1 to 100 ohm-cm, polished front and etched back, SEMI standard 57.5 mm flat, total thickness variation below 10 micron. Production style doped substrate from European stock. Part number 150MM", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Wafer Universe (Plan Optik AG)", + "part_name": "150MM" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "848640", + "850490", + "850431", + "381800" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0148", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0148", + "justification_text": "A 200 mm boron-doped CZ silicon wafer is a doped chemical element in wafer form for electronics, which is what heading 3818 covers. The SEMI notch and diameter are production format choices, not cl. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-953265", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-880773", + "CROSS-G86346", + "CROSS-N332099", + "EBTI-DE-DEBTI17180/20-1", + "CROSS-842711", + "EBTI-FR-FR-PRO-2010-002956-02" + ], + "segment": "material", + "split": "train", + "tier1_description": "Czochralski silicon wafer of 200 mm diameter within 0.3 mm tolerance, P-type boron doped, orientation (100), resistivity 1 to 100 ohm-cm, standard thickness tolerance of 25 micron. The 200 mm doped substrate class serves legacy node production lines and equipment demonstration. Part number 200MM", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Wafer Universe (Plan Optik AG)", + "part_name": "200MM" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "848640", + "850490", + "850431", + "381800" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0149", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0149", + "justification_text": "Heading 3818 covers N-type doped silicon as well as P-type. Antimony is a donor dopant that gives this wafer N-type conductivity, and doped silicon of either polarity in wafer form for electronics. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-953265", + "CROSS-880773", + "CROSS-842711", + "CROSS-G86346", + "CROSS-N223365", + "CROSS-N332099", + "EBTI-DE-DEBTI17180/20-1", + "EBTI-FR-FR-PRO-2010-002956-02" + ], + "segment": "material", + "split": "train", + "tier1_description": "Czochralski silicon wafer doped N-type with antimony, drawn from a stocked program covering boron, phosphorus, antimony, and arsenic dopants in (100), (111), and (110) orientations with SEMI standard flats or notch. Antimony doping gives low resistivity substrates with minimal autodoping for epitaxial device wafers", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "SIEGERT WAFER GmbH", + "part_name": "SI WFR N/SB CZ <111> EPI substrate" + } + }, + { + "bol_metadata": null, + "boundary_note": "Doped vs undoped material: chemical elements doped for use in electronics (3818.00) vs high-purity elemental silicon (2804.61) vs nitrides and silicides such as GaN (2850.00); doping and intended electronic use decide.", + "candidate_set": { + "codes": [ + "848640", + "850490", + "850431", + "381800" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "doped_vs_undoped" + ], + "frozen_id": "v2.0.train.0150", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0150", + "justification_text": "Gas-doped float zone silicon is a doped chemical element in wafer form, and heading 3818 doesn't restrict by doping method. The essentials are all there: silicon, intentional doping, wafer geometry. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-953265", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-880773", + "CROSS-G86346", + "CROSS-N332099", + "EBTI-DE-DEBTI17180/20-1", + "CROSS-842711", + "EBTI-FR-FR-PRO-2010-002956-02" + ], + "segment": "material", + "split": "train", + "tier1_description": "Float zone silicon wafer doped during growth by the gas doping route, supplied from a program that also spans hyper pure and neutron transmutation doped float zone material. Uniformly doped FZ substrates address power semiconductors and detector fabrication requiring tight resistivity control", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "SIEGERT WAFER GmbH", + "part_name": "FZ-GD SI N-type 4IN" + } + }, + { + "bol_metadata": null, + "boundary_note": "Worked synthetic crystal (7104.99) vs element doped for use in electronics (3818.00) vs optical element (9001.90); working, doping and optical function decide.", + "candidate_set": { + "codes": [ + "848640", + "850490", + "850431", + "381800" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "crystal_substrate_boundary" + ], + "frozen_id": "v2.0.train.0151", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0151", + "justification_text": "Silicon-doped N-type gallium arsenide in polished wafer form falls under the second limb of heading 3818, covering chemical compounds doped for electronics. The LED and laser end-uses confirm the e. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-953265", + "CROSS-N223365", + "EBTI-FR-FR-PRO-2010-002956-02", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-842711", + "CROSS-880773", + "CROSS-G86346", + "CROSS-N332099", + "EBTI-DE-DEBTI17180/20-1" + ], + "segment": "material", + "split": "train", + "tier1_description": "Gallium arsenide single crystal wafer, 2 inch diameter, thickness 450 micron within 25 micron, single side polished to an epi ready surface, doped N-type with silicon. A doped compound semiconductor substrate for epitaxial growth of LED, laser, and microwave device structures. Part number 450UM", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Nanografi Nano Technology", + "part_name": "450UM" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "848640", + "850490", + "850431", + "381800" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0152", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0152", + "justification_text": "Zinc-doped P-type gallium arsenide in wafer form meets heading 3818 as a doped chemical compound for electronics. The zinc dopant gives it P-type conductivity, and the epi-ready surface is the subs. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-N223365", + "CROSS-953265", + "EBTI-FR-FR-PRO-2010-002956-02", + "CROSS-842711", + "CROSS-G86346", + "CROSS-N332099", + "EBTI-DE-DEBTI17180/20-1", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-880773" + ], + "segment": "material", + "split": "train", + "tier1_description": "Gallium arsenide wafer of 2 inch diameter and 350 micron thickness, polished on both sides to epi ready condition, doped P-type with zinc. Zinc doped gallium arsenide substrates support optoelectronic emitter structures and P side contact layers in compound semiconductor processing. Part number 350UM", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Nanochemazone", + "part_name": "350UM" + } + }, + { + "bol_metadata": null, + "boundary_note": "Doped vs undoped material: chemical elements doped for use in electronics (3818.00) vs high-purity elemental silicon (2804.61) vs nitrides and silicides such as GaN (2850.00); doping and intended electronic use decide.", + "candidate_set": { + "codes": [ + "848640", + "850490", + "850431", + "381800" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "doped_vs_undoped" + ], + "frozen_id": "v2.0.train.0153", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0153", + "justification_text": "Free-standing silicon-doped N-type gallium nitride in wafer form is a doped compound semiconductor for electronics, which sits in the second limb of heading 3818. The power switching and RF amplifi. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-953265", + "EBTI-FR-FR-PRO-2010-002956-02", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-842711", + "CROSS-880773", + "CROSS-G86346", + "CROSS-N223365", + "CROSS-N332099", + "EBTI-DE-DEBTI17180/20-1" + ], + "segment": "material", + "split": "train", + "tier1_description": "Free standing gallium nitride wafer, 2 inch diameter, doped N-type with silicon, purity above 99.9 percent. Doped wide bandgap compound substrate enabling vertical power switching devices and radio frequency amplifiers where gallium nitride outperforms silicon at high voltage and frequency", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Nanorh", + "part_name": "GAN WFR 2IN N-type SI-doped" + } + }, + { + "bol_metadata": null, + "boundary_note": "Doped vs undoped material: chemical elements doped for use in electronics (3818.00) vs high-purity elemental silicon (2804.61) vs nitrides and silicides such as GaN (2850.00); doping and intended electronic use decide.", + "candidate_set": { + "codes": [ + "848640", + "850490", + "850431", + "381800" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "doped_vs_undoped" + ], + "frozen_id": "v2.0.train.0154", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0154", + "justification_text": "A boron-doped P-type silicon disc for IC prototyping and MEMS work is a straightforward heading 3818 classification. The research-grade channel and application don't affect the heading. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-953265", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-880773", + "CROSS-G86346", + "CROSS-N332099", + "EBTI-DE-DEBTI17180/20-1", + "CROSS-842711", + "EBTI-FR-FR-PRO-2010-002956-02" + ], + "segment": "material", + "split": "train", + "tier1_description": "P-type silicon wafer of 4 inch diameter doped with boron, supplied as a high purity research substrate with worldwide laboratory distribution. The doped wafer forms the base material for integrated circuit prototyping and microelectromechanical device work", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Nanorh", + "part_name": "SI WFR 4IN P-type boron" + } + }, + { + "bol_metadata": null, + "boundary_note": "Worked synthetic crystal (7104.99) vs element doped for use in electronics (3818.00) vs optical element (9001.90); working, doping and optical function decide.", + "candidate_set": { + "codes": [ + "848640", + "850490", + "850431", + "381800" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "crystal_substrate_boundary" + ], + "frozen_id": "v2.0.train.0155", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0155", + "justification_text": "VGF-grown gallium arsenide doped to N-type low resistivity is a doped chemical compound in wafer form for electronics, so heading 3818 applies. The epi-ready surface and supply to device makers con. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-N223365", + "CROSS-953265", + "EBTI-FR-FR-PRO-2010-002956-02", + "CROSS-842711", + "EBTI-DE-DEBTI17180/20-1", + "EBTI-NL-NLRTD-2014-1125" + ], + "segment": "material", + "split": "train", + "tier1_description": "Gallium arsenide wafer sliced from vertical gradient freeze grown single crystal, with electrical properties set by dopant addition during growth to give N-type low resistance material below 0.01 ohm-cm, epi ready surface. Production substrate supplied to compound semiconductor device manufacturers", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Freiberger Compound Materials GmbH", + "part_name": "FCM gaas VGF N-type 4IN EPI-ready" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "848640", + "850490", + "850431", + "381800" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0156", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0156", + "justification_text": "This prime-grade boron-doped P-type silicon disc meets heading 3818 as a doped chemical element in wafer form for electronics. The fact that it sells through a marketplace listing doesn't change th. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-953265", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-880773", + "CROSS-G86346", + "CROSS-N332099", + "EBTI-DE-DEBTI17180/20-1", + "CROSS-842711", + "EBTI-FR-FR-PRO-2010-002956-02" + ], + "segment": "material", + "split": "train", + "tier1_description": "Prime grade silicon wafer, 100 mm diameter within 0.2 mm, thickness 525 micron within 15 micron, orientation (100), P-type boron doped, resistivity 1 to 10 ohm-cm, single side polished, total thickness variation under 10 micron. Marketplace listed doped substrate sold in single wafer quantities. Part number 525UM", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Pluto", + "part_name": "525UM" + } + }, + { + "bol_metadata": null, + "boundary_note": "Doped vs undoped material: chemical elements doped for use in electronics (3818.00) vs high-purity elemental silicon (2804.61) vs nitrides and silicides such as GaN (2850.00); doping and intended electronic use decide. Worked synthetic crystal (7104.99) vs element doped for use in electronics (3818.00) vs optical element (9001.90); working, doping and optical function decide.", + "candidate_set": { + "codes": [ + "848640", + "850490", + "850431", + "381800" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "doped_vs_undoped", + "crystal_substrate_boundary" + ], + "frozen_id": "v2.0.train.0157", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0157", + "justification_text": "American Elements markets this as boron-doped silicon for transistors, rectifiers, and photovoltaic devices, all electronics uses, so heading 3818 is correct across the custom-diameter range. Custo. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-953265", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-880773", + "CROSS-G86346", + "CROSS-N332099", + "EBTI-DE-DEBTI17180/20-1", + "CROSS-842711", + "EBTI-FR-FR-PRO-2010-002956-02" + ], + "segment": "material", + "split": "train", + "tier1_description": "Boron doped single crystal silicon wafer manufactured from ultra high purity material in nominal diameters from 25.4 mm to 300 mm, sliced and polished from doped ingots, with custom resistivity on request. Doped silicon for transistors, rectifiers, and photovoltaic device production. Part number 100MM", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "American Elements", + "part_name": "100MM" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "848640", + "850490", + "850431", + "381800" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0158", + "hs2_label": "38", + "hs4_label": "3818", + "hs6_label": "381800", + "id": "SH-0158", + "justification_text": "A 200 mm CZ silicon wafer with defined 24-36 ohm-cm boron P-type doping is classified under heading 3818 as a doped chemical element in wafer form for electronics. The resistivity band and surface. Classified under HS 3818.00.", + "reference_ruling_ids": [ + "CROSS-957293", + "CROSS-953265", + "EBTI-NL-NLRTD-2014-1125", + "CROSS-880773", + "CROSS-G86346", + "CROSS-N332099", + "EBTI-DE-DEBTI17180/20-1", + "CROSS-842711", + "EBTI-FR-FR-PRO-2010-002956-02" + ], + "segment": "material", + "split": "train", + "tier1_description": "Czochralski silicon wafer, 200 mm diameter, P-type boron doped, orientation (100), resistivity 24 to 36 ohm-cm, thickness 725 micron, single side polished, listed as in stock substrate inventory. Full size doped wafer supplying 200 mm production and equipment demonstration lines. Part number 200MM", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Xiamen Powerway Advanced Material Co., Ltd. (PAM-XIAMEN)", + "part_name": "200MM" + } + }, + { + "bol_metadata": { + "bol_description": "KT Sapphire substrate, 50.8mm dia x 0.432mm thick, EP", + "origin_country": "US", + "shipper": "alfa aesar" + }, + "boundary_note": "Worked synthetic crystal (7104.99) vs element doped for use in electronics (3818.00) vs optical element (9001.90); working, doping and optical function decide.", + "candidate_set": { + "codes": [ + "854130", + "902519", + "710499", + "853890" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "crystal_substrate_boundary" + ], + "frozen_id": "v2.0.train.0159", + "hs2_label": "71", + "hs4_label": "7104", + "hs6_label": "710499", + "id": "SH-0159", + "justification_text": "Synthetic or reconstructed gemstone materials such as sapphire or diamond wafers/bars are classified under 7104.99. Classified under HS 7104.99.", + "reference_ruling_ids": [], + "segment": "material", + "split": "train", + "tier1_description": "Single-crystal sapphire substrate, 50.8 mm diameter by 0.432 mm thick, epitaxial-grade polished on one side, C-axis crystal orientation. The disc is synthetic corundum (aluminium oxide) grown by the heat-exchanger method and finished to an epitaxy-ready surface. Sapphire substrates of this type serve as insulating base plates for depositing semiconductor layers, including silicon-on-sapphire circuits and gallium nitride layers for blue light-emitting diodes", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Alfa Aesar", + "part_name": "KT Sapphire substrate 50.8mm dia x" + } + }, + { + "bol_metadata": { + "bol_description": "SAPHIRE SUBSTRATE", + "origin_country": "AT", + "shipper": "ams-osram international gmbh" + }, + "boundary_note": "Worked synthetic crystal (7104.99) vs element doped for use in electronics (3818.00) vs optical element (9001.90); working, doping and optical function decide.", + "candidate_set": { + "codes": [ + "847150", + "710499", + "851680", + "854160" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "crystal_substrate_boundary" + ], + "frozen_id": "v2.0.train.0160", + "hs2_label": "71", + "hs4_label": "7104", + "hs6_label": "710499", + "id": "SH-0160", + "justification_text": "Synthetic or reconstructed gemstone materials such as sapphire or diamond wafers/bars are classified under 7104.99. Classified under HS 7104.99.", + "reference_ruling_ids": [], + "segment": "material", + "split": "train", + "tier1_description": "Sapphire substrate: a thin polished disc of synthetic single-crystal corundum (aluminium oxide) grown from high-purity alumina and sliced and polished to an epitaxy-ready surface. Sapphire substrates are electrically insulating, optically transparent and thermally stable, and are used chiefly as the base wafer on which gallium nitride layers are epitaxially grown to manufacture light-emitting diodes and related optoelectronic devices", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "ams OSRAM", + "part_name": "saphire substrate" + } + }, + { + "bol_metadata": { + "bol_description": "SINGLE CRYSTAL CVD DIAMOND WAFER FOR SEM", + "origin_country": "IN", + "shipper": "anjali diamonds private limited" + }, + "boundary_note": "Worked synthetic crystal (7104.99) vs element doped for use in electronics (3818.00) vs optical element (9001.90); working, doping and optical function decide.", + "candidate_set": { + "codes": [ + "902910", + "854149", + "848620", + "710499" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "crystal_substrate_boundary" + ], + "frozen_id": "v2.0.train.0161", + "hs2_label": "71", + "hs4_label": "7104", + "hs6_label": "710499", + "id": "SH-0161", + "justification_text": "Synthetic or reconstructed gemstone materials such as sapphire or diamond wafers/bars are classified under 7104.99. Classified under HS 7104.99.", + "reference_ruling_ids": [], + "segment": "material", + "split": "train", + "tier1_description": "Single-crystal diamond wafer produced by chemical vapor deposition: a thin lab-grown diamond plate cut and polished to wafer form for semiconductor and scientific applications. Synthetic single-crystal diamond offers extreme thermal conductivity, wide bandgap, hardness and chemical inertness, and such wafers are used for thermal management of high-power devices, as substrates for electronics development, and in electron-microscopy and detector applications", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Anjali Diamonds", + "part_name": "single crystal CVD diamond wafer for SEM" + } + }, + { + "bol_metadata": { + "bol_description": "SAPPHIRE WAFER 2- INCH/C-A3.5DEG./430PM/SSP(10) (R&D PURPOSE) PO", + "origin_country": "CN", + "shipper": "cryscore optoelectronic limited" + }, + "boundary_note": "Worked synthetic crystal (7104.99) vs element doped for use in electronics (3818.00) vs optical element (9001.90); working, doping and optical function decide.", + "candidate_set": { + "codes": [ + "282612", + "284430", + "854159", + "710499" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "crystal_substrate_boundary" + ], + "frozen_id": "v2.0.train.0162", + "hs2_label": "71", + "hs4_label": "7104", + "hs6_label": "710499", + "id": "SH-0162", + "justification_text": "Synthetic or reconstructed gemstone materials such as sapphire or diamond wafers/bars are classified under 7104.99. Classified under HS 7104.99.", + "reference_ruling_ids": [], + "segment": "material", + "split": "train", + "tier1_description": "A two-inch diameter single-crystal sapphire wafer with C-plane (0001) orientation and a 3.5-degree off-axis miscut toward the A-plane, approximately 430 micrometres thick and single-side polished. Made of 99.999 percent pure synthetic aluminium oxide (corundum), the wafer serves as an epitaxial growth substrate for gallium nitride and related III-V compound semiconductor layers; this lot of was imported for research and development use", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Cryscore", + "part_name": "sapphire wafer 2" + } + }, + { + "bol_metadata": { + "bol_description": "Sapphire bar for industrial use, P/N: SR-70C200FG, diameter 70mm, length 200mm, used as filter, cleaning for neutron beam from nuclear reactor. Manufacturer: Cryscore Optoelectronic Limited China", + "origin_country": "CN", + "shipper": "cryscore optoelectronic limited" + }, + "boundary_note": "Worked synthetic crystal (7104.99) vs element doped for use in electronics (3818.00) vs optical element (9001.90); working, doping and optical function decide.", + "candidate_set": { + "codes": [ + "381800", + "710499", + "852351", + "854149" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "crystal_substrate_boundary" + ], + "frozen_id": "v2.0.train.0163", + "hs2_label": "71", + "hs4_label": "7104", + "hs6_label": "710499", + "id": "SH-0163", + "justification_text": "Synthetic or reconstructed gemstone materials such as sapphire or diamond wafers/bars are classified under 7104.99. Classified under HS 7104.99.", + "reference_ruling_ids": [], + "segment": "material", + "split": "train", + "tier1_description": "A cylindrical single-crystal sapphire bar, 70 mm in diameter and 200 mm long with fine-ground surfaces. Grown from high-purity synthetic aluminium oxide (corundum), its highly ordered crystal lattice transmits thermal neutrons while attenuating fast neutrons and gamma radiation, so the bar is installed as a filter element to clean and condition neutron beams extracted from a nuclear research reactor", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Cryscore", + "part_name": "Sapphire bar for industrial use P/N" + } + }, + { + "bol_metadata": null, + "boundary_note": "Part attribution: an identifiable part of a specific machine (8486.90, 8538.90, 9030.90, 9031.90) vs a general-use metal article (7320.90, 7326.90, 7616.99); the Section XV exclusions and Section XVI Note 2 decide.", + "candidate_set": { + "codes": [ + "282619", + "732090", + "854121", + "732690" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "parts_attribution" + ], + "frozen_id": "v2.0.train.0164", + "hs2_label": "73", + "hs4_label": "7320", + "hs6_label": "732090", + "id": "SH-0164", + "justification_text": "A catalogue helical compression spring of stainless steel is a spring of iron or steel under heading 7320. It isn't a leaf spring (7320.20) or a vehicle road spring (7320.10), so it lands in the ca. Classified under HS 7320.90.", + "reference_ruling_ids": [], + "segment": "equipment", + "split": "train", + "tier1_description": "Helical compression spring of stainless steel round wire from a standard catalogue range, supplied in defined wire diameter, outside diameter, free length, and spring rate. Such springs are fitted in valves, probes, and chamber hardware of semiconductor process and test equipment as energy storing machine elements. Part number 032D", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Lee Spring Company", + "part_name": "032D" + } + }, + { + "bol_metadata": null, + "boundary_note": "Part attribution: an identifiable part of a specific machine (8486.90, 8538.90, 9030.90, 9031.90) vs a general-use metal article (7320.90, 7326.90, 7616.99); the Section XV exclusions and Section XVI Note 2 decide.", + "candidate_set": { + "codes": [ + "282619", + "732090", + "854121", + "732690" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "parts_attribution" + ], + "frozen_id": "v2.0.train.0165", + "hs2_label": "73", + "hs4_label": "7320", + "hs6_label": "732090", + "id": "SH-0165", + "justification_text": "A flat-wire stainless steel wave spring is still a spring of iron or steel, and since it isn't a leaf spring (7320.20) or a road spring (7320.10), subheading 7320.90 applies. The wave form just red. Classified under HS 7320.90.", + "reference_ruling_ids": [], + "segment": "equipment", + "split": "train", + "tier1_description": "Flat wire wave spring of stainless steel coiled crest to crest to deliver compression force at roughly half the axial height of an equivalent round wire spring. Applied in vacuum hardware, seal preloading, and bearing retention within semiconductor capital equipment assemblies. Part number SSB-0150", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Smalley Steel Ring Company", + "part_name": "SSB-0150" + } + }, + { + "bol_metadata": null, + "boundary_note": "Part attribution: an identifiable part of a specific machine (8486.90, 8538.90, 9030.90, 9031.90) vs a general-use metal article (7320.90, 7326.90, 7616.99); the Section XV exclusions and Section XVI Note 2 decide.", + "candidate_set": { + "codes": [ + "282619", + "732090", + "854121", + "732690" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "parts_attribution" + ], + "frozen_id": "v2.0.train.0166", + "hs2_label": "73", + "hs4_label": "7320", + "hs6_label": "732090", + "id": "SH-0166", + "justification_text": "A configurable round-wire steel compression spring sits in heading 7320.90 as a spring of iron or steel that isn't a leaf or road spring. Being able to configure the dimensions is a commercial feat. Classified under HS 7320.90.", + "reference_ruling_ids": [], + "segment": "equipment", + "split": "train", + "tier1_description": "Configurable round wire helical compression spring of steel, ordered by catalogue series with specified outside diameter, free length, and load class, delivered to dimension without tooling. Standard machine springs consumed in jigs, fixtures, and automation stages serving electronics manufacturing. Part number WF10-30", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "MISUMI Group Inc.", + "part_name": "WF10-30" + } + }, + { + "bol_metadata": { + "bol_description": "ASSY,G2.4T,PWG5XT", + "origin_country": "USA", + "shipper": "kla singapore pte ltd" + }, + "boundary_note": "Part attribution: an identifiable part of a specific machine (8486.90, 8538.90, 9030.90, 9031.90) vs a general-use metal article (7320.90, 7326.90, 7616.99); the Section XV exclusions and Section XVI Note 2 decide.", + "candidate_set": { + "codes": [ + "732690", + "940542", + "732090", + "903039" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "low", + "difficulty_tags": [ + "parts_attribution" + ], + "frozen_id": "v2.0.train.0167", + "hs2_label": "73", + "hs4_label": "7326", + "hs6_label": "732690", + "id": "SH-0167", + "justification_text": "A shipping or handling fixture is not an operational measuring-instrument accessory; metal fixtures fall under 7326.90 unless itemization shows otherwise. Classified under HS 7326.90.", + "reference_ruling_ids": [], + "segment": "equipment", + "split": "train", + "tier1_description": "Assembly forming part of a shipping and handling fixture for a heavy semiconductor metrology or inspection tool. The structural base, fabricated mainly from steel and engineered wood, is configured to cradle and immobilize a roughly system during transport and installation. It includes integrated mounting points and load-distribution features specific to the host instrument and is", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "KLA Corporation", + "part_name": "assy G2.4T PWG5XT" + } + }, + { + "bol_metadata": { + "bol_description": "HEAT SINK", + "origin_country": "US", + "shipper": "boyd shanghai technologies ltd" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "903141", + "848610", + "854121", + "761699" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0168", + "hs2_label": "76", + "hs4_label": "7616", + "hs6_label": "761699", + "id": "SH-0168", + "justification_text": "Aluminium machined, extruded, enclosure or heat-sink articles not more specifically provided elsewhere fall under 7616.99. Classified under HS 7616.99.", + "reference_ruling_ids": [], + "segment": "equipment", + "split": "train", + "tier1_description": "Passive heat sink of extruded aluminium alloy, machined with parallel cooling fins on a flat mounting base. The finned geometry enlarges the surface area available for convective heat transfer, drawing waste heat away from power semiconductors, processors or other board-mounted electronic components to keep junction temperatures within rated limits in industrial and computing equipment", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Boyd", + "part_name": "heat sink" + } + }, + { + "bol_metadata": { + "bol_description": "HEATSINK EXTRUSION RAW", + "origin_country": "US", + "shipper": "boyd shanghai technologies ltd" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "761699", + "850431", + "732690", + "854159" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0169", + "hs2_label": "76", + "hs4_label": "7616", + "hs6_label": "761699", + "id": "SH-0169", + "justification_text": "Aluminium machined, extruded, enclosure or heat-sink articles not more specifically provided elsewhere fall under 7616.99. Classified under HS 7616.99.", + "reference_ruling_ids": [], + "segment": "equipment", + "split": "train", + "tier1_description": "Raw extruded aluminium heat sink profile supplied in unfinished form. The profile is a continuous extrusion of aluminium alloy with a finned cross-section that is later cut, drilled and surface-finished into thermal-management heat sinks for cooling power electronics and circuit-board assemblies", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Boyd", + "part_name": "heatsink extrusion RAW- 1" + } + }, + { + "bol_metadata": { + "bol_description": "LFIALC3KC60534AAAA HEAT SINK 3KC60534AAAA REV01 (GP) 672690HEAT SINK (USED FOR PCBA ASSMBELY)", + "origin_country": "US", + "shipper": "boyd thermal systems hongkong ltd" + }, + "boundary_note": "Part attribution: an identifiable part of a specific machine (8486.90, 8538.90, 9030.90, 9031.90) vs a general-use metal article (7320.90, 7326.90, 7616.99); the Section XV exclusions and Section XVI Note 2 decide.", + "candidate_set": { + "codes": [ + "761699", + "710499", + "285000", + "903090" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "parts_attribution" + ], + "frozen_id": "v2.0.train.0170", + "hs2_label": "76", + "hs4_label": "7616", + "hs6_label": "761699", + "id": "SH-0170", + "justification_text": "Aluminium machined, extruded, enclosure or heat-sink articles not more specifically provided elsewhere fall under 7616.99. Classified under HS 7616.99.", + "reference_ruling_ids": [], + "segment": "equipment", + "split": "train", + "tier1_description": "Aluminium heat sink, part of a telecommunications printed-circuit-board assembly, machined to a board-specific outline with fins and mounting features. It is fastened over heat-generating components during PCBA assembly to conduct and dissipate waste heat by convection, maintaining safe operating temperatures of the electronics in network equipment", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Boyd", + "part_name": "LFIALC3KC60534AAAA heat sink" + } + }, + { + "bol_metadata": { + "bol_description": "LFIALC8DG63046ACAA HEAT SINK 8DG63046ACAA HEAT SINK ALUMINUM(USED FOR PCBA ASSEMBLY)", + "origin_country": "US", + "shipper": "boyd thermal systems hong kong" + }, + "boundary_note": "Part attribution: an identifiable part of a specific machine (8486.90, 8538.90, 9030.90, 9031.90) vs a general-use metal article (7320.90, 7326.90, 7616.99); the Section XV exclusions and Section XVI Note 2 decide.", + "candidate_set": { + "codes": [ + "761699", + "854110", + "282612", + "848690" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "parts_attribution" + ], + "frozen_id": "v2.0.train.0171", + "hs2_label": "76", + "hs4_label": "7616", + "hs6_label": "761699", + "id": "SH-0171", + "justification_text": "Aluminium machined, extruded, enclosure or heat-sink articles not more specifically provided elsewhere fall under 7616.99. Classified under HS 7616.99.", + "reference_ruling_ids": [], + "segment": "equipment", + "split": "train", + "tier1_description": "Machined aluminium heat sink intended for mounting onto a printed-circuit-board assembly in telecommunications equipment. The part is fabricated from aluminium with a finned or ribbed surface and drilled mounting points, and serves to absorb and dissipate heat from power-dissipating components, keeping the assembly within its operating envelope", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Boyd", + "part_name": "LFIALC8DG63046ACAA heat sink" + } + }, + { + "bol_metadata": { + "bol_description": "XPWMH CUS,HTSNK,STD,1U,R750/650 (HEATSINK)", + "origin_country": "US", + "shipper": "dell global b.v" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "854142", + "902590", + "761699", + "854143" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0172", + "hs2_label": "76", + "hs4_label": "7616", + "hs6_label": "761699", + "id": "SH-0172", + "justification_text": "Aluminium machined, extruded, enclosure or heat-sink articles not more specifically provided elsewhere fall under 7616.99. Classified under HS 7616.99.", + "reference_ruling_ids": [], + "segment": "equipment", + "split": "train", + "tier1_description": "Standard 1U-height passive CPU heat sink for rack-mounted server chassis, designed for processors with thermal design power up to roughly 165 W. It consists of a finned aluminium body on a flat contact base with captive spring-loaded mounting screws, transferring processor heat into the chassis airflow generated by system fans", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Dell", + "part_name": "xpwmh CUS htsnk STD 1U R750/650" + } + }, + { + "bol_metadata": { + "bol_description": "AKG 105 22 120 SA MINIATURE ALUMINIUM CASE", + "origin_country": "DE", + "shipper": "fischer elektronik gmbh & co kg" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "903141", + "761699", + "282619", + "280440" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0173", + "hs2_label": "76", + "hs4_label": "7616", + "hs6_label": "761699", + "id": "SH-0173", + "justification_text": "Aluminium machined, extruded, enclosure or heat-sink articles not more specifically provided elsewhere fall under 7616.99. Classified under HS 7616.99.", + "reference_ruling_ids": [], + "segment": "equipment", + "split": "train", + "tier1_description": "Miniature aluminium electronics enclosure, approximately 105 x 22 x 120 mm, formed from two interlocking extruded aluminium half-shell profiles with two 2 mm cover panels and mounting hardware. Internal guide rails accept 100 mm Eurocard circuit boards, and integrated cooling-fin geometry on the profiles aids heat dissipation; used to house small electronic modules", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Fischer Elektronik", + "part_name": "AKG 105 22 120 SA miniature aluminium" + } + }, + { + "bol_metadata": { + "bol_description": "MUSTERTUTE FK 259 265 274 V5", + "origin_country": "DE", + "shipper": "fischer elektronik gmbh & co kg" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "848620", + "852491", + "282619", + "761699" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0174", + "hs2_label": "76", + "hs4_label": "7616", + "hs6_label": "761699", + "id": "SH-0174", + "justification_text": "Aluminium machined, extruded, enclosure or heat-sink articles not more specifically provided elsewhere fall under 7616.99. Classified under HS 7616.99.", + "reference_ruling_ids": [], + "segment": "equipment", + "split": "train", + "tier1_description": "Sample containing assorted small clip-on heat sinks for discrete semiconductor such as TO-220, TO-218 and TO-247. Each piece is a finned metal body, around 20 x 13 x 9 mm with an integral clamping spring that snaps onto the transistor case without screws, lowering the device's thermal resistance to ambient air on densely populated circuit boards", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Fischer Elektronik", + "part_name": "mustertute FK 259 265 274 V5" + } + }, + { + "bol_metadata": { + "bol_description": "HEAT SINKS PLCL", + "origin_country": "DE", + "shipper": "fischer elektronik gmbh & co kg" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "370710", + "854290", + "761699", + "850431" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0175", + "hs2_label": "76", + "hs4_label": "7616", + "hs6_label": "761699", + "id": "SH-0175", + "justification_text": "Aluminium machined, extruded, enclosure or heat-sink articles not more specifically provided elsewhere fall under 7616.99. Classified under HS 7616.99.", + "reference_ruling_ids": [], + "segment": "equipment", + "split": "train", + "tier1_description": "Aluminium heat sinks for electronic components, supplied in various extruded and finger-shaped profiles. Each heat sink presents a finned aluminium body that mounts onto semiconductors, voltage regulators or power modules, enlarging the heat-exchange surface so that component waste heat is dissipated to the surrounding air by natural or forced convection", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Fischer Elektronik", + "part_name": "heat sinks plcl" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "848620", + "844332", + "847150", + "847330" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0176", + "hs2_label": "84", + "hs4_label": "8443", + "hs6_label": "844332", + "id": "SH-0176", + "justification_text": "The Zebra ZT411 is a thermal transfer label printer with USB, Ethernet, and Bluetooth connections to host computers, which makes it a printer that can connect to an automatic data processing machin. Classified under HS 8443.32.", + "reference_ruling_ids": [], + "segment": "end_product", + "split": "train", + "tier1_description": "Industrial thermal transfer and direct thermal label printer, 4 inch print width, 203 to 600 dpi options, with USB, serial, Ethernet, and Bluetooth connectivity to host computers. Prints barcode and identification labels for wafer lots, reticle pods, and shipping cartons in electronics logistics. Part number ZT411", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Zebra Technologies", + "part_name": "ZT411" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "848620", + "844332", + "847150", + "847330" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0177", + "hs2_label": "84", + "hs4_label": "8443", + "hs6_label": "844332", + "id": "SH-0177", + "justification_text": "The ZT610 is an industrial label printer with Ethernet and USB connectivity, so it sits in subheading 8443.32 as a printer that can connect to an automatic data processing machine. The heavy-duty m. Classified under HS 8443.32.", + "reference_ruling_ids": [], + "segment": "end_product", + "split": "train", + "tier1_description": "Heavy duty industrial label printer using thermal transfer printing at up to 600 dpi, network and USB connected, metal frame construction for continuous duty. Produces high density component, ESD bag, and carton labels in semiconductor manufacturing and distribution operations. Part number ZT610", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Zebra Technologies", + "part_name": "ZT610" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "848620", + "844332", + "847150", + "847330" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0178", + "hs2_label": "84", + "hs4_label": "8443", + "hs6_label": "844332", + "id": "SH-0178", + "justification_text": "The BradyPrinter i5300 is an industrial label printer with USB and Ethernet connections to host systems, which puts it in subheading 8443.32 as a printer that can connect to an automatic data proce. Classified under HS 8443.32.", + "reference_ruling_ids": [], + "segment": "end_product", + "split": "train", + "tier1_description": "Industrial label printer with automatic material setup and calibration, printing polyester and polyimide identification labels resistant to process chemistries, connected by USB and Ethernet to host systems. Labels printed circuit boards, wafers carriers, and laboratory samples in electronics production. Part number I5300", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Brady Corporation", + "part_name": "I5300" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8471 separates portable complete data-processing machines (8471.30) from processing units presented separately (8471.50).", + "candidate_set": { + "codes": [ + "848620", + "848610", + "847150", + "847130" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8471_adp_splits" + ], + "frozen_id": "v2.0.train.0179", + "hs2_label": "84", + "hs4_label": "8471", + "hs6_label": "847130", + "id": "SH-0179", + "justification_text": "The Toughbook FZ-55 is a portable ADP machine with an Intel processor, built-in keyboard, and 14-inch display, weighing under 10 kg, which meets every part of heading 8471.30. The rugged housing an. Classified under HS 8471.30.", + "reference_ruling_ids": [], + "segment": "end_product", + "split": "train", + "tier1_description": "Semi rugged portable automatic data processing machine with 14 inch display, Intel processor, keyboard, and modular expansion bays, weighing under 10 kg with battery. Deployed as a service and diagnostics terminal alongside production equipment in industrial and field environments. Part number FZ-55", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Panasonic Connect", + "part_name": "FZ-55" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8471 separates portable complete data-processing machines (8471.30) from processing units presented separately (8471.50). HS2022 flat-panel display module (8524.91) vs other optical appliance (9013.80) vs a complete data-processing machine (8471.30); whether the module is presented bare, as an optical device, or built into a machine decides.", + "candidate_set": { + "codes": [ + "848620", + "848610", + "847150", + "847130" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8471_adp_splits", + "display_module_boundary" + ], + "frozen_id": "v2.0.train.0180", + "hs2_label": "84", + "hs4_label": "8471", + "hs6_label": "847130", + "id": "SH-0180", + "justification_text": "The Getac F110 is a rugged tablet with an Intel processor and an 11.5-inch touchscreen that acts as both display and input, weighing well under 10 kg. Heading 8471.30 covers portable ADP machines w. Classified under HS 8471.30.", + "reference_ruling_ids": [], + "segment": "end_product", + "split": "train", + "tier1_description": "Fully rugged tablet computer with 11.5 inch sunlight readable touchscreen, Intel processor, hot swappable batteries, and MIL-STD-810H rated housing, total weight well under 10 kg. Used as a mobile terminal for equipment checklists and facility monitoring in fabs and industrial plants. Part number F110", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Getac Technology Corporation", + "part_name": "F110" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8471 separates portable complete data-processing machines (8471.30) from processing units presented separately (8471.50). HS2022 flat-panel display module (8524.91) vs other optical appliance (9013.80) vs a complete data-processing machine (8471.30); whether the module is presented bare, as an optical device, or built into a machine decides.", + "candidate_set": { + "codes": [ + "848620", + "848610", + "847150", + "847130" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8471_adp_splits", + "display_module_boundary" + ], + "frozen_id": "v2.0.train.0181", + "hs2_label": "84", + "hs4_label": "8471", + "hs6_label": "847130", + "id": "SH-0181", + "justification_text": "The Toughbook G2 is a rugged detachable 2-in-1 with an Intel CPU, 10.1-inch touchscreen, and optional keyboard base, weighing under 10 kg, which puts it in heading 8471.30 as a portable ADP machine. Classified under HS 8471.30.", + "reference_ruling_ids": [], + "segment": "end_product", + "split": "train", + "tier1_description": "Rugged detachable two in one computer combining a 10.1 inch touchscreen tablet with optional keyboard base, Intel processor, user replaceable expansion packs, weight under 10 kg. Serves cleanroom adjacent maintenance, logistics scanning, and inspection data entry in electronics manufacturing", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Panasonic Connect", + "part_name": "toughbook G2 MK1 detachable" + } + }, + { + "bol_metadata": { + "bol_description": "Wall-mounted 21.5'' Touchscreen Automatic Data Processing Device (PKX-SP2-KL-21-i5, 4GB, SSD128GB, ADP 60W, WITH 1x Clip_Kits). Model: BD/OM-215/Clip_Kits /ADP60W. Manufacturer: ADLINK. 100% new", + "origin_country": "TW", + "shipper": "adlink technology singapore pte ltd" + }, + "boundary_note": "Heading 8471 separates portable complete data-processing machines (8471.30) from processing units presented separately (8471.50).", + "candidate_set": { + "codes": [ + "847150", + "847130", + "844332", + "848610" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8471_adp_splits" + ], + "frozen_id": "v2.0.train.0182", + "hs2_label": "84", + "hs4_label": "8471", + "hs6_label": "847150", + "id": "SH-0182", + "justification_text": "Complete processing units, industrial computers, servers or embedded computer systems fall under 8471.50. Classified under HS 8471.50.", + "reference_ruling_ids": [], + "segment": "end_product", + "split": "train", + "tier1_description": "Wall-mounted 21.5-inch fanless touchscreen panel computer combining a flat capacitive touch display with a quad-core processor, 4 GB RAM and a 128 GB solid-state drive, powered by an external 60 W adapter and supplied with mounting clip kits. The unit operates as a complete computer whose touch panel serves as both input and display, used for self-service kiosks, factory human-machine interfaces and information stations", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "ADLINK", + "part_name": "Wall-mounted 21.5'' Touchscreen" + } + }, + { + "bol_metadata": { + "bol_description": "Image data processor & storage for digital cameras (AmITX-RL-I, i3-13100TE, YZ21B+F300, 16GB, SSD 256GB, Win 10 LTSC 2021 Value). Model: A-RL/i/WMB/M16G/S2/10V/RTC01. Manufacturer: ADLINK. 100% new", + "origin_country": "TW", + "shipper": "adlink technology singapore pte ltd" + }, + "boundary_note": "Heading 8471 separates portable complete data-processing machines (8471.30) from processing units presented separately (8471.50).", + "candidate_set": { + "codes": [ + "848640", + "847130", + "844332", + "847150" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8471_adp_splits" + ], + "frozen_id": "v2.0.train.0183", + "hs2_label": "84", + "hs4_label": "8471", + "hs6_label": "847150", + "id": "SH-0183", + "justification_text": "Complete processing units, industrial computers, servers or embedded computer systems fall under 8471.50. Classified under HS 8471.50.", + "reference_ruling_ids": [], + "segment": "end_product", + "split": "train", + "tier1_description": "Embedded Mini-ITX computer board assembly populated with a 13th-generation quad-core processor, 16 GB DDR5 memory and a 256 GB solid-state drive, preloaded with a long-term-servicing operating system. The board provides multiple display outputs, dual Gigabit Ethernet, USB 3.2 ports, a PCIe x16 slot and M.2 expansion, and functions as the image data processing and storage unit inside digital camera and machine-vision systems and other edge equipment", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "ADLINK", + "part_name": "Image data processor & storage for" + } + }, + { + "bol_metadata": { + "bol_description": "COMPUTER SYSTEM - MODEL NAME: V470VAB-KWPE001WS 90PT03W1-M00PD0(ASUS) (DT: 16.01.2025)COMPUTER SYSTEM", + "origin_country": "TW", + "shipper": "asus global pte. ltd" + }, + "boundary_note": "Heading 8471 separates portable complete data-processing machines (8471.30) from processing units presented separately (8471.50).", + "candidate_set": { + "codes": [ + "847330", + "848610", + "847150", + "847130" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8471_adp_splits" + ], + "frozen_id": "v2.0.train.0184", + "hs2_label": "84", + "hs4_label": "8471", + "hs6_label": "847150", + "id": "SH-0184", + "justification_text": "Complete processing units, industrial computers, servers or embedded computer systems fall under 8471.50. Classified under HS 8471.50.", + "reference_ruling_ids": [], + "segment": "end_product", + "split": "train", + "tier1_description": "All-in-one desktop computer integrating a 27-inch full-HD touch-capable display and the system electronics in a single housing, configured with a six-core low-power processor, 8 GB DDR5 memory (expandable to 32 GB), solid-state storage, Wi-Fi 6E and a preinstalled Windows operating system, supplied with a wired keyboard and mouse. Used as a general-purpose computer for home, education and office tasks", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "ASUS", + "part_name": "computer system - model name" + } + }, + { + "bol_metadata": { + "bol_description": "REPAI & RETURN-SAMPLE OF SERVER SKY-8134S-11, S/NO.SKY8134S11RAD-ES- FOCREPAI & RETURN-SAMPLE OF SERVER SKY-81345-11, S/NO", + "origin_country": "TW", + "shipper": "advantech co., ltd" + }, + "boundary_note": "Heading 8471 separates portable complete data-processing machines (8471.30) from processing units presented separately (8471.50).", + "candidate_set": { + "codes": [ + "847150", + "847330", + "847130", + "848610" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8471_adp_splits" + ], + "frozen_id": "v2.0.train.0185", + "hs2_label": "84", + "hs4_label": "8471", + "hs6_label": "847150", + "id": "SH-0185", + "justification_text": "Complete processing units, industrial computers, servers or embedded computer systems fall under 8471.50. Classified under HS 8471.50.", + "reference_ruling_ids": [], + "segment": "end_product", + "split": "train", + "tier1_description": "Ultra-short-depth 1U rack-mount edge server built around a fourth-generation scalable server processor with integrated radio-access-network acceleration, providing up to sixteen 25-Gigabit Ethernet ports with precision time synchronization, a PCIe 5.0 or OCP 3.0 expansion slot, redundant power supplies and hot-swappable modules, rated for wide operating temperatures. Deployed for Open RAN baseband and multi-access edge computing; this unit is a repaired sample being returned free of charge", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Advantech", + "part_name": "repai & return-sample of server" + } + }, + { + "bol_metadata": { + "bol_description": "NRE-DMSU OF 12NC 3000 147 :AWS (FOR R&D PURPOSE)", + "origin_country": "TW", + "shipper": "advantech europe b.v" + }, + "boundary_note": "Heading 8471 separates portable complete data-processing machines (8471.30) from processing units presented separately (8471.50).", + "candidate_set": { + "codes": [ + "847150", + "847130", + "844332", + "848690" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8471_adp_splits" + ], + "frozen_id": "v2.0.train.0186", + "hs2_label": "84", + "hs4_label": "8471", + "hs6_label": "847150", + "id": "SH-0186", + "justification_text": "Complete processing units, industrial computers, servers or embedded computer systems fall under 8471.50. Classified under HS 8471.50.", + "reference_ruling_ids": [], + "segment": "end_product", + "split": "train", + "tier1_description": "Electronic computing assembly identified only by a twelve-digit manufacturer ordering code, supplied in a small quantity for research and development use under a non-recurring engineering arrangement", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Advantech", + "part_name": "NRE-dmsu of 12NC 3000 147 :AWS (for R&D" + } + }, + { + "bol_metadata": { + "bol_description": "INIZIO VTX V13, P1061838001 REV. B 500-23-0019 (MODEL NO.INIZIO)", + "origin_country": "TW", + "shipper": "american portwell technology, inc" + }, + "boundary_note": "Heading 8471 separates portable complete data-processing machines (8471.30) from processing units presented separately (8471.50).", + "candidate_set": { + "codes": [ + "847150", + "847130", + "844332", + "848620" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8471_adp_splits" + ], + "frozen_id": "v2.0.train.0187", + "hs2_label": "84", + "hs4_label": "8471", + "hs6_label": "847150", + "id": "SH-0187", + "justification_text": "Complete processing units, industrial computers, servers or embedded computer systems fall under 8471.50. Classified under HS 8471.50.", + "reference_ruling_ids": [], + "segment": "end_product", + "split": "train", + "tier1_description": "A purpose-built embedded computer system supplied as a complete boxed unit for integration into a medical or industrial instrument. It comprises an x86 processor board, system memory, solid-state storage and power supply in a metal enclosure, without an integrated display or keyboard. The unit runs the host instrument's control and data-processing software and connects to peripherals through USB, Ethernet and video interfaces", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Portwell", + "part_name": "inizio VTX V13 P1061838001 REV. 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Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-882148", + "CROSS-085221", + "CROSS-877693", + "CROSS-875090", + "CROSS-881718", + "CROSS-884834", + "CROSS-880525", + "CROSS-f89232", + "CROSS-087791", + "CROSS-089042", + "CROSS-816945", + "CROSS-854821", + "CROSS-868566", + "CROSS-883337", + "CROSS-963301", + "CROSS-087695", + "CROSS-803861", + "CROSS-814743", + "CROSS-816943", + "CROSS-816946", + "CROSS-816949", + "CROSS-817220", + "CROSS-818428", + "CROSS-855680", + "CROSS-856928", + "CROSS-869221", + "CROSS-874481", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "Credit-card-sized single-board computer carrying a quad-core x86 system-on-chip with burst speed up to 2.0 GHz, 4 GB of onboard RAM and 64 GB eMMC flash storage with gigabit Ethernet, HDMI output, three USB 3.2 ports and a 40-pin expansion header; functions as a complete processing unit for automation, robotics, edge-AI and retail computing applications", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "AAEON", + "part_name": "UP-APL03X7F-A10-0464 board intel atom" + } + }, + { + "bol_metadata": { + "bol_description": "COM-ICDB7-A12-0006 COM.EXPRESS TYPE 7.D-1848TER 10C.i210.4X10G.4USB.4XDDR4.PEG.4XPCIE[X4]TPM2.0AT.A1.2MOTHERBOARDFOC", + "origin_country": "TW", + "shipper": "aaeon technology inc" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "848640", + "847330", + "848610", + "847150" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0202", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0202", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-881718", + "CROSS-877693", + "CROSS-882148", + "CROSS-085221", + "CROSS-883337", + "CROSS-089122", + "CROSS-816943", + "CROSS-816945", + "CROSS-817220", + "CROSS-818428", + "CROSS-854821", + "CROSS-869221", + "CROSS-874481" + ], + "segment": "component", + "split": "train", + "tier1_description": "Server-grade computer-on-module in COM Express Basic Type 7 format, 125 x 95 mm with a soldered 10-core x86 server processor at 2.0 GHz, four DDR4 SODIMM sockets supporting up to 128 GB, four 10 Gigabit Ethernet interfaces plus a gigabit Ethernet controller, PCIe x16 and four PCIe x4 lanes, four USB ports and hardware TPM 2.0; mounts on carrier boards in edge servers and networking equipment", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "AAEON", + "part_name": "COM-ICDB7-A12-0006 COM.express type" + } + }, + { + "bol_metadata": { + "bol_description": "ECB-927A-A10-0001 COME TYPE7.CARRIER BOARD.4X10GBE.4USB.2COM.2SATA.PCIe.ATX.A1.0 MOTHERBOARDF O C", + "origin_country": "TW", + "shipper": "aaeon technology inc" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "848640", + "844332", + "847330", + "848610" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0203", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0203", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-f89232", + "CROSS-882148", + "CROSS-877693", + "CROSS-883337", + "CROSS-881718", + "CROSS-085221", + "CROSS-884834", + "CROSS-814743", + "CROSS-087791", + "CROSS-089042", + "CROSS-816945", + "CROSS-874481", + "CROSS-880525", + "CROSS-N292764", + "CROSS-816946", + "CROSS-816949", + "CROSS-854821", + "CROSS-855680", + "CROSS-856928", + "CROSS-868566", + "CROSS-875090" + ], + "segment": "component", + "split": "train", + "tier1_description": "An ATX form factor evaluation carrier board for COM Express Type 7 computer-on-modules. The printed circuit board provides four 10 Gigabit Ethernet ports, four USB 3.2 ports, two serial UARTs, two SATA III storage connectors, and PCI Express expansion slots (x16, x8 and two x4), plus debug LEDs and GPIO. It carries no processor itself, supplying the input/output and expansion infrastructure for a plug-in processor module during embedded system development", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "AAEON", + "part_name": "ECB-927A-A10-0001 come TYPE7.carrier" + } + }, + { + "bol_metadata": { + "bol_description": "PICO-APL3-A10-F002 PCIO.N3350.HDMI.EDP.4GBDDR3L.LAN.2COM.4USB.32GB eMMC.M.2 B/E KEY DIO AUDIO A10.MOTHERBOARDF O C", + "origin_country": "TW", + "shipper": "aaeon technology inc" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "847150", + "847330", + "847130", + "848690" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0204", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0204", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-085221", + "CROSS-877693", + "CROSS-880525", + "CROSS-881718", + "CROSS-882148", + "CROSS-087791", + "CROSS-089042", + "CROSS-883337", + "CROSS-818428", + "CROSS-884834", + "CROSS-087695", + "CROSS-089122", + "CROSS-801545", + "CROSS-803861", + "CROSS-816943", + "CROSS-816945", + "CROSS-817220", + "CROSS-854821", + "CROSS-868566", + "CROSS-869221", + "CROSS-874481", + "CROSS-875090", + "CROSS-963301" + ], + "segment": "component", + "split": "train", + "tier1_description": "A Pico-ITX form factor single-board computer roughly 100 x 72 mm, populated with a dual-core 1.1 GHz x86 system-on-chip processor, 4 GB of soldered DDR3L memory, and 32 GB eMMC storage. Interfaces include HDMI and eDP display outputs, Gigabit Ethernet, two serial ports, four USB ports, audio, digital I/O, and an M.2 B/E-key expansion socket. It serves as the processing core of compact embedded and industrial systems", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "AAEON", + "part_name": "pico-APL3-A10-F002" + } + }, + { + "bol_metadata": { + "bol_description": "CARD MZ-POE CARD", + "origin_country": "TW", + "shipper": "asrock industrial computer corporat" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "847330", + "847130", + "844332", + "848610" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0205", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0205", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-882148", + "CROSS-f89232", + "CROSS-884834", + "CROSS-880525", + "CROSS-881718", + "CROSS-883337", + "CROSS-814743", + "CROSS-084702", + "CROSS-085221", + "CROSS-087791", + "CROSS-089042", + "CROSS-801545", + "CROSS-802809", + "CROSS-816263", + "CROSS-816945", + "CROSS-855827", + "CROSS-869571", + "CROSS-877693" + ], + "segment": "component", + "split": "train", + "tier1_description": "An expansion card kit that adds Power-over-Ethernet network capability to a compact embedded. The small printed circuit module plugs into an M.2 socket and provides a Gigabit Ethernet port with power-sourcing circuitry compliant with IEEE 802.3at, able to deliver roughly 30 W at 54 V DC over the network cable to powered devices such as IP cameras", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "ASRock Industrial", + "part_name": "card MZ-POE card" + } + }, + { + "bol_metadata": { + "bol_description": "COMPUTER ACCESSORIES SUB ACCESSORIES", + "origin_country": "TW", + "shipper": "asrock industrial computer corporat" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "848610", + "847330", + "847130", + "844332" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0206", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0206", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-085221", + "CROSS-089122", + "CROSS-877693", + "CROSS-880525", + "CROSS-882148", + "CROSS-881718", + "CROSS-884834", + "CROSS-087695", + "CROSS-087791", + "CROSS-089042", + "CROSS-816943", + "CROSS-817220", + "CROSS-818428", + "CROSS-854821", + "CROSS-868566", + "CROSS-869221", + "CROSS-875090", + "CROSS-883337", + "CROSS-963301" + ], + "segment": "component", + "split": "train", + "tier1_description": "Miscellaneous sub-accessory items packed with compact industrial systems, typically comprising mounting brackets, screws, jumper caps, cable assemblies, and pluggable terminal plugs bundled into accessory kits that support installation and connection of fanless embedded controllers. The shipping line gives no detail on individual contents beyond their role as supplementary accessories", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "ASRock Industrial", + "part_name": "computer accessories SUB accessories" + } + }, + { + "bol_metadata": { + "bol_description": "SINK SODIMM HEATSINK FOR IEP-9000E SINK", + "origin_country": "TW", + "shipper": "asrock industrial computer corporat" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "847330", + "848620", + "844332", + "847130" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0207", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0207", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-882148", + "CROSS-085221", + "CROSS-087791", + "CROSS-089042", + "CROSS-880525", + "CROSS-881718", + "CROSS-089122", + "CROSS-801545", + "CROSS-803861", + "CROSS-814743", + "CROSS-875090", + "CROSS-877693", + "CROSS-884834" + ], + "segment": "component", + "split": "train", + "tier1_description": "A metal heat sink shaped to fit over an SO-DIMM memory module inside a fanless embedded. The finned block, typically extruded aluminum fitted with a thermal interface pad, conducts heat away from the memory chips toward the sealed enclosure for passive dissipation, helping the system maintain reliable operation across wide industrial temperature ranges without a cooling fan", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "ASRock Industrial", + "part_name": "sink SODIMM heatsink for IEP-9000E sink" + } + }, + { + "bol_metadata": { + "bol_description": "CHASSIS BASE CHASSIS (BASE) ASSY CHASSIS", + "origin_country": "TW", + "shipper": "asrock industrial computer corporat" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "847330", + "848620", + "847150", + "848640" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0208", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0208", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-882148", + "CROSS-883337", + "CROSS-877693", + "CROSS-881718", + "CROSS-085221", + "CROSS-087791", + "CROSS-089042", + "CROSS-089822", + "CROSS-816263", + "CROSS-875090" + ], + "segment": "component", + "split": "train", + "tier1_description": "A base chassis assembly for a compact fanless industrial. The machined and sheet-metal base forms the lower structural housing onto which the motherboard, storage, and I/O hardware are mounted with fixing points, connector cut-outs, and surfaces that couple to the finned enclosure for passive cooling. It supports DIN-rail or wall mounting of the finished edge controller", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "ASRock Industrial", + "part_name": "chassis base chassis (base) assy chassis" + } + }, + { + "bol_metadata": { + "bol_description": "COMPUTER CASE DN 1005819-1.1", + "origin_country": "TW", + "shipper": "asus global pte. ltd" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "848620", + "847130", + "847330", + "848690" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0209", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0209", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-882148", + "CROSS-880525", + "CROSS-085221", + "CROSS-877693", + "CROSS-881718", + "CROSS-884834", + "CROSS-f89232", + "CROSS-816263", + "CROSS-087695", + "CROSS-087791", + "CROSS-089042", + "CROSS-089122", + "CROSS-089822", + "CROSS-816943", + "CROSS-816945", + "CROSS-817220", + "CROSS-818428", + "CROSS-854821", + "CROSS-855827", + "CROSS-868566", + "CROSS-869221", + "CROSS-875090", + "CROSS-883337", + "CROSS-963301" + ], + "segment": "component", + "split": "train", + "tier1_description": "Computer cases supplied in volume, on. Each unit is an empty enclosure for a desktop personal computer comprising a steel frame with plastic front panel, drive mounting bays, expansion slot openings, ventilation mesh, and pre-routed front-panel cabling, ready to receive a motherboard, power supply, and storage drives during system assembly", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "ASUS", + "part_name": "computer case DN" + } + }, + { + "bol_metadata": { + "bol_description": "QT cable Raspberry Pi HAT", + "origin_country": "US", + "shipper": "adafruit industries" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "847330", + "848610", + "847130", + "848640" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0210", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0210", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-f89232", + "CROSS-881718", + "CROSS-882148", + "CROSS-884834", + "CROSS-085221", + "CROSS-883337", + "CROSS-877693", + "CROSS-880525", + "CROSS-814743", + "CROSS-816946", + "CROSS-868566", + "CROSS-087695", + "CROSS-802676", + "CROSS-816943", + "CROSS-816945", + "CROSS-816949", + "CROSS-817220", + "CROSS-818428", + "CROSS-854821", + "CROSS-855680", + "CROSS-856928", + "CROSS-869221", + "CROSS-874481", + "CROSS-875090", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "A small add-on circuit board that mounts on the 40-pin GPIO header of a single-board computer and breaks the I2C bus out to several 4-pin JST-SH plug-in connectors. The passive board carries only sockets and routing traces, allowing sensor and peripheral modules to be daisy-chained with polarized cables to the host computer without any soldering", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit Industries", + "part_name": "QT cable Raspberry Pi HAT" + } + }, + { + "bol_metadata": { + "bol_description": "RP2040 board, 8MB QSPI, 20 GPIO, USB Type", + "origin_country": "US", + "shipper": "adafruit industries" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "847330", + "848640", + "844332", + "847150" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0211", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0211", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-882148", + "CROSS-877693", + "CROSS-881718", + "CROSS-f89232", + "CROSS-085221", + "CROSS-875090", + "CROSS-880525", + "CROSS-087791", + "CROSS-089042", + "CROSS-089122", + "CROSS-803861", + "CROSS-814743", + "CROSS-816945", + "CROSS-816946", + "CROSS-816949", + "CROSS-855680", + "CROSS-856928", + "CROSS-868566", + "CROSS-874481", + "CROSS-883337", + "CROSS-884834", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "Compact microcontroller development board built around an RP2040 dual-core Arm Cortex-M0+ chip running at 133 MHz with 264 KB RAM, 8 MB QSPI flash for program and file storage, about 20 general-purpose I/O pins, and a USB Type-C connector. The board exposes I2C, SPI, UART, analog and PWM interfaces and is programmed over USB in C/C++, MicroPython or CircuitPython for prototyping and embedded control projects", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit Industries", + "part_name": "RP2040 board 8MB QSPI 20 GPIO USB Type" + } + }, + { + "bol_metadata": { + "bol_description": "RP2040 USB Key, Stemma QT, PCB, NeoPixel", + "origin_country": "US", + "shipper": "adafruit industries" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "848610", + "847330", + "844332", + "847150" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0212", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0212", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-f89232", + "CROSS-882148", + "CROSS-085221", + "CROSS-881718", + "CROSS-883337", + "CROSS-884834", + "CROSS-814743", + "CROSS-877693", + "CROSS-816945", + "CROSS-816946", + "CROSS-875090", + "CROSS-880525", + "CROSS-802676", + "CROSS-803861", + "CROSS-816949", + "CROSS-855680", + "CROSS-856928", + "CROSS-868566", + "CROSS-874481", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "USB-key form-factor microcontroller board based on an RP2040 dual-core Arm Cortex-M0+ running at about 125 MHz with 264 KB RAM and 8 MB flash. The bare printed circuit board plugs directly into a USB Type-A port and carries an addressable RGB LED, reset and boot buttons, and a 4-pin I2C expansion connector for plug-and-play sensor modules. Programmable in CircuitPython or C/C++ for sensor logging, HID and macro-key applications", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit Industries", + "part_name": "RP2040 USB Key Stemma QT PCB NeoPixel" + } + }, + { + "bol_metadata": { + "bol_description": "USB key, Trinket M0, APDS9960 sensor", + "origin_country": "US", + "shipper": "adafruit industries" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "847150", + "847330", + "844332", + "847130" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0213", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0213", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-882148", + "CROSS-877693", + "CROSS-883337", + "CROSS-f89232", + "CROSS-085221", + "CROSS-875090", + "CROSS-880525", + "CROSS-881718", + "CROSS-884834", + "CROSS-803861", + "CROSS-814743", + "CROSS-816945", + "CROSS-816946", + "CROSS-816949", + "CROSS-854821", + "CROSS-855680", + "CROSS-856928", + "CROSS-868566", + "CROSS-874481", + "CROSS-963301", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "USB-key form-factor sensor development board carrying a 48 MHz ATSAMD21 32-bit Arm Cortex-M0+ microcontroller with 256 KB flash and 32 KB RAM, an APDS9960 integrated proximity, ambient-light, RGB color and gesture sensor, two addressable RGB LEDs, and two capacitive-touch pads. The bare PCB plugs into a USB Type-A port and is programmed in CircuitPython or Arduino to provide serial, MIDI or keyboard/mouse HID output from sensor readings", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit Industries", + "part_name": "USB key Trinket M0 APDS9960 sensor" + } + }, + { + "bol_metadata": { + "bol_description": "USB NeoPixel rotary encoder board", + "origin_country": "US", + "shipper": "adafruit industries" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "847130", + "847330", + "848620", + "844332" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0214", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0214", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-882148", + "CROSS-f89232", + "CROSS-881718", + "CROSS-877693", + "CROSS-880525", + "CROSS-883337", + "CROSS-884834", + "CROSS-085221", + "CROSS-868566", + "CROSS-875090", + "CROSS-087695", + "CROSS-803861", + "CROSS-814743", + "CROSS-816943", + "CROSS-816945", + "CROSS-816946", + "CROSS-816949", + "CROSS-817220", + "CROSS-818428", + "CROSS-854821", + "CROSS-855680", + "CROSS-856928", + "CROSS-869221", + "CROSS-874481", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "USB-key form-factor microcontroller board with a 48 MHz ATSAMD21 32-bit Arm Cortex-M0+ (256 KB flash, 32 KB RAM), an addressable RGB LED, a capacitive-touch pad, and a solder footprint for a standard PEC11/PEC12-type rotary encoder. The bare PCB plugs into a USB Type-A port and is programmed in CircuitPython or Arduino to act as a volume knob, scroll wheel or macro input device for a computer", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit Industries", + "part_name": "USB NeoPixel rotary encoder board" + } + }, + { + "bol_metadata": { + "bol_description": "Microcoprocessor Board KB2040 MICROPROCESSOR BOARD", + "origin_country": "US", + "shipper": "adafruit industries llc" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "847130", + "847150", + "848610", + "847330" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0215", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0215", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-882148", + "CROSS-085221", + "CROSS-881718", + "CROSS-877693", + "CROSS-884834", + "CROSS-f89232", + "CROSS-816945", + "CROSS-868566", + "CROSS-875090", + "CROSS-880525", + "CROSS-883337", + "CROSS-087695", + "CROSS-803861", + "CROSS-814743", + "CROSS-816943", + "CROSS-816946", + "CROSS-816949", + "CROSS-817220", + "CROSS-818428", + "CROSS-854821", + "CROSS-855680", + "CROSS-856928", + "CROSS-869221", + "CROSS-874481", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "Small microcontroller driver board in the Pro Micro footprint, intended for building custom computer keyboards. It carries an RP2040 dual-core Arm Cortex-M0+ at up to 133 MHz, 264 KB RAM, 8 MB QSPI flash, 20 GPIO pins, a USB Type-C socket, an addressable RGB LED, a boot button, and a 4-pin I2C expansion connector. Castellated edge pads allow it to be soldered onto keyboard PCBs as the controller", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit Industries", + "part_name": "Microcoprocessor Board KB2040" + } + }, + { + "bol_metadata": { + "bol_description": "Microprocessor Board ESP32-S3-WROOM-1 Matrix Portal S3(WPC REG NO:ETA-SD-20220807236 DTD:01.09.2022)MICROPROCESSOR BOARD", + "origin_country": "US", + "shipper": "adafruit industries llc" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "847130", + "844332", + "848610", + "847330" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0216", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0216", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-085221", + "CROSS-881718", + "CROSS-882148", + "CROSS-875090", + "CROSS-877693", + "CROSS-f89232", + "CROSS-816945", + "CROSS-880525", + "CROSS-883337", + "CROSS-884834", + "CROSS-087791", + "CROSS-089042", + "CROSS-803861", + "CROSS-814743", + "CROSS-816946", + "CROSS-816949", + "CROSS-818428", + "CROSS-854821", + "CROSS-855680", + "CROSS-856928", + "CROSS-868566", + "CROSS-874481", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "Microcontroller driver board for HUB75-compatible RGB LED matrix display panels from 16x32 up to 64x64 pixels. It is built on an ESP32-S3 dual-core module with 2.4 GHz Wi-Fi and Bluetooth LE, 8 MB flash and 2 MB PSRAM, and includes a USB Type-C connector, a triple-axis accelerometer, an I2C expansion connector, and a parallel output peripheral that drives the matrix directly. Programmable in CircuitPython or Arduino for internet-connected LED signage", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit Industries", + "part_name": "Microprocessor Board ESP32-S3-WROOM-1" + } + }, + { + "bol_metadata": { + "bol_description": "Microprocessor Board ESP32-WROOM-32E HUZZAH32 Feather Board(WPC REG NO:ETA-SD-20211108498 DTD:17.12.2021)MICROPROCESSOR BOARD", + "origin_country": "US", + "shipper": "adafruit industries llc" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "847330", + "848620", + "848640", + "844332" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0217", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0217", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-f89232", + "CROSS-881718", + "CROSS-085221", + "CROSS-882148", + "CROSS-877693", + "CROSS-883337", + "CROSS-087791", + "CROSS-089122", + "CROSS-814743", + "CROSS-874481", + "CROSS-884834", + "CROSS-089042", + "CROSS-801545", + "CROSS-803861", + "CROSS-816945", + "CROSS-816946", + "CROSS-816949", + "CROSS-855680", + "CROSS-856928", + "CROSS-868566", + "CROSS-875090", + "CROSS-880525", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "Microcontroller development board built around an ESP32-WROOM-32E module containing a 240 MHz dual-core processor, 520 KB SRAM, 4 MB SPI flash, and integrated 2.4 GHz Wi-Fi and Bluetooth with PCB trace antenna. The roughly 51 x 23 mm board adds a USB-to-serial converter, lithium-polymer battery charging circuit, and breadboard-friendly GPIO headers exposing UART, SPI, I2C and analog pins, and is used for prototyping wireless IoT and embedded control applications", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit Industries", + "part_name": "Microprocessor Board ESP32-WROOM-32E" + } + }, + { + "bol_metadata": { + "bol_description": "Microprocessor Board Adafruit Feather M4 Express MICROPROCESSOR BOARD", + "origin_country": "US", + "shipper": "adafruit industries llc" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "847150", + "847330", + "848620", + "848640" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0218", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0218", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-882148", + "CROSS-085221", + "CROSS-881718", + "CROSS-877693", + "CROSS-f89232", + "CROSS-874481", + "CROSS-875090", + "CROSS-883337", + "CROSS-963301", + "CROSS-087791", + "CROSS-089042", + "CROSS-803861", + "CROSS-814743", + "CROSS-816945", + "CROSS-816946", + "CROSS-816949", + "CROSS-855680", + "CROSS-855827", + "CROSS-856928", + "CROSS-868566", + "CROSS-880525", + "CROSS-884834", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "Microcontroller development board approximately 51 x 23 mm carrying a 120 MHz ATSAMD51 Arm Cortex-M4 processor with floating-point unit, 512 KB internal flash, 192 KB RAM, and an additional 2 MB SPI flash for file and script storage. It provides micro-USB connectivity with a drag-and-drop bootloader, a lithium-polymer battery connector and charger, an addressable RGB LED, and 3.3 V GPIO headers with PWM, analog, I2C, SPI and UART for embedded prototyping", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit Industries", + "part_name": "Microprocessor Board Feather M4 Express" + } + }, + { + "bol_metadata": { + "bol_description": "Microprocessor Board Adafruit HUZZAH32 ESP32 Feather Board ESP32-WROOM-32(WPC REG NO:ETA-SD-20240706763 DTD:16.07.202MICROPROCESSOR BOARD", + "origin_country": "US", + "shipper": "adafruit industries llc" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "847150", + "847330", + "848610", + "848690" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0219", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0219", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-882148", + "CROSS-085221", + "CROSS-087791", + "CROSS-877693", + "CROSS-881718", + "CROSS-883337", + "CROSS-f89232", + "CROSS-089042", + "CROSS-874481", + "CROSS-875090", + "CROSS-884834", + "CROSS-801545", + "CROSS-803861", + "CROSS-814743", + "CROSS-816945", + "CROSS-816946", + "CROSS-816949", + "CROSS-855680", + "CROSS-856928", + "CROSS-868566", + "CROSS-880525", + "CROSS-963301", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "Microcontroller development board based on an ESP32-WROOM-32 module with a 240 MHz dual-core processor, 520 KB SRAM, 4 MB SPI flash, and integrated 2.4 GHz Wi-Fi plus Bluetooth Classic/LE on a tuned PCB antenna. The board includes a USB-to-serial bridge, automatic bootloader reset, lithium-polymer battery charging, and stackable GPIO headers exposing UART, SPI, I2C, analog and PWM signals for wireless sensing, automation and IoT prototyping", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit Industries", + "part_name": "Microprocessor Board HUZZAH32 ESP32" + } + }, + { + "bol_metadata": { + "bol_description": "Microprocessor Board Adafruit ESP32-S3 Feather ESP32-S3-MINI-1(WPC REG NO:ETA-SD-20230807584 DTD:30.08.2023)MICROPROCESSOR BOARD", + "origin_country": "US", + "shipper": "adafruit industries llc" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "847130", + "848610", + "848640", + "847330" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0220", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0220", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-882148", + "CROSS-085221", + "CROSS-881718", + "CROSS-883337", + "CROSS-f89232", + "CROSS-816945", + "CROSS-877693", + "CROSS-884834", + "CROSS-087791", + "CROSS-089042", + "CROSS-803861", + "CROSS-814743", + "CROSS-816946", + "CROSS-816949", + "CROSS-855680", + "CROSS-856928", + "CROSS-868566", + "CROSS-874481", + "CROSS-875090", + "CROSS-880525", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "Microcontroller development board in a 51 x 23 mm form factor using an ESP32-S3-MINI-1 module with dual 240 MHz cores, 8 MB flash, 2.4 GHz Wi-Fi and Bluetooth LE, and native USB allowing it to enumerate as a keyboard, disk drive or serial device. The board provides a USB Type-C connector, lithium-polymer battery charging, an I2C expansion connector, an addressable RGB LED, and GPIO headers for embedded and IoT prototyping in Arduino, ESP-IDF or CircuitPython", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit Industries", + "part_name": "Microprocessor Board ESP32-S3 Feather" + } + }, + { + "bol_metadata": { + "bol_description": ")9698851917E Motherboard 9698851917E Motherboard", + "origin_country": "TW", + "shipper": "advantech co.,ltd" + }, + "boundary_note": "Populated printed-circuit board: classifiable as an ADP part (8473.30), as the integrated circuit that dominates it (8542.31/32/39), or as a part of control apparatus (8538.90); Section XVI Note 2 governs the attribution. Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "847130", + "848640", + "847330", + "847150" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "populated_board_boundary", + "storage_boundary" + ], + "frozen_id": "v2.0.train.0221", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0221", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-882148", + "CROSS-f89232", + "CROSS-085221", + "CROSS-881718", + "CROSS-883337", + "CROSS-884834", + "CROSS-875090", + "CROSS-880525", + "CROSS-814743", + "CROSS-877693", + "CROSS-087791", + "CROSS-089042", + "CROSS-089122", + "CROSS-803861", + "CROSS-816943", + "CROSS-816945", + "CROSS-854821", + "CROSS-868566", + "CROSS-874481", + "CROSS-087695", + "CROSS-089822", + "CROSS-801545", + "CROSS-816263", + "CROSS-816946", + "CROSS-816949", + "CROSS-817220", + "CROSS-818428", + "CROSS-855680", + "CROSS-856928", + "CROSS-869221", + "CROSS-869571", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "Industrial computer motherboard assembly supplied as a spare or replacement part. It is a printed circuit board populated with chipset, memory sockets, expansion slots and I/O interfaces, supplied without a processor installed, and is designed to be fitted inside an industrial or embedded computer system to interconnect the CPU, memory, storage and peripheral cards. Supplied free of charge as a service/replacement item for an existing system", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Advantech", + "part_name": ")9698851917E Motherboard" + } + }, + { + "bol_metadata": { + "bol_description": "9896U117N00 BOARD 96/97 ASSEMBLY, 989 PN for 9696U117N00", + "origin_country": "TW", + "shipper": "advantech co., ltd" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "847330", + "848690", + "847130", + "848640" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0222", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0222", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-f89232", + "CROSS-882148", + "CROSS-085221", + "CROSS-881718", + "CROSS-883337", + "CROSS-884834", + "CROSS-880525", + "CROSS-814743", + "CROSS-877693", + "CROSS-089122", + "CROSS-868566", + "CROSS-874481", + "CROSS-875090", + "CROSS-087695", + "CROSS-087791", + "CROSS-089042", + "CROSS-089822", + "CROSS-816263", + "CROSS-816943", + "CROSS-816945", + "CROSS-816946", + "CROSS-816949", + "CROSS-817220", + "CROSS-818428", + "CROSS-854821", + "CROSS-855680", + "CROSS-856928", + "CROSS-869221", + "CROSS-963301", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "Printed circuit board assembly for an industrial embedded computer, supplied as a numbered service part replacing an earlier board revision. The populated board carries the interconnect circuitry, connectors and supporting components needed to function within the host computer system, and is supplied on its own without processor, enclosure or accessories for incorporation into or repair of industrial computing equipment", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Advantech", + "part_name": "9896U117N00 board 96/97 assembly 989 PN" + } + }, + { + "bol_metadata": { + "bol_description": "PCI-1710U-DE CARD, 100KS/s, 12-bit Multi Universal PCI Card", + "origin_country": "TW", + "shipper": "advantech co., ltd" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "848620", + "848690", + "848610", + "847330" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0223", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0223", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-877693", + "CROSS-085221", + "CROSS-883337", + "CROSS-880525", + "CROSS-882148", + "CROSS-087791", + "CROSS-089042", + "CROSS-854821", + "CROSS-855827", + "CROSS-881718", + "CROSS-884834", + "CROSS-963301", + "CROSS-801545", + "CROSS-802809", + "CROSS-816263", + "CROSS-816945", + "CROSS-816946", + "CROSS-816949", + "CROSS-869571", + "CROSS-875090" + ], + "segment": "component", + "split": "train", + "tier1_description": "Universal PCI plug-in data acquisition card for desktop and industrial computers. It provides 16 single-ended or 8 differential analog input channels with a 12-bit analog-to-digital converter sampling at up to 100 kS/s, two 12-bit analog output channels, 16 digital inputs, 16 digital outputs, a programmable counter/timer, automatic channel/gain scanning and a 4,096-sample FIFO buffer, used for measurement and control tasks in test and automation systems", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Advantech", + "part_name": "PCI-1710U-DE CARD 100KS/s 12-bit Multi" + } + }, + { + "bol_metadata": { + "bol_description": "PCE-7132G2-00A3 BOARD, LGA1200 W480E DDR4/Xeon WITH VGA, WITH o LPT,8892", + "origin_country": "TW", + "shipper": "advantech co., ltd" + }, + "boundary_note": "Populated printed-circuit board: classifiable as an ADP part (8473.30), as the integrated circuit that dominates it (8542.31/32/39), or as a part of control apparatus (8538.90); Section XVI Note 2 governs the attribution. Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "847150", + "847330", + "848690", + "848640" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "populated_board_boundary", + "storage_boundary" + ], + "frozen_id": "v2.0.train.0224", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0224", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-880525", + "CROSS-882148", + "CROSS-085221", + "CROSS-877693", + "CROSS-881718", + "CROSS-884834", + "CROSS-f89232", + "CROSS-801545", + "CROSS-818428", + "CROSS-854821", + "CROSS-868566", + "CROSS-869571", + "CROSS-874481", + "CROSS-875090", + "CROSS-883337", + "CROSS-087695", + "CROSS-087791", + "CROSS-089042", + "CROSS-089122", + "CROSS-802809", + "CROSS-803861", + "CROSS-814743", + "CROSS-816263", + "CROSS-816943", + "CROSS-816945", + "CROSS-816946", + "CROSS-816949", + "CROSS-817220", + "CROSS-855680", + "CROSS-855827", + "CROSS-856928", + "CROSS-869221", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "Full-size PICMG 1.3 single-board computer card for industrial rack-mount systems, accepting LGA1200-socket 10th-generation Xeon W and Core processors on a W480E chipset. The board supports up to 64 GB dual-channel DDR4, PCIe 3.0, M.2, SATA 3.0 with software RAID, USB 3.2, dual gigabit Ethernet, and triple display output via VGA and DVI-D/DisplayPort, and slides into a backplane to serve as the host processor board of an industrial computer. Supplied without CPU or memory installed", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Advantech", + "part_name": "PCE-7132G2-00A3 board LGA1200 W480E" + } + }, + { + "bol_metadata": { + "bol_description": "SOM-DB2510-00A1 BOARD, SMARC R2.1 Devel. Board Rev. A1", + "origin_country": "TW", + "shipper": "advantech co., ltd" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "847330", + "847130", + "848620", + "848610" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0225", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0225", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-882148", + "CROSS-085221", + "CROSS-877693", + "CROSS-f89232", + "CROSS-874481", + "CROSS-880525", + "CROSS-884834", + "CROSS-N292764", + "CROSS-087791", + "CROSS-089042", + "CROSS-814743", + "CROSS-816945", + "CROSS-816946", + "CROSS-816949", + "CROSS-855680", + "CROSS-856928", + "CROSS-868566", + "CROSS-881718", + "CROSS-883337", + "CROSS-963301" + ], + "segment": "component", + "split": "train", + "tier1_description": "Development carrier board for SMARC 2.0/2.1.1 computer-on-modules, used during design and evaluation of embedded computing products. The board provides the module connector plus break-outs for LVDS/eDP and HDMI/DisplayPort displays, PCIe with SIM socket, M.2 E-key, SATA, USB 3.2 and USB Type-C, CAN-FD, eSPI, up to 14 GPIO, and a Micro SD slot with ATX or 12 V DC power input and onboard debug indicators for BIOS and power states. Supplied without the processor module", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Advantech", + "part_name": "SOM-DB2510-00A1 board smarc R2.1 Devel" + } + }, + { + "bol_metadata": { + "bol_description": "PCI-1602B-CE CARD, RS232/422/485 PCI COMM CARD WITH SURGE", + "origin_country": "TW", + "shipper": "advantech co., ltd" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "844332", + "847330", + "848690", + "847130" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0226", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0226", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-881718", + "CROSS-882148", + "CROSS-085221", + "CROSS-880525", + "CROSS-883337", + "CROSS-855827", + "CROSS-877693", + "CROSS-884834", + "CROSS-087695", + "CROSS-087791", + "CROSS-089042", + "CROSS-089122", + "CROSS-801545", + "CROSS-802809", + "CROSS-814743", + "CROSS-816263", + "CROSS-816943", + "CROSS-817220", + "CROSS-818428", + "CROSS-854821", + "CROSS-868566", + "CROSS-869221", + "CROSS-869571", + "CROSS-875090", + "CROSS-963301" + ], + "segment": "component", + "split": "train", + "tier1_description": "A two-port serial communication interface card on a Universal PCI bus form factor, providing RS-232, RS-422 and RS-485 ports for installation in a desktop or industrial computer. It uses a dual-UART controller with 256-byte FIFOs, supports data rates up to 921.6 kbps, and includes built-in surge protection on the serial lines for connecting industrial field devices and instruments to the host computer", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Advantech", + "part_name": "PCI-1602B-CE card RS232/422/485 PCI" + } + }, + { + "bol_metadata": { + "bol_description": "AIMB-TPMSPI-0IA1 BOARD, SPI TPM 2.0 Module Infineon IC, A101-1", + "origin_country": "TW", + "shipper": "advantech co., ltd" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "848640", + "844332", + "847330", + "847130" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0227", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0227", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-881718", + "CROSS-f89232", + "CROSS-882148", + "CROSS-883337", + "CROSS-884834", + "CROSS-085221", + "CROSS-814743", + "CROSS-875090", + "CROSS-877693", + "CROSS-880525", + "CROSS-087791", + "CROSS-089042", + "CROSS-868566", + "CROSS-087695", + "CROSS-816943", + "CROSS-816945", + "CROSS-816946", + "CROSS-816949", + "CROSS-817220", + "CROSS-818428", + "CROSS-854821", + "CROSS-855680", + "CROSS-856928", + "CROSS-869221", + "CROSS-874481", + "CROSS-963301", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "A small printed circuit board module carrying a Trusted Platform Module 2.0 security controller chip, designed to plug into the SPI header of an industrial motherboard. The module provides hardware-based cryptographic key generation and storage, secure boot attestation and platform integrity functions compliant with TCG 2.0 specifications, enabling disk encryption and trusted computing features on the host computer", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Advantech", + "part_name": "aimb-tpmspi-0IA1 board SPI TPM 2.0" + } + }, + { + "bol_metadata": { + "bol_description": "IPC-610BP-00HD CHASSIS FOR INDUSTRIAL COMPUTER, IPC-610BP-HRev.D WITH O PSU", + "origin_country": "TW", + "shipper": "advantech co., ltd" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "848690", + "848640", + "847130", + "847330" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0228", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0228", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-882148", + "CROSS-877693", + "CROSS-880525", + "CROSS-881718", + "CROSS-883337", + "CROSS-085221", + "CROSS-884834", + "CROSS-087695", + "CROSS-801545", + "CROSS-802809", + "CROSS-816263", + "CROSS-816943", + "CROSS-816945", + "CROSS-816946", + "CROSS-816949", + "CROSS-817220", + "CROSS-818428", + "CROSS-854821", + "CROSS-855827", + "CROSS-868566", + "CROSS-869221", + "CROSS-869571", + "CROSS-875090" + ], + "segment": "component", + "split": "train", + "tier1_description": "A 4U 19-inch rackmount steel chassis for building an industrial computer, supplied without a power supply unit. It accommodates a backplane or motherboard with up to 15 add-on card slots, shock-resistant bays for three 5.25-inch and one 3.5-inch drives, dual front-accessible filtered cooling fans, front USB and PS/2 ports, status LEDs and a lockable front door, and accepts single or redundant power supplies", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Advantech", + "part_name": "IPC-610BP-00HD chassis for industrial" + } + }, + { + "bol_metadata": { + "bol_description": "P KGS COMPUTER SYSTEM LCD DISPLAY CIRCUIT BOARD DC NO 8228 9231 9232 9909", + "origin_country": "TW", + "shipper": "advantech co., ltd" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "848620", + "847330", + "844332", + "848640" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "low", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0229", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0229", + "justification_text": "Mixed computer systems, displays and PCBs need itemization; the described principal goods appear to be ADP processing units under 8471.50 rather than parts-only 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-882148", + "CROSS-877693", + "CROSS-881718", + "CROSS-085221", + "CROSS-f89232", + "CROSS-880525", + "CROSS-883337", + "CROSS-818428", + "CROSS-854821", + "CROSS-884834", + "CROSS-087791", + "CROSS-089042", + "CROSS-814743", + "CROSS-816943", + "CROSS-817220", + "CROSS-869221", + "CROSS-875090", + "CROSS-963301", + "CROSS-087695", + "CROSS-816945", + "CROSS-855827", + "CROSS-868566" + ], + "segment": "component", + "split": "train", + "tier1_description": "A consolidated palletized computer hardware comprising assembled computer systems, liquid crystal display monitors and populated printed circuit boards. The goods are finished data processing equipment and their electronic board-level components supplied together for distribution with desktop computer systems integrating a processing unit with input and output capability as the lead commodity", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Advantech", + "part_name": "P KGS computer system LCD display" + } + }, + { + "bol_metadata": { + "bol_description": "ITEM)ADD-IN CARD,OTHER,FOR COMPUTER,NO ENC FM67/85 LOOKOUT RIDGE mUDV (FOR R&D PURPOSE)", + "origin_country": "US", + "shipper": "altera semiconductor technology m sdn" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "847330", + "847130", + "848690", + "847150" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0230", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0230", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-f89232", + "CROSS-882148", + "CROSS-880525", + "CROSS-881718", + "CROSS-884834", + "CROSS-085221", + "CROSS-814743", + "CROSS-883337", + "CROSS-089122", + "CROSS-877693", + "CROSS-816945", + "CROSS-868566", + "CROSS-875090", + "CROSS-087695", + "CROSS-801545", + "CROSS-802809", + "CROSS-816263", + "CROSS-816943", + "CROSS-816946", + "CROSS-816949", + "CROSS-817220", + "CROSS-818428", + "CROSS-854821", + "CROSS-855680", + "CROSS-855827", + "CROSS-856928", + "CROSS-869221", + "CROSS-869571", + "CROSS-874481", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "An unenclosed printed circuit add-in card for installation in a computer expansion slot, supplied free of charge for research and development use. The card is a development and validation board populated with programmable logic and interface circuitry, used by engineers to prototype and test new platform features inside a host computer system rather than for resale as a finished consumer product", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Altera", + "part_name": "item)ADD-in card other for computer NO" + } + }, + { + "bol_metadata": { + "bol_description": "UCSX-9508-ACPEM= UCS 9508 CHASSIS REAR AC POWER EXPANSION MODULE", + "origin_country": "US", + "shipper": "cisco systems, inc" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "847330", + "848620", + "848690", + "848610" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0231", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0231", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-085221", + "CROSS-877693", + "CROSS-880525", + "CROSS-882148", + "CROSS-883337", + "CROSS-884834", + "CROSS-087791", + "CROSS-089042", + "CROSS-089122", + "CROSS-089822", + "CROSS-816263", + "CROSS-816945", + "CROSS-818428", + "CROSS-869571", + "CROSS-963301" + ], + "segment": "component", + "split": "train", + "tier1_description": "A rear-mounted plug-in power expansion module for an 8-slot modular server chassis. The module installs at the back of the enclosure and allows additional AC power supply units to be fitted, scaling the chassis power capacity and providing power distribution and management for the compute nodes. It is a hot-pluggable mechanical-electrical assembly dedicated to that server enclosure family", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Cisco Systems", + "part_name": "ucsx-9508-acpem= UCS 9508 chassis rear" + } + }, + { + "bol_metadata": { + "bol_description": "CERTIFIED MEMORY MODULE FOR CONGATEC COME TYPE 6 SOM,DDR4-SODIMM-2400", + "origin_country": "DE", + "shipper": "congatec gmbh" + }, + "boundary_note": "Populated printed-circuit board: classifiable as an ADP part (8473.30), as the integrated circuit that dominates it (8542.31/32/39), or as a part of control apparatus (8538.90); Section XVI Note 2 governs the attribution. Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "848620", + "847130", + "844332", + "847330" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "populated_board_boundary", + "storage_boundary" + ], + "frozen_id": "v2.0.train.0232", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0232", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-f89232", + "CROSS-882148", + "CROSS-881718", + "CROSS-085221", + "CROSS-087791", + "CROSS-877693", + "CROSS-884834", + "CROSS-814743", + "CROSS-880525", + "CROSS-883337", + "CROSS-089042", + "CROSS-816943", + "CROSS-816945", + "CROSS-817220", + "CROSS-818428", + "CROSS-854821", + "CROSS-868566", + "CROSS-869221", + "CROSS-087695", + "CROSS-801545", + "CROSS-803861", + "CROSS-816946", + "CROSS-816949", + "CROSS-855680", + "CROSS-855827", + "CROSS-856928", + "CROSS-874481", + "CROSS-875090", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "A 260-pin DDR4 SO-DIMM random access memory module rated at /s and 1.2 V, validated for use with computer-on-module boards conforming to the COM Express Type 6 standard. The small-outline module carries DRAM integrated circuits on a printed circuit board and plugs into the SODIMM socket of an embedded computer board to provide its working system memory", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Congatec", + "part_name": "certified memory module for come type 6" + } + }, + { + "bol_metadata": { + "bol_description": "ITEM)-ITL2G-N31937-202 TA ADD-IN CARD PTL-P RVP TCSS 104-USBC RETIMER CCG (FOR R&D PURPOSE)", + "origin_country": "US", + "shipper": "flextronics telecom systems ltd" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "847330", + "847150", + "848690", + "844332" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0233", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0233", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-f89232", + "CROSS-881718", + "CROSS-883337", + "CROSS-085221", + "CROSS-882148", + "CROSS-814743", + "CROSS-884834", + "CROSS-874481", + "CROSS-875090", + "CROSS-877693", + "CROSS-880525", + "CROSS-089122", + "CROSS-801545", + "CROSS-802809", + "CROSS-816263", + "CROSS-816945", + "CROSS-816946", + "CROSS-816949", + "CROSS-855680", + "CROSS-855827", + "CROSS-856928", + "CROSS-868566", + "CROSS-869571", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "An unenclosed printed circuit add-in test card for a processor reference validation platform, supplied free of charge for research and development. The board carries a 40 Gbps USB Type-C signal retimer and a USB power-delivery controller, and plugs into the validation platform to exercise and debug the host processor's Type-C subsystem during pre-production engineering work", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Flex", + "part_name": "item)-ITL2G-N31937-202 TA ADD-in card" + } + }, + { + "bol_metadata": { + "bol_description": "MOTHER BOARD (30)", + "origin_country": "TW", + "shipper": "gigabyte technology co ltd" + }, + "boundary_note": "Populated printed-circuit board: classifiable as an ADP part (8473.30), as the integrated circuit that dominates it (8542.31/32/39), or as a part of control apparatus (8538.90); Section XVI Note 2 governs the attribution. Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "847150", + "848610", + "847330", + "848690" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "populated_board_boundary", + "storage_boundary" + ], + "frozen_id": "v2.0.train.0234", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0234", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-f89232", + "CROSS-882148", + "CROSS-085221", + "CROSS-884834", + "CROSS-877693", + "CROSS-880525", + "CROSS-883337", + "CROSS-854821", + "CROSS-881718", + "CROSS-814743", + "CROSS-816945", + "CROSS-868566", + "CROSS-816946", + "CROSS-816949", + "CROSS-874481", + "CROSS-875090", + "CROSS-087695", + "CROSS-087791", + "CROSS-089042", + "CROSS-089122", + "CROSS-089822", + "CROSS-801545", + "CROSS-803861", + "CROSS-816263", + "CROSS-816943", + "CROSS-817220", + "CROSS-818428", + "CROSS-855680", + "CROSS-855827", + "CROSS-856928", + "CROSS-857854", + "CROSS-869221", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "A bulk desktop computer motherboards. Each motherboard is a populated printed circuit board providing the processor socket, memory slots, chipset, expansion slots and rear input/output connectors that form the main system board of a personal computer, supplied without processor or memory installed for assembly into finished computers", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "GIGABYTE", + "part_name": "mother board (30)" + } + }, + { + "bol_metadata": { + "bol_description": "MOTHERBOARD) B650M GAMING X AX M/B B650M GAMING X AX 1.3", + "origin_country": "TW", + "shipper": "gigabyte technology co. ltd" + }, + "boundary_note": "Populated printed-circuit board: classifiable as an ADP part (8473.30), as the integrated circuit that dominates it (8542.31/32/39), or as a part of control apparatus (8538.90); Section XVI Note 2 governs the attribution.", + "candidate_set": { + "codes": [ + "848690", + "848620", + "847330", + "844332" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "populated_board_boundary" + ], + "frozen_id": "v2.0.train.0235", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0235", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-877693", + "CROSS-880525", + "CROSS-882148", + "CROSS-881718", + "CROSS-883337", + "CROSS-884834", + "CROSS-085221", + "CROSS-868566", + "CROSS-f89232", + "CROSS-816945", + "CROSS-087695", + "CROSS-087791", + "CROSS-089042", + "CROSS-814743", + "CROSS-816943", + "CROSS-816946", + "CROSS-816949", + "CROSS-817220", + "CROSS-818428", + "CROSS-854821", + "CROSS-855680", + "CROSS-855827", + "CROSS-856928", + "CROSS-869221", + "CROSS-874481", + "CROSS-875090", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "A micro-ATX desktop computer motherboard for socket AM5 processors, based on a mid-range chipset. It provides four DDR5 DIMM slots supporting up to 256 GB, two PCIe 4.0 x4 M.2 storage connectors, a PCIe x16 expansion slot, digital VRM power delivery, 2.5 Gigabit Ethernet, Wi-Fi 6E, and DisplayPort, HDMI and USB-C rear connectivity, serving as the main system board of a gaming PC", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "GIGABYTE", + "part_name": "motherboard) B650M gaming X AX M/B" + } + }, + { + "bol_metadata": { + "bol_description": "GRAPHIC CARD) GV-N507TGAMING OC-16GD GRAPHICS CARD GV-N507TGAMING OC-16GD 1.0", + "origin_country": "TW", + "shipper": "gigabyte technology co. ltd" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "847130", + "848620", + "848690", + "847330" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0236", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0236", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-880525", + "CROSS-884834", + "CROSS-085221", + "CROSS-882148", + "CROSS-801545", + "CROSS-855827", + "CROSS-881718", + "CROSS-087695", + "CROSS-087791", + "CROSS-089042", + "CROSS-089122", + "CROSS-802809", + "CROSS-803861", + "CROSS-814743", + "CROSS-816263", + "CROSS-816943", + "CROSS-816945", + "CROSS-817220", + "CROSS-818428", + "CROSS-854821", + "CROSS-868566", + "CROSS-869221", + "CROSS-869571", + "CROSS-875090", + "CROSS-877693", + "CROSS-883337" + ], + "segment": "component", + "split": "train", + "tier1_description": "A PCI Express 5.0 graphics card built around a current-generation GPU with 16 GB of GDDR7 memory on a 256-bit interface, boosting to about 2.6 GHz. The card features a triple-fan cooler with vapor chamber and copper heat pipes, DisplayPort 2.1 and HDMI 2.1 outputs, and installs in a desktop computer expansion slot to accelerate real-time ray-traced 3D rendering and AI workloads", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "GIGABYTE", + "part_name": "graphic card) GV-N507TGAMING OC-16GD" + } + }, + { + "bol_metadata": { + "bol_description": "GV-N507T GAMING OC -16GB (VGA CARD / GRAPHICS CARD)", + "origin_country": "TW", + "shipper": "gigabyte technology co ltd" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "848620", + "844332", + "847330", + "847130" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0237", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0237", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-880525", + "CROSS-085221", + "CROSS-884834", + "CROSS-882148", + "CROSS-881718", + "CROSS-883337", + "CROSS-089822", + "CROSS-801545", + "CROSS-802809", + "CROSS-816263", + "CROSS-816945", + "CROSS-818428", + "CROSS-854821", + "CROSS-855827", + "CROSS-875090", + "CROSS-087695", + "CROSS-087791", + "CROSS-089042", + "CROSS-803861", + "CROSS-816943", + "CROSS-816946", + "CROSS-816949", + "CROSS-817220", + "CROSS-868566", + "CROSS-869221", + "CROSS-869571", + "CROSS-877693" + ], + "segment": "component", + "split": "train", + "tier1_description": "A factory-overclocked PCI Express 5.0 video graphics adapter card with 16 GB of GDDR7 memory and a 256-bit memory bus, designed for desktop gaming computers. It carries a high-performance GPU cooled by a triple-fan heatsink assembly, offers multiple DisplayPort 2.1 and HDMI 2.1 display outputs, and plugs into the host computer's x16 expansion slot to render 3D graphics and run AI-accelerated workloads", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "GIGABYTE", + "part_name": "GV-N507T gaming OC -16GB (VGA card" + } + }, + { + "bol_metadata": { + "bol_description": "DDR MEMORY MODULE", + "origin_country": "TW", + "shipper": "gigabyte technology india private limited" + }, + "boundary_note": "Populated printed-circuit board: classifiable as an ADP part (8473.30), as the integrated circuit that dominates it (8542.31/32/39), or as a part of control apparatus (8538.90); Section XVI Note 2 governs the attribution. Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "848640", + "844332", + "848620", + "847330" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "populated_board_boundary", + "storage_boundary" + ], + "frozen_id": "v2.0.train.0238", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0238", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-f89232", + "CROSS-882148", + "CROSS-085221", + "CROSS-880525", + "CROSS-881718", + "CROSS-884834", + "CROSS-877693", + "CROSS-883337", + "CROSS-814743", + "CROSS-087791", + "CROSS-089042", + "CROSS-816945", + "CROSS-816946", + "CROSS-816949", + "CROSS-854821", + "CROSS-855827", + "CROSS-868566", + "CROSS-084702", + "CROSS-087695", + "CROSS-089822", + "CROSS-801545", + "CROSS-803861", + "CROSS-816263", + "CROSS-816943", + "CROSS-817220", + "CROSS-818428", + "CROSS-855680", + "CROSS-856928", + "CROSS-869221", + "CROSS-874481", + "CROSS-875090", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "A double-data-rate synchronous DRAM memory module consisting of memory integrated circuits mounted on a printed circuit board with an edge connector. The module plugs into the DIMM socket of a desktop or notebook computer motherboard to provide volatile working system memory, supplied in standard capacities and speed grades for assembly into or upgrade of personal computers", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Gigabyte", + "part_name": "DDR memory module" + } + }, + { + "bol_metadata": { + "bol_description": "ITEM)ADD-IN CARD, OTHER, FOR COMPUTER, NO ENC Lenovo 40AN0135US Thunderbolt 3 Gen 2 Dock + power supply(FOR R&D PUR", + "origin_country": "US", + "shipper": "intel corporation" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "844332", + "848610", + "847130", + "847330" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0239", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0239", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. 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Used to expand laptop connectivity at a workstation", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Intel", + "part_name": "item)ADD-in card other for computer NO" + } + }, + { + "bol_metadata": { + "bol_description": "ITEM)ADD-IN CARD, OTHER, FOR COMPUTER, NO ENC Micron 256GB DDR4 CXL Card(FOR R&D PURPOSE)", + "origin_country": "US", + "shipper": "intel corporation" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "848640", + "847330", + "844332", + "848690" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0240", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0240", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. 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It supplies additional system memory capacity and roughly 36 GB/s read/write bandwidth to host processors, used in data-center servers running in-memory databases, virtualization and other memory-intensive workloads. Supplied free of charge for research and development", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Intel", + "part_name": "item)ADD-in card other for computer NO" + } + }, + { + "bol_metadata": { + "bol_description": "ITEM)TA,ADD-IN CARD,BMG,X2, FRD-B37 Graphics Card (FORR&D PURPOSE)", + "origin_country": "US", + "shipper": "intel corporation" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "848640", + "847330", + "844332", + "848610" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0241", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0241", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. 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The printed circuit board assembly carries the graphics processing units, GDDR6 memory and display outputs and installs in a PCI Express slot of a host system. This unit is an engineering reference board supplied free of charge for research and development validation work", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Intel", + "part_name": "item)TA ADD-in card BMG X2 FRD-B37" + } + }, + { + "bol_metadata": { + "bol_description": "ITEM)ADD-IN CARD, OTHER, FOR COMPUTER, NO ENC Dell WD19TB Thunderbolt 3 dock + power supply(FOR R&D PURPOSE)", + "origin_country": "US", + "shipper": "intel corporation" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "848640", + "848610", + "847150", + "847330" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0242", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0242", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-882148", + "CROSS-877693", + "CROSS-880525", + "CROSS-085221", + "CROSS-854821", + "CROSS-883337", + "CROSS-884834", + "CROSS-089122", + "CROSS-855827", + "CROSS-875090", + "CROSS-881718", + "CROSS-087695", + "CROSS-089822", + "CROSS-801545", + "CROSS-802809", + "CROSS-816263", + "CROSS-816943", + "CROSS-816945", + "CROSS-816946", + "CROSS-816949", + "CROSS-817220", + "CROSS-818428", + "CROSS-868566", + "CROSS-869221", + "CROSS-869571" + ], + "segment": "component", + "split": "train", + "tier1_description": "A desktop docking station for portable computers connecting through a Thunderbolt 3 cable. It offers two DisplayPort 1.4 outputs, an HDMI 2.0 output, a multifunction USB-C port, several USB 3.1 ports, Gigabit Ethernet and audio jacks, supporting dual 4K external displays. A 180 W external power adapter powers the dock and delivers up to 130 W charging to the attached notebook. Used to expand laptop connectivity at a desk", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Intel", + "part_name": "item)ADD-in card other for computer NO" + } + }, + { + "bol_metadata": { + "bol_description": "ITEM)ADD-IN CARD, OTHER, FOR COMPUTER, NO ENC Gen6 BaseKit (FOR R&D PURPOSE)", + "origin_country": "US", + "shipper": "intel corporation" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "848640", + "848690", + "848620", + "847330" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0243", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0243", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-882148", + "CROSS-f89232", + "CROSS-881718", + "CROSS-085221", + "CROSS-884834", + "CROSS-880525", + "CROSS-883337", + "CROSS-814743", + "CROSS-875090", + "CROSS-877693", + "CROSS-816263", + "CROSS-816945", + "CROSS-816946", + "CROSS-816949", + "CROSS-854821", + "CROSS-868566", + "CROSS-084702", + "CROSS-087695", + "CROSS-089122", + "CROSS-089822", + "CROSS-801545", + "CROSS-802809", + "CROSS-816943", + "CROSS-817220", + "CROSS-818428", + "CROSS-855680", + "CROSS-855827", + "CROSS-856928", + "CROSS-869221", + "CROSS-869571", + "CROSS-874481", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "An engineering base kit comprising a printed circuit board assembly and associated hardware used as a development and validation platform for sixth-generation high-speed serial interface technology in computers. The unenclosed add-in card installs in a host system slot and provides the baseline electronics for interoperability and signal testing during product development. Supplied free of charge for research and development purposes", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Intel", + "part_name": "item)ADD-in card other for computer NO" + } + }, + { + "bol_metadata": { + "bol_description": "ITEM)PBA,ADD-IN CARD,BMG,X2,IBC_B36_SD,PILOT> GraphicsCards(FOR R&D PURPOSE)", + "origin_country": "US", + "shipper": "intel corporation" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "847130", + "848640", + "847150", + "847330" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0244", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0244", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-085221", + "CROSS-880525", + "CROSS-882148", + "CROSS-883337", + "CROSS-f89232", + "CROSS-877693", + "CROSS-881718", + "CROSS-884834", + "CROSS-875090", + "CROSS-087791", + "CROSS-089042", + "CROSS-089122", + "CROSS-801545", + "CROSS-814743", + "CROSS-816263", + "CROSS-818428", + "CROSS-868566", + "CROSS-874481", + "CROSS-087695", + "CROSS-089822", + "CROSS-802809", + "CROSS-803861", + "CROSS-816943", + "CROSS-816945", + "CROSS-816946", + "CROSS-816949", + "CROSS-817220", + "CROSS-854821", + "CROSS-855680", + "CROSS-855827", + "CROSS-856928", + "CROSS-869221", + "CROSS-869571", + "CROSS-963301", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "A printed board assembly for a discrete graphics add-in card built around a next-generation graphics processor in a dual-GPU configuration, from a pilot production run. The assembly carries the graphics processing units, memory and power circuitry and is designed to install in a PCI Express slot of a host computer to render graphics and accelerate parallel workloads. Supplied free of charge for research and development validation", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Intel", + "part_name": "item)PBA ADD-in card BMG X2 IBC_B36_SD" + } + }, + { + "bol_metadata": { + "bol_description": "0H05XX000002270L 3.5 -SBC-WLU/TGL-COOLER WITH THERMAL-PAD FOR 3.5-SBC-WLU/TDLNA", + "origin_country": "AT", + "shipper": "kontron asia technology inc" + }, + "boundary_note": "Populated printed-circuit board: classifiable as an ADP part (8473.30), as the integrated circuit that dominates it (8542.31/32/39), or as a part of control apparatus (8538.90); Section XVI Note 2 governs the attribution.", + "candidate_set": { + "codes": [ + "847130", + "847330", + "848640", + "848610" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "populated_board_boundary" + ], + "frozen_id": "v2.0.train.0245", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0245", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-882148", + "CROSS-881718", + "CROSS-085221", + "CROSS-875090", + "CROSS-877693", + "CROSS-883337", + "CROSS-884834", + "CROSS-f89232", + "CROSS-814743", + "CROSS-868566", + "CROSS-874481", + "CROSS-880525", + "CROSS-087695", + "CROSS-089822", + "CROSS-816263", + "CROSS-816943", + "CROSS-816945", + "CROSS-816946", + "CROSS-816949", + "CROSS-817220", + "CROSS-818428", + "CROSS-854821", + "CROSS-855680", + "CROSS-856928", + "CROSS-869221", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "A passive cooling assembly for a 3.5-inch embedded single-board computer, consisting of a machined metal heat spreader or finned heatsink supplied with a pre-applied thermal interface pad. It mounts directly over the processor and chipset of the board to conduct heat away from the components, enabling fanless operation of the embedded computer in industrial enclosures across an extended temperature range", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Kontron", + "part_name": "0H05XX000002270L 3.5" + } + }, + { + "bol_metadata": { + "bol_description": "0H05XX000001910L PROCESSOR SERIES COOLER (LGA 1155/ 1156 HASWELL LGANA", + "origin_country": "AT", + "shipper": "kontron asia technology inc" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "847330", + "847130", + "848610", + "848690" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0246", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0246", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-085221", + "CROSS-882148", + "CROSS-880525", + "CROSS-875090", + "CROSS-877693", + "CROSS-883337", + "CROSS-881718", + "CROSS-818428", + "CROSS-884834", + "CROSS-087695", + "CROSS-087791", + "CROSS-089042", + "CROSS-089822", + "CROSS-814743", + "CROSS-816263", + "CROSS-816943", + "CROSS-817220", + "CROSS-854821", + "CROSS-855827", + "CROSS-868566", + "CROSS-869221", + "CROSS-874481", + "CROSS-963301" + ], + "segment": "component", + "split": "train", + "tier1_description": "A processor cooling assembly designed for desktop computer central processing units in 1155/1156-pin land-grid-array sockets of a fourth-generation processor platform. It consists of an aluminum heatsink with mounting hardware, typically combined with thermal interface material, that clamps onto the motherboard socket area to dissipate heat from the processor and keep it within operating temperature limits", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Kontron", + "part_name": "0H05XX000001910L processor series" + } + }, + { + "bol_metadata": { + "bol_description": "REPAIR & RETURN) PROD 3.5-SBC-TGL-5-I5-1145GRE-XT & BU3333330004PARTS", + "origin_country": "AT", + "shipper": "kontron asia technology inc" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "848620", + "847330", + "848610", + "848640" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0247", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0247", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-085221", + "CROSS-882148", + "CROSS-883337", + "CROSS-877693", + "CROSS-880525", + "CROSS-881718", + "CROSS-884834", + "CROSS-087791", + "CROSS-089042", + "CROSS-816945", + "CROSS-818428", + "CROSS-963301", + "CROSS-f89232", + "CROSS-816946", + "CROSS-816949", + "CROSS-854821", + "CROSS-874481", + "CROSS-089122", + "CROSS-801545", + "CROSS-803861", + "CROSS-814743", + "CROSS-816943", + "CROSS-817220", + "CROSS-855680", + "CROSS-856928", + "CROSS-868566", + "CROSS-869221", + "CROSS-875090", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "Embedded 3.5-inch single-board computers being returned after repair, each integrating a quad-core eleventh-generation 1145GRE-class embedded processor, soldered memory support, integrated graphics, Gigabit and 2.5-Gigabit Ethernet, display interfaces and storage connectors on one compact board rated for -40 to 85 degC operation. Such boards function as complete processing units inside industrial automation, transportation and medical equipment", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Kontron", + "part_name": "repair & return) prod" + } + }, + { + "bol_metadata": { + "bol_description": ") 35-SBC-TGL-5-I5-1145GRE-XT B35STGLI-051006T PROD 3.5 SBC-TGL-5-I5-1145GRE-XT-40 85C INTELNA", + "origin_country": "AT", + "shipper": "kontron asia technology inc" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "848620", + "847330", + "848610", + "848640" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0248", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0248", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-085221", + "CROSS-882148", + "CROSS-880525", + "CROSS-087791", + "CROSS-089042", + "CROSS-875090", + "CROSS-877693", + "CROSS-881718", + "CROSS-089122", + "CROSS-818428", + "CROSS-883337", + "CROSS-087695", + "CROSS-801545", + "CROSS-803861", + "CROSS-816943", + "CROSS-817220", + "CROSS-854821", + "CROSS-868566", + "CROSS-869221", + "CROSS-874481", + "CROSS-884834", + "CROSS-963301" + ], + "segment": "component", + "split": "train", + "tier1_description": "A 3.5-inch embedded single-board computer built around a quad-core eleventh-generation 1145GRE-class embedded processor with integrated graphics, supporting onboard memory, multiple display outputs, Gigabit and 2.5-Gigabit Ethernet, USB and storage interfaces, and rated for an extended -40 to 85 degC operating range. It serves as the complete processing unit in industrial automation, transport and similar rugged embedded systems. Supplied free of charge", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Kontron", + "part_name": ") 35-SBC-TGL-5-I5-1145GRE-XT" + } + }, + { + "bol_metadata": { + "bol_description": "MITX-CFL-S-0-C246-ET BTXCLST-001002T PROD MITX-CFL-S-0-C246-ET /MITX-CLS0T- 20 70 CNA", + "origin_country": "AT", + "shipper": "kontron asia technology inc" + }, + "boundary_note": "Populated printed-circuit board: classifiable as an ADP part (8473.30), as the integrated circuit that dominates it (8542.31/32/39), or as a part of control apparatus (8538.90); Section XVI Note 2 governs the attribution.", + "candidate_set": { + "codes": [ + "848620", + "847330", + "847150", + "848640" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "populated_board_boundary" + ], + "frozen_id": "v2.0.train.0249", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0249", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-880525", + "CROSS-882148", + "CROSS-085221", + "CROSS-089122", + "CROSS-818428", + "CROSS-877693", + "CROSS-881718", + "CROSS-087695", + "CROSS-087791", + "CROSS-089042", + "CROSS-816943", + "CROSS-817220", + "CROSS-854821", + "CROSS-855827", + "CROSS-868566", + "CROSS-869221", + "CROSS-874481", + "CROSS-875090", + "CROSS-883337", + "CROSS-884834" + ], + "segment": "component", + "split": "train", + "tier1_description": "An industrial Mini-ITX computer motherboard measuring 170 x 170 mm, fitted with an LGA1151 processor socket and a C246 server-class chipset supporting eighth/ninth-generation desktop and Xeon-class processors. It provides two DDR4 DIMM sockets with ECC support up to 64 GB, M.2 and SATA storage interfaces, three Gigabit Ethernet ports, multiple display outputs and an onboard TPM 2.0, in an extended-temperature variant rated -20 to 70 degC for industrial computing systems", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Kontron", + "part_name": "mitx-CFL-S-0-C246-ET btxclst-001002T" + } + }, + { + "bol_metadata": { + "bol_description": "COMPUTER ADAPTER PCBA", + "origin_country": "AT", + "shipper": "kontron america modules llc" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "847130", + "848640", + "847330", + "848620" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0250", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0250", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-881718", + "CROSS-882148", + "CROSS-085221", + "CROSS-f89232", + "CROSS-883337", + "CROSS-884834", + "CROSS-877693", + "CROSS-880525", + "CROSS-814743", + "CROSS-816945", + "CROSS-854821", + "CROSS-089822", + "CROSS-816263", + "CROSS-816943", + "CROSS-816946", + "CROSS-816949", + "CROSS-817220", + "CROSS-818428", + "CROSS-868566", + "CROSS-869221", + "CROSS-875090", + "CROSS-087695", + "CROSS-087791", + "CROSS-089042", + "CROSS-089122", + "CROSS-801545", + "CROSS-802809", + "CROSS-855680", + "CROSS-855827", + "CROSS-856928", + "CROSS-869571", + "CROSS-874481", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "A printed circuit board assembly serving as an adapter card for computers, populated with interface circuitry, connectors and passive components. Such adapter assemblies translate between bus, signal or connector standards inside a computer system, allowing peripheral, storage devices or expansion boards to be attached to a host platform. The board is supplied as a bare assembly without enclosure for integration into embedded computing equipment", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Kontron", + "part_name": "computer adapter pcba" + } + }, + { + "bol_metadata": { + "bol_description": "B166404010 VME 64x 4Sl 6HE J1/J2/J0 ADC/Aktiv Coated", + "origin_country": "DE", + "shipper": "kontron hartmann-wiener gmbh" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "848610", + "847330", + "847150", + "848690" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0251", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0251", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. 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The multilayer printed circuit board carries 160-pin IEC 61076-4-113 connectors, active bus termination, automatic daisy-chaining and a protective conformal coating. Mounted at the rear of a card cage, it distributes power and bus signals among the processor and I/O boards of a modular embedded computer system", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Kontron Hartmann-Wiener", + "part_name": "B166404010 VME 64x 4Sl 6HE J1/J2/J0" + } + }, + { + "bol_metadata": { + "bol_description": "1075-0524 VM6064-WA4G-00200100", + "origin_country": "AT", + "shipper": "kontron modular computers s a s" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "848610", + "848690", + "844332", + "847330" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0252", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0252", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-085221", + "CROSS-880525", + "CROSS-877693", + "CROSS-882148", + "CROSS-881718", + "CROSS-884834", + "CROSS-087791", + "CROSS-089042", + "CROSS-816945", + "CROSS-883337", + "CROSS-f89232", + "CROSS-801545", + "CROSS-816943", + "CROSS-816946", + "CROSS-816949", + "CROSS-817220", + "CROSS-818428", + "CROSS-854821", + "CROSS-868566", + "CROSS-869221", + "CROSS-874481", + "CROSS-087695", + "CROSS-089122", + "CROSS-802809", + "CROSS-803861", + "CROSS-814743", + "CROSS-816263", + "CROSS-855680", + "CROSS-855827", + "CROSS-856928", + "CROSS-869571", + "CROSS-875090", + "CROSS-963301", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "A 6U Eurocard-format single board computer for VMEbus card cages. The plug-in module carries a low-power x86 multi-core processor, soldered DDR4 memory (the configuration code indicates 4 GB), Gigabit Ethernet, USB and serial interfaces, and front-panel I/O, and runs general-purpose operating systems. Such boards provide the central processing function in long-lifecycle industrial, transportation and defense embedded computer systems", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Kontron", + "part_name": "1075-0524 VM6064-WA4G-00200100" + } + }, + { + "bol_metadata": { + "bol_description": ") 1058-4240 PB-VX3-501 PROCESSOR NA", + "origin_country": "AT", + "shipper": "kontron modular computers s a s" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "848620", + "847330", + "848690", + "844332" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0253", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0253", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. 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Boards in this series are rear transition modules that mount behind the backplane, routing Ethernet, serial, USB and other signals from a companion processor blade to rear-accessible connectors so that system cabling can be serviced without removing the computing board. It contains connectors, passive routing and interface circuitry", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Kontron", + "part_name": ") 1058-4240 PB-VX3-501 processor NA" + } + }, + { + "bol_metadata": { + "bol_description": ") 1062-6905 VX3058SA8G115101P PROCESSOR NA", + "origin_country": "AT", + "shipper": "kontron modular computers s a s" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "848610", + "847150", + "847330", + "847130" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0254", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0254", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-085221", + "CROSS-877693", + "CROSS-880525", + "CROSS-881718", + "CROSS-882148", + "CROSS-884834", + "CROSS-087791", + "CROSS-089042", + "CROSS-816945", + "CROSS-883337", + "CROSS-f89232", + "CROSS-816946", + "CROSS-816949", + "CROSS-868566", + "CROSS-874481", + "CROSS-875090", + "CROSS-087695", + "CROSS-089122", + "CROSS-801545", + "CROSS-803861", + "CROSS-814743", + "CROSS-816943", + "CROSS-817220", + "CROSS-818428", + "CROSS-854821", + "CROSS-855680", + "CROSS-856928", + "CROSS-869221", + "CROSS-963301", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "A rugged 3U VPX single board computer built around an eight-core server-class x86 system-on-chip with 8 GB of DDR4 memory (per the configuration code), two 10 Gigabit Ethernet backplane ports, PCI Express 3.0 fabric lanes, and mezzanine sites for storage, graphics and I/O expansion. Available in air- and conduction-cooled builds, it serves as a processing blade in high-performance embedded computing platforms for aerospace and defense applications", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Kontron", + "part_name": ") 1062-6905 VX3058SA8G115101P processor" + } + }, + { + "bol_metadata": { + "bol_description": "TARJETA DE VIDEO GE FORCE RTX 3050 VENTUS 2X OC PARTES Y PIEZAS MSI RTX 3050", + "origin_country": "TW", + "shipper": "msi computer corp" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "847330", + "848620", + "847130", + "848640" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0255", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0255", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-085221", + "CROSS-880525", + "CROSS-882148", + "CROSS-884834", + "CROSS-877693", + "CROSS-883337", + "CROSS-f89232", + "CROSS-087791", + "CROSS-089042", + "CROSS-801545", + "CROSS-802809", + "CROSS-816945", + "CROSS-816946", + "CROSS-816949", + "CROSS-855827", + "CROSS-881718", + "CROSS-089122", + "CROSS-803861", + "CROSS-814743", + "CROSS-816263", + "CROSS-854821", + "CROSS-855680", + "CROSS-856928", + "CROSS-868566", + "CROSS-869571", + "CROSS-874481", + "CROSS-963301", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "A consumer add-in graphics card for desktop computers occupying a PCI Express 4.0 x16 slot (x8 electrical). The board carries a graphics processing unit with 2304 shader cores, 6 GB of GDDR6 memory on a 96-bit bus, a dual-fan cooler, and one DisplayPort 1.4a plus two HDMI 2.1 outputs with board power around 70 W. It renders 3D graphics and drives displays when installed in a personal", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "MSI", + "part_name": "tarjeta DE video GE force RTX 3050" + } + }, + { + "bol_metadata": { + "bol_description": "PLACA PRO B760MP DDR4 PARTES Y PIEZAS MSI PRO B760MP", + "origin_country": "TW", + "shipper": "msi computer corp" + }, + "boundary_note": "Populated printed-circuit board: classifiable as an ADP part (8473.30), as the integrated circuit that dominates it (8542.31/32/39), or as a part of control apparatus (8538.90); Section XVI Note 2 governs the attribution. Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "848640", + "848620", + "847150", + "847330" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "populated_board_boundary", + "storage_boundary" + ], + "frozen_id": "v2.0.train.0256", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0256", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-f89232", + "CROSS-880525", + "CROSS-883337", + "CROSS-085221", + "CROSS-882148", + "CROSS-877693", + "CROSS-881718", + "CROSS-884834", + "CROSS-814743", + "CROSS-816945", + "CROSS-868566", + "CROSS-874481", + "CROSS-087791", + "CROSS-089042", + "CROSS-801545", + "CROSS-803861", + "CROSS-816946", + "CROSS-816949", + "CROSS-855680", + "CROSS-855827", + "CROSS-856928", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "A micro-ATX desktop motherboard with a socket for 12th to 14th generation x86 desktop processors and a mainstream chipset. It provides four DDR4 DIMM slots supporting up to 128 GB, one PCIe 4.0 x16 and two x1 expansion slots, two M.2 sockets, four SATA III ports, gigabit Ethernet, and HDMI, DisplayPort and VGA outputs. It is the main printed circuit board interconnecting processor, memory and peripherals in a personal", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "MSI", + "part_name": "placa PRO B760MP DDR4 partes Y piezas" + } + }, + { + "bol_metadata": { + "bol_description": "PLACA MAG B760 TOMAHAWK WIFI PARTES Y PIEZAS MSI MAG B760", + "origin_country": "TW", + "shipper": "msi computer corp" + }, + "boundary_note": "Populated printed-circuit board: classifiable as an ADP part (8473.30), as the integrated circuit that dominates it (8542.31/32/39), or as a part of control apparatus (8538.90); Section XVI Note 2 governs the attribution. Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "847150", + "847330", + "848640", + "847130" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "populated_board_boundary", + "storage_boundary" + ], + "frozen_id": "v2.0.train.0257", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0257", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-880525", + "CROSS-881718", + "CROSS-085221", + "CROSS-f89232", + "CROSS-877693", + "CROSS-882148", + "CROSS-883337", + "CROSS-884834", + "CROSS-087791", + "CROSS-089042", + "CROSS-803861", + "CROSS-814743", + "CROSS-816943", + "CROSS-816945", + "CROSS-816946", + "CROSS-816949", + "CROSS-854821", + "CROSS-855680", + "CROSS-855827", + "CROSS-856928", + "CROSS-868566", + "CROSS-874481", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "A full-size ATX desktop motherboard for current-generation x86 desktop processors on a mainstream chipset. The board offers four DDR5 DIMM slots, a reinforced PCI Express x16 slot for graphics cards, multiple M.2 solid-state drive sockets with heatsinks, SATA III ports, 2.5 gigabit Ethernet, an integrated Wi-Fi and Bluetooth module, extensive USB connectivity and onboard audio. It forms the central interconnect board of a desktop personal", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "MSI", + "part_name": "placa MAG B760 tomahawk wifi partes Y" + } + }, + { + "bol_metadata": { + "bol_description": "PLACA B860M GAMING PLUS WIFI PARTES Y PIEZAS MSI B860M", + "origin_country": "TW", + "shipper": "msi computer corp" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "847130", + "847330", + "847150", + "848620" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0258", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0258", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-880525", + "CROSS-881718", + "CROSS-882148", + "CROSS-883337", + "CROSS-877693", + "CROSS-085221", + "CROSS-855827", + "CROSS-884834" + ], + "segment": "component", + "split": "train", + "tier1_description": "A micro-ATX desktop motherboard with an LGA 1851 socket for current-generation x86 desktop processors. It carries four DDR5 DIMM slots supporting up to 256 GB at overclocked speeds beyond /s, one PCIe 5.0 x16 slot, one PCIe 5.0 and two PCIe 4.0 M.2 sockets, four SATA III ports, 5 gigabit Ethernet, Wi-Fi 7 and Bluetooth 5.4 connectivity, and onboard audio, interconnecting the components of a personal", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "MSI", + "part_name": "placa B860M gaming plus wifi partes Y" + } + }, + { + "bol_metadata": { + "bol_description": "CASE MAG FORGE M100A PARTES Y PIEZAS MSI M100A", + "origin_country": "TW", + "shipper": "msi computer corp" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "847330", + "848620", + "847150", + "847130" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0259", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0259", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-880525", + "CROSS-881718", + "CROSS-883337", + "CROSS-882148", + "CROSS-085221", + "CROSS-089122", + "CROSS-803861", + "CROSS-816263", + "CROSS-816943", + "CROSS-854821", + "CROSS-857854", + "CROSS-875090", + "CROSS-877693" + ], + "segment": "component", + "split": "train", + "tier1_description": "A micro-tower personal enclosure of steel and plastic with a transparent acrylic side panel, approximately 423 x 200 x 388 mm, accepting micro-ATX and mini-ITX motherboards. It ships with four pre-installed 120 mm RGB-illuminated cooling fans, bays for 2.5 and 3.5 inch drives, front-panel USB 3.2 and audio ports, dust filters, and clearance for graphics cards up to 300 mm and 240 mm liquid-cooling radiators", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "MSI", + "part_name": "case MAG forge M100A partes Y piezas" + } + }, + { + "bol_metadata": { + "bol_description": "Engineering Development Board (Full description as per inv)", + "origin_country": "US", + "shipper": "msi - marvell semiconductor inc" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "848610", + "844332", + "847330", + "848620" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0260", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0260", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-882148", + "CROSS-f89232", + "CROSS-085221", + "CROSS-883337", + "CROSS-877693", + "CROSS-881718", + "CROSS-884834", + "CROSS-814743", + "CROSS-816945", + "CROSS-818428", + "CROSS-874481", + "CROSS-875090", + "CROSS-880525", + "CROSS-087791", + "CROSS-089042", + "CROSS-089122", + "CROSS-089822", + "CROSS-801545", + "CROSS-803861", + "CROSS-816263", + "CROSS-816943", + "CROSS-816946", + "CROSS-816949", + "CROSS-817220", + "CROSS-854821", + "CROSS-855680", + "CROSS-856928", + "CROSS-868566", + "CROSS-869221", + "CROSS-963301", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "An engineering development board: a populated printed circuit assembly carrying a system-on-chip processor together with memory, power regulation, Ethernet and serial interfaces, and header connectors that expose the chip's signal pins. Engineers use such boards to bring up and debug firmware, measure performance and evaluate the silicon before committing to a production hardware design; units are typically supplied to development partners rather than sold at retail", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Marvell Semiconductor", + "part_name": "Engineering Development Board (Full" + } + }, + { + "bol_metadata": { + "bol_description": "ЧАСТИНИ ТА ПРИЛАДДЯ (КРІМ ФУТЛЯРІВ, ЧОХЛІВ ТА АНАЛОГІЧНИХ ВИРОБ��В), ПРИЗНАЧЕНІ ВИНЯТКОВО АБО ПЕРЕВАЖНО ДЛЯ МАШИН ТОВАРНИХ ПОЗИЦІЙ 8470 - 8472: - ЧАСТИНИ ТА ПРИЛАДДЯ ДО МАШИН ТОВАРНОЇ ПОЗИЦІЇ 8471: ЕЛЕКТРОННІ МОДУЛІ", + "origin_country": "TW", + "shipper": "msi computer europe b v" + }, + "boundary_note": "Populated printed-circuit board: classifiable as an ADP part (8473.30), as the integrated circuit that dominates it (8542.31/32/39), or as a part of control apparatus (8538.90); Section XVI Note 2 governs the attribution.", + "candidate_set": { + "codes": [ + "847330", + "848690", + "848640", + "844332" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "populated_board_boundary" + ], + "frozen_id": "v2.0.train.0261", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0261", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-881718", + "CROSS-085221", + "CROSS-883337", + "CROSS-882148", + "CROSS-f89232", + "CROSS-877693", + "CROSS-884834", + "CROSS-963301", + "CROSS-087791", + "CROSS-089042", + "CROSS-814743", + "CROSS-880525", + "CROSS-816945", + "CROSS-816946", + "CROSS-875090", + "CROSS-816949", + "CROSS-868566", + "CROSS-089122", + "CROSS-802676", + "CROSS-854821", + "CROSS-855680", + "CROSS-855827", + "CROSS-856928", + "CROSS-874481", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "Electronic modules for automatic data processing machines: populated printed circuit board assemblies such as interface, controller or expansion modules that plug into a 's main board or chassis to add, extend or restore functions. Each module carries integrated circuits, passive components and edge or header connectors and is designed for use solely or principally with desktop or portable computers. The product text identifies only the product category, not a specific model", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "MSI", + "part_name": "ЧАСТИНИ ТА ПРИЛАДДЯ (КРІМ ФУТЛЯРІВ" + } + }, + { + "bol_metadata": { + "bol_description": ") EVALUATION BOARDS -5A002 A.2 LICENSE ENC:EV-CRB -SL2151-A0-R1 MARVELL EVALUATION BOARD WITH ILIAD-E CRBEVALUATION BOARDS -5A002 A.2 LICENSE ENC:EV-CRB -SL2151-A0-R", + "origin_country": "US", + "shipper": "msi- marvell semiconductor inc" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "847130", + "848690", + "844332", + "847330" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0262", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0262", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-f89232", + "CROSS-882148", + "CROSS-085221", + "CROSS-877693", + "CROSS-881718", + "CROSS-883337", + "CROSS-884834", + "CROSS-814743", + "CROSS-880525", + "CROSS-089122", + "CROSS-816945", + "CROSS-874481", + "CROSS-875090", + "CROSS-N292764", + "CROSS-087791", + "CROSS-089042", + "CROSS-089822", + "CROSS-801545", + "CROSS-803861", + "CROSS-816263", + "CROSS-816943", + "CROSS-816946", + "CROSS-816949", + "CROSS-817220", + "CROSS-818428", + "CROSS-854821", + "CROSS-855680", + "CROSS-856928", + "CROSS-868566", + "CROSS-869221" + ], + "segment": "component", + "split": "train", + "tier1_description": "An evaluation and customer reference board for a communications system-on-chip that incorporates cryptographic acceleration, supplied free of charge under an encryption export-control license. The populated printed circuit assembly carries the processor together with memory, power circuitry, network ports and debug interfaces, letting engineers boot software, exercise the chip's secure networking features and validate designs before building production hardware. Intended for laboratory development use rather than end-product deployment", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Marvell Semiconductor", + "part_name": ") evaluation boards -5A002 A.2 license" + } + }, + { + "bol_metadata": { + "bol_description": "ITEM - PCIE TO GEN4 M.2 EXPANSION CARD", + "origin_country": "IN", + "shipper": "miphi semiconductors private limited" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "848620", + "847330", + "847150", + "848610" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0263", + "hs2_label": "84", + "hs4_label": "8473", + "hs6_label": "847330", + "id": "SH-0263", + "justification_text": "Parts and accessories suitable for use principally with ADP machines of heading 8471 fall under 8473.30. Classified under HS 8473.30.", + "reference_ruling_ids": [ + "CROSS-882148", + "CROSS-f89232", + "CROSS-881718", + "CROSS-085221", + "CROSS-877693", + "CROSS-883337", + "CROSS-884834", + "CROSS-880525", + "CROSS-814743", + "CROSS-816945", + "CROSS-855827", + "CROSS-868566", + "CROSS-875090", + "CROSS-087695", + "CROSS-087791", + "CROSS-089042", + "CROSS-089122", + "CROSS-089822", + "CROSS-801545", + "CROSS-802809", + "CROSS-816263", + "CROSS-816943", + "CROSS-816946", + "CROSS-816949", + "CROSS-817220", + "CROSS-818428", + "CROSS-854821", + "CROSS-855680", + "CROSS-856928", + "CROSS-869221", + "CROSS-869571", + "CROSS-874481", + "CROSS-N292764" + ], + "segment": "component", + "split": "train", + "tier1_description": "An expansion card that adapts an M.2 solid-state drive to a desktop computer's PCI Express slot, supplied free of charge. The printed circuit board routes four Gen4 PCI Express lanes from the gold-finger edge connector to an M.2 socket accepting common 2230 to 2280 drive lengths, usually with a mounting bracket, standoff screws and often a heatsink, enabling NVMe storage in systems lacking a free onboard M.2 socket", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "MiPhi Semiconductors", + "part_name": "item - PCIE to GEN4 M.2 expansion card" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-16 00:00:00", + "bol_description": "LINER,CHMBR,VAT 65,TRNSN MANF ( 839-495013-002 ) -", + "consignee": "infineon technologies kulim s/b", + "declared_hs": "8486109000", + "hs_verified": true, + "origin_country": "UNITED STATES", + "port_dest": "KULIM", + "port_origin": "BAYAN LEPAS", + "shipper": "lam research malaysia sdn bhd" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848640", + "848620", + "848690", + "848610" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0264", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848610", + "id": "SH-0264", + "justification_text": "Goods classified under HS 8486.10; corroborated by 1 customs ruling on comparable goods (EU-NL).", + "reference_ruling_ids": [ + "EBTI-NL-NLRTD-2007-000125" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Chamber liner (VAT 65, transition manifold; part 839-495013-002): a consumable liner part that shields the interior walls of a plasma process chamber/manifold. It is supplied as a replacement or spare component for the parent semiconductor tool rather than as standalone equipment, and is fitted, consumed or maintained during normal tool operation", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Lam Research", + "part_name": "liner chmbr VAT 65 trnsn manf" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-16 00:00:00", + "bol_description": "BELLOWS, INNER GATE ( 839-012255-001 ) -", + "consignee": "infineon technologies kulim s/b", + "declared_hs": "8486109000", + "hs_verified": true, + "origin_country": "SOUTH KOREA", + "port_dest": "KULIM", + "port_origin": "BAYAN LEPAS", + "shipper": "lam research malaysia sdn bhd" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848620", + "848690", + "848640", + "848610" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0265", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848610", + "id": "SH-0265", + "justification_text": "Goods classified under HS 8486.10; corroborated by 1 customs ruling on comparable goods (EU-NL).", + "reference_ruling_ids": [ + "EBTI-NL-NLRTD-2007-000125" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Inner gate bellows (part 839-012255-001): a flexible vacuum bellows part that seals the inner gate/valve of a process-chamber transfer mechanism. It is supplied as a replacement or spare component for the parent semiconductor tool rather than as standalone equipment, and is fitted, consumed or maintained during normal tool operation", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Lam Research", + "part_name": "bellows inner gate (839-012255-001)" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-16 00:00:00", + "bol_description": "ASSY,PED,200MM MOER,D.3,SEMI ( 02-033134-01 ) -", + "consignee": "infineon technologies kulim s/b", + "declared_hs": "8486109000", + "hs_verified": true, + "origin_country": "UNITED STATES", + "port_dest": "KULIM", + "port_origin": "BAYAN LEPAS", + "shipper": "lam research malaysia sdn bhd" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848640", + "848620", + "848610", + "848690" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0266", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848610", + "id": "SH-0266", + "justification_text": "Goods classified under HS 8486.10; corroborated by 3 customs rulings on comparable goods (EU-DE, EU-NL, US).", + "reference_ruling_ids": [ + "CROSS-N240976", + "EBTI-NL-NLRTD-2007-000125", + "EBTI-DE-DEM/2304/07-1" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Pedestal assembly (200 mm MOER, part 02-033134-01): a wafer-support pedestal part for a plasma process chamber that holds and positions the wafer during etch/deposition. It is supplied as a replacement or spare component for the parent semiconductor tool rather than as standalone equipment, and is fitted, consumed or maintained during normal tool operation", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Lam Research", + "part_name": "assy PED 200MM moer D.3 semi" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-15 00:00:00", + "bol_description": "BAF,4528,UPR TPL SET K000037226 ( 715-140124-002 ) -", + "consignee": "infineon technologies kulim s/b", + "declared_hs": "8486109000", + "hs_verified": true, + "origin_country": "UNITED STATES", + "port_dest": "KULIM", + "port_origin": "BAYAN LEPAS", + "shipper": "lam research malaysia sdn bhd" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848620", + "848640", + "848690", + "848610" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0267", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848610", + "id": "SH-0267", + "justification_text": "Goods classified under HS 8486.10; corroborated by 1 customs ruling on comparable goods (EU-NL).", + "reference_ruling_ids": [ + "EBTI-NL-NLRTD-2007-000125" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Upper triple-baffle set (4528; part 715-140124-002): a set of consumable baffle parts that distribute gas/plasma in the upper region of a process chamber. It is consumed as a process material/consumable in semiconductor or related manufacturing rather than forming part of the finished device, and is supplied in bulk/packaged form", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Lam Research", + "part_name": "BAF 4528 UPR TPL SET K000037226" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-15 00:00:00", + "bol_description": "ASSY, WFR LIFT PIN,WCVD ( 02-122840-00 ) -", + "consignee": "infineon technologies kulim s/b", + "declared_hs": "8486109000", + "hs_verified": true, + "origin_country": "UNITED STATES", + "port_dest": "KULIM", + "port_origin": "BAYAN LEPAS", + "shipper": "lam research malaysia sdn bhd" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848620", + "848640", + "848690", + "848610" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0268", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848610", + "id": "SH-0268", + "justification_text": "Goods classified under HS 8486.10; corroborated by 3 customs rulings on comparable goods (EU-DE, EU-NL, US).", + "reference_ruling_ids": [ + "CROSS-N240976", + "EBTI-NL-NLRTD-2007-000125", + "EBTI-DE-DEM/2304/07-1" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Wafer lift-pin assembly (WCVD; part 02-122840-00): a part that raises/lowers the wafer onto the chamber pedestal for handling in a CVD process tool. It is supplied as a replacement or spare component for the parent semiconductor tool rather than as standalone equipment, and is fitted, consumed or maintained during normal tool operation", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Lam Research", + "part_name": "assy WFR lift PIN wcvd (02-122840-00)" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-14 00:00:00", + "bol_description": "SPCR,BAFFLE ( 713-020447-701 ) -", + "consignee": "infineon technologies kulim s/b", + "declared_hs": "8486109000", + "hs_verified": true, + "origin_country": "UNITED STATES", + "port_dest": "KULIM", + "port_origin": "BAYAN LEPAS", + "shipper": "lam research malaysia sdn bhd" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848610", + "848690", + "848620", + "848640" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0269", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848610", + "id": "SH-0269", + "justification_text": "Goods classified under HS 8486.10; corroborated by 1 customs ruling on comparable goods (EU-NL).", + "reference_ruling_ids": [ + "EBTI-NL-NLRTD-2007-000125" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Baffle spacer (part 713-020447-701): a spacer part that sets the gap/position of a baffle within a plasma process chamber. It is supplied as a replacement or spare component for the parent semiconductor tool rather than as standalone equipment, and is fitted, consumed or maintained during normal tool operation", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Lam Research", + "part_name": "spcr baffle (713-020447-701)" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-11 00:00:00", + "bol_description": "SPCR,D-SHP,TAPERED BOT,WAP,200MM,2300 ( 713-021105-002 ) -", + "consignee": "infineon technologies kulim s/b", + "declared_hs": "8486109000", + "hs_verified": true, + "origin_country": "UNITED STATES", + "port_dest": "KULIM", + "port_origin": "BAYAN LEPAS", + "shipper": "lam research malaysia sdn bhd" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848640", + "848690", + "848620", + "848610" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0270", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848610", + "id": "SH-0270", + "justification_text": "Goods classified under HS 8486.10; corroborated by 1 customs ruling on comparable goods (EU-NL).", + "reference_ruling_ids": [ + "EBTI-NL-NLRTD-2007-000125" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "D-shaped tapered-bottom spacer (WAP, 200 mm, 2300 platform; part 713-021105-002): a chamber spacer part that positions components in a 200 mm plasma process chamber. It is supplied as a replacement or spare component for the parent semiconductor tool rather than as standalone equipment, and is fitted, consumed or maintained during normal tool operation", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Lam Research", + "part_name": "spcr D-SHP tapered BOT WAP 200MM 2300" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-10 00:00:00", + "bol_description": "RING,PTN UPR,GAS DUAL FEED,200MM 2300 ( 713-031390-005 ) -", + "consignee": "infineon technologies kulim s/b", + "declared_hs": "8486109000", + "hs_verified": true, + "origin_country": "UNITED STATES", + "port_dest": "KULIM", + "port_origin": "BAYAN LEPAS", + "shipper": "lam research malaysia sdn bhd" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848640", + "848690", + "848620", + "848610" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0271", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848610", + "id": "SH-0271", + "justification_text": "Goods classified under HS 8486.10; corroborated by 2 customs rulings on comparable goods (EU-DE, US).", + "reference_ruling_ids": [ + "CROSS-N240976", + "EBTI-DE-DEM/2304/07-1" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Upper pattern ring with dual gas feed (200 mm, 2300 platform; part 713-031390-005): a consumable ring part that distributes process gas above a 200 mm wafer in a plasma chamber", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Lam Research", + "part_name": "ring PTN UPR gas dual feed 200MM 2300" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-10 00:00:00", + "bol_description": "ELCTD,SILICON,LR,8 IN ( 839-011907-300 ) -", + "consignee": "infineon technologies kulim s/b", + "declared_hs": "8486109000", + "hs_verified": true, + "origin_country": "UNITED STATES", + "port_dest": "KULIM", + "port_origin": "BAYAN LEPAS", + "shipper": "lam research malaysia sdn bhd" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848620", + "848690", + "848610", + "848640" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0272", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848610", + "id": "SH-0272", + "justification_text": "Goods classified under HS 8486.10; corroborated by 2 customs rulings on comparable goods (EU-FR, EU-NL).", + "reference_ruling_ids": [ + "EBTI-FR-FRFR-RTC-2013-160374", + "EBTI-NL-NLRTD-2007-000125" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Silicon electrode (LR, 8-inch; part 839-011907-300): a consumable silicon electrode/showerhead part that delivers and shapes the plasma in an etch chamber. It is supplied as a replacement or spare component for the parent semiconductor tool rather than as standalone equipment, and is fitted, consumed or maintained during normal tool operation", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Lam Research", + "part_name": "elctd silicon LR 8 in (839-011907-300)" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-02-15 00:00:00", + "bol_description": "QUARTZ TEMPERATURE BATH", + "consignee": "on semiconductor malaysia sdn bhd", + "declared_hs": "8486109000", + "hs_verified": true, + "origin_country": "UNITED STATES", + "port_dest": "KUALA LUMPUR", + "port_origin": "HONG KONG", + "shipper": "modutek corporation" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848690", + "848640", + "848620", + "848610" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0273", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848610", + "id": "SH-0273", + "justification_text": "Goods classified under HS 8486.10; corroborated by 3 customs rulings on comparable goods (EU-DE, EU-FR, US).", + "reference_ruling_ids": [ + "CROSS-N240976", + "EBTI-FR-FRFR-RTC-2013-160374", + "EBTI-DE-DEM/2304/07-1" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Quartz-bath temperature/wet-process tank: a quartz-lined heated chemical bath used for wafer wet-processing (cleaning/etching) at controlled temperature", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Modutek", + "part_name": "quartz temperature bath" + } + }, + { + "bol_metadata": { + "arrival_date": "2024-12-16 00:00:00", + "bol_description": "------------ TLLU1252106 DESCRIPTION--------- PVT0100330 SICMA4.840PCLR SK SILTRON CUSTOMS TARIFF NO: 84861000 HS CODE: 848610 OVERSIZE - HEIGHT: 137.7 CM -------------GENERIC DESCRIPTION-------------", + "consignee": "sk siltron css, llc", + "declared_hs": "848610,84861000", + "hs_verified": true, + "origin_country": "GERMANY", + "port_dest": "NEW YORK NEW YORK", + "port_origin": "BREMERHAVEN", + "shipper": "pva crystal growing systems" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848610", + "848640", + "848620", + "848690" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0274", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848610", + "id": "SH-0274", + "justification_text": "Goods classified under HS 8486.10; corroborated by 2 customs rulings on comparable goods (US).", + "reference_ruling_ids": [ + "CROSS-N057062", + "CROSS-N240976" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "A silicon-carbide single-crystal growth furnace using the physical-vapour-transport (PVT) sublimation method (part PVT0100330): an induction-heated vacuum system that sublimes SiC source powder above ~2000 C onto a seed crystal to grow monocrystalline SiC boules for power-semiconductor substrates. Oversize shipment", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "PVA Crystal Growing Systems", + "part_name": "TLLU1252106 description" + } + }, + { + "bol_metadata": { + "arrival_date": "2023-07-21 00:00:00", + "bol_description": "VERTICAL DOUBLE DISK GRINDING MACHINE", + "consignee": "shin-etsu magnetics philippines inc", + "declared_hs": "84861050000", + "hs_verified": true, + "origin_country": "JAPAN", + "port_dest": "MANILA INTERNATIONAL CONTAINER TERMINAL", + "port_origin": "", + "shipper": "shin etsu chemical co.,ltd" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848690", + "848620", + "848610", + "848640" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0275", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848610", + "id": "SH-0275", + "justification_text": "Goods classified under HS 8486.10; corroborated by 4 customs rulings on comparable goods (EU-DE, EU-FR, EU-NL, US).", + "reference_ruling_ids": [ + "EBTI-DE-DEM/2304/07-1", + "CROSS-N240976", + "EBTI-FR-FRFR-RTC-2013-160374", + "EBTI-NL-NLRTD-2007-000125" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Vertical double-disk grinding machine: a wafer-thinning tool that simultaneously grinds both faces of a wafer between two opposed grinding wheels to achieve flatness and target thickness", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Shin-Etsu Chemical", + "part_name": "vertical double disk grinding machine" + } + }, + { + "bol_metadata": { + "arrival_date": "2023-01-11 00:00:00", + "bol_description": "MW300GT-AUTO FOSB(PART OF TESTER HANDLER MACHINE FOR ALL IC PRODUCTS)", + "consignee": "stmicroelectronics inc", + "declared_hs": "84861090000", + "hs_verified": true, + "origin_country": "JAPAN", + "port_dest": "NINOY AQUINO INTERNATIONAL AIRPORT", + "port_origin": "", + "shipper": "shin-etsu polymer co ltd" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848690", + "848610", + "848620", + "848640" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0276", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848610", + "id": "SH-0276", + "justification_text": "Goods classified under HS 8486.10; corroborated by 2 customs rulings on comparable goods (EU-DE, EU-NL).", + "reference_ruling_ids": [ + "EBTI-NL-NLRTD-2007-000125", + "EBTI-DE-DEM/2304/07-1" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Front-opening shipping box (FOSB, MW300GT-AUTO): a 300 mm wafer-carrier/transport box used to store and ship wafers between tools; described as part of a tester/handler flow. It is supplied as a replacement or spare component for the parent semiconductor tool rather than as standalone equipment, and is fitted, consumed or maintained during normal tool operation", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Shin-Etsu Chemical", + "part_name": "MW300GT-auto fosb(part of tester" + } + }, + { + "bol_metadata": { + "arrival_date": "2024-12-10 00:00:00", + "bol_description": "WAFER CATCH P/N 136-05-060W1 SPEED FAM", + "consignee": "sumco indonesia", + "declared_hs": "84861090", + "hs_verified": true, + "origin_country": "JAPAN", + "port_dest": "", + "port_origin": "GUANGZHOU", + "shipper": "speedfam co., ltd" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848610", + "848690", + "848620", + "848640" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0277", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848610", + "id": "SH-0277", + "justification_text": "Goods classified under HS 8486.10; corroborated by 3 customs rulings on comparable goods (EU-DE, EU-NL, US).", + "reference_ruling_ids": [ + "EBTI-DE-DEM/2304/07-1", + "EBTI-NL-NLRTD-2007-000125", + "CROSS-N240976" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Wafer catch (part 136-05-060W1): a small catcher/retainer part that captures or supports wafers in a polishing/lapping machine. It is supplied as a replacement or spare component for the parent semiconductor tool rather than as standalone equipment, and is fitted, consumed or maintained during normal tool operation", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "SpeedFam", + "part_name": "wafer catch P/N 136-05-060W1 speed FAM" + } + }, + { + "bol_metadata": { + "arrival_date": "2024-08-23 00:00:00", + "bol_description": "DOUBLE SIDE POLISHING MACHINE POLISHER, 16B-5 HS CODE 8486.10", + "consignee": "3d glass solutions", + "declared_hs": "848610", + "hs_verified": true, + "origin_country": "JAPAN", + "port_dest": "LOS ANGELES CALIFORNIA", + "port_origin": "TOKYO", + "shipper": "speedfam co ltd" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848640", + "848610", + "848620", + "848690" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0278", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848610", + "id": "SH-0278", + "justification_text": "Goods classified under HS 8486.10; corroborated by 3 customs rulings on comparable goods (EU-DE, EU-FR, EU-NL).", + "reference_ruling_ids": [ + "EBTI-FR-FRFR-RTC-2013-160374", + "EBTI-DE-DEM/2304/07-1", + "EBTI-NL-NLRTD-2007-000125" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Double-side polishing machine (type 16B-5): a wafer-polishing tool that simultaneously planarises both faces of silicon wafers between rotating platens to achieve high flatness and parallelism during substrate manufacture", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "SpeedFam", + "part_name": "double side polishing machine polisher" + } + }, + { + "bol_metadata": { + "arrival_date": "2024-12-10 00:00:00", + "bol_description": "LAPPING PLATEN 22B M-030-016 REV.3/017 REV.2", + "consignee": "sumco indonesia", + "declared_hs": "84861050", + "hs_verified": true, + "origin_country": "JAPAN", + "port_dest": "", + "port_origin": "KOBE", + "shipper": "sumco corporation" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848640", + "848620", + "848610", + "848690" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0279", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848610", + "id": "SH-0279", + "justification_text": "Goods classified under HS 8486.10; corroborated by 4 customs rulings on comparable goods (EU-DE, EU-FR, EU-NL, US).", + "reference_ruling_ids": [ + "EBTI-NL-NLRTD-2007-000125", + "CROSS-N240976", + "EBTI-DE-DEM/2304/07-1", + "EBTI-FR-FRFR-RTC-2013-160374" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Lapping platen (22B; part M-030-016): a rotating flat lapping plate consumable that planarises/laps wafer surfaces in a double-side lapping machine. It is supplied as a replacement or spare component for the parent semiconductor tool rather than as standalone equipment, and is fitted, consumed or maintained during normal tool operation", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "SUMCO Corporation", + "part_name": "lapping platen 22B M-030-016 REV.3/017" + } + }, + { + "bol_metadata": { + "arrival_date": "2023-11-09 00:00:00", + "bol_description": "QUARTZ BOAT PBS MARUWA, 1261-0083-A", + "consignee": "sumco indonesia", + "declared_hs": "84861010", + "hs_verified": true, + "origin_country": "JAPAN", + "port_dest": "", + "port_origin": "HAKATA", + "shipper": "sumco techxiv corporation" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848620", + "848690", + "848610", + "848640" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0280", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848610", + "id": "SH-0280", + "justification_text": "Goods classified under HS 8486.10; corroborated by 2 customs rulings on comparable goods (EU-DE, EU-FR).", + "reference_ruling_ids": [ + "EBTI-DE-DEM/2304/07-1", + "EBTI-FR-FRFR-RTC-2013-160374" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Quartz boat (PBS; part 1261-0083-A): a quartz wafer-carrier 'boat' that holds a batch of wafers vertically inside a diffusion/oxidation/LPCVD furnace tube", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "SUMCO Corporation", + "part_name": "quartz boat PBS maruwa 1261-0083-A" + } + }, + { + "bol_metadata": { + "arrival_date": "2023-03-28 00:00:00", + "bol_description": "Z CHAMBER CARTRIDGE THETA 0.001 ADEP/N.021544-03CW-SPTI-2301-011", + "consignee": "lsy zen solutions", + "declared_hs": "84861060", + "hs_verified": true, + "origin_country": "INDONESIA", + "port_dest": "KUALA LUMPUR", + "port_origin": "CENGKARENG SOEKARNO HATTA U", + "shipper": "pt. sumco indonesia" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848690", + "848640", + "848620", + "848610" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0281", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848610", + "id": "SH-0281", + "justification_text": "Goods classified under HS 8486.10; corroborated by 1 customs ruling on comparable goods (EU-NL).", + "reference_ruling_ids": [ + "EBTI-NL-NLRTD-2007-000125" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Z-chamber cartridge (theta, 0.001; part 021544-03CW): a precision positioning cartridge part for a semiconductor wafer-processing tool's Z/theta stage. It is supplied as a replacement or spare component for the parent semiconductor tool rather than as standalone equipment, and is fitted, consumed or maintained during normal tool operation", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "SUMCO Corporation", + "part_name": "Z chamber cartridge theta 0.001" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-01-05 00:00:00", + "bol_description": "ROD PART FOR SHIMADZU INDUSTRIAL EQUIPMENT USE IN SLIDER MANUFACTURING", + "consignee": "western digital storage technologi-", + "declared_hs": "84861090000", + "hs_verified": true, + "origin_country": "UNITED STATES", + "port_dest": "NINOY AQUINO INTERNATIONAL AIRPORT", + "port_origin": "", + "shipper": "veeco process equipment inc" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848620", + "848690", + "848640", + "848610" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0282", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848610", + "id": "SH-0282", + "justification_text": "Goods classified under HS 8486.10; corroborated by 2 customs rulings on comparable goods (EU-FR, EU-NL).", + "reference_ruling_ids": [ + "EBTI-NL-NLRTD-2007-000125", + "EBTI-FR-FRFR-RTC-2013-160374" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Rod part for industrial slider-manufacturing equipment: a mechanical rod/shaft component used in a hard-disk magnetic-head (slider) fabrication tool. It is supplied as a replacement or spare component for the parent semiconductor tool rather than as standalone equipment, and is fitted, consumed or maintained during normal tool operation", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Veeco Instruments", + "part_name": "ROD part for shimadzu industrial" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-03-12 00:00:00", + "bol_description": "2.00 UN DFD6362 FULLY AUTOMATIC DICING SAW", + "consignee": "stmicroelectronics inc", + "declared_hs": "84861040000", + "hs_verified": true, + "origin_country": "JAPAN", + "port_dest": "MANILA INTERNATIONAL CONTAINER TERMINAL", + "port_origin": "", + "shipper": "disco corporation" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848640", + "848620", + "848690", + "848610" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0283", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848610", + "id": "SH-0283", + "justification_text": "Goods classified under HS 8486.10; corroborated by 3 customs rulings on comparable goods (EU-DE, EU-NL, US).", + "reference_ruling_ids": [ + "CROSS-N057062", + "EBTI-DE-DEM/2304/07-1", + "EBTI-NL-NLRTD-2007-000125" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "A fully-automatic dual-spindle dicing saw (type DFD6362) for 300 mm wafers: a blade-dicing machine whose facing twin air-bearing spindles (up to ~60,000 rpm) cut wafers along street lines to singulate them into individual dies, with automated blade replacement and precut. Two units", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "DISCO Corporation", + "part_name": "2.00 UN DFD6362 fully automatic dicing" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-02-26 00:00:00", + "bol_description": "PROXIMITY SWITCH O 8X39 PNP-NO SN2MM", + "consignee": "on semiconductor malaysia sdn bhd", + "declared_hs": "8486209900", + "hs_verified": true, + "origin_country": "SWITZERLAND", + "port_dest": "KUALA LUMPUR", + "port_origin": "SINGAPORE", + "shipper": "evatec ag" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848610", + "848690", + "848640", + "848620" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0284", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848620", + "id": "SH-0284", + "justification_text": "Goods classified under HS 8486.20; corroborated by 35 customs rulings on comparable goods across 5 jurisdictions.", + "reference_ruling_ids": [ + "CROSS-H122279", + "CROSS-H293625", + "CROSS-N027335", + "CROSS-N100422", + "EBTI-EN-0130", + "CROSS-N347911", + "CROSS-N015714", + "CROSS-N024146", + "CROSS-N026262", + "CROSS-N048675", + "CROSS-N133297", + "CROSS-N239347", + "CROSS-N240072", + "CROSS-N282620", + "CROSS-N336528", + "EBTI-EN-0013", + "CROSS-N158117", + "EBTI-CZ-CZ07-0791-2007", + "EBTI-DE-DE24351/10-1", + "EBTI-DE-DEM/8183/09-1", + "EBTI-DE-DEM/8217/09-1", + "EBTI-EN-0010", + "EBTI-EN-0012", + "EBTI-EN-0126", + "EBTI-EN-0127", + "EBTI-EN-0128", + "EBTI-EN-0129", + "CROSS-N347909", + "CROSS-N349446", + "CROSS-N349449", + "CROSS-N349451", + "EBTI-EN-0011", + "EBTI-EN-0125", + "EBTI-FR-FR-PRO-2011-007249", + "EBTI-FR-FR-RTC-2015-004290" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Proximity switch (8x39 mm, PNP-NO, 2 mm sensing): an inductive proximity sensor part that detects position/presence on a semiconductor process tool. The device converts the detected physical quantity into an electrical signal that the host machine's control system uses for monitoring, positioning or feedback during operation", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Evatec", + "part_name": "proximity switch O 8X39 PNP-NO SN2MM" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-29 00:00:00", + "bol_description": "660-078399-205 GEN,PRMT,13.56MHZ,3.0KW,PULSE(RF GENERATORS - ETCH) (13", + "consignee": "lam research international sdn bhd", + "declared_hs": "8486203200", + "hs_verified": true, + "origin_country": "UNITED STATES", + "port_dest": "KUALA LUMPUR", + "port_origin": "SAN FRANCISCO CA", + "shipper": "lam research corporation" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848610", + "848640", + "848690", + "848620" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0285", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848620", + "id": "SH-0285", + "justification_text": "Goods classified under HS 8486.20; corroborated by 15 customs rulings on comparable goods (EU-DE, EU-EN, EU-FR, US).", + "reference_ruling_ids": [ + "CROSS-H293625", + "CROSS-H122279", + "CROSS-N044476", + "EBTI-EN-0130", + "CROSS-N296265", + "CROSS-N349446", + "EBTI-DE-DEM/8183/09-1", + "EBTI-EN-0010", + "EBTI-EN-0012", + "EBTI-EN-0013", + "EBTI-EN-0126", + "EBTI-EN-0127", + "EBTI-EN-0128", + "EBTI-EN-0129", + "EBTI-FR-FR-PRO-2011-007249" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "RF generator (13.56 MHz, 3.0 kW, pulse-capable; part 660-078399-205) for a plasma etch tool: a power-supply part that delivers radio-frequency energy to generate and sustain the etch plasma", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Lam Research", + "part_name": "660-078399-205 GEN prmt 13.56MHZ 3.0KW" + } + }, + { + "bol_metadata": { + "arrival_date": "2023-02-15 00:00:00", + "bol_description": "NES1W-H04A (NIKON STEPPER MACHINE)", + "consignee": "western digital storage technologi-", + "declared_hs": "84862019000", + "hs_verified": true, + "origin_country": "JAPAN", + "port_dest": "NINOY AQUINO INTERNATIONAL AIRPORT", + "port_origin": "", + "shipper": "nikon tec corp" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848690", + "848620", + "848640", + "848610" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0286", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848620", + "id": "SH-0286", + "justification_text": "Goods classified under HS 8486.20; corroborated by 21 customs rulings on comparable goods (EU-EN, EU-FR, US).", + "reference_ruling_ids": [ + "CROSS-N349446", + "CROSS-N048675", + "CROSS-N100422", + "CROSS-N240072", + "CROSS-N268097", + "CROSS-N277250", + "CROSS-N347909", + "CROSS-N348150", + "CROSS-N348151", + "CROSS-N347911", + "EBTI-EN-0125", + "EBTI-FR-FR-RTC-2015-004290", + "CROSS-H122279", + "CROSS-H293625", + "CROSS-N349449", + "CROSS-N349451", + "EBTI-EN-0010", + "EBTI-EN-0012", + "EBTI-EN-0013", + "EBTI-EN-0130", + "EBTI-FR-FR-PRO-2011-007249" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "An i-line (365 nm) projection lithography stepper (type NES1W-H04A): a step-and-repeat wafer-exposure tool with a variable-numerical-aperture (0.12-0.24), 2.5x-reduction projection lens delivering sub-1 um resolution, used to print circuit patterns for MEMS, power-device and advanced-packaging applications", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Nikon", + "part_name": "NES1W-H04A (stepper machine)" + } + }, + { + "bol_metadata": { + "arrival_date": "2024-12-12 00:00:00", + "bol_description": "SPRAY COATER 176518 3-1 8200809403 MODEL SC-80EX SN V70W00185A HS CODE 848620", + "consignee": "headway technologies inc", + "declared_hs": "848620,8486200000", + "hs_verified": true, + "origin_country": "JAPAN", + "port_dest": "OAKLAND CALIFORNIA", + "port_origin": "KOBE", + "shipper": "screen semiconductor solutions co" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848690", + "848610", + "848640", + "848620" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0287", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848620", + "id": "SH-0287", + "justification_text": "Goods classified under HS 8486.20; corroborated by 8 customs rulings on comparable goods (EU-EN, US).", + "reference_ruling_ids": [ + "CROSS-N015714", + "CROSS-N282620", + "CROSS-H122279", + "CROSS-H293625", + "EBTI-EN-0011", + "CROSS-N349446", + "CROSS-N361144", + "EBTI-EN-0130" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "A spray coater (type SC-80EX): a wafer-coating tool that uses proprietary spray technology to deposit uniform photoresist or protective films onto 3D-structured, stepped or through-hole substrates for MEMS, SAW and power-device manufacturing, where conventional spin coaters struggle. Serial V70W00185A", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "SCREEN Semiconductor Solutions", + "part_name": "spray coater 1765183-18200809403 model" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-22 00:00:00", + "bol_description": "O-RING BUNA (O-RING)", + "consignee": "fuji electric m sdn bhd", + "declared_hs": "8486203300", + "hs_verified": true, + "origin_country": "JAPAN", + "port_dest": "PENANG GEORGETOWN", + "port_origin": "KANSAI INT APT", + "shipper": "sumitomo heavy industries" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848690", + "848620", + "848640", + "848610" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0288", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848620", + "id": "SH-0288", + "justification_text": "Goods classified under HS 8486.20; corroborated by 26 customs rulings on comparable goods across 5 jurisdictions.", + "reference_ruling_ids": [ + "CROSS-H293625", + "CROSS-N015714", + "CROSS-N026262", + "CROSS-N133297", + "CROSS-H122279", + "EBTI-CZ-CZ07-0791-2007", + "CROSS-N027335", + "CROSS-N100422", + "CROSS-N158117", + "CROSS-N250406", + "CROSS-N282620", + "EBTI-EN-0013", + "EBTI-EN-0130", + "CROSS-N347911", + "EBTI-DE-DE24351/10-1", + "EBTI-DE-DEM/8183/09-1", + "EBTI-DE-DEM/8217/09-1", + "EBTI-EN-0127", + "EBTI-EN-0128", + "EBTI-EN-0129", + "CROSS-N349446", + "EBTI-EN-0010", + "EBTI-EN-0011", + "EBTI-EN-0012", + "EBTI-EN-0126", + "EBTI-FR-FR-RTC-2015-004290" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "O-ring (Buna/nitrile rubber): an elastomer sealing-ring part used to seal joints/vacuum interfaces in a semiconductor process tool. It is supplied as a replacement or spare component for the parent semiconductor tool rather than as standalone equipment, and is fitted, consumed or maintained during normal tool operation", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Sumitomo Heavy Industries", + "part_name": "O-ring buna (O-ring)" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-22 00:00:00", + "bol_description": "O-RING VITON (O-RING)(O-RING)", + "consignee": "fuji electric m sdn bhd", + "declared_hs": "8486203300", + "hs_verified": true, + "origin_country": "JAPAN", + "port_dest": "PENANG GEORGETOWN", + "port_origin": "KANSAI INT APT", + "shipper": "sumitomo heavy industries" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848610", + "848640", + "848620", + "848690" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0289", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848620", + "id": "SH-0289", + "justification_text": "Goods classified under HS 8486.20; corroborated by 25 customs rulings on comparable goods across 5 jurisdictions.", + "reference_ruling_ids": [ + "CROSS-H293625", + "CROSS-N015714", + "CROSS-N282620", + "EBTI-EN-0130", + "CROSS-H122279", + "CROSS-N026262", + "CROSS-N027335", + "CROSS-N100422", + "CROSS-N133297", + "CROSS-N250406", + "EBTI-EN-0013", + "CROSS-N158117", + "CROSS-N347911", + "EBTI-CZ-CZ07-0791-2007", + "EBTI-DE-DE24351/10-1", + "EBTI-DE-DEM/8183/09-1", + "EBTI-DE-DEM/8217/09-1", + "EBTI-EN-0011", + "EBTI-EN-0127", + "EBTI-EN-0128", + "EBTI-EN-0129", + "CROSS-N349446", + "EBTI-EN-0010", + "EBTI-EN-0012", + "EBTI-FR-FR-RTC-2015-004290" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "O-ring (Viton/FKM fluoroelastomer): a chemically-resistant elastomer sealing-ring part used to seal joints/vacuum interfaces in a semiconductor process tool. It is consumed as a process material/consumable in semiconductor or related manufacturing rather than forming part of the finished device, and is supplied in bulk/packaged form", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Sumitomo Heavy Industries", + "part_name": "O-ring viton (O-ring)(O-ring)" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-15 00:00:00", + "bol_description": "TMNL RING (RING)(A1/126)", + "consignee": "fuji electric m sdn bhd", + "declared_hs": "8486203300", + "hs_verified": true, + "origin_country": "JAPAN", + "port_dest": "PENANG GEORGETOWN", + "port_origin": "KANSAI INT APT", + "shipper": "sumitomo heavy industries" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848610", + "848620", + "848640", + "848690" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0290", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848620", + "id": "SH-0290", + "justification_text": "Goods classified under HS 8486.20; corroborated by 24 customs rulings on comparable goods across 5 jurisdictions.", + "reference_ruling_ids": [ + "CROSS-H293625", + "CROSS-N015714", + "CROSS-N026262", + "CROSS-N133297", + "CROSS-H122279", + "EBTI-CZ-CZ07-0791-2007", + "CROSS-N027335", + "CROSS-N100422", + "CROSS-N158117", + "CROSS-N282620", + "CROSS-N347911", + "EBTI-DE-DE24351/10-1", + "EBTI-DE-DEM/8183/09-1", + "EBTI-DE-DEM/8217/09-1", + "EBTI-EN-0013", + "EBTI-EN-0126", + "EBTI-EN-0130", + "EBTI-FR-FR-RTC-2015-004290", + "CROSS-N349446", + "EBTI-EN-0010", + "EBTI-EN-0012", + "EBTI-EN-0127", + "EBTI-EN-0128", + "EBTI-EN-0129" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Terminal ring (part A1/126): a ring-shaped electrical-terminal/contact part for a semiconductor process tool. It is supplied as a replacement or spare component for the parent semiconductor tool rather than as standalone equipment, and is fitted, consumed or maintained during normal tool operation", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Sumitomo Heavy Industries", + "part_name": "tmnl ring (ring)(A1/126)" + } + }, + { + "bol_metadata": { + "arrival_date": "2024-08-09 00:00:00", + "bol_description": "PLANT FOR THE PRODUCTION OF SEMICONDUCTOR COM PONENTSHERE SMTSXBS200-003018", + "consignee": "texas instruments incorporated", + "declared_hs": "8486200000", + "hs_verified": true, + "origin_country": "GERMANY", + "port_dest": "HOUSTON TEXAS", + "port_origin": "HAMBURG STADE", + "shipper": "suss microtec solutions gmbh & co" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848610", + "848640", + "848690", + "848620" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0291", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848620", + "id": "SH-0291", + "justification_text": "Goods classified under HS 8486.20; corroborated by 30 customs rulings on comparable goods (EU-CZ, EU-DE, EU-EN, US).", + "reference_ruling_ids": [ + "CROSS-N026262", + "CROSS-N027335", + "CROSS-N100422", + "CROSS-N133297", + "CROSS-H293625", + "EBTI-DE-DE24351/10-1", + "CROSS-N015714", + "CROSS-N024146", + "CROSS-N048675", + "CROSS-N158117", + "CROSS-N239347", + "CROSS-N240072", + "CROSS-N282620", + "CROSS-N347911", + "EBTI-CZ-CZ07-0791-2007", + "EBTI-DE-DEM/8183/09-1", + "EBTI-DE-DEM/8217/09-1", + "EBTI-EN-0127", + "EBTI-EN-0128", + "EBTI-EN-0129", + "EBTI-EN-0130", + "CROSS-H122279", + "CROSS-N347909", + "CROSS-N349449", + "CROSS-N349451", + "EBTI-EN-0010", + "EBTI-EN-0011", + "EBTI-EN-0012", + "EBTI-EN-0013", + "EBTI-EN-0126" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Plant/system for semiconductor-component production (SMTSXBS200 platform): a wafer-processing system/line used in the manufacture of semiconductor components", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "SUSS MicroTec", + "part_name": "plant for the production of" + } + }, + { + "bol_metadata": { + "arrival_date": "2024-07-22 00:00:00", + "bol_description": "SEMI-AUTOMATED COATING DEVELOPING PLATFORM RCD8 SERIAL NUMBER:RCD8-000253 INV NO: EX2024039 HS CODE: 848620", + "consignee": "meta platforms technologies, llc", + "declared_hs": "848620", + "hs_verified": true, + "origin_country": "CHINA TAIWAN", + "port_dest": "TACOMA WASHINGTON", + "port_origin": "KAO HSIUNG", + "shipper": "suss microtec taiwan co., ltd" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848640", + "848690", + "848610", + "848620" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0292", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848620", + "id": "SH-0292", + "justification_text": "Goods classified under HS 8486.20; corroborated by 18 customs rulings on comparable goods across 5 jurisdictions.", + "reference_ruling_ids": [ + "CROSS-N349446", + "CROSS-N048675", + "CROSS-N100422", + "CROSS-N240072", + "CROSS-N268097", + "CROSS-N347909", + "CROSS-N348150", + "CROSS-N348151", + "CROSS-N277250", + "EBTI-CZ-CZ07-0791-2007", + "EBTI-EN-0130", + "CROSS-H122279", + "CROSS-N349449", + "CROSS-N349451", + "EBTI-DE-DE24351/10-1", + "EBTI-EN-0010", + "EBTI-EN-0012", + "EBTI-FR-FR-PRO-2011-007249" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Semi-automated coat/develop platform (RCD8): a resist spin/spray-coat and puddle-develop tool for wafers up to 200 mm, used in R&D and small-scale lithography. Serial RCD8-000253", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "SUSS MicroTec", + "part_name": "semi-automated coating developing" + } + }, + { + "bol_metadata": { + "arrival_date": "2023-04-28 00:00:00", + "bol_description": "100007228 SMTS LABSPIN6 (SN. NO. LABSPIN6-000592)", + "consignee": "indo french high tech equipments", + "declared_hs": "84862000", + "hs_verified": true, + "origin_country": "GERMANY", + "port_dest": "SAHAR AIR CARGO ACC INBOM4", + "port_origin": "STUTTGART", + "shipper": "suss microtec solutions gmbh & co. kg" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848610", + "848690", + "848620", + "848640" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0293", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848620", + "id": "SH-0293", + "justification_text": "Goods classified under HS 8486.20; corroborated by 11 customs rulings on comparable goods across 5 jurisdictions.", + "reference_ruling_ids": [ + "EBTI-CZ-CZ07-0791-2007", + "EBTI-EN-0130", + "CROSS-H122279", + "CROSS-N349446", + "EBTI-DE-DE24351/10-1", + "EBTI-EN-0010", + "EBTI-EN-0011", + "EBTI-EN-0012", + "EBTI-EN-0125", + "EBTI-EN-0126", + "EBTI-FR-FR-PRO-2011-007249" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Manual spin coater/developer (LabSpin6): a benchtop resist coat-and-develop tool that spins photoresist onto wafers/substrates and develops exposed resist. Serial LabSpin6-000592", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "SUSS MicroTec", + "part_name": "100007228 smts LABSPIN6 (SN. NO" + } + }, + { + "bol_metadata": { + "arrival_date": "2024-12-06 00:00:00", + "bol_description": "- EI 501Z ULVAC HIGH VACUUM EVAPORATION", + "consignee": "gruppo ems inc", + "declared_hs": "84862013000", + "hs_verified": true, + "origin_country": "CHINA MAINLAND", + "port_dest": "NINOY AQUINO INTERNATIONAL AIRPORT", + "port_origin": "", + "shipper": "ulvac suzhou co ltd" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848610", + "848640", + "848690", + "848620" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0294", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848620", + "id": "SH-0294", + "justification_text": "Goods classified under HS 8486.20; corroborated by 27 customs rulings on comparable goods across 5 jurisdictions.", + "reference_ruling_ids": [ + "EBTI-EN-0130", + "EBTI-EN-0011", + "CROSS-H122279", + "EBTI-EN-0126", + "CROSS-N024146", + "CROSS-N027335", + "CROSS-N048675", + "CROSS-N100422", + "CROSS-N239347", + "CROSS-N240072", + "CROSS-N250406", + "EBTI-CZ-CZ07-0791-2007", + "EBTI-DE-DEM/8183/09-1", + "EBTI-DE-DEM/8217/09-1", + "EBTI-EN-0010", + "EBTI-EN-0012", + "EBTI-EN-0013", + "CROSS-H293625", + "CROSS-N347909", + "CROSS-N347911", + "CROSS-N349446", + "CROSS-N349449", + "CROSS-N349451", + "EBTI-EN-0127", + "EBTI-EN-0128", + "EBTI-EN-0129", + "EBTI-FR-FR-PRO-2011-007249" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "High-vacuum thermal evaporation system (model EI-501Z): a physical-vapour-deposition tool that evaporates metals/materials under high vacuum to deposit thin films on substrates for research and device fabrication", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "ULVAC", + "part_name": "EI 501Z high vacuum evaporation" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-30 00:00:00", + "bol_description": "VEECO PN:AP-SYS ULTRATECH AP300E MAIN TOOL", + "consignee": "texas instruments electronics", + "declared_hs": "8486209500", + "hs_verified": true, + "origin_country": "UNITED STATES", + "port_dest": "KUALA LUMPUR", + "port_origin": "SAN FRANCISCO CA", + "shipper": "veeco inc" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848610", + "848620", + "848690", + "848640" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0295", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848620", + "id": "SH-0295", + "justification_text": "Goods classified under HS 8486.20; corroborated by 19 customs rulings on comparable goods across 5 jurisdictions.", + "reference_ruling_ids": [ + "CROSS-N349446", + "CROSS-N048675", + "CROSS-N100422", + "CROSS-N240072", + "CROSS-N268097", + "CROSS-N277250", + "CROSS-N347909", + "CROSS-N348150", + "CROSS-N348151", + "EBTI-CZ-CZ07-0791-2007", + "CROSS-H122279", + "CROSS-N349449", + "CROSS-N349451", + "EBTI-DE-DE24351/10-1", + "EBTI-EN-0010", + "EBTI-EN-0012", + "EBTI-EN-0125", + "EBTI-EN-0130", + "EBTI-FR-FR-PRO-2011-007249" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Advanced-packaging lithography stepper (AP300E platform): a broadband ghi-line projection stepper (NA 0.16, 1X Wynne-Dyson lens, ~2 um resolution) for 200/300 mm wafers, used for copper-pillar, fan-out, TSV and interposer packaging. Main tool", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Veeco Instruments", + "part_name": "PN:AP-SYS ultratech AP300E main tool" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848690", + "848620", + "848610", + "848640" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0296", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848620", + "id": "SH-0296", + "justification_text": "The product falls under HS 8486.20 (Machines for semiconductor or IC manufacture).", + "reference_ruling_ids": [ + "CROSS-H293625", + "EBTI-EN-0130", + "CROSS-N027335", + "CROSS-N100422", + "CROSS-N239347", + "EBTI-CZ-CZ07-0791-2007", + "CROSS-H122279", + "CROSS-N158117", + "EBTI-DE-DEM/8183/09-1", + "EBTI-DE-DEM/8217/09-1", + "EBTI-EN-0011", + "CROSS-N015714", + "CROSS-N024146", + "CROSS-N026262", + "CROSS-N048675", + "CROSS-N133297", + "CROSS-N240072", + "CROSS-N250406", + "CROSS-N282620", + "CROSS-N347911", + "EBTI-EN-0010", + "EBTI-EN-0012", + "EBTI-EN-0126", + "CROSS-N296265", + "EBTI-DE-DE24351/10-1", + "EBTI-EN-0013", + "EBTI-EN-0127", + "EBTI-EN-0128", + "EBTI-EN-0129", + "CROSS-N347909", + "CROSS-N349449", + "CROSS-N349451", + "EBTI-FR-FR-PRO-2011-007249" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "A modular physical-vapour-deposition (PVD) system providing a configurable vacuum platform for thin-film deposition by evaporation and sputtering. It supports research and small-scale fabrication of coatings and device layers in materials and semiconductor laboratories (part MiniLab090-MSE-Configured)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Moorfield Nanotechnology", + "part_name": "MiniLab090-MSE-Configured" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848640", + "848620", + "848610", + "848690" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0297", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848620", + "id": "SH-0297", + "justification_text": "The product falls under HS 8486.20 (Machines for semiconductor or IC manufacture).", + "reference_ruling_ids": [ + "EBTI-EN-0130", + "CROSS-H122279", + "CROSS-N250406", + "EBTI-EN-0010", + "EBTI-EN-0011", + "EBTI-EN-0012", + "EBTI-EN-0126", + "CROSS-H293625", + "CROSS-N049723", + "EBTI-EN-0013", + "EBTI-EN-0127", + "EBTI-EN-0128", + "EBTI-EN-0129", + "EBTI-FR-FR-PRO-2011-007249" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "A compact, floor-standing vacuum thermal evaporator for depositing thin metal and dielectric films onto substrates under high vacuum. It supports research and small-scale fabrication of coatings, contacts and device layers in laboratories (part MiniLab-026-Configured)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Moorfield Nanotechnology", + "part_name": "MiniLab-026-Configured" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848620", + "848640", + "848610", + "848690" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0298", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848620", + "id": "SH-0298", + "justification_text": "The product falls under HS 8486.20 (Machines for semiconductor or IC manufacture).", + "reference_ruling_ids": [ + "EBTI-EN-0130", + "CROSS-H293625", + "CROSS-N239347", + "CROSS-H122279", + "EBTI-EN-0011", + "CROSS-N024146", + "CROSS-N027335", + "CROSS-N048675", + "CROSS-N100422", + "CROSS-N240072", + "CROSS-N250406", + "CROSS-N158117", + "CROSS-N296265", + "EBTI-EN-0010", + "EBTI-EN-0012", + "EBTI-EN-0013", + "EBTI-EN-0127", + "EBTI-EN-0128", + "EBTI-EN-0129", + "CROSS-N049723", + "CROSS-N347909", + "CROSS-N347911", + "CROSS-N349449", + "CROSS-N349451", + "EBTI-EN-0126", + "EBTI-FR-FR-PRO-2011-007249" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "A benchtop vacuum deposition system combining thermal evaporation and magnetron sputtering for thin-film coating of substrates. 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It supports sample coating for microscopy and research thin-film deposition in laboratories (part MA0589)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "MSE Supplies", + "part_name": "MA0589" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-22 00:00:00", + "bol_description": "857-295144-001 KIT,ROBOT,BLACK,VORTEX-WET,ROW(ROBOTS - WAFER HANDLERS)", + "consignee": "lam research international sdn bhd", + "declared_hs": "8486402000", + "hs_verified": true, + "origin_country": "SINGAPORE", + "port_dest": "PENANG GEORGETOWN", + "port_origin": "PORTLAND OR", + "shipper": "lam research corporation" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848620", + "848690", + "848610", + "848640" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0305", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848640", + "id": "SH-0305", + "justification_text": "Goods classified under HS 8486.40; corroborated by 1 customs ruling on comparable goods (US).", + "reference_ruling_ids": [ + "CROSS-N231738" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Wafer-handler robot kit (Vortex-Wet, black, ROW; part 857-295144-001): a robotic wafer-handling assembly part for a wet-process tool that transfers wafers between stations", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Lam Research", + "part_name": "857-295144-001 kit robot black" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-15 00:00:00", + "bol_description": "Y52K HANDLER COK 350HTCK00019B PO NO. 3501331134 (QTY )", + "consignee": "micron semiconductor technology india private limi", + "declared_hs": "84864000", + "hs_verified": true, + "origin_country": "SOUTH KOREA", + "port_dest": "", + "port_origin": "", + "shipper": "techwing, inc" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848690", + "848640", + "848610", + "848620" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0306", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848640", + "id": "SH-0306", + "justification_text": "Goods classified under HS 8486.40; corroborated by 1 customs ruling on comparable goods (US).", + "reference_ruling_ids": [ + "CROSS-N007092" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Device test handler (Y52K): a back-end handler that presents packaged devices to a tester contactor and sorts them by test result. 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corroborated by 2 customs rulings on comparable goods (US).", + "reference_ruling_ids": [ + "CROSS-N007092", + "CROSS-N231738" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Pin-insertion / pin-inspection handler: an assembly/inspection machine that inserts and inspects package leads/pins on devices during back-end processing", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "STMicroelectronics", + "part_name": "PIN insertion handler pentamaster PIN" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-03 00:00:00", + "bol_description": "853-228807-003 ROBOT ASSY,BACKEND NO FLIP XY7ROBOTS - WAFER HANDLERS (", + "consignee": "lam research international sdn bhd", + "declared_hs": "8486402000", + "hs_verified": true, + "origin_country": "UNITED STATES", + "port_dest": "KUALA LUMPUR", + "port_origin": "SAN FRANCISCO CA", + "shipper": "ultra clean technology" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848640", + "848610", + "848690", + "848620" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0309", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848640", + "id": "SH-0309", + "justification_text": "Goods classified under HS 8486.40; corroborated by 1 customs ruling on comparable goods (US).", + "reference_ruling_ids": [ + "CROSS-N231738" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Back-end wafer-handler robot assembly (no-flip, XY7; part 853-228807-003): a robotic wafer-transfer assembly part that moves wafers between back-end process stations", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Ultra Clean Holdings", + "part_name": "853-228807-003 robot assy backend NO" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-01-09 00:00:00", + "bol_description": "AD8312FC 2 HIGH SPEED FLIP CHIP BONDER", + "consignee": "ti philippines inc", + "declared_hs": "84864090000", + "hs_verified": true, + "origin_country": "CHINA HONGKONG", + "port_dest": "MANILA INTERNATIONAL CONTAINER TERMINAL", + "port_origin": "", + "shipper": "asmpt singapore pte ltd co asmpt technology hong kong limited" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848620", + "848610", + "848690", + "848640" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0310", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848640", + "id": "SH-0310", + "justification_text": "Goods classified under HS 8486.40; corroborated by 1 customs ruling on comparable goods (US).", + "reference_ruling_ids": [ + "CROSS-N231738" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "A high-speed flip-chip bonder (type AD8312FC): an automated assembly machine that flips and bonds dies face-down onto a substrate, forming bump interconnects for flip-chip and wafer-level packaging at high placement accuracy and throughput", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "ASMPT", + "part_name": "AD8312FC 2 high speed flip chip bonder" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-17 00:00:00", + "bol_description": "HB 16 SEMI-AUTOMATIC THERMOSONIC WEDGE, BALL AND RIBBON BONDER ASSEMBLY KIT SN 1439 INCLUDING ACCESSORIES.", + "consignee": "mcube technologies private limited", + "declared_hs": "84864000", + "hs_verified": true, + "origin_country": "GERMANY", + "port_dest": "", + "port_origin": "", + "shipper": "tpt wire bonder gmbh & co. kg" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848690", + "848610", + "848640", + "848620" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0311", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848640", + "id": "SH-0311", + "justification_text": "Goods classified under HS 8486.40; corroborated by 1 customs ruling on comparable goods (US).", + "reference_ruling_ids": [ + "CROSS-N231738" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Semi-automatic thermosonic wire bonder (type HB 16): a benchtop wedge/ball/ribbon bonder that forms gold/aluminium wire and ribbon interconnects between die pads and package leads using heat and ultrasonic energy. Supplied as an assembly kit with accessories (S/N 1439)", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "TPT Wire Bonder", + "part_name": "HB 16 semi-automatic thermosonic wedge" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-02-19 00:00:00", + "bol_description": "EAGLEAERO GOLD WIRE BALL BONDER EA42-279", + "consignee": "mmrfic technology private limited", + "declared_hs": "84864000", + "hs_verified": true, + "origin_country": "SINGAPORE", + "port_dest": "BANGALORE ICD INWFD6", + "port_origin": "SINGAPORE", + "shipper": "asmpt singapore pte. ltd" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848620", + "848640", + "848610", + "848690" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0312", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848640", + "id": "SH-0312", + "justification_text": "Goods classified under HS 8486.40; corroborated by 1 customs ruling on comparable goods (US).", + "reference_ruling_ids": [ + "CROSS-N231738" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "An automatic gold-wire ball bonder (EagleAero, EA42-279): an automated thermosonic wire bonder that forms fine-pitch gold ball-wedge wire interconnects between die pads and package leads during integrated-circuit assembly, with advanced vision and process control", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "ASMPT", + "part_name": "eagleaero gold wire ball bonder EA42-279" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-01-16 00:00:00", + "bol_description": "Die Tool-Form & Singulate (LQFP7x748L)", + "consignee": "tata semiconductor assembly and test private limit", + "declared_hs": "84864000", + "hs_verified": true, + "origin_country": "SOUTH KOREA", + "port_dest": "", + "port_origin": "", + "shipper": "genesem inc" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848610", + "848690", + "848620", + "848640" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0313", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848640", + "id": "SH-0313", + "justification_text": "Goods classified under HS 8486.40; corroborated by 6 customs rulings on comparable goods (US).", + "reference_ruling_ids": [ + "CROSS-N007092", + "CROSS-N231738", + "CROSS-N242843", + "CROSS-N275956", + "CROSS-N336802", + "CROSS-N342524" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Package form-and-singulation tool (for LQFP 7x7 48-lead packages): an assembly-line machine that trims/forms the leads and singulates molded leadframe strips into individual finished IC packages", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Genesem", + "part_name": "Die Tool-Form & Singulate (LQFP7x748L)" + } + }, + { + "bol_metadata": { + "arrival_date": "2024-12-16 00:00:00", + "bol_description": "CHIP MODULE ENCAPSULATION CME3060 SERIAL NO.: 10000319124", + "consignee": "pt utac manufacturing services indonesia", + "declared_hs": "84864030", + "hs_verified": true, + "origin_country": "CHINA MAINLAND", + "port_dest": "", + "port_origin": "WUXI", + "shipper": "muehlbauer technologies wuxi co., ltd" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848690", + "848640", + "848620", + "848610" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0314", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848640", + "id": "SH-0314", + "justification_text": "Goods classified under HS 8486.40; corroborated by 3 customs rulings on comparable goods (US).", + "reference_ruling_ids": [ + "CROSS-N336802", + "CROSS-N342524", + "CROSS-N231738" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "A chip-module encapsulation system (type CME3060): an assembly machine that encapsulates IC modules using dam-and-fill or glob-top processes (with dispensing and curing) for smart-card and module production, optionally integrated for inline inspection. Serial 10000319124", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Muehlbauer", + "part_name": "chip module encapsulation CME3060" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-26 00:00:00", + "bol_description": "REEL TAPING MACHINE OUBEL 0B-T02A 1500 X430 X720(MM)", + "consignee": "umeco india automation private limited", + "declared_hs": "84864000", + "hs_verified": true, + "origin_country": "CHINA MAINLAND", + "port_dest": "", + "port_origin": "", + "shipper": "grace industries limited" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848610", + "848620", + "848640", + "848690" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0315", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848640", + "id": "SH-0315", + "justification_text": "Goods classified under HS 8486.40; corroborated by 1 customs ruling on comparable goods (US).", + "reference_ruling_ids": [ + "CROSS-N336802" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Reel taping machine (type OUBEL 0B-T02A): a back-end handling machine that loads components into carrier tape and winds them onto reels for shipment. Footprint ~1500x430x720 mm", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Grace", + "part_name": "reel taping machine oubel 0B-T02A 1500" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-03-13 00:00:00", + "bol_description": "TAPE AND REEL NEON BOOSTER", + "consignee": "ti philippines inc", + "declared_hs": "84864020000", + "hs_verified": true, + "origin_country": "MALAYSIA", + "port_dest": "NINOY AQUINO INTERNATIONAL AIRPORT", + "port_origin": "", + "shipper": "cohu malaysia sdn. bhd" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848690", + "848620", + "848610", + "848640" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0316", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848640", + "id": "SH-0316", + "justification_text": "Goods classified under HS 8486.40; corroborated by 1 customs ruling on comparable goods (US).", + "reference_ruling_ids": [ + "CROSS-N336802" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Tape-and-reel handling booster (Neon): a back-end handling module that loads tested/singulated devices into carrier tape on reels for shipment", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Cohu", + "part_name": "tape and reel neon booster" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-17 00:00:00", + "bol_description": "ANHUI ZHONGHE MOLD CHASES", + "consignee": "carsem m sdn bhd", + "declared_hs": "8486403000", + "hs_verified": true, + "origin_country": "CHINA MAINLAND", + "port_dest": "PORT KLANG PELABUHAN KLANG", + "port_origin": "SHANGHAI", + "shipper": "anhui zhonghe semiconductor tech," + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848610", + "848640", + "848620", + "848690" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0317", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848640", + "id": "SH-0317", + "justification_text": "Goods classified under HS 8486.40; corroborated by 1 customs ruling on comparable goods (US).", + "reference_ruling_ids": [ + "CROSS-N007092" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Mold chases for a semiconductor molding machine: replaceable mold-tooling inserts that define the package cavity shape during transfer/compression encapsulation of IC packages", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Anhui Zhonghe Semiconductor", + "part_name": "mold chases" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-16 00:00:00", + "bol_description": "MOLDING PROCESS-WAXING,SPRAY,FORMULA TEN2(AMBERSIL)", + "consignee": "texas instruments electronics", + "declared_hs": "8486403000", + "hs_verified": true, + "origin_country": "MALAYSIA", + "port_dest": "BATU BERENDAM MELAKA", + "port_origin": "BATU BERENDAM MELAKA", + "shipper": "texas instruments electronics" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848640", + "848620", + "848690", + "848610" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0318", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848640", + "id": "SH-0318", + "justification_text": "Goods classified under HS 8486.40; corroborated by 2 customs rulings on comparable goods (US).", + "reference_ruling_ids": [ + "CROSS-N007092", + "CROSS-N231738" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Mold-release agent (type Formula Ten2): a wax/spray release chemical applied to mould surfaces so encapsulated semiconductor packages release cleanly during the molding process. A process consumable, not a machine. It is consumed as a process material/consumable in semiconductor or related manufacturing rather than forming part of the finished device, and is supplied in bulk/packaged form", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Texas Instruments", + "part_name": "molding process-waxing spray formula" + } + }, + { + "bol_metadata": { + "arrival_date": "2024-11-14 00:00:00", + "bol_description": "APTURA TRAY TO WAFER HS CODE: 84864020 INV NO : 2946386 SO NO : 190101455 PO NO : 3048190- APF DESCRIPTION: TW03_KSI / INTEL OREGON (US) : APTURA TRAY TO WAFER", + "consignee": "kulicke & soffa industries inc", + "declared_hs": "84864020", + "hs_verified": true, + "origin_country": "SINGAPORE", + "port_dest": "NEW YORK NEWARK AREA NEWARK NEW JERSEY", + "port_origin": "SINGAPORE", + "shipper": "kulicke & soffa pte ltd" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848610", + "848640", + "848690", + "848620" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0319", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848640", + "id": "SH-0319", + "justification_text": "Goods classified under HS 8486.40; corroborated by 5 customs rulings on comparable goods (US).", + "reference_ruling_ids": [ + "CROSS-N336802", + "CROSS-N007092", + "CROSS-N275956", + "CROSS-N242843", + "CROSS-N231738" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Tray-to-wafer handling module (APTURA, TW03): a pick-and-place handling subsystem that transfers dies between trays and wafer/film-frame carriers during assembly. It is supplied as a replacement or spare component for the parent semiconductor tool rather than as standalone equipment, and is fitted, consumed or maintained during normal tool operation", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Kulicke & Soffa", + "part_name": "aptura tray to wafer INV NO: 2946386 SO" + } + }, + { + "bol_metadata": { + "arrival_date": "2024-07-01 00:00:00", + "bol_description": "Underside shaping mold for molding machines using compression molds, used in semiconductor wafer production, model: M200207-0409-2 (TX bp of the machine belongs to item number 1 of import account 100999519610/A12 dated August 19, 2016 )", + "consignee": "towa korea co., ltd", + "declared_hs": "84864030", + "hs_verified": true, + "origin_country": "VIETNAM", + "port_dest": "KRICN", + "port_origin": "VNHAN", + "shipper": "hana micron vietnam company limited" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848620", + "848610", + "848640", + "848690" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0320", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848640", + "id": "SH-0320", + "justification_text": "Goods classified under HS 8486.40; corroborated by 1 customs ruling on comparable goods (US).", + "reference_ruling_ids": [ + "CROSS-N007092" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Underside-shaping mold (type M200207-0409-2) for a compression molding machine: a mold-tooling part that shapes the underside of encapsulated semiconductor packages during compression molding", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Micron Technology", + "part_name": "Underside shaping mold for molding" + } + }, + { + "bol_metadata": { + "arrival_date": "2024-06-28 00:00:00", + "bol_description": "CASSETTE FOR DICING MACHINE", + "consignee": "shindengen philippines corp", + "declared_hs": "84864020000", + "hs_verified": true, + "origin_country": "JAPAN", + "port_dest": "NINOY AQUINO INTERNATIONAL AIRPORT", + "port_origin": "", + "shipper": "shindengen electric mfg co ltd" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848690", + "848620", + "848640", + "848610" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0321", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848640", + "id": "SH-0321", + "justification_text": "Goods classified under HS 8486.40; corroborated by 4 customs rulings on comparable goods (US).", + "reference_ruling_ids": [ + "CROSS-N336802", + "CROSS-N007092", + "CROSS-N275956", + "CROSS-N242843" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Wafer cassette for a dicing machine: a slotted carrier/holder that stores and transports wafers (on dicing frames) into and out of a wafer dicing saw. A handling accessory/part for dicing equipment", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Shindengen Electric", + "part_name": "cassette for dicing machine" + } + }, + { + "bol_metadata": { + "arrival_date": "2023-03-09 00:00:00", + "bol_description": "DICING SAW Semiconductor Ball Cutting Machine, MODEL DAD 321. Export and liquidation according to declaration 101485356450/ A12 dated 30/06/2017 item 4 (SET=PCS)", + "consignee": "brt capital assets, inc", + "declared_hs": "84864020", + "hs_verified": true, + "origin_country": "VIETNAM", + "port_dest": "CNSHA", + "port_origin": "VNCLI", + "shipper": "on semiconductor vietnam company limited" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848620", + "848640", + "848690", + "848610" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0322", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848640", + "id": "SH-0322", + "justification_text": "Goods classified under HS 8486.40; corroborated by 1 customs ruling on comparable goods (US).", + "reference_ruling_ids": [ + "CROSS-N007092" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Fully-automatic dicing saw (type DAD 321): a blade-dicing machine that cuts semiconductor wafers/substrates along street lines to singulate them into individual dies. Used/liquidation equipment", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "onsemi", + "part_name": "DICING SAW Semiconductor Ball Cutting" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-03-25 00:00:00", + "bol_description": "OLD WIRE BONDER MACHINE HTS: 848640", + "consignee": "creeled, inc", + "declared_hs": "848640", + "hs_verified": true, + "origin_country": "CHINA MAINLAND", + "port_dest": "LONG BEACH CALIFORNIA", + "port_origin": "YANTIAN", + "shipper": "cree huizhou solid state lighting c" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848640", + "848610", + "848620", + "848690" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0323", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848640", + "id": "SH-0323", + "justification_text": "Goods classified under HS 8486.40; corroborated by 2 customs rulings on comparable goods (US).", + "reference_ruling_ids": [ + "CROSS-N007092", + "CROSS-N231738" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Wire bonder (used machine): an automated wire-bonding machine that forms fine-wire interconnects between die pads and package leads during semiconductor assembly", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Cree LED", + "part_name": "OLD wire bonder machine" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-03-24 00:00:00", + "bol_description": "ORTHODYNE 5MIL WIRE BONDER", + "consignee": "ii-vi laser enterprise philippines", + "declared_hs": "84864020000", + "hs_verified": true, + "origin_country": "UNITED STATES", + "port_dest": "NINOY AQUINO INTERNATIONAL AIRPORT", + "port_origin": "", + "shipper": "coherent santa clara" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848640", + "848620", + "848690", + "848610" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0324", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848640", + "id": "SH-0324", + "justification_text": "Goods classified under HS 8486.40; corroborated by 2 customs rulings on comparable goods (US).", + "reference_ruling_ids": [ + "CROSS-N336802", + "CROSS-N231738" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Heavy-wire wedge bonder (5 mil): a wedge bonder that forms thick (5 mil) aluminium wire interconnects between die/substrate pads for power-device and module assembly", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Coherent", + "part_name": "orthodyne 5MIL wire bonder" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-20 00:00:00", + "bol_description": "ASSY,SEALING COVER,TEBR,LOW PROFILE", + "consignee": "lam research international sdn bhd", + "declared_hs": "8486902300", + "hs_verified": true, + "origin_country": "THAILAND", + "port_dest": "PENANG GEORGETOWN", + "port_origin": "BANGKOK", + "shipper": "mitsubishi chemical advanced" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848610", + "848620", + "848640", + "848690" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0325", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848690", + "id": "SH-0325", + "justification_text": "Goods classified under HS 8486.90; corroborated by 30 customs rulings on comparable goods (EU-DE, EU-EN, EU-NL, US).", + "reference_ruling_ids": [ + "CROSS-N129286", + "CROSS-H044559", + "CROSS-H055636", + "CROSS-N168335", + "CROSS-N023455", + "EBTI-EN-0016", + "EBTI-EN-0022", + "EBTI-EN-0023", + "EBTI-EN-0027", + "CROSS-H031396", + "CROSS-H044558", + "CROSS-H055635", + "CROSS-N087022", + "CROSS-N100423", + "CROSS-N167595", + "CROSS-N358520", + "CROSS-N359267", + "EBTI-DE-DEBTI24024/17-1", + "EBTI-EN-0018", + "EBTI-EN-0020", + "EBTI-EN-0025", + "EBTI-NL-NLRTD-2014-1871", + "CROSS-N245162", + "EBTI-EN-0014", + "EBTI-EN-0015", + "EBTI-EN-0017", + "EBTI-EN-0019", + "EBTI-EN-0021", + "EBTI-EN-0024", + "EBTI-EN-0026" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Sealing-cover assembly (TEBR, low profile): a chamber sealing-cover part for a semiconductor process tool that seals/encloses a chamber subassembly", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Mitsubishi Chemical", + "part_name": "assy sealing cover tebr LOW profile" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-19 00:00:00", + "bol_description": "853-339773-005 EOS,DS L,PRCS CHMBR,R CLD,CLB,WF (1 )", + "consignee": "lam research international sdn bhd", + "declared_hs": "8486902900", + "hs_verified": true, + "origin_country": "GERMANY", + "port_dest": "PENANG GEORGETOWN", + "port_origin": "STUTTGART", + "shipper": "mitsubishi chemical advanced materi" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848640", + "848620", + "848610", + "848690" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0326", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848690", + "id": "SH-0326", + "justification_text": "Goods classified under HS 8486.90; corroborated by 30 customs rulings on comparable goods (EU-DE, EU-EN, EU-NL, US).", + "reference_ruling_ids": [ + "CROSS-H055636", + "CROSS-N023455", + "CROSS-N350440", + "CROSS-N359267", + "EBTI-EN-0016", + "EBTI-EN-0023", + "EBTI-NL-NLRTD-2014-1871", + "CROSS-H031396", + "CROSS-H044558", + "CROSS-H044559", + "CROSS-H055635", + "CROSS-N100423", + "CROSS-N129286", + "CROSS-N167595", + "CROSS-N168335", + "CROSS-N358520", + "EBTI-DE-DEBTI24024/17-1", + "EBTI-EN-0022", + "EBTI-EN-0025", + "EBTI-EN-0027", + "CROSS-N087022", + "EBTI-EN-0014", + "EBTI-EN-0015", + "EBTI-EN-0017", + "EBTI-EN-0018", + "EBTI-EN-0019", + "EBTI-EN-0020", + "EBTI-EN-0021", + "EBTI-EN-0024", + "EBTI-EN-0026" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "End-of-service / chamber sensor module (EOS, DS L, process chamber, R-CLD, CLB, WF; part 853-339773-005): a chamber-mounted sensor/calibration part for a semiconductor process tool", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Mitsubishi Chemical", + "part_name": "853-339773-005 EOS DS L prcs chmbr R" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-10 00:00:00", + "bol_description": "27-324553-00 GENERATOR,PLASMA SOURCE,400KHZ,HF-S,CDA", + "consignee": "lam research international sdn bhd", + "declared_hs": "8486902900", + "hs_verified": true, + "origin_country": "UNITED STATES", + "port_dest": "PENANG GEORGETOWN", + "port_origin": "MEMPHIS TN", + "shipper": "mks instruments, inc" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90). Electrical machine with an individual function (8543.70) vs equipment solely or principally for semiconductor manufacture (8486) vs electric heating resistors (8516.80); specificity of purpose drives the heading.", + "candidate_set": { + "codes": [ + "848640", + "848690", + "848620", + "848610" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage", + "machine_with_function" + ], + "frozen_id": "v2.0.train.0327", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848690", + "id": "SH-0327", + "justification_text": "Goods classified under HS 8486.90; corroborated by 30 customs rulings on comparable goods (EU-DE, EU-EN, EU-NL, US).", + "reference_ruling_ids": [ + "CROSS-H044559", + "CROSS-H055636", + "CROSS-N023455", + "CROSS-N214380", + "CROSS-N241695", + "EBTI-EN-0014", + "EBTI-EN-0015", + "EBTI-EN-0016", + "EBTI-EN-0023", + "CROSS-H044558", + "CROSS-N100423", + "CROSS-N129286", + "CROSS-N167595", + "CROSS-N168335", + "CROSS-N358520", + "CROSS-N359267", + "EBTI-DE-DEBTI24024/17-1", + "EBTI-EN-0022", + "EBTI-EN-0027", + "EBTI-NL-NLRTD-2014-1871", + "CROSS-H031396", + "CROSS-H055635", + "CROSS-N087022", + "EBTI-EN-0018", + "EBTI-EN-0019", + "EBTI-EN-0020", + "EBTI-EN-0021", + "EBTI-EN-0024", + "EBTI-EN-0025", + "EBTI-EN-0026" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Plasma-source RF generator (400 kHz, HF-S, CDA; part 27-324553-00): a radio-frequency generator that powers a plasma source for chamber processing/cleaning in a semiconductor tool", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "MKS Instruments", + "part_name": "27-324553-00 generator plasma source" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-09 00:00:00", + "bol_description": "ULTRA LOW POWER GENERATOR", + "consignee": "benchmark electronics m sdn bhd", + "declared_hs": "8486904900", + "hs_verified": true, + "origin_country": "CHINA MAINLAND", + "port_dest": "KAMPONG TANJONG KUPANG", + "port_origin": "SINGAPORE", + "shipper": "mks instruments singapore pte ltd" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90). Electrical machine with an individual function (8543.70) vs equipment solely or principally for semiconductor manufacture (8486) vs electric heating resistors (8516.80); specificity of purpose drives the heading.", + "candidate_set": { + "codes": [ + "848610", + "848640", + "848690", + "848620" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage", + "machine_with_function" + ], + "frozen_id": "v2.0.train.0328", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848690", + "id": "SH-0328", + "justification_text": "Goods classified under HS 8486.90; corroborated by 32 customs rulings on comparable goods (EU-DE, EU-EN, EU-NL, US).", + "reference_ruling_ids": [ + "CROSS-H055636", + "CROSS-N023455", + "CROSS-N214380", + "CROSS-N241695", + "CROSS-N252272", + "CROSS-N350440", + "CROSS-H031396", + "CROSS-H044558", + "CROSS-H044559", + "CROSS-H055635", + "CROSS-N100423", + "CROSS-N129286", + "CROSS-N167595", + "CROSS-N168335", + "CROSS-N358520", + "CROSS-N359267", + "EBTI-DE-DEBTI24024/17-1", + "EBTI-EN-0014", + "EBTI-EN-0015", + "EBTI-EN-0016", + "EBTI-EN-0019", + "EBTI-EN-0023", + "EBTI-EN-0025", + "EBTI-NL-NLRTD-2014-1871", + "CROSS-N087022", + "EBTI-EN-0017", + "EBTI-EN-0018", + "EBTI-EN-0020", + "EBTI-EN-0021", + "EBTI-EN-0022", + "EBTI-EN-0024", + "EBTI-EN-0027" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Ultra-low-power RF/plasma generator: a low-power generator subsystem used to drive a plasma source in a semiconductor process tool", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "MKS Instruments", + "part_name": "ultra LOW power generator" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-04 00:00:00", + "bol_description": "PRESSURE TRANSDUCER/PRSSURE CONTROLLER", + "consignee": "infineon technologies kulim", + "declared_hs": "8486904900", + "hs_verified": true, + "origin_country": "UNITED STATES", + "port_dest": "PENANG GEORGETOWN", + "port_origin": "MEMPHIS TN", + "shipper": "mks instruments, inc" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848610", + "848690", + "848640", + "848620" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0329", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848690", + "id": "SH-0329", + "justification_text": "Goods classified under HS 8486.90; corroborated by 34 customs rulings on comparable goods across 5 jurisdictions.", + "reference_ruling_ids": [ + "EBTI-EN-0014", + "EBTI-EN-0015", + "CROSS-H044558", + "CROSS-H044559", + "CROSS-H055635", + "CROSS-H055636", + "CROSS-N129286", + "CROSS-N168335", + "CROSS-N359267", + "EBTI-EN-0027", + "EBTI-NL-NLRTD-2013-002630", + "EBTI-NL-NLRTD-2013-002631", + "CROSS-H031396", + "CROSS-N023455", + "CROSS-N350440", + "EBTI-EN-0017", + "EBTI-EN-0022", + "EBTI-NL-NLRTD-2014-1871", + "CROSS-N087022", + "CROSS-N100423", + "CROSS-N167595", + "CROSS-N358520", + "EBTI-DE-DEBTI24024/17-1", + "EBTI-EN-0016", + "EBTI-EN-0019", + "EBTI-EN-0023", + "EBTI-EN-0024", + "EBTI-EN-0025", + "EBTI-IT-ITIT-2004-052M-101100", + "CROSS-N232638", + "EBTI-EN-0018", + "EBTI-EN-0020", + "EBTI-EN-0021", + "EBTI-EN-0026" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Pressure transducer / pressure controller: a vacuum/process pressure-sensing and control device used to measure and regulate chamber pressure in a semiconductor process tool. The device converts the detected physical quantity into an electrical signal that the host machine's control system uses for monitoring, positioning or feedback during operation", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "MKS Instruments", + "part_name": "pressure transducer/prssure controller" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-28 00:00:00", + "bol_description": "853-195470-028ASSY,ESC,HTM,PCKTD,3 ELCTD, CLP-", + "consignee": "lam research international sdn bhd", + "declared_hs": "8486902100", + "hs_verified": true, + "origin_country": "JAPAN", + "port_dest": "PENANG GEORGETOWN", + "port_origin": "NARITA APT TOKYO", + "shipper": "ngk insulators ltd" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90). Part attribution: an identifiable part of a specific machine (8486.90, 8538.90, 9030.90, 9031.90) vs a general-use metal article (7320.90, 7326.90, 7616.99); the Section XV exclusions and Section XVI Note 2 decide.", + "candidate_set": { + "codes": [ + "848620", + "848640", + "848610", + "848690" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage", + "parts_attribution" + ], + "frozen_id": "v2.0.train.0330", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848690", + "id": "SH-0330", + "justification_text": "Goods classified under HS 8486.90; corroborated by 27 customs rulings on comparable goods (EU-EN, EU-IT, EU-NL, US).", + "reference_ruling_ids": [ + "CROSS-N129286", + "CROSS-N245162", + "CROSS-N349761", + "EBTI-EN-0027", + "CROSS-H044559", + "CROSS-H055635", + "CROSS-H055636", + "CROSS-N168335", + "CROSS-N248597", + "CROSS-N359267", + "EBTI-EN-0017", + "EBTI-EN-0022", + "EBTI-EN-0025", + "CROSS-H031396", + "EBTI-EN-0014", + "EBTI-EN-0015", + "EBTI-EN-0016", + "EBTI-EN-0018", + "EBTI-EN-0020", + "EBTI-EN-0023", + "EBTI-EN-0024", + "EBTI-EN-0026", + "EBTI-EN-0028", + "EBTI-IT-ITIT-2004-052M-101100", + "EBTI-IT-ITIT-2007-0052M-101100", + "EBTI-NL-NLRTD-2013-002630", + "EBTI-NL-NLRTD-2013-002631" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Electrostatic-chuck (ESC) assembly (HTM, pocketed, 3-electrode, clamp; part 853-195470-028): a ceramic wafer-chuck part that holds the wafer electrostatically and controls its temperature in a process chamber", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "NGK Insulators", + "part_name": "853-195470-028ASSY ESC HTM pcktd 3" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-02-22 00:00:00", + "bol_description": "PART FOR LP(SEMICONDUCTOR CARRIER DEVICE) CABLE, PWR,CID,ATR60LF,SINFO", + "consignee": "jabil circuits sdn bhd", + "declared_hs": "8486903900", + "hs_verified": true, + "origin_country": "JAPAN", + "port_dest": "PENANG GEORGETOWN", + "port_origin": "HONG KONG", + "shipper": "sinfonia technology" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848620", + "848690", + "848640", + "848610" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0331", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848690", + "id": "SH-0331", + "justification_text": "Goods classified under HS 8486.90; corroborated by 35 customs rulings on comparable goods across 5 jurisdictions.", + "reference_ruling_ids": [ + "CROSS-H055636", + "CROSS-N359267", + "CROSS-N023455", + "CROSS-N252272", + "CROSS-N349761", + "CROSS-H044558", + "CROSS-H044559", + "CROSS-N100423", + "CROSS-N129286", + "CROSS-N167595", + "CROSS-N168335", + "CROSS-N245162", + "CROSS-N248597", + "CROSS-N358520", + "EBTI-DE-DEBTI24024/17-1", + "EBTI-EN-0016", + "EBTI-EN-0019", + "EBTI-EN-0022", + "EBTI-EN-0023", + "EBTI-EN-0024", + "EBTI-EN-0025", + "EBTI-EN-0027", + "EBTI-NL-NLRTD-2014-1871", + "CROSS-H031396", + "CROSS-H055635", + "CROSS-N087022", + "EBTI-EN-0017", + "EBTI-EN-0020", + "EBTI-EN-0021", + "EBTI-EN-0026", + "EBTI-EN-0028", + "EBTI-IT-ITIT-2004-052M-101100", + "EBTI-IT-ITIT-2007-0052M-101100", + "EBTI-NL-NLRTD-2013-002630", + "EBTI-NL-NLRTD-2013-002631" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Load-port part (power cable, CID, type ATR60LF): a power cable part for a wafer load-port (semiconductor carrier-handling device)", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Sinfonia Technology", + "part_name": "part for LP(semiconductor carrier" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-11 00:00:00", + "bol_description": "LLK-D 01/04 20M ST SG DC SPL4Q C", + "consignee": "greatech integration m s/b", + "declared_hs": "8486903900", + "hs_verified": true, + "origin_country": "SINGAPORE", + "port_dest": "PENANG GEORGETOWN", + "port_origin": "SINGAPORE", + "shipper": "trumpf pte ltd" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848620", + "848640", + "848690", + "848610" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0332", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848690", + "id": "SH-0332", + "justification_text": "Goods classified under HS 8486.90; corroborated by 30 customs rulings on comparable goods (EU-DE, EU-EN, EU-NL, US).", + "reference_ruling_ids": [ + "CROSS-H055636", + "CROSS-N023455", + "CROSS-N350440", + "CROSS-H055635", + "CROSS-N100423", + "CROSS-N358520", + "CROSS-H031396", + "CROSS-H044559", + "CROSS-N168335", + "CROSS-N241695", + "EBTI-EN-0016", + "EBTI-EN-0023", + "EBTI-NL-NLRTD-2014-1871", + "CROSS-H044558", + "CROSS-N129286", + "CROSS-N167595", + "CROSS-N359267", + "EBTI-DE-DEBTI24024/17-1", + "EBTI-EN-0024", + "EBTI-EN-0025", + "CROSS-N087022", + "EBTI-EN-0014", + "EBTI-EN-0015", + "EBTI-EN-0018", + "EBTI-EN-0019", + "EBTI-EN-0020", + "EBTI-EN-0021", + "EBTI-EN-0022", + "EBTI-EN-0026", + "EBTI-EN-0027" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Fibre-optic laser light cable (LLK-D 01/04, 20 m): a laser beam-delivery fibre cable part that routes laser light within a laser-based material-processing system. It is supplied as a replacement or spare component for the parent semiconductor tool rather than as standalone equipment, and is fitted, consumed or maintained during normal tool operation", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "TRUMPF", + "part_name": "LLK-D 01/0420M ST SG DC SPL4Q C" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-01-09 00:00:00", + "bol_description": "COMPACT CUTTING UNIT 2 1 D/S 0075 10M", + "consignee": "kemikon sdn bhd", + "declared_hs": "8486904900", + "hs_verified": true, + "origin_country": "SINGAPORE", + "port_dest": "PENANG GEORGETOWN", + "port_origin": "SINGAPORE", + "shipper": "trumpf pte ltd" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848620", + "848610", + "848690", + "848640" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0333", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848690", + "id": "SH-0333", + "justification_text": "Goods classified under HS 8486.90; corroborated by 30 customs rulings on comparable goods (EU-DE, EU-EN, EU-NL, US).", + "reference_ruling_ids": [ + "CROSS-H055636", + "CROSS-N023455", + "CROSS-N350440", + "CROSS-H055635", + "CROSS-N100423", + "CROSS-N358520", + "CROSS-H044559", + "CROSS-N168335", + "EBTI-EN-0016", + "EBTI-EN-0023", + "CROSS-H031396", + "CROSS-H044558", + "CROSS-N129286", + "CROSS-N167595", + "CROSS-N359267", + "EBTI-DE-DEBTI24024/17-1", + "EBTI-EN-0014", + "EBTI-EN-0024", + "EBTI-EN-0025", + "EBTI-NL-NLRTD-2014-1871", + "CROSS-N087022", + "EBTI-EN-0015", + "EBTI-EN-0017", + "EBTI-EN-0018", + "EBTI-EN-0019", + "EBTI-EN-0020", + "EBTI-EN-0021", + "EBTI-EN-0022", + "EBTI-EN-0026", + "EBTI-EN-0027" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Compact laser cutting unit (2-1 D/S 0075, 10 m): a laser-processing head/cutting-unit part for a laser-based material-processing system. It is supplied as a replacement or spare component for the parent semiconductor tool rather than as standalone equipment, and is fitted, consumed or maintained during normal tool operation", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "TRUMPF", + "part_name": "compact cutting 21 D/S 007510M" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-30 00:00:00", + "bol_description": "KIT POSITION INDICATOR(QTY: )", + "consignee": "vat manufacturing malaysia sdn bhd", + "declared_hs": "8486904900", + "hs_verified": true, + "origin_country": "SWITZERLAND", + "port_dest": "KUALA LUMPUR", + "port_origin": "ZURICH", + "shipper": "vat vakuumventile ag" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848640", + "848690", + "848610", + "848620" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0334", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848690", + "id": "SH-0334", + "justification_text": "Goods classified under HS 8486.90; corroborated by 33 customs rulings on comparable goods (EU-DE, EU-EN, EU-NL, US).", + "reference_ruling_ids": [ + "CROSS-H055636", + "CROSS-N023455", + "CROSS-N358520", + "EBTI-EN-0016", + "EBTI-EN-0023", + "EBTI-EN-0027", + "CROSS-H031396", + "CROSS-H044558", + "CROSS-H044559", + "CROSS-H055635", + "CROSS-N100423", + "CROSS-N129286", + "CROSS-N167595", + "CROSS-N168335", + "CROSS-N359267", + "EBTI-DE-DEBTI24024/17-1", + "EBTI-EN-0017", + "EBTI-EN-0025", + "EBTI-NL-NLRTD-2014-1871", + "CROSS-N087022", + "CROSS-N232638", + "CROSS-N248597", + "EBTI-EN-0014", + "EBTI-EN-0015", + "EBTI-EN-0018", + "EBTI-EN-0019", + "EBTI-EN-0020", + "EBTI-EN-0021", + "EBTI-EN-0022", + "EBTI-EN-0024", + "EBTI-EN-0026", + "EBTI-NL-NLRTD-2013-002630", + "EBTI-NL-NLRTD-2013-002631" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Valve position-indicator kit: a sensor/indicator part that reports the open/closed position of a vacuum valve on a semiconductor process tool", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "VAT Vakuumventile", + "part_name": "kit position indicator" + } + }, + { + "bol_metadata": { + "arrival_date": "2023-06-09 00:00:00", + "bol_description": "AIR JOINT 3 WAY PRODUCTION USED", + "consignee": "toms manufacturing corp", + "declared_hs": "84869049000", + "hs_verified": true, + "origin_country": "THAILAND", + "port_dest": "NINOY AQUINO INTERNATIONAL AIRPORT", + "port_origin": "", + "shipper": "yaskawa electric thailand co.ltd" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848620", + "848610", + "848640", + "848690" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0335", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848690", + "id": "SH-0335", + "justification_text": "Goods classified under HS 8486.90; corroborated by 33 customs rulings on comparable goods across 5 jurisdictions.", + "reference_ruling_ids": [ + "CROSS-N129286", + "CROSS-H044558", + "CROSS-N168335", + "EBTI-NL-NLRTD-2014-1871", + "CROSS-H044559", + "CROSS-N359267", + "EBTI-DE-DEBTI24024/17-1", + "EBTI-NL-NLRTD-2013-002630", + "EBTI-NL-NLRTD-2013-002631", + "CROSS-H055636", + "CROSS-N023455", + "CROSS-N245162", + "EBTI-EN-0026", + "CROSS-H031396", + "CROSS-H055635", + "CROSS-N087022", + "CROSS-N100423", + "CROSS-N167595", + "CROSS-N248597", + "CROSS-N358520", + "EBTI-EN-0016", + "EBTI-EN-0020", + "EBTI-EN-0022", + "EBTI-EN-0023", + "EBTI-EN-0024", + "EBTI-EN-0025", + "EBTI-EN-0027", + "EBTI-IT-ITIT-2004-052M-101100", + "EBTI-EN-0014", + "EBTI-EN-0015", + "EBTI-EN-0017", + "EBTI-EN-0019", + "EBTI-EN-0021" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Three-way air joint (pneumatic fitting): a pneumatic connector part that routes compressed air within a semiconductor assembly/handling machine. Production used", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Yaskawa", + "part_name": "AIR joint 3 WAY production used" + } + }, + { + "bol_metadata": { + "arrival_date": "2023-01-03 00:00:00", + "bol_description": "PARTE PARA MAQUINA COLOCADORA DE COMPONENTES", + "consignee": "pillar mexicana s.a. de c.v", + "declared_hs": "84869005", + "hs_verified": true, + "origin_country": "JAPAN", + "port_dest": "", + "port_origin": "", + "shipper": "yaskawa america inc" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848620", + "848690", + "848640", + "848610" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0336", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848690", + "id": "SH-0336", + "justification_text": "Goods classified under HS 8486.90; corroborated by 19 customs rulings on comparable goods (EU-EN, EU-IT, EU-NL, US).", + "reference_ruling_ids": [ + "CROSS-N168335", + "EBTI-IT-ITIT-2004-052M-101100", + "EBTI-NL-NLRTD-2013-002630", + "EBTI-NL-NLRTD-2013-002631", + "CROSS-H044558", + "CROSS-H044559", + "CROSS-N129286", + "CROSS-N359267", + "EBTI-EN-0026", + "CROSS-N087022", + "EBTI-EN-0014", + "EBTI-EN-0015", + "EBTI-EN-0016", + "EBTI-EN-0022", + "EBTI-EN-0023", + "EBTI-EN-0024", + "EBTI-EN-0027", + "EBTI-IT-ITIT-2007-0052M-101100", + "EBTI-NL-NLRTD-2014-1871" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Part for a component-placement machine: a spare/replacement part for an automated electronic-component placement (pick-and-place) machine", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Yaskawa", + "part_name": "parte para maquina colocadora DE" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-28 00:00:00", + "bol_description": "- PEDESTAL KIT,WELDED,TYPE 11,KALREZ,OVERA", + "consignee": "ultimate machining solutions m sb", + "declared_hs": "8486901500", + "hs_verified": true, + "origin_country": "UNITED STATES", + "port_dest": "KAMPONG TANJONG KUPANG", + "port_origin": "SINGAPORE", + "shipper": "lam research singapore pte ltd" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848610", + "848690", + "848640", + "848620" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0337", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848690", + "id": "SH-0337", + "justification_text": "Goods classified under HS 8486.90; corroborated by 20 customs rulings on comparable goods (EU-EN, US).", + "reference_ruling_ids": [ + "CROSS-N129286", + "CROSS-H044559", + "CROSS-N168335", + "EBTI-EN-0014", + "EBTI-EN-0015", + "EBTI-EN-0027", + "CROSS-H031396", + "CROSS-H055635", + "CROSS-H055636", + "CROSS-N245162", + "CROSS-N248597", + "CROSS-N358520", + "EBTI-EN-0016", + "EBTI-EN-0017", + "EBTI-EN-0018", + "EBTI-EN-0020", + "EBTI-EN-0022", + "EBTI-EN-0023", + "EBTI-EN-0025", + "EBTI-EN-0026" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Welded pedestal kit (type 11, Kalrez-sealed): a wafer-support pedestal assembly part (with chemically-resistant Kalrez seals) for a plasma process chamber", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Lam Research", + "part_name": "pedestal kit welded type 11 kalrez overa" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-28 00:00:00", + "bol_description": "PRESSURE PLATE ASSY SLFLX3", + "consignee": "besi apac sdn bhd", + "declared_hs": "8486904900", + "hs_verified": true, + "origin_country": "CHINA MAINLAND", + "port_dest": "KUALA LUMPUR", + "port_origin": "HONG KONG", + "shipper": "besi leshan co. ltd" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848690", + "848620", + "848610", + "848640" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0338", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848690", + "id": "SH-0338", + "justification_text": "Goods classified under HS 8486.90; corroborated by 27 customs rulings on comparable goods (EU-DE, EU-EN, EU-NL, US).", + "reference_ruling_ids": [ + "CROSS-H055636", + "CROSS-N129286", + "CROSS-H044559", + "CROSS-N168335", + "CROSS-H055635", + "CROSS-N023455", + "CROSS-N277379", + "EBTI-EN-0016", + "EBTI-EN-0023", + "CROSS-H031396", + "CROSS-H044558", + "CROSS-N100423", + "CROSS-N167595", + "CROSS-N358520", + "CROSS-N359267", + "EBTI-DE-DEBTI24024/17-1", + "EBTI-EN-0020", + "EBTI-NL-NLRTD-2014-1871", + "CROSS-N087022", + "CROSS-N245162", + "EBTI-EN-0019", + "EBTI-EN-0021", + "EBTI-EN-0022", + "EBTI-EN-0024", + "EBTI-EN-0025", + "EBTI-EN-0026", + "EBTI-EN-0027" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Pressure-plate assembly (type SLFLX3): a clamping/pressure-plate part for a semiconductor die-attach/assembly tool that holds or presses substrates during processing", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "BESI", + "part_name": "pressure plate assy SLFLX3" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-26 00:00:00", + "bol_description": "SUPER-HIGH PRESSURE UV LAMP USH-1003 FNE (A1-203) (UV LAMP)", + "consignee": "fuji electric m sdn bhd", + "declared_hs": "8486904900", + "hs_verified": true, + "origin_country": "JAPAN", + "port_dest": "PENANG GEORGETOWN", + "port_origin": "NARITA APT TOKYO", + "shipper": "nikon tec corporation" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848610", + "848690", + "848620", + "848640" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0339", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848690", + "id": "SH-0339", + "justification_text": "Goods classified under HS 8486.90; corroborated by 7 customs rulings on comparable goods (EU-EN, US).", + "reference_ruling_ids": [ + "CROSS-H055636", + "CROSS-N350440", + "CROSS-N018931", + "CROSS-H055635", + "EBTI-EN-0016", + "EBTI-EN-0023", + "EBTI-EN-0026" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Super-high-pressure UV mercury lamp (USH-1003 FNE): a high-intensity UV light-source lamp part used to expose photoresist in a lithography mask aligner/stepper", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Nikon", + "part_name": "super-high pressure UV lamp USH-1003" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-30 00:00:00", + "bol_description": "301-030053-050 MFC D519 GEN5 NF3 50 SCCM", + "consignee": "centum electronics limited", + "declared_hs": "84869000", + "hs_verified": true, + "origin_country": "UNITED STATES", + "port_dest": "", + "port_origin": "", + "shipper": "lam research corporation" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848620", + "848610", + "848640", + "848690" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0340", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848690", + "id": "SH-0340", + "justification_text": "Goods classified under HS 8486.90; corroborated by 29 customs rulings on comparable goods (EU-DE, EU-EN, EU-NL, US).", + "reference_ruling_ids": [ + "CROSS-H055636", + "CROSS-N100423", + "CROSS-N358520", + "CROSS-H031396", + "CROSS-N023455", + "EBTI-EN-0023", + "EBTI-EN-0025", + "CROSS-H044558", + "CROSS-H044559", + "CROSS-H055635", + "CROSS-N087022", + "CROSS-N129286", + "CROSS-N167595", + "CROSS-N168335", + "CROSS-N359267", + "EBTI-DE-DEBTI24024/17-1", + "EBTI-EN-0016", + "EBTI-EN-0017", + "EBTI-EN-0022", + "EBTI-EN-0024", + "EBTI-EN-0027", + "EBTI-NL-NLRTD-2014-1871", + "EBTI-EN-0014", + "EBTI-EN-0015", + "EBTI-EN-0018", + "EBTI-EN-0019", + "EBTI-EN-0020", + "EBTI-EN-0021", + "EBTI-EN-0026" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Mass flow controller (D519 Gen5, NF3, 50 sccm; part 301-030053-050): a precision gas-flow controller that meters nitrogen-trifluoride flow into a process chamber. It is consumed as a process material/consumable in semiconductor or related manufacturing rather than forming part of the finished device, and is supplied in bulk/packaged form", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Lam Research", + "part_name": "301-030053-050 MFC D519 GEN5 NF350 sccm" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-29 00:00:00", + "bol_description": "CHUCK DR & ELEVATOR UNIT,MCC,CIP1 - 1.", + "consignee": "lam research international sdn bhd", + "declared_hs": "8486901500", + "hs_verified": true, + "origin_country": "UNITED STATES", + "port_dest": "KUALA LUMPUR", + "port_origin": "SAN FRANCISCO CA", + "shipper": "lam research international sdn bhd" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848640", + "848620", + "848610", + "848690" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0341", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848690", + "id": "SH-0341", + "justification_text": "Goods classified under HS 8486.90; corroborated by 24 customs rulings on comparable goods (EU-EN, EU-IT, EU-NL, US).", + "reference_ruling_ids": [ + "CROSS-N349761", + "CROSS-N350440", + "EBTI-EN-0017", + "CROSS-H044559", + "CROSS-H055636", + "CROSS-N245162", + "CROSS-N248597", + "CROSS-N359267", + "EBTI-EN-0016", + "EBTI-EN-0023", + "EBTI-EN-0025", + "CROSS-H031396", + "CROSS-H055635", + "EBTI-EN-0014", + "EBTI-EN-0018", + "EBTI-EN-0022", + "EBTI-EN-0024", + "EBTI-EN-0026", + "EBTI-EN-0027", + "EBTI-EN-0028", + "EBTI-IT-ITIT-2004-052M-101100", + "EBTI-IT-ITIT-2007-0052M-101100", + "EBTI-NL-NLRTD-2013-002630", + "EBTI-NL-NLRTD-2013-002631" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Chuck-drive and elevator unit (MCC, CIP1): a wafer-chuck drive/lift mechanism part that rotates and raises/lowers the wafer chuck in a process tool", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Lam Research", + "part_name": "chuck DR & elevator MCC CIP1 - 1" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-26 00:00:00", + "bol_description": "PLUG EMPTY SITE CHUCK", + "consignee": "cohu malaysia sdn bhd", + "declared_hs": "8486904600", + "hs_verified": true, + "origin_country": "PHILIPPINES", + "port_dest": "KUALA LUMPUR", + "port_origin": "MANILA", + "shipper": "delta design phils llc" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848690", + "848640", + "848620", + "848610" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0342", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848690", + "id": "SH-0342", + "justification_text": "Goods classified under HS 8486.90; 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corroborated by 27 customs rulings on comparable goods across 5 jurisdictions.", + "reference_ruling_ids": [ + "CROSS-H055636", + "CROSS-N349761", + "CROSS-H044559", + "CROSS-H055635", + "CROSS-N167595", + "CROSS-N245162", + "CROSS-N248597", + "CROSS-N359267", + "EBTI-DE-DEBTI24024/17-1", + "EBTI-EN-0017", + "EBTI-EN-0021", + "EBTI-EN-0022", + "EBTI-EN-0024", + "EBTI-EN-0025", + "EBTI-EN-0026", + "EBTI-EN-0027", + "EBTI-IT-ITIT-2004-052M-101100", + "EBTI-IT-ITIT-2007-0052M-101100", + "EBTI-EN-0016", + "EBTI-EN-0018", + "EBTI-EN-0019", + "EBTI-EN-0020", + "EBTI-EN-0023", + "EBTI-EN-0028", + "EBTI-NL-NLRTD-2013-002630", + "EBTI-NL-NLRTD-2013-002631", + "EBTI-NL-NLRTD-2014-1871" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Quartz phosphorus-deposition wafer boat (part 81TON25408D001): a quartz wafer-carrier boat that holds a batch of wafers in a phosphorus diffusion/deposition furnace tube", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Wacom Quartz", + "part_name": "81TON25408D001 phos DEP boat" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-26 00:00:00", + "bol_description": "QUARTZ GLASS - 61AON11226D QUARTZ 3 BAFFLE DUMMY", + "consignee": "on semiconductor malaysia sdn bhd", + "declared_hs": "8486904900", + "hs_verified": true, + "origin_country": "UNITED STATES", + "port_dest": "KUALA LUMPUR", + "port_origin": "HONG KONG", + "shipper": "wacom quartz" + }, + "boundary_note": "Heading 8486 splits by process stage: boule and wafer production (8486.10) vs device fabrication on the wafer (8486.20) vs the machines specified in Chapter 84 Note 11(C) (8486.40) vs parts and accessories (8486.90).", + "candidate_set": { + "codes": [ + "848690", + "848610", + "848620", + "848640" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8486_process_stage" + ], + "frozen_id": "v2.0.train.0344", + "hs2_label": "84", + "hs4_label": "8486", + "hs6_label": "848690", + "id": "SH-0344", + "justification_text": "Goods classified under HS 8486.90; corroborated by 12 customs rulings on comparable goods (EU-EN, US).", + "reference_ruling_ids": [ + "CROSS-H055636", + "CROSS-H055635", + "CROSS-N277379", + "CROSS-N167595", + "EBTI-EN-0021", + "EBTI-EN-0016", + "EBTI-EN-0019", + "EBTI-EN-0020", + "EBTI-EN-0022", + "EBTI-EN-0023", + "EBTI-EN-0025", + "EBTI-EN-0026" + ], + "segment": "equipment", + "split": "train", + "tier1_description": "Quartz baffle/dummy plate (part 61AON11226D): a quartz furnace component (3-baffle dummy) that shapes gas flow/thermal profile in a diffusion/CVD furnace tube", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Wacom Quartz", + "part_name": "glass - 61AON11226D 3 baffle dummy" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850440", + "850490", + "850450", + "850431" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0345", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850431", + "id": "SH-0345", + "justification_text": "The product falls under HS 8504.31 (Transformers, not over 1 kVA).", + "reference_ruling_ids": [ + "CROSS-956000", + "EBTI-DK-DK12-162485" + ], + "segment": "component", + "split": "train", + "tier1_description": "A high-voltage isolation transformer rated 198 VA, with a 600 V primary and multiple secondaries (6.3 V, 5 V, 2.5 V). It provides isolated, multi-voltage supply for tube, instrument and high-voltage equipment applications (part 302AX)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Hammond", + "part_name": "302AX" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850440", + "850490", + "850450", + "850431" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0346", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850431", + "id": "SH-0346", + "justification_text": "The product falls under HS 8504.31 (Transformers, not over 1 kVA).", + "reference_ruling_ids": [ + "CROSS-956000", + "EBTI-DK-DK12-162485" + ], + "segment": "component", + "split": "train", + "tier1_description": "A pulse transformer with a 1CT:1CT centre-tapped ratio, about 10 mH inductance and 1 kV isolation. It couples fast pulses and gate-drive signals with isolation, used in switching power supplies and IGBT/MOSFET driver circuits (part 78615/9JC)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Murata", + "part_name": "78615/9JC" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850440", + "850450", + "850490", + "850431" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0347", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850431", + "id": "SH-0347", + "justification_text": "The product falls under HS 8504.31 (Transformers, not over 1 kVA).", + "reference_ruling_ids": [ + "CROSS-956000", + "EBTI-CZ-CZ36-0127-2014", + "EBTI-DK-DK12-162485" + ], + "segment": "component", + "split": "train", + "tier1_description": "A gate-drive transformer with about 400 uH inductance and 2.5 kV isolation. It couples isolated gate-drive signals to IGBTs and power MOSFETs, providing safe level translation in switching power converters and inverters (part B82804E0473A200)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "TDK", + "part_name": "B82804E0473A200" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850450", + "850440", + "850490", + "850431" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0348", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850431", + "id": "SH-0348", + "justification_text": "The product falls under HS 8504.31 (Transformers, not over 1 kVA).", + "reference_ruling_ids": [ + "EBTI-DE-DE6900/16-1", + "EBTI-CZ-CZ36-0127-2014", + "EBTI-ES-ESBTIESBTI2025SOL596", + "CROSS-956000", + "CROSS-K87746" + ], + "segment": "component", + "split": "train", + "tier1_description": "A development kit containing ten UI-7-format gate-driver transformers for IGBT and SiC applications. It lets engineers evaluate and prototype isolated gate-drive coupling for power switches in converter and inverter designs (part B78541X0001)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "TDK", + "part_name": "B78541X0001" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850450", + "850440", + "850490", + "850431" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0349", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850431", + "id": "SH-0349", + "justification_text": "The product falls under HS 8504.31 (Transformers, not over 1 kVA).", + "reference_ruling_ids": [ + "CROSS-956000", + "EBTI-DK-DK12-162485" + ], + "segment": "component", + "split": "train", + "tier1_description": "A Power-over-Ethernet (PoE) transformer rated for about 12 W, in an EP13 core format with around 133 uH inductance at 250 kHz. It provides isolated power coupling in PoE powered-device power supplies and DC-DC stages (part POE012-EP13033S)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Bourns", + "part_name": "POE012-EP13033S" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850490", + "850440", + "850450", + "850431" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0350", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850431", + "id": "SH-0350", + "justification_text": "The product falls under HS 8504.31 (Transformers, not over 1 kVA).", + "reference_ruling_ids": [ + "CROSS-956000", + "EBTI-CZ-CZ36-0127-2014", + "EBTI-DK-DK12-162485" + ], + "segment": "component", + "split": "train", + "tier1_description": "A surface-mount gate-drive transformer with a 1:1:0.909 ratio, about 110 uH inductance, 0.3 ohm resistance and 3.75 kV isolation, rated from -40 C. It couples high-isolation gate-drive pulses to power switches in converters (part PMG3045NLT)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Pulse Electronics", + "part_name": "PMG3045NLT" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850450", + "850431", + "850490", + "850440" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0351", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850431", + "id": "SH-0351", + "justification_text": "The product falls under HS 8504.31 (Transformers, not over 1 kVA).", + "reference_ruling_ids": [ + "EBTI-CZ-CZ36-0127-2014", + "EBTI-DE-DE6900/16-1", + "EBTI-ES-ESBTIESBTI2025SOL596", + "CROSS-K87746" + ], + "segment": "component", + "split": "train", + "tier1_description": "A development kit containing four EE12.6-core current-sense transformers for evaluation and prototyping. It lets engineers measure load and switching currents with isolation in power-supply, motor-drive and converter control and protection circuits during design and testing (part B82801X3)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "TDK", + "part_name": "B82801X3" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850490", + "850440", + "850450", + "850431" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0352", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850431", + "id": "SH-0352", + "justification_text": "The product falls under HS 8504.31 (Transformers, not over 1 kVA).", + "reference_ruling_ids": [ + "CROSS-956000", + "EBTI-DK-DK12-162485" + ], + "segment": "component", + "split": "train", + "tier1_description": "A Power-over-Ethernet (PoE) transformer rated for about 26 W with 1500 VAC isolation, dual primaries and triple secondaries. It provides isolated, flyback power conversion for higher-power PoE powered-device supplies in networking equipment (part POE26W5V-R)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Eaton Bussmann", + "part_name": "POE26W5V-R" + } + }, + { + "bol_metadata": { + "bol_description": "TRANSFORMERS (RAW MATS FOR PRODUCTION USE)", + "origin_country": "US", + "shipper": "bourns" + }, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850450", + "850440", + "850490", + "850431" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0353", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850431", + "id": "SH-0353", + "justification_text": "Transformers having a power handling capacity not exceeding 1 kVA fall under 8504.31. Classified under HS 8504.31.", + "reference_ruling_ids": [ + "EBTI-CZ-CZ36-0127-2014", + "EBTI-DE-DE6900/16-1", + "EBTI-ES-ESBTIESBTI2025SOL596", + "CROSS-956000" + ], + "segment": "component", + "split": "train", + "tier1_description": "Electronic transformers imported as raw materials for production use. These are small dry-type wound components, copper windings with power handling capacity below 1 kVA. They provide voltage step-up or step-down, impedance matching and galvanic isolation when assembled into power supplies, telecom interfaces and other electronic end products", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Bourns", + "part_name": "transformers (RAW mats for production" + } + }, + { + "bol_metadata": { + "bol_description": "TRANSFORMADORES ELECTRICOS POT. INF=1KVA", + "origin_country": "US", + "shipper": "bourns de mexico s de rl de cv" + }, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850440", + "850431", + "850450", + "850490" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0354", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850431", + "id": "SH-0354", + "justification_text": "Transformers having a power handling capacity not exceeding 1 kVA fall under 8504.31. Classified under HS 8504.31.", + "reference_ruling_ids": [ + "EBTI-ES-ESBTIESBTI2025SOL596", + "EBTI-DE-DE6900/16-1", + "EBTI-CZ-CZ36-0127-2014", + "CROSS-956000" + ], + "segment": "component", + "split": "train", + "tier1_description": "Electrical transformers with power handling capacity not exceeding 1 kVA (BOL text in Spanish: 'transformadores electricos pot. Inf=1kVA'). They are dry-type wound components with copper windings on ferrite or laminated cores, mounted on circuit boards or chassis to convert voltages and isolate circuits in electronic equipment and low-power supplies", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Bourns", + "part_name": "transformadores electricos POT. INF=1KVA" + } + }, + { + "bol_metadata": { + "bol_description": "TRANSFORMER (ELECTRONIC PART)", + "origin_country": "US", + "shipper": "bourns dongguan electronics co.,lt" + }, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850431", + "850490", + "850450", + "850440" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0355", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850431", + "id": "SH-0355", + "justification_text": "Transformers having a power handling capacity not exceeding 1 kVA fall under 8504.31. Classified under HS 8504.31.", + "reference_ruling_ids": [ + "EBTI-DE-DE6900/16-1", + "EBTI-ES-ESBTIESBTI2025SOL596", + "CROSS-956000", + "EBTI-DK-DK12-162485" + ], + "segment": "component", + "split": "train", + "tier1_description": "Transformer supplied as an electronic part for circuit assembly. It is a miniature wound magnetic component, copper windings around a ferrite core, that couples signals or converts voltages with galvanic isolation at power levels below 1 kVA, typical of telecom line interfaces, LAN magnetics and switching power supplies", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Bourns", + "part_name": "transformer (electronic part)" + } + }, + { + "bol_metadata": { + "bol_description": "TRANSFORMERS - DA2320-ALC", + "origin_country": "US", + "shipper": "coilcraft singapore pte ltd" + }, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850490", + "850440", + "850450", + "850431" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0356", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850431", + "id": "SH-0356", + "justification_text": "Transformers having a power handling capacity not exceeding 1 kVA fall under 8504.31. Classified under HS 8504.31.", + "reference_ruling_ids": [ + "EBTI-CZ-CZ36-0127-2014", + "CROSS-956000", + "EBTI-DE-DE6900/16-1", + "EBTI-ES-ESBTIESBTI2025SOL596", + "EBTI-DK-DK12-162485" + ], + "segment": "component", + "split": "train", + "tier1_description": "Surface-mount gate drive transformer, approximately 6.6 x 5.0 x 5.4 mm. It provides transformer-coupled drive for MOSFET and IGBT gate circuits at operating frequencies from 50 kHz to 2.5 MHz with 1250 V DC primary-to-secondary isolation and about 264 microhenries primary inductance, used in switching power converters and motor drive electronics", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Coilcraft", + "part_name": "transformers - DA2320-ALC" + } + }, + { + "bol_metadata": { + "bol_description": "CV9172-ALD TRANSFORMERS (303-0-00618) (FOR EV Charger)", + "origin_country": "US", + "shipper": "coilcraft singapore pte ltd" + }, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850490", + "850450", + "850440", + "850431" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0357", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850431", + "id": "SH-0357", + "justification_text": "Transformers having a power handling capacity not exceeding 1 kVA fall under 8504.31. Classified under HS 8504.31.", + "reference_ruling_ids": [ + "EBTI-DE-DE6900/16-1", + "EBTI-CZ-CZ36-0127-2014", + "EBTI-ES-ESBTIESBTI2025SOL596", + "CROSS-956000", + "EBTI-DK-DK12-162485" + ], + "segment": "component", + "split": "train", + "tier1_description": "Wound power transformer designed into electric vehicle charging equipment. It is a custom magnetic component with copper windings on a ferrite core, providing galvanic isolation and voltage conversion in the switching power stage or auxiliary/gate-drive bias supply of a charger with a power handling capacity below 1 kVA and board- or bracket-mount construction", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Coilcraft", + "part_name": "CV9172-ALD transformers (303-0-00618)" + } + }, + { + "bol_metadata": { + "bol_description": "sweep transformer (capacity <1kVA, voltage <66kV) for wifi transmitter", + "origin_country": "US", + "shipper": "coilcraft singapore pte ltd" + }, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850440", + "850490", + "850450", + "850431" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0358", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850431", + "id": "SH-0358", + "justification_text": "Transformers having a power handling capacity not exceeding 1 kVA fall under 8504.31. Classified under HS 8504.31.", + "reference_ruling_ids": [ + "CROSS-956000", + "EBTI-CZ-CZ36-0127-2014", + "EBTI-DE-DE6900/16-1", + "EBTI-DK-DK12-162485", + "EBTI-ES-ESBTIESBTI2025SOL596" + ], + "segment": "component", + "split": "train", + "tier1_description": "Wound electronic signal transformer with a power handling capacity below 1 kVA and operating voltage below 66 kV, designed for the return-sweep (upstream) signal path of a wireless transmitter module. It is a small ferrite-core component that couples and impedance-matches RF signals between circuit stages on the transmitter board while providing galvanic isolation", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Coilcraft", + "part_name": "Return sweep transformer (capacity 1kVA" + } + }, + { + "bol_metadata": { + "bol_description": "P/N:) TRANSFORMERS (P/F MFG OF UPS)", + "origin_country": "US", + "shipper": "coilcraft singapore pte ltd" + }, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850490", + "850450", + "850440", + "850431" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0359", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850431", + "id": "SH-0359", + "justification_text": "Transformers having a power handling capacity not exceeding 1 kVA fall under 8504.31. Classified under HS 8504.31.", + "reference_ruling_ids": [ + "EBTI-ES-ESBTIESBTI2025SOL596", + "EBTI-DE-DE6900/16-1", + "EBTI-CZ-CZ36-0127-2014", + "CROSS-956000", + "EBTI-DK-DK12-162485" + ], + "segment": "component", + "split": "train", + "tier1_description": "Wound electrical transformer supplied as a production component for the manufacture of uninterruptible power supply (UPS) units. It is a dry-type magnetic component with copper windings on a ferrite or laminated core with a power handling capacity not exceeding 1 kVA, used for voltage conversion, sensing, or isolation within the UPS power conversion circuitry", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Coilcraft", + "part_name": "P/N:) transformers (P/F MFG of UPS)" + } + }, + { + "bol_metadata": { + "bol_description": "DA2303-ALD TRANSFORMERS (FOR MFG)", + "origin_country": "US", + "shipper": "coilcraft singapore pte ltd" + }, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850431", + "850440", + "850490", + "850450" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0360", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850431", + "id": "SH-0360", + "justification_text": "Transformers having a power handling capacity not exceeding 1 kVA fall under 8504.31. Classified under HS 8504.31.", + "reference_ruling_ids": [ + "EBTI-DE-DE6900/16-1", + "EBTI-ES-ESBTIESBTI2025SOL596", + "CROSS-956000", + "EBTI-CZ-CZ36-0127-2014", + "EBTI-DK-DK12-162485" + ], + "segment": "component", + "split": "train", + "tier1_description": "Surface-mount isolation transformer designed for isolated RS-485 transceiver circuits, stepping up a 5 V or 3.3 V supply to 6 V across the isolation barrier. It has center-tapped primary and secondary windings on a ferrite core and provides 2500 Vrms one-minute interwinding isolation with a power handling capacity well below 1 kVA, for powering isolated data-interface electronics", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Coilcraft", + "part_name": "DA2303-ALD transformers (for MFG)" + } + }, + { + "bol_metadata": { + "bol_description": "DA2033-ALD TRANSFORMERS (ED47-110) DA2033-ALD", + "origin_country": "US", + "shipper": "coilcraft singapore pte ltd" + }, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850431", + "850490", + "850440", + "850450" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0361", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850431", + "id": "SH-0361", + "justification_text": "Transformers having a power handling capacity not exceeding 1 kVA fall under 8504.31. Classified under HS 8504.31.", + "reference_ruling_ids": [ + "EBTI-DE-DE6900/16-1", + "EBTI-ES-ESBTIESBTI2025SOL596", + "CROSS-956000", + "EBTI-CZ-CZ36-0127-2014", + "EBTI-DK-DK12-162485" + ], + "segment": "component", + "split": "train", + "tier1_description": "Surface-mount flyback transformer developed for capacitor charger controller circuits (high-voltage capacitor charging applications). It uses a ferrite core with a 10 microhenry primary winding rated for 5 A peak current, provides 1500 Vrms one-minute winding-to-winding isolation and 750 Vrms winding-to-core isolation, and has a power handling capacity far below 1 kVA", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Coilcraft", + "part_name": "DA2033-ALD transformers (ED47-110)" + } + }, + { + "bol_metadata": { + "bol_description": "TRANSFORMER DH2M001-00029-LF Z9528-AL", + "origin_country": "US", + "shipper": "coilcraft singapore pte ltd" + }, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850431", + "850450", + "850440", + "850490" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0362", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850431", + "id": "SH-0362", + "justification_text": "Transformers having a power handling capacity not exceeding 1 kVA fall under 8504.31. Classified under HS 8504.31.", + "reference_ruling_ids": [ + "EBTI-CZ-CZ36-0127-2014", + "CROSS-956000", + "EBTI-DE-DE6900/16-1", + "EBTI-DK-DK12-162485", + "EBTI-ES-ESBTIESBTI2025SOL596" + ], + "segment": "component", + "split": "train", + "tier1_description": "Custom-designed wound transformer supplied as a board-level electronic component, identified by a customer-specific lead-free part number. It is a small ferrite-core magnetic component with insulated copper windings with a power handling capacity not exceeding 1 kVA, used for voltage conversion and galvanic isolation in switched-mode power or signal circuits of electronic equipment", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Coilcraft", + "part_name": "transformer DH2M001-00029-LF Z9528-AL" + } + }, + { + "bol_metadata": { + "bol_description": "TRANSFORMERS (TGMR-350V6LFTR)", + "origin_country": "US", + "shipper": "halo electronics s pte ltd" + }, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850490", + "850431", + "850440", + "850450" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0363", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850431", + "id": "SH-0363", + "justification_text": "Transformers having a power handling capacity not exceeding 1 kVA fall under 8504.31. Classified under HS 8504.31.", + "reference_ruling_ids": [ + "EBTI-CZ-CZ36-0127-2014", + "EBTI-DE-DE6900/16-1", + "EBTI-ES-ESBTIESBTI2025SOL596", + "CROSS-956000", + "EBTI-DK-DK12-162485" + ], + "segment": "component", + "split": "train", + "tier1_description": "Six-pin surface-mount transformer for isolated DC-DC converter circuits with a 1CT:1CT (center-tapped) turns ratio. It provides 3000 Vrms isolation between primary and secondary windings with working voltage up to 300 V, is built, and handles only a few watts, far below 1 kVA, supplying isolated power to interface and communication circuits", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Halo Electronics", + "part_name": "transformers (tgmr-350V6LFTR)" + } + }, + { + "bol_metadata": { + "bol_description": "CIS1-24-2775-01)TRANSFORMERS (Parts for Mfg of Router)", + "origin_country": "US", + "shipper": "halo electronics s pte ltd" + }, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850440", + "850431", + "850490", + "850450" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0364", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850431", + "id": "SH-0364", + "justification_text": "Transformers having a power handling capacity not exceeding 1 kVA fall under 8504.31. Classified under HS 8504.31.", + "reference_ruling_ids": [ + "EBTI-DE-DE6900/16-1", + "EBTI-ES-ESBTIESBTI2025SOL596", + "CROSS-956000", + "EBTI-CZ-CZ36-0127-2014", + "EBTI-DK-DK12-162485" + ], + "segment": "component", + "split": "train", + "tier1_description": "Surface-mount LAN isolation transformer module supplied under a network-equipment maker's part number for router manufacturing. It contains ferrite-core wound transformers and common-mode chokes that couple Ethernet PHY circuits to the line, providing 1500 Vrms-class galvanic isolation, signal coupling, and EMI suppression with a power handling capacity far below 1 kVA", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Halo Electronics", + "part_name": "CIS1-24-2775-01)TRANSFORMERS (Parts for" + } + }, + { + "bol_metadata": { + "bol_description": "PAPER CORRU GATED BOXES PACKED IN 28 OTHER TRANSFORMERS <1 KVA 0 274INVOICE DT:24.2.2025SB NO: SB DT: 2 4.2.2025HS CODE: 850431IEC NO: 0788008617REF NO :IN4-5298NET WT", + "origin_country": "IN", + "shipper": "kaypee electronics & assoc" + }, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850440", + "850450", + "850431", + "850490" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0365", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850431", + "id": "SH-0365", + "justification_text": "Transformers having a power handling capacity not exceeding 1 kVA fall under 8504.31. Classified under HS 8504.31.", + "reference_ruling_ids": [ + "EBTI-ES-ESBTIESBTI2025SOL596", + "EBTI-DE-DE6900/16-1", + "EBTI-CZ-CZ36-0127-2014", + "CROSS-956000" + ], + "segment": "component", + "split": "train", + "tier1_description": "Wound electrical transformers with a power handling capacity of less than 1 kVA with a of. These are dry-type magnetic components with copper windings on laminated or ferrite cores, used for voltage conversion and isolation in electronic and electrical equipment", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Kaypee Electronics & Associates", + "part_name": "paper corru gated boxes packed in 28" + } + }, + { + "bol_metadata": { + "bol_description": "PAPER CORRUGATED BOXES PACKED IN 14 OTHER TRANSFORMERS<1 KVA N 24 0276INVOICE DT:28.02.2025SB NO:8618128SB D T:01.03.2025HS CODE: 850431IEC NO: REF NO:IN4-5304NET WT", + "origin_country": "IN", + "shipper": "kaypee electronics & assoc" + }, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850440", + "850431", + "850450", + "850490" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0366", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850431", + "id": "SH-0366", + "justification_text": "Transformers having a power handling capacity not exceeding 1 kVA fall under 8504.31. Classified under HS 8504.31.", + "reference_ruling_ids": [ + "EBTI-ES-ESBTIESBTI2025SOL596", + "EBTI-DE-DE6900/16-1", + "EBTI-CZ-CZ36-0127-2014", + "CROSS-956000" + ], + "segment": "component", + "split": "train", + "tier1_description": "Wound electrical transformers, each rated below 1 kVA power handling capacity with a of. The goods are dry-type transformers with insulated copper windings on magnetic cores, used for stepping voltages and providing isolation in electronic and electrical equipment", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Kaypee Electronics & Associates", + "part_name": "paper corrugated boxes packed in 14" + } + }, + { + "bol_metadata": { + "bol_description": "PAPER CORRUGATED B OXES PACKED IN 14 OTHER TRANSF ORMERS<1 KVA 0280INVO ICE DATE:07.03.2025SB NO: SB DT:10.3.2 025NET WT: IEC NO:07 88008617REF NO: IN4-5312", + "origin_country": "IN", + "shipper": "kaypee electronics & assoc" + }, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850431", + "850450", + "850490", + "850440" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0367", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850431", + "id": "SH-0367", + "justification_text": "Transformers having a power handling capacity not exceeding 1 kVA fall under 8504.31. Classified under HS 8504.31.", + "reference_ruling_ids": [ + "EBTI-ES-ESBTIESBTI2025SOL596", + "EBTI-DE-DE6900/16-1", + "EBTI-CZ-CZ36-0127-2014", + "CROSS-956000" + ], + "segment": "component", + "split": "train", + "tier1_description": "Wound electrical transformers with power handling capacity below 1 kVA. The units are dry-type magnetic components with copper windings on laminated or ferrite cores, serving voltage transformation and galvanic isolation functions in electronic and electrical apparatus", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Kaypee Electronics & Associates", + "part_name": "paper corrugated B oxes packed in 14" + } + }, + { + "bol_metadata": { + "bol_description": "P/N:) BALUN-50 TO 870MHZ,0805,SM", + "origin_country": "JP", + "shipper": "murata electronics singapore pte. ltd" + }, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850440", + "850450", + "850490", + "850431" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0368", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850431", + "id": "SH-0368", + "justification_text": "Transformers having a power handling capacity not exceeding 1 kVA fall under 8504.31. Classified under HS 8504.31.", + "reference_ruling_ids": [ + "CROSS-956000", + "EBTI-DK-DK12-162485" + ], + "segment": "component", + "split": "train", + "tier1_description": "Surface-mount chip balun transformer in a 0805 (2.0 x 1.2 mm), operating over 50 MHz to 870 MHz with 75 ohm balanced and unbalanced impedances and about 1 dB maximum insertion loss. It converts between balanced and unbalanced RF signals in television and cable-TV tuner front ends and other compact communication equipment with an operating range of -40 to +85 degrees C", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Murata", + "part_name": "P/N:) balun-50 to 870MHZ 0805 SM" + } + }, + { + "bol_metadata": { + "bol_description": "transformer (for audio) H0670220", + "origin_country": "JP", + "shipper": "murata electronics singapore pte. ltd" + }, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850440", + "850431", + "850490", + "850450" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0369", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850431", + "id": "SH-0369", + "justification_text": "Transformers having a power handling capacity not exceeding 1 kVA fall under 8504.31. Classified under HS 8504.31.", + "reference_ruling_ids": [ + "EBTI-DE-DE6900/16-1", + "EBTI-ES-ESBTIESBTI2025SOL596", + "CROSS-956000", + "EBTI-DK-DK12-162485" + ], + "segment": "component", + "split": "train", + "tier1_description": "A miniature 6-pin wire-wound audio signal transformer for printed-circuit-board mounting. It uses a small ferrite core with primary and secondary windings to provide galvanic isolation, impedance matching, and signal coupling in audio paths such as digital audio interfaces, telephone line coupling, and voice circuits. Power handling is well below 1 kVA, typical of board-level signal magnetics", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Murata", + "part_name": "6-pin transformer (for audio) H0670220" + } + }, + { + "bol_metadata": { + "bol_description": "TRANSFORMERS & INDUCTORS 53040C", + "origin_country": "JP", + "shipper": "murata electronics singapore pte. ltd" + }, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850450", + "850490", + "850440", + "850431" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0370", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850431", + "id": "SH-0370", + "justification_text": "Transformers having a power handling capacity not exceeding 1 kVA fall under 8504.31. Classified under HS 8504.31.", + "reference_ruling_ids": [ + "CROSS-956000", + "EBTI-CZ-CZ36-0127-2014", + "EBTI-DE-DE6900/16-1", + "EBTI-ES-ESBTIESBTI2025SOL596", + "EBTI-DK-DK12-162485" + ], + "segment": "component", + "split": "train", + "tier1_description": "A surface-mount current-sense transformer from a 5300-series family rated for 10 A primary current with turns-ratio variants from 20 to 200 turns, 500 Vrms primary-to-secondary isolation, and a 50 kHz to 500 kHz operating frequency range. It is used to monitor AC currents in switched-mode power supplies, motor control, and electronic lighting ballast circuits", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Murata", + "part_name": "transformers & inductors 53040C" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850450", + "850431", + "850440", + "850490" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0371", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850440", + "id": "SH-0371", + "justification_text": "The product falls under HS 8504.40 (Static converters).", + "reference_ruling_ids": [ + "CROSS-086518", + "CROSS-N107344", + "CROSS-N065844", + "CROSS-N093423", + "CROSS-960624", + "CROSS-D84215", + "CROSS-D87300", + "CROSS-K80314", + "CROSS-K81644", + "CROSS-N038000", + "CROSS-N049638", + "CROSS-N060855", + "EBTI-DK-DKBTI19-0396035", + "CROSS-086223", + "CROSS-836990", + "CROSS-G86582", + "CROSS-H287893", + "CROSS-K89511", + "CROSS-L80554", + "CROSS-N021176", + "CROSS-N022970", + "CROSS-N024590" + ], + "segment": "component", + "split": "train", + "tier1_description": "An AC-DC power-factor-correction (PFC) module that shapes input current to improve power factor and meet harmonic standards ahead of a DC stage. It boosts efficiency and line compliance in higher-power switch-mode power supplies (part LPS352-CF)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Artesyn Embedded Technologies", + "part_name": "LPS352-CF" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850440", + "850450", + "850431", + "850490" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0372", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850440", + "id": "SH-0372", + "justification_text": "The product falls under HS 8504.40 (Static converters).", + "reference_ruling_ids": [ + "CROSS-N107344", + "CROSS-N065844", + "CROSS-N049638", + "CROSS-086518", + "CROSS-L80554", + "CROSS-N024590", + "CROSS-N038000", + "CROSS-N093423", + "CROSS-836990", + "CROSS-960624", + "CROSS-D84215", + "CROSS-D87300", + "CROSS-G86582", + "CROSS-H287893", + "CROSS-K80314", + "CROSS-K81644", + "CROSS-K89511", + "CROSS-N022970", + "CROSS-N060855" + ], + "segment": "component", + "split": "train", + "tier1_description": "A synchronous step-down (buck) point-of-load DC-DC converter IC in a PQFN-34 package, integrating control and power switches. It provides compact, efficient regulated power for processors, FPGAs and digital loads (part IR38163M). Part number IR38163MTRPBFAUMA1", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Infineon", + "part_name": "IR38163MTRPBFAUMA1" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850490", + "850440", + "850450", + "850431" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0373", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850440", + "id": "SH-0373", + "justification_text": "The product falls under HS 8504.40 (Static converters).", + "reference_ruling_ids": [ + "CROSS-086518", + "CROSS-N065844", + "CROSS-N107344", + "CROSS-N024590", + "CROSS-N038000", + "CROSS-N049638", + "CROSS-N093423", + "CROSS-836990", + "CROSS-960624", + "CROSS-D84215", + "CROSS-D87300", + "CROSS-G86582", + "CROSS-H287893", + "CROSS-K80314", + "CROSS-K81644", + "CROSS-K89511", + "CROSS-L80554", + "CROSS-N021176", + "CROSS-N022970", + "CROSS-N060855" + ], + "segment": "component", + "split": "train", + "tier1_description": "An enclosed AC-DC power-supply module accepting 90 to 264 VAC and delivering about 20 W at 24 V (around 840 mA). It provides compact, regulated DC power for industrial, control and embedded equipment (part TML 20124C)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Traco Power", + "part_name": "TML 20124C" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850450", + "850490", + "850431", + "850440" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0374", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850440", + "id": "SH-0374", + "justification_text": "The product falls under HS 8504.40 (Static converters).", + "reference_ruling_ids": [ + "CROSS-N107344", + "CROSS-N049638", + "CROSS-086518", + "CROSS-N065844", + "EBTI-DK-DKBTI19-0396035", + "CROSS-B89006", + "CROSS-K89511", + "CROSS-L80554", + "CROSS-N021176", + "CROSS-N024590", + "CROSS-N038000", + "CROSS-N060855", + "EBTI-CZ-CZBTI46/112597/2023-580000-04/01" + ], + "segment": "component", + "split": "train", + "tier1_description": "A synchronous step-down (buck) DC-DC converter IC switching at 850 kHz, rated to 85 C. The integrated synchronous switches provide efficient point-of-load voltage regulation for digital and industrial loads (part 171031801)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Wurth Elektronik", + "part_name": "171031801" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850450", + "850440", + "850431", + "850490" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0375", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850440", + "id": "SH-0375", + "justification_text": "The product falls under HS 8504.40 (Static converters).", + "reference_ruling_ids": [ + "CROSS-N107344", + "CROSS-N065844", + "CROSS-N049638", + "CROSS-086518", + "CROSS-L80554", + "CROSS-N024590", + "CROSS-N038000", + "CROSS-N060855", + "CROSS-N093423", + "CROSS-836990", + "CROSS-960624", + "CROSS-D84215", + "CROSS-D87300", + "CROSS-G86582", + "CROSS-H287893", + "CROSS-K80314", + "CROSS-K81644", + "CROSS-K89511", + "CROSS-N022970" + ], + "segment": "component", + "split": "train", + "tier1_description": "An isolated board-mount DC-DC converter in a SIP through-hole package, rated for 1 W with a 24 V output (about 42 mA). It provides isolated, regulated power for sensors, interfaces and control circuits (part NME0524SC)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Murata Power Solutions", + "part_name": "NME0524SC" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850431", + "850450", + "850490", + "850440" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0376", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850440", + "id": "SH-0376", + "justification_text": "The product falls under HS 8504.40 (Static converters).", + "reference_ruling_ids": [ + "CROSS-086518", + "CROSS-N049638", + "CROSS-N065844", + "CROSS-N107344", + "CROSS-N093423", + "CROSS-K89511", + "CROSS-N021176", + "CROSS-N024590", + "CROSS-N060855", + "CROSS-G86582", + "CROSS-N022970", + "CROSS-N038000", + "EBTI-DK-DKBTI19-0396035", + "CROSS-836990", + "CROSS-954766", + "CROSS-960624", + "CROSS-B89006", + "CROSS-D84215", + "CROSS-D87300", + "CROSS-H287893", + "CROSS-K80314", + "CROSS-K81644", + "CROSS-L80554" + ], + "segment": "component", + "split": "train", + "tier1_description": "A 70 V, 3 A step-down power module with high-speed control and integrated inductor, in a 12 x 12 mm QFN-style package. It delivers a complete regulated supply from a high input voltage for industrial and telecom loads (part MIC28304-2YMP). Part number MIC28304-2YMP-TR", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Microchip", + "part_name": "MIC28304-2YMP-TR" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850490", + "850440", + "850431", + "850450" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0377", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850440", + "id": "SH-0377", + "justification_text": "The product falls under HS 8504.40 (Static converters).", + "reference_ruling_ids": [ + "CROSS-N065844", + "CROSS-N107344", + "CROSS-086518", + "CROSS-N038000", + "CROSS-N049638", + "CROSS-N093423", + "CROSS-N060855", + "CROSS-D84215", + "CROSS-K89511", + "CROSS-N021176", + "CROSS-960624", + "CROSS-D87300", + "CROSS-G86582", + "CROSS-K80314", + "CROSS-K81644", + "CROSS-L80554", + "CROSS-N022970", + "EBTI-DK-DKBTI19-0396035", + "CROSS-836990", + "CROSS-B89006", + "CROSS-H287893", + "CROSS-N024590" + ], + "segment": "component", + "split": "train", + "tier1_description": "A board-mount DC-DC converter module providing isolated, regulated DC output for embedded and industrial power supplies. It delivers compact, efficient point-of-load or intermediate-bus voltage conversion for circuit boards and electronic equipment requiring stable supply rails (part RP40-11005SFR). Part number RP40-11005SFR/P-HC", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Recom Power", + "part_name": "RP40-11005SFR/P-HC" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850431", + "850440", + "850490", + "850450" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0378", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850440", + "id": "SH-0378", + "justification_text": "The product falls under HS 8504.40 (Static converters).", + "reference_ruling_ids": [ + "CROSS-N107344", + "CROSS-N049638", + "CROSS-N065844", + "CROSS-086518", + "CROSS-N038000", + "CROSS-N093423", + "CROSS-N060855", + "CROSS-836990", + "CROSS-960624", + "CROSS-D84215", + "CROSS-D87300", + "CROSS-G86582", + "CROSS-H287893", + "CROSS-K80314", + "CROSS-K81644", + "CROSS-K89511", + "CROSS-L80554", + "CROSS-N021176", + "CROSS-N021277", + "CROSS-N022970", + "CROSS-N024590" + ], + "segment": "component", + "split": "train", + "tier1_description": "A configurable buck-boost DC-DC power module with adjustable output, in a compact USLIC package integrating the controller, switches and inductor. It delivers regulated power from a varying input for portable and space-constrained electronics (part MAXM20344AMP). Part number MAXM20344AMP+", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Analog Devices", + "part_name": "MAXM20344AMP+" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850450", + "850440", + "850431", + "850490" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0379", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850440", + "id": "SH-0379", + "justification_text": "The product falls under HS 8504.40 (Static converters).", + "reference_ruling_ids": [ + "CROSS-N065844", + "CROSS-N107344", + "CROSS-086518", + "CROSS-N021176", + "CROSS-N038000", + "CROSS-N049638", + "CROSS-N060855", + "CROSS-N093423" + ], + "segment": "component", + "split": "train", + "tier1_description": "An enclosed AC-DC power-supply module providing dual outputs (about +5 V and -5 V at 2 A each). It converts mains AC to regulated bipolar DC for analog, logic and instrumentation circuits (part TML 20205C)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Traco Power", + "part_name": "TML 20205C" + } + }, + { + "bol_metadata": { + "bol_description": "DCDC POWER SUPPLY", + "origin_country": "JP", + "shipper": "tdk usa corporation" + }, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850450", + "850431", + "850440", + "850490" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0380", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850440", + "id": "SH-0380", + "justification_text": "A DC-DC power supply is a static converter under 8504.40, not a transformer under 8504.31. Classified under HS 8504.40.", + "reference_ruling_ids": [ + "CROSS-086518", + "CROSS-N107344", + "CROSS-N065844", + "CROSS-N049638", + "CROSS-N060855", + "CROSS-N093423", + "CROSS-K89511", + "CROSS-N021176", + "CROSS-N038000", + "CROSS-G86582", + "CROSS-L80554", + "CROSS-N022970", + "CROSS-N024590", + "EBTI-CZ-CZBTI46/112597/2023-580000-04/01", + "EBTI-DK-DKBTI19-0396035", + "CROSS-836990", + "CROSS-960624", + "CROSS-B89006", + "CROSS-D84215", + "CROSS-D87300", + "CROSS-H287893", + "CROSS-K80314", + "CROSS-K81644" + ], + "segment": "component", + "split": "train", + "tier1_description": "DC-DC power supply module: an electronic converter that accepts a direct-current input voltage and delivers a regulated direct-current output at a different voltage level. Built around switching semiconductors, a transformer or inductor, and control circuitry, typically. Used to power telecom, industrial, and embedded equipment from battery or distributed DC buses", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "TDK", + "part_name": "dcdc power supply" + } + }, + { + "bol_metadata": { + "bol_description": "CHARGING CONV AC/DC-30KW SINGLE X- (DCM-303AA00U-S)-PARTS OF CHARGER FOR ELECTRIC VEHICLECONVERTER AC/DC-15KW SINGLE PACKING X-5125175809-RD-DCM-153A", + "origin_country": "TW", + "shipper": "delta electronics intl singapore pte ltd" + }, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850440", + "850450", + "850490", + "850431" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0381", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850440", + "id": "SH-0381", + "justification_text": "An AC/DC charging converter module is a static converter of 8504.40, not a part of converters or transformers under 8504.90. Classified under HS 8504.40.", + "reference_ruling_ids": [ + "CROSS-086518", + "CROSS-N107344", + "CROSS-N065844", + "CROSS-N038000", + "CROSS-N093423", + "EBTI-CZ-CZBTI46/112597/2023-580000-04/01", + "CROSS-N049638", + "EBTI-DE-DEBTI40809/18-1", + "CROSS-836990", + "CROSS-G86582", + "CROSS-L80554", + "CROSS-N022970", + "CROSS-085027", + "CROSS-960624", + "CROSS-D84215", + "CROSS-D87300", + "CROSS-H287893", + "CROSS-K80314", + "CROSS-K81644", + "CROSS-K89511", + "CROSS-N021176", + "CROSS-N024590", + "CROSS-N060855" + ], + "segment": "component", + "split": "train", + "tier1_description": "AC/DC charging converter modules rated 30 kW and 15 kW, packed singly, for electric-vehicle direct-current fast chargers. Each module rectifies three-phase AC mains into regulated high-voltage DC suitable for battery charging, incorporating power-factor correction and isolated DC-DC conversion stages, and is installed in multiples inside charger cabinets to scale total output power", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Delta Electronics", + "part_name": "charging conv AC/DC-30KW single X" + } + }, + { + "bol_metadata": { + "bol_description": "UNINTERRUPTIBLE POWER SUPPLY -000PARTS OR COMPONENTS OF UPSHS CODE: 850 49090-000DN: / / / 49090-000DN", + "origin_country": "IE", + "shipper": "eaton industries philippines llc" + }, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850450", + "850440", + "850490", + "850431" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "low", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0382", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850440", + "id": "SH-0382", + "justification_text": "A UPS or static converter system is classified as a static converter under 8504.40; itemization is needed for separately shipped parts. Classified under HS 8504.40.", + "reference_ruling_ids": [ + "CROSS-N065844", + "CROSS-086518", + "CROSS-N093423", + "CROSS-N107344", + "CROSS-086223", + "CROSS-N049638", + "CROSS-G86582", + "CROSS-N038000", + "CROSS-H287893", + "CROSS-K80314", + "CROSS-K81644", + "CROSS-K89511", + "CROSS-N022970", + "CROSS-N024590", + "EBTI-CZ-CZBTI46/112597/2023-580000-04/01", + "CROSS-085540", + "CROSS-836990", + "CROSS-887804", + "CROSS-954766", + "CROSS-960624", + "CROSS-D84215", + "CROSS-D87300", + "CROSS-L80554", + "CROSS-L81390", + "CROSS-N021176", + "CROSS-N060855", + "EBTI-DE-DEBTI40809/18-1" + ], + "segment": "component", + "split": "train", + "tier1_description": "An uninterruptible power supply system supplied together with associated spare parts and components. The unit contains a rectifier, battery charger, inverter and transfer circuitry that maintain regulated alternating-current output to connected computing or industrial equipment during mains disturbances or outages, drawing on stored battery energy until normal supply returns or loads are shut down safely", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Eaton", + "part_name": "uninterruptible power supply -000PARTS" + } + }, + { + "bol_metadata": { + "bol_description": "MODEL: 3LPV-35-24-SMT-P PCB MODLUE PCB MODLUE", + "origin_country": "TW", + "shipper": "mean well guangzhou electronics co.ltd" + }, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850431", + "850450", + "850440", + "850490" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0383", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850440", + "id": "SH-0383", + "justification_text": "A switching power supply module is a static converter under 8504.40, not a part under 8504.90. Classified under HS 8504.40.", + "reference_ruling_ids": [ + "CROSS-N065844", + "CROSS-086518", + "CROSS-N049638", + "CROSS-N107344", + "CROSS-N093423", + "CROSS-N038000", + "CROSS-G86582", + "CROSS-K89511", + "CROSS-L80554", + "CROSS-N021176", + "CROSS-N022970", + "EBTI-DE-DEBTI40809/18-1", + "CROSS-836990", + "CROSS-960624", + "CROSS-D84215", + "CROSS-D87300", + "CROSS-H121540", + "CROSS-H287893", + "CROSS-K80314", + "CROSS-K81644", + "CROSS-N024590", + "CROSS-N060855" + ], + "segment": "component", + "split": "train", + "tier1_description": "An AC/DC switching power supply in printed-circuit-board module form, a surface-mount assembly variant of a 35 W constant-voltage unit delivering 24 V DC at about 1.5 A from a 90-264 V AC universal input. Intended for building into LED lighting fixtures and similar end equipment, it includes short-circuit, overload and over-voltage protection", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Mean Well", + "part_name": "model: 3LPV-35-24-SMT-P PCB modlue PCB" + } + }, + { + "bol_metadata": { + "bol_description": "TC2_3 PRM3 38/48/60VIN 48VOUT 800W PRM2313S60E54HOT00 POWER SUPPL", + "origin_country": "US", + "shipper": "vicor corporation" + }, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850431", + "850440", + "850490", + "850450" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0384", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850440", + "id": "SH-0384", + "justification_text": "A DC-DC regulator or converter module is a static converter under 8504.40, not a part under 8504.90. Classified under HS 8504.40.", + "reference_ruling_ids": [ + "CROSS-N107344", + "CROSS-086518", + "CROSS-N065844", + "CROSS-N038000", + "CROSS-N049638", + "CROSS-836990", + "CROSS-N022970", + "CROSS-N060855", + "CROSS-N093423", + "CROSS-085027", + "CROSS-960624", + "CROSS-D84215", + "CROSS-D87300", + "CROSS-F83421", + "CROSS-G86582", + "CROSS-H287893", + "CROSS-K80314", + "CROSS-K81644", + "CROSS-K89511", + "CROSS-L80554", + "CROSS-N021176", + "CROSS-N024590" + ], + "segment": "component", + "split": "train", + "tier1_description": "A non-isolated buck-boost DC-DC regulator module accepting a 38-60 V DC input and delivering a regulated 48 V output at up to 800 W, packaged as an encapsulated 13-pin through-hole power component. It serves as the pre-regulation stage in factorized power architectures, feeding downstream transformation modules at the point of load in data-center, telecom and high-performance computing systems", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Vicor", + "part_name": "TC2 3 PRM3 38/48/60VIN 48VOUT 800W" + } + }, + { + "bol_metadata": { + "bol_description": "POWER SUPPLIES", + "origin_country": "US", + "shipper": "vicor corporation" + }, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850450", + "850490", + "850431", + "850440" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0385", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850440", + "id": "SH-0385", + "justification_text": "Power supplies and DC-DC converter modules are static converters under 8504.40, not parts under 8504.90. Classified under HS 8504.40.", + "reference_ruling_ids": [ + "CROSS-086518", + "CROSS-N107344", + "CROSS-N065844", + "CROSS-N038000", + "CROSS-N060855", + "CROSS-N049638", + "CROSS-N093423", + "CROSS-836990", + "CROSS-960624", + "CROSS-D84215", + "CROSS-D87300", + "CROSS-K80314", + "CROSS-K81644", + "CROSS-K89511", + "CROSS-L80554", + "CROSS-N022970", + "EBTI-BG-BGBG/2008/000001", + "EBTI-DK-DKBTI19-0396035", + "CROSS-085027", + "CROSS-954766", + "CROSS-B89006", + "CROSS-G86582", + "CROSS-H287893", + "CROSS-N021176", + "CROSS-N024590" + ], + "segment": "component", + "split": "train", + "tier1_description": "Electronic power supplies in modular form that convert an input voltage into one or more tightly regulated direct-current outputs for powering electronic equipment. Units of this origin are typically high-density encapsulated brick or chip-scale DC-DC converter and regulator modules used in computing, telecommunications, aerospace and industrial systems, offering isolation, high conversion efficiency and board-level mounting", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Vicor", + "part_name": "power supplies" + } + }, + { + "bol_metadata": { + "bol_description": "LASER TUBE POWER SUPPLY FOR ZYGO INTERFEROMETER", + "origin_country": "US", + "shipper": "ii-vi singapore pte ltd" + }, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850431", + "850440", + "850450", + "850490" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0386", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850440", + "id": "SH-0386", + "justification_text": "A laser tube power supply is a static converter of 8504.40, not an optical device of 9013.80. Classified under HS 8504.40.", + "reference_ruling_ids": [ + "CROSS-086518", + "CROSS-N065844", + "CROSS-N107344", + "CROSS-N093423", + "EBTI-DK-DKBTI19-0396035", + "CROSS-G86582", + "CROSS-K89511", + "CROSS-N021176", + "CROSS-N049638", + "CROSS-N060855", + "CROSS-086223", + "CROSS-N022970", + "CROSS-N024590", + "CROSS-N038000", + "CROSS-836990", + "CROSS-954766", + "CROSS-960624", + "CROSS-B89006", + "CROSS-D84215", + "CROSS-D87300", + "CROSS-H287893", + "CROSS-K80314", + "CROSS-K81644", + "CROSS-L80554", + "CROSS-N005851" + ], + "segment": "component", + "split": "train", + "tier1_description": "Power supply unit for the laser tube of a laser interferometer, providing regulated drive voltage and current to energize the gas-laser source. An electrical power-conversion subassembly dedicated to a laser-based optical measuring instrument. Supplied as a replacement power module for an interferometric metrology system", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "II-VI", + "part_name": "laser tube power supply for zygo" + } + }, + { + "bol_metadata": { + "bol_description": "AC SOURCE / AC POWER SOURCE", + "origin_country": "JP", + "shipper": "kikusui electronics corp" + }, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850490", + "850431", + "850440", + "850450" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0387", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850440", + "id": "SH-0387", + "justification_text": "A programmable AC power source is a static converter/power supply of 8504.40, not an electrical measuring instrument of 9030.84. Classified under HS 8504.40.", + "reference_ruling_ids": [ + "CROSS-N060855", + "CROSS-086518", + "CROSS-N107344", + "CROSS-N049638", + "CROSS-N065844", + "CROSS-K89511", + "CROSS-N024590", + "CROSS-N093423", + "EBTI-DE-DEBTI40809/18-1", + "EBTI-DK-DKBTI19-0396035", + "CROSS-836990", + "CROSS-887804", + "CROSS-954766", + "CROSS-960624", + "CROSS-B89006", + "CROSS-D84215", + "CROSS-D87300", + "CROSS-G86582", + "CROSS-H287893", + "CROSS-K80314", + "CROSS-K81644", + "CROSS-L80554", + "CROSS-L81390", + "CROSS-N005851", + "CROSS-N021176", + "CROSS-N022970", + "CROSS-N038000", + "JP_CUSTOMS-123003575", + "JP_CUSTOMS-124002114" + ], + "segment": "component", + "split": "train", + "tier1_description": "Programmable AC power source that generates a stable, adjustable alternating-current output of selectable voltage and frequency from a mains or DC input. Built around a PWM inverter and control electronics, it can simulate power-line conditions such as dips, surges and outages and offers LAN, USB and RS-232 control interfaces. It is used to power and stress-test electrical and electronic products during compliance, development and production testing", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Kikusui Electronics", + "part_name": "AC source / AC power source" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850440", + "850431", + "850490", + "850450" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0388", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850440", + "id": "SH-0388", + "justification_text": "The item is a DC/stepper motor driver board with a specific electrical control function. Heading 8543 covers electrical apparatus with individual functions, not ADP accessories. Classified under HS 8504.40.", + "reference_ruling_ids": [ + "CROSS-N049638", + "CROSS-086518", + "CROSS-N065844", + "CROSS-N107344", + "CROSS-N060855", + "EBTI-DE-DEBTI40809/18-1", + "CROSS-954408", + "CROSS-B86868", + "CROSS-B89006", + "CROSS-L84394", + "CROSS-N024590", + "CROSS-N093423" + ], + "segment": "component", + "split": "train", + "tier1_description": "Dual DC / single stepper motor driver expansion board for a 40-pin single-board computer, using an H-bridge driver to control bidirectional motor rotation, with onboard 5V regulator, IR receiver, multi-protection circuitry and a 2A self-recovery fuse for mobile robotics (MPN: WAV-11820)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Waveshare", + "part_name": "WAV-11820" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850431", + "850490", + "850440", + "850450" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0389", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850440", + "id": "SH-0389", + "justification_text": "The item is a serial-bus servo driver/control board with an individual motor-control function. Heading 8543 is more appropriate than ADP parts/accessories. Classified under HS 8504.40.", + "reference_ruling_ids": [ + "CROSS-N049638", + "CROSS-N107344", + "CROSS-086518", + "CROSS-N060855", + "CROSS-N065844", + "CROSS-N093423", + "EBTI-DE-DEBTI40809/18-1", + "CROSS-L84394", + "CROSS-N021176", + "CROSS-N038000", + "JP_CUSTOMS-123003575", + "JP_CUSTOMS-124002114" + ], + "segment": "component", + "split": "train", + "tier1_description": "Serial-bus servo driver expansion board (daughter board) for single-board computers, controlling up to 253 serial-bus servos simultaneously; built around an ESP32-WROOM-32 module with 2.4G WiFi and UART/2x USB Type-C interfaces, 9-25V wide-voltage input via XT60/DC jack and onboard 5V buck regulator, supporting JSON command communication and feedback (MPN: WAV-27577)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Waveshare", + "part_name": "WAV-27577" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850431", + "850440", + "850490", + "850450" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0390", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850440", + "id": "SH-0390", + "justification_text": "The item is an AC/DC or DC/DC power supply, charger, regulator, or static converter. 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Classified under HS 8504.40.", + "reference_ruling_ids": [ + "CROSS-086518", + "CROSS-N049638", + "CROSS-N065844", + "CROSS-N107344", + "CROSS-N060855", + "EBTI-DK-DKBTI19-0396035", + "CROSS-N038000", + "CROSS-N093423", + "CROSS-N021176", + "EBTI-BG-BGBG/2008/000001", + "EBTI-CZ-CZBTI46/112597/2023-580000-04/01", + "EBTI-DE-DEBTI40809/18-1", + "CROSS-954766", + "CROSS-B89006", + "CROSS-H121540", + "CROSS-K89511", + "CROSS-L80554" + ], + "segment": "component", + "split": "train", + "tier1_description": "USB-input DC-DC step-up (boost) static converter stepping 5V up to a switch-selectable 9V or 12V DC output, with a digital LED voltage display; rated approximately 1A at 9V and 0.8A at 12V depending on source. 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Classified under HS 8504.40.", + "reference_ruling_ids": [ + "CROSS-N107344", + "CROSS-086518", + "CROSS-N065844", + "EBTI-DK-DKBTI19-0396035", + "CROSS-N038000", + "CROSS-N060855", + "CROSS-N049638", + "EBTI-BG-BGBG/2008/000001", + "EBTI-CZ-CZBTI46/112597/2023-580000-04/01", + "EBTI-DE-DEBTI40809/18-1", + "CROSS-086223", + "CROSS-954766", + "CROSS-L80554", + "CROSS-N021176", + "CROSS-N093423" + ], + "segment": "component", + "split": "train", + "tier1_description": "High-efficiency synchronous DC-DC step-up (boost) static converter/regulator module with breadboard-compatible pinout, accepting 5V input at up to 4A switching current and delivering a solder-pad-selectable 12V/1A or 24V/0.5A output at over 90% efficiency (MPN: 105367)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Olimex", + "part_name": "105367" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850490", + "850450", + "850431", + "850440" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0393", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850440", + "id": "SH-0393", + "justification_text": "The item is an AC/DC or DC/DC power supply, charger, regulator, or static converter. Heading 8504 specifically covers static converters, so current 850440 is appropriate. Classified under HS 8504.40.", + "reference_ruling_ids": [ + "CROSS-N107344", + "CROSS-N065844", + "CROSS-086518", + "CROSS-N049638", + "CROSS-N038000", + "CROSS-N060855", + "CROSS-N093423", + "EBTI-BG-BGBG/2008/000001", + "EBTI-CZ-CZBTI46/112597/2023-580000-04/01", + "EBTI-DE-DEBTI40809/18-1", + "EBTI-DK-DKBTI19-0396035", + "CROSS-954766", + "CROSS-L80554", + "CROSS-N021176" + ], + "segment": "component", + "split": "train", + "tier1_description": "Synchronous DC-DC step-up/step-down (buck-boost) static converter module producing a regulated 12V output from input voltages of 2.8V to 22V at continuous currents of 0.5-2.5A and 85-95% efficiency; features reverse-voltage protection and an enable input, in a 0.9 x 0.9 in board format (MPN: POL-4984)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Pololu", + "part_name": "POL-4984" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850440", + "850490", + "850450", + "850431" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0394", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850440", + "id": "SH-0394", + "justification_text": "The item is an AC/DC or DC/DC power supply, charger, regulator, or static converter. Heading 8504 specifically covers static converters, so current 850440 is appropriate. Classified under HS 8504.40.", + "reference_ruling_ids": [ + "CROSS-N107344", + "CROSS-086518", + "CROSS-N065844", + "CROSS-N038000", + "CROSS-N060855", + "CROSS-N093423", + "EBTI-DK-DKBTI19-0396035", + "CROSS-N049638", + "CROSS-G86582", + "CROSS-K89511", + "CROSS-L80554", + "CROSS-N021176", + "CROSS-N022970", + "EBTI-BG-BGBG/2008/000001", + "EBTI-CZ-CZBTI46/112597/2023-580000-04/01", + "EBTI-DE-DEBTI40809/18-1", + "CROSS-086223", + "CROSS-836990", + "CROSS-954766", + "CROSS-960624", + "CROSS-D84215", + "CROSS-D87300", + "CROSS-H287893", + "CROSS-K80314", + "CROSS-K81644", + "CROSS-N024590" + ], + "segment": "component", + "split": "train", + "tier1_description": "Synchronous DC-DC step-up/step-down (buck-boost) static converter module producing a regulated 5V/1A output from input voltages of 2.8V to 22V at 85-95% typical efficiency, with 20 uA maximum quiescent current; compact 0.35 x 0.475 in board format for embedded power supply (MPN: POL-4083)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Pololu", + "part_name": "POL-4083" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850450", + "850440", + "850490", + "850431" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0395", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850440", + "id": "SH-0395", + "justification_text": "The item is an AC/DC or DC/DC power supply, charger, regulator, or static converter. Heading 8504 specifically covers static converters, so current 850440 is appropriate. Classified under HS 8504.40.", + "reference_ruling_ids": [ + "CROSS-086518", + "CROSS-N107344", + "CROSS-N049638", + "CROSS-N065844", + "CROSS-N093423", + "CROSS-G86582", + "CROSS-K89511", + "CROSS-N022970", + "EBTI-DE-DEBTI40809/18-1", + "CROSS-836990", + "CROSS-960624", + "CROSS-D84215", + "CROSS-D87300", + "CROSS-H287893", + "CROSS-K80314", + "CROSS-K81644", + "CROSS-L80554", + "CROSS-N021176", + "CROSS-N024590", + "CROSS-N038000", + "CROSS-N060855", + "JP_CUSTOMS-123003575", + "JP_CUSTOMS-124002114" + ], + "segment": "component", + "split": "train", + "tier1_description": "27 W USB-C AC-DC switching power supply with USB Power Delivery, supporting standard PD profiles 5V/3A, 9V/3A, 12V/2.25A and 15V/1.8A plus a 5V/5A mode, >91% efficiency, for powering USB-C single-board computers and PD-enabled devices (MPN: SC1158)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Raspberry Pi", + "part_name": "SC1158" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850490", + "850450", + "850431", + "850440" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0396", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850450", + "id": "SH-0396", + "justification_text": "The product falls under HS 8504.50 (Inductors).", + "reference_ruling_ids": [ + "CROSS-963137" + ], + "segment": "component", + "split": "train", + "tier1_description": "A semi-shielded surface-mount power inductor rated for 22 uH and about 1.5 A, in the SRN6045 series footprint. It provides energy storage and current smoothing in DC-DC converters and switching power supplies (part SRN6045-220M)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Bourns", + "part_name": "SRN6045-220M" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850440", + "850490", + "850431", + "850450" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0397", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850450", + "id": "SH-0397", + "justification_text": "The product falls under HS 8504.50 (Inductors).", + "reference_ruling_ids": [ + "CROSS-963137" + ], + "segment": "component", + "split": "train", + "tier1_description": "A magnetically shielded surface-mount power inductor rated for 100 uH and about 2.5 A, with a 20% tolerance. The shielded design limits EMI, suiting energy storage and filtering in DC-DC converters and regulators (part SRR1210-101M)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Bourns", + "part_name": "SRR1210-101M" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850450", + "850490", + "850431", + "850440" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0398", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850450", + "id": "SH-0398", + "justification_text": "The product falls under HS 8504.50 (Inductors).", + "reference_ruling_ids": [ + "CROSS-963137" + ], + "segment": "component", + "split": "train", + "tier1_description": "A magnetically shielded surface-mount power inductor rated for 1 uH and about 4.5 A, in the compact IHLP-1616BZ series. Its low-loss construction suits high-frequency DC-DC conversion in space-constrained power circuits (part IHLP1616BZER1R0M11)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Vishay", + "part_name": "IHLP1616BZER1R0M11" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850490", + "850440", + "850431", + "850450" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0399", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850450", + "id": "SH-0399", + "justification_text": "The product falls under HS 8504.50 (Inductors).", + "reference_ruling_ids": [ + "CROSS-963137" + ], + "segment": "component", + "split": "train", + "tier1_description": "An automotive-grade (AEC-Q200), magnetically shielded power inductor rated for 100 uH and about 1.7 A. The shielded construction limits EMI, suiting automotive and industrial DC-DC conversion and filtering (part ETQP5M101YGK)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Panasonic", + "part_name": "ETQP5M101YGK" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850431", + "850450", + "850490", + "850440" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0400", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850450", + "id": "SH-0400", + "justification_text": "The product falls under HS 8504.50 (Inductors).", + "reference_ruling_ids": [ + "CROSS-963137" + ], + "segment": "component", + "split": "train", + "tier1_description": "A shielded surface-mount power inductor rated for 10 uH and about 2.5 A, in the SRN6045 series footprint. 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Suppresses common mode noise and interference on AC or DC power lines in automotive and industrial electronics", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Abracon", + "part_name": "Sample inductor brand code" + } + }, + { + "bol_metadata": { + "bol_description": "MAGNETICS -HIGH CURRENT POWER INDUCTORS - INDUCTOR", + "origin_country": "US", + "shipper": "bourns inc" + }, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850431", + "850490", + "850440", + "850450" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0419", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850450", + "id": "SH-0419", + "justification_text": "Inductors, chokes and ferrite-bead inductor components are classified under 8504.50. Classified under HS 8504.50.", + "reference_ruling_ids": [ + "CROSS-963137", + "EBTI-CZ-CZ21-0733-2010" + ], + "segment": "component", + "split": "train", + "tier1_description": "High-current surface-mount power inductor from a shielded /molded core product line, wound with heavy-gauge wire for low DC resistance and high saturation current. Such inductors typically span roughly 0.1 uH to several hundred uH with current ratings from a few amperes to tens of amperes. Used for energy storage, ripple filtering and EMI reduction in DC-DC converters, voltage regulator modules and power supplies", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Bourns", + "part_name": "magnetics -high current power inductors" + } + }, + { + "bol_metadata": { + "bol_description": "CB2X1.2X.9MM,60 25%5A,NON-SHDSMD-INDUCTOR", + "origin_country": "US", + "shipper": "bourns inc" + }, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850440", + "850450", + "850431", + "850490" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0420", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850450", + "id": "SH-0420", + "justification_text": "Inductors, chokes and ferrite-bead inductor components are classified under 8504.50. Classified under HS 8504.50.", + "reference_ruling_ids": [ + "CROSS-963137", + "EBTI-CZ-CZ21-0733-2010", + "CROSS-C82362" + ], + "segment": "component", + "split": "train", + "tier1_description": "Surface-mount ferrite chip bead in a 2.0 x 1.2 x 0.9 mm, non-shielded construction with approximately 60 ohm impedance at 100 MHz, +/-25% tolerance, and a 5 A current rating. A multilayer ferrite inductive component placed in series with power or signal lines to absorb high-frequency noise and suppress electromagnetic interference in power rails and high-speed digital circuits", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Bourns", + "part_name": "CB2X1.2X.9MM 60 25%5A" + } + }, + { + "bol_metadata": { + "bol_description": "INDUCTOR (F10X04)", + "origin_country": "US", + "shipper": "bourns, inc" + }, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850431", + "850440", + "850490", + "850450" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0421", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850450", + "id": "SH-0421", + "justification_text": "Inductors, chokes and ferrite-bead inductor components are classified under 8504.50. Classified under HS 8504.50.", + "reference_ruling_ids": [ + "CROSS-963137", + "EBTI-CZ-CZ21-0733-2010" + ], + "segment": "component", + "split": "train", + "tier1_description": "Fixed, supplied as two related custom part variants. Each consists of a copper winding on a ferrite or powdered-iron core, designed for energy storage and current smoothing. Components of this type are used in DC-DC converters, switching power supplies and filtering stages of industrial and consumer electronic equipment with inductance and current ratings set by the customer-specific drawing", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Bourns", + "part_name": "inductor (F10X04)" + } + }, + { + "bol_metadata": { + "bol_description": "FERRITE CORE 154 SET", + "origin_country": "US", + "shipper": "artesyn embedded technologies" + }, + "boundary_note": "Heading 8504 separates transformers (8504.31) from static converters (8504.40), inductors (8504.50) and parts (8504.90); the principle of electrical conversion decides.", + "candidate_set": { + "codes": [ + "850431", + "850490", + "850440", + "850450" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8504_power_splits" + ], + "frozen_id": "v2.0.train.0422", + "hs2_label": "85", + "hs4_label": "8504", + "hs6_label": "850490", + "id": "SH-0422", + "justification_text": "Dedicated parts of transformers, static converters or inductors are provided for in 8504.90. Classified under HS 8504.90.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "Soft ferrite magnetic cores supplied in sets of mating halves for assembly into transformers and inductors. Each core is a sintered ceramic body of manganese-zinc or nickel-zinc iron oxide, unmagnetized, shaped to accept a wound bobbin and form a closed magnetic circuit. The cores concentrate magnetic flux in switch-mode power supplies, chokes and EMI suppression components", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Artesyn Embedded Technologies", + "part_name": "ferrite core" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "851310", + "854231", + "850440", + "854442" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0423", + "hs2_label": "85", + "hs4_label": "8513", + "hs6_label": "851310", + "id": "SH-0423", + "justification_text": "The OPX-365 is a cordless rechargeable handheld lamp running off a built-in NiMH battery, which puts it in heading 8513.10 for portable electric lamps that work from their own power source. The UV-. Classified under HS 8513.10.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123003344", + "JP_CUSTOMS-123003376", + "JP_CUSTOMS-124003220" + ], + "segment": "end_product", + "split": "train", + "tier1_description": "Cordless rechargeable handheld inspection flashlight with 365 nm UV-A LED source, nominal intensity 18000 microwatt per cm2 at 38 cm, anodised aluminium body, NiMH battery giving 90 minutes per charge. Portable self contained lamp used for fluorescent penetrant inspection, leak tracing, and surface contamination checks. Part number OPX-365", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Spectronics Corporation (Spectro-UV)", + "part_name": "OPX-365" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "851310", + "854231", + "850440", + "854442" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0424", + "hs2_label": "85", + "hs4_label": "8513", + "hs6_label": "851310", + "id": "SH-0424", + "justification_text": "A handheld UV-A flashlight running on a built-in lithium-ion battery is a portable electric lamp powered by its own source, which is what heading 8513.10 covers. The 365 nm wavelength and NDT use a. Classified under HS 8513.10.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123003344", + "JP_CUSTOMS-123003376", + "JP_CUSTOMS-124003220" + ], + "segment": "end_product", + "split": "train", + "tier1_description": "Handheld battery operated UV-A inspection flashlight with 365 nm LED, intensity 10000 microwatt per cm2 at 38 cm, lithium ion battery providing four hours of continuous operation, supplied with charging cradle and spectacles. Portable lamp for nondestructive testing and fluorescence inspection. Part number OLX-365", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Spectronics Corporation (Spectro-UV)", + "part_name": "OLX-365" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "851310", + "854231", + "850440", + "854442" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0425", + "hs2_label": "85", + "hs4_label": "8513", + "hs6_label": "851310", + "id": "SH-0425", + "justification_text": "The internal black-light filter is built into the lamp body and doesn't change what the article is: a portable rechargeable electric lamp under heading 8513.10. It is still a self-contained lamp ru. Classified under HS 8513.10.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123003344", + "JP_CUSTOMS-123003376", + "JP_CUSTOMS-124003220" + ], + "segment": "end_product", + "split": "train", + "tier1_description": "Compact rechargeable UV-A LED flashlight with internal black light filter for enhanced fluorescence contrast, 365 nm output, rugged anodised body, lithium ion power. Self powered portable inspection lamp for penetrant and magnetic particle examination and cleanliness verification. Part number OLX-365B", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Spectronics Corporation (Spectro-UV)", + "part_name": "OLX-365B" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "851310", + "854231", + "850440", + "854442" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0426", + "hs2_label": "85", + "hs4_label": "8513", + "hs6_label": "851310", + "id": "SH-0426", + "justification_text": "Both the filter and the focusing optics are built into this handheld rechargeable unit, which is still a portable electric lamp under heading 8513.10. The focused beam is a performance feature, not. Classified under HS 8513.10.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123003344", + "JP_CUSTOMS-123003376", + "JP_CUSTOMS-124003220" + ], + "segment": "end_product", + "split": "train", + "tier1_description": "Battery powered handheld UV-A LED flashlight combining internal pass filter and focused beam optics for directed fluorescence inspection at 365 nm. Rechargeable portable lamp applied in nondestructive testing, resin curing checks, and contamination screening on production surfaces. Part number OLX-365BFL", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Spectronics Corporation (Spectro-UV)", + "part_name": "OLX-365BFL" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "851310", + "854231", + "850440", + "854442" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0427", + "hs2_label": "85", + "hs4_label": "8513", + "hs6_label": "851310", + "id": "SH-0427", + "justification_text": "The OPX-450 is a handheld rechargeable inspection lamp using the same body and battery format as the OPX-365 family, so it sits in heading 8513.10 as a portable lamp powered by its own source. The. Classified under HS 8513.10.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123003344", + "JP_CUSTOMS-123003376", + "JP_CUSTOMS-124003220" + ], + "segment": "end_product", + "split": "train", + "tier1_description": "Handheld rechargeable LED inspection flashlight in the OPTIMAX family with anodised aluminium housing and replaceable battery stick, sharing accessories with the 365 nm model. Portable self powered lamp for industrial fluorescence inspection tasks. Part number OPX-450", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Spectronics Corporation (Spectro-UV)", + "part_name": "OPX-450" + } + }, + { + "bol_metadata": { + "bol_description": "VAKUM FIRINI (EKİPMANLARI İLE BİRLİKTE KOMPLE)", + "origin_country": "CN", + "shipper": "beijing naura vacuum technology co.ltd" + }, + "boundary_note": "General industrial furnace or oven (8514.19) vs semiconductor processing equipment of Chapter 84 Note 11 (8486.20) for diffusion, oxidation, rapid thermal processing and annealing; the semiconductor-specific purpose decides.", + "candidate_set": { + "codes": [ + "854159", + "851310", + "854160", + "851419" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "furnace_boundary" + ], + "frozen_id": "v2.0.train.0428", + "hs2_label": "85", + "hs4_label": "8514", + "hs6_label": "851419", + "id": "SH-0428", + "justification_text": "Resistance-heated industrial or laboratory furnaces and ovens are classified under 8514.19. Classified under HS 8514.19.", + "reference_ruling_ids": [], + "segment": "equipment", + "split": "train", + "tier1_description": "Complete vacuum furnace supplied with its auxiliary equipment, for industrial heat treatment of metals and electronic materials. The system comprises a sealed water-cooled chamber with internal electric resistance heating elements and heat shields, vacuum pumping units, and programmable temperature and process control. Such furnaces perform brazing, annealing, sintering, and degassing of components under vacuum to prevent oxidation, serving sectors such as semiconductors, magnetic materials, and aerospace", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "NAURA", + "part_name": "vakum firini (EKİpmanlari İLE BİRLİKTE" + } + }, + { + "bol_metadata": { + "bol_description": "VACUUM HEAT TREATMENT FURNACE MODEL NO.RL-70-6 (OLD & USED MACHINE)", + "origin_country": "CN", + "shipper": "beijing yeke magnetic materials co" + }, + "boundary_note": "General industrial furnace or oven (8514.19) vs semiconductor processing equipment of Chapter 84 Note 11 (8486.20) for diffusion, oxidation, rapid thermal processing and annealing; the semiconductor-specific purpose decides.", + "candidate_set": { + "codes": [ + "854233", + "850431", + "854121", + "851419" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "furnace_boundary" + ], + "frozen_id": "v2.0.train.0429", + "hs2_label": "85", + "hs4_label": "8514", + "hs6_label": "851419", + "id": "SH-0429", + "justification_text": "Resistance-heated industrial or laboratory furnaces and ovens are classified under 8514.19. Classified under HS 8514.19.", + "reference_ruling_ids": [], + "segment": "equipment", + "split": "train", + "tier1_description": "Used industrial vacuum heat treatment furnace manufactured in 2012, of a type employed for sintering and annealing rare-earth permanent magnet materials. The unit consists of a sealed chamber evacuated by vacuum pumps and heated internally by electric resistance elements with refractory metal shielding, allowing oxidation-free sintering and tempering of pressed powder compacts and similar metal parts at temperatures around 1100 degrees Celsius under programmable control", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Beijing Yeke Magnetic Materials", + "part_name": "vacuum heat treatment furnace model" + } + }, + { + "bol_metadata": { + "bol_description": "LAB INSTRUMENTS:MUFFLE FURNACE SIZE:12X6X6", + "origin_country": "IN", + "shipper": "bio technics india" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "854160", + "854159", + "851419", + "854233" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0430", + "hs2_label": "85", + "hs4_label": "8514", + "hs6_label": "851419", + "id": "SH-0430", + "justification_text": "Resistance-heated industrial or laboratory furnaces and ovens are classified under 8514.19. Classified under HS 8514.19.", + "reference_ruling_ids": [], + "segment": "equipment", + "split": "train", + "tier1_description": "Laboratory muffle furnace with an internal chamber of about 12 by 6 by 6 inches, rated around 3500 watts. The rectangular horizontal unit has a thick-gauge powder-coated mild steel outer body, a refractory ceramic muffle heated by embedded electric resistance elements, insulation, and thermostatic or digital temperature control. Used for ashing, ignition tests, heat treating, and high-temperature processing of small samples in pharmaceutical, chemical, and materials laboratories", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Bio Technics India", + "part_name": "LAB instruments:muffle furnace" + } + }, + { + "bol_metadata": { + "bol_description": "MUFFLE FURNACE MX10-13TP", + "origin_country": "CN", + "shipper": "biobase biocare co.,ltd" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "851419", + "854149", + "851680", + "854231" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0431", + "hs2_label": "85", + "hs4_label": "8514", + "hs6_label": "851419", + "id": "SH-0431", + "justification_text": "Resistance-heated industrial or laboratory furnaces and ovens are classified under 8514.19. Classified under HS 8514.19.", + "reference_ruling_ids": [], + "segment": "equipment", + "split": "train", + "tier1_description": "Benchtop laboratory muffle furnace with a ceramic-fibre insulated chamber and a maximum operating temperature of 1300 degrees C. Heating is by nickel-chromium alloy resistance wire elements with programmable PID temperature control, settable ramp rates up to 30 degrees C per minute, over-temperature alarm and approximately 4 kW power draw. Used for ashing, ignition loss tests, sintering and general high-temperature sample treatment in laboratories", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "BIOBASE", + "part_name": "muffle furnace MX10-13TP" + } + }, + { + "bol_metadata": { + "bol_description": "HORNO SE FUSION GOLD MELTING DEVICE 220V GOLD MELTING DEVICE 220V BIOBASE BK-GMM03", + "origin_country": "CN", + "shipper": "bobase biotech jinan co ltd" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "850490", + "854159", + "851419", + "854129" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0432", + "hs2_label": "85", + "hs4_label": "8514", + "hs6_label": "851419", + "id": "SH-0432", + "justification_text": "Resistance-heated industrial or laboratory furnaces and ovens are classified under 8514.19. Classified under HS 8514.19.", + "reference_ruling_ids": [], + "segment": "equipment", + "split": "train", + "tier1_description": "Compact electric melting furnace for precious metals with a crucible capacity, operating on 220 V single-phase power. A graphite crucible sits inside a resistance-heated chamber reaching roughly 1100-1150 degrees C, sufficient to melt gold, silver and copper alloys with digital temperature control and crucible tongs. Used in jewellery workshops, assay laboratories and small refineries for melting and casting precious-metal scrap and granules", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "BIOBASE", + "part_name": "horno SE fusion gold melting device" + } + }, + { + "bol_metadata": { + "bol_description": "MUFFLE FURNACE TEMP 1200 DEG CEN", + "origin_country": "GB", + "shipper": "carbolite gero ltd" + }, + "boundary_note": "General industrial furnace or oven (8514.19) vs semiconductor processing equipment of Chapter 84 Note 11 (8486.20) for diffusion, oxidation, rapid thermal processing and annealing; the semiconductor-specific purpose decides.", + "candidate_set": { + "codes": [ + "851840", + "851419", + "854159", + "852691" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "furnace_boundary" + ], + "frozen_id": "v2.0.train.0433", + "hs2_label": "85", + "hs4_label": "8514", + "hs6_label": "851419", + "id": "SH-0433", + "justification_text": "Resistance-heated industrial or laboratory furnaces and ovens are classified under 8514.19. Classified under HS 8514.19.", + "reference_ruling_ids": [], + "segment": "equipment", + "split": "train", + "tier1_description": "Electric laboratory chamber furnace with a maximum operating temperature of 1200 degrees C. The insulated refractory chamber is heated by wire resistance elements embedded in carrier plates with a programmable PID controller, thermocouple sensing and over-temperature protection. Designed for bench mounting and used for ashing, annealing, sintering, heat treatment and materials testing of small samples in industrial and research laboratories", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Carbolite Gero", + "part_name": "muffle furnace temp 1200 DEG CEN" + } + }, + { + "bol_metadata": { + "bol_description": "Heating furnace, for laboratory use 230V. Code: -230SN 230SN TS1 12/60/300. 100% new. Carbolite brand (1 set =)", + "origin_country": "GB", + "shipper": "carbolite gero ltd" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "851419", + "854129", + "854130", + "854149" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0434", + "hs2_label": "85", + "hs4_label": "8514", + "hs6_label": "851419", + "id": "SH-0434", + "justification_text": "Resistance-heated industrial or laboratory furnaces and ovens are classified under 8514.19. Classified under HS 8514.19.", + "reference_ruling_ids": [], + "segment": "equipment", + "split": "train", + "tier1_description": "Single-zone split tube furnace for laboratory use, 230 V with a maximum temperature of 1200 degrees C, a 60 mm tube diameter and a 300 mm heated length. Free-radiating resistance wire elements are embedded in vacuum-formed insulation in a hinged split body that opens around the work tube; a digital programmer provides multi-segment temperature control. Used for materials research, calcination and heat treatment of samples in controlled or ambient atmospheres", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Carbolite Gero", + "part_name": "Heating furnace for laboratory use" + } + }, + { + "bol_metadata": { + "bol_description": "FAN ASSISTED OVENAX060 220-240V 1PH", + "origin_country": "GB", + "shipper": "carbolite gero ltd" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "850431", + "851419", + "854442", + "854129" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0435", + "hs2_label": "85", + "hs4_label": "8514", + "hs6_label": "851419", + "id": "SH-0435", + "justification_text": "Resistance-heated industrial or laboratory furnaces and ovens are classified under 8514.19. Classified under HS 8514.19.", + "reference_ruling_ids": [], + "segment": "equipment", + "split": "train", + "tier1_description": "Bench-top laboratory oven with a stainless-steel-lined chamber, 220-240 V single-phase supply and a maximum operating temperature of 250 degrees C. Fan-assisted convection circulates air heated by electric resistance elements for rapid heat-up and good temperature uniformity, controlled by a digital PID controller with two adjustable wire shelves. Used for drying, curing, conditioning and general sample heating in laboratories", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Carbolite Gero", + "part_name": "FAN assisted OVENAX060 220-240V 1PH" + } + }, + { + "bol_metadata": { + "bol_description": "CHAMBER FURNACECWF 11/13 220-240 1PH", + "origin_country": "GB", + "shipper": "carbolite gero ltd" + }, + "boundary_note": "General industrial furnace or oven (8514.19) vs semiconductor processing equipment of Chapter 84 Note 11 (8486.20) for diffusion, oxidation, rapid thermal processing and annealing; the semiconductor-specific purpose decides.", + "candidate_set": { + "codes": [ + "850450", + "854233", + "851680", + "851419" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "furnace_boundary" + ], + "frozen_id": "v2.0.train.0436", + "hs2_label": "85", + "hs4_label": "8514", + "hs6_label": "851419", + "id": "SH-0436", + "justification_text": "Resistance-heated industrial or laboratory furnaces and ovens are classified under 8514.19. Classified under HS 8514.19.", + "reference_ruling_ids": [], + "segment": "equipment", + "split": "train", + "tier1_description": "General-purpose bench-mounted laboratory chamber furnace with a chamber (about 200 x 200 x 325 mm internal), 220-240 V single-phase supply, maximum temperature 1100 degrees C and roughly 3.1 kW power draw. Resistance heating elements on both side walls are protected by alumina tiles for uniform heating with digital PID control and optional program segments. Used for ashing, ignition tests, annealing and general heat treatment of laboratory samples", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Carbolite Gero", + "part_name": "chamber furnacecwf 11/13 220-240 1PH" + } + }, + { + "bol_metadata": { + "bol_description": "CONVEYOR FURNACE MACHINEMODEL C.DCB-17000-400 N2-AIRQUANTITY: 2 UNITSI", + "origin_country": "Germany", + "shipper": "centrotherm international ag" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "853890", + "850450", + "851419", + "854149" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0437", + "hs2_label": "85", + "hs4_label": "8514", + "hs6_label": "851419", + "id": "SH-0437", + "justification_text": "Resistance-heated industrial or laboratory furnaces and ovens are classified under 8514.19. Classified under HS 8514.19.", + "reference_ruling_ids": [], + "segment": "equipment", + "split": "train", + "tier1_description": "Industrial conveyor (belt) furnace designed for direct copper bonding of copper foil to ceramic substrates used in power electronic modules. Workpieces travel on a continuous conveyor through resistance-heated zones operated under controlled nitrogen and air atmospheres at peak temperatures near the copper-oxide eutectic point with PLC-based monitoring of all process parameters. Model designation indicates an extended heated length and 400 mm working width; comprises two units", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Centrotherm International", + "part_name": "conveyor furnace machinemodel" + } + }, + { + "bol_metadata": { + "bol_description": "MUFFLE FURNACE VOLTAJE 120V 60 HZ MUFFLE FURNACE GB1 122 PAD P H 27 02 25 N 196 HOBERSAL GB1 122", + "origin_country": "ES", + "shipper": "forns hobersal, s.l" + }, + "boundary_note": "General industrial furnace or oven (8514.19) vs semiconductor processing equipment of Chapter 84 Note 11 (8486.20) for diffusion, oxidation, rapid thermal processing and annealing; the semiconductor-specific purpose decides.", + "candidate_set": { + "codes": [ + "854143", + "854190", + "852491", + "851419" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "furnace_boundary" + ], + "frozen_id": "v2.0.train.0438", + "hs2_label": "85", + "hs4_label": "8514", + "hs6_label": "851419", + "id": "SH-0438", + "justification_text": "Resistance-heated industrial or laboratory furnaces and ovens are classified under 8514.19. Classified under HS 8514.19.", + "reference_ruling_ids": [], + "segment": "equipment", + "split": "train", + "tier1_description": "Compact table-top laboratory muffle furnace operating on 120 V, 60 Hz with a maximum temperature of 1200 degrees C. The chamber is built from low-thermal-mass ceramic brick and fibre insulation and heated on two sides by iron-chromium-aluminium resistance heating plates with a type K thermocouple, microprocessor-based digital controller and solid-state relay. Used for ashing, calcination, annealing and general high-temperature laboratory work", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Hobersal", + "part_name": "muffle furnace voltaje 120V 60 HZ" + } + }, + { + "bol_metadata": { + "bol_description": "MUFFLE FURNACE VOLTAJE 120V 60 HZ MUFFLE FURNACE XB2 115 PAD P H 16 12 24 N 120 HOBERSAL XB2 115", + "origin_country": "ES", + "shipper": "forns hobersal, s.l" + }, + "boundary_note": "General industrial furnace or oven (8514.19) vs semiconductor processing equipment of Chapter 84 Note 11 (8486.20) for diffusion, oxidation, rapid thermal processing and annealing; the semiconductor-specific purpose decides.", + "candidate_set": { + "codes": [ + "852351", + "851419", + "854141", + "854159" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "furnace_boundary" + ], + "frozen_id": "v2.0.train.0439", + "hs2_label": "85", + "hs4_label": "8514", + "hs6_label": "851419", + "id": "SH-0439", + "justification_text": "Resistance-heated industrial or laboratory furnaces and ovens are classified under 8514.19. Classified under HS 8514.19.", + "reference_ruling_ids": [], + "segment": "equipment", + "split": "train", + "tier1_description": "Table-top laboratory muffle furnace operating on 120 V, 60 Hz with a maximum chamber temperature of about 1100 degrees C. The refractory-insulated chamber is heated by metallic resistance elements with thermocouple sensing, a digital microprocessor temperature controller and solid-state power switching. Intended for ashing, ignition-loss testing, calcination, annealing and other routine high-temperature treatments of small samples in quality-control and research laboratories", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Hobersal", + "part_name": "muffle furnace voltaje 120V 60 HZ" + } + }, + { + "bol_metadata": { + "bol_description": "FURNACE WITH HEATING CHAMBER", + "origin_country": "IT", + "shipper": "gb flli bertoncello srl" + }, + "boundary_note": "General industrial furnace or oven (8514.19) vs semiconductor processing equipment of Chapter 84 Note 11 (8486.20) for diffusion, oxidation, rapid thermal processing and annealing; the semiconductor-specific purpose decides.", + "candidate_set": { + "codes": [ + "851419", + "851840", + "851680", + "851310" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "furnace_boundary" + ], + "frozen_id": "v2.0.train.0440", + "hs2_label": "85", + "hs4_label": "8514", + "hs6_label": "851419", + "id": "SH-0440", + "justification_text": "Resistance-heated industrial or laboratory furnaces and ovens are classified under 8514.19. Classified under HS 8514.19.", + "reference_ruling_ids": [], + "segment": "equipment", + "split": "train", + "tier1_description": "Industrial electric furnace with a heating chamber, of the conveyor-belt type used for braze-soldering and heat treatment of small metal articles such as jewellery, watch components, eyewear parts and other manufactured goods. Workpieces pass on a continuous belt through a pre-heating chamber and resistance-heated hot zone, optionally under protective atmosphere with thermostatic zone control for repeatable brazing, annealing and stress-relieving cycles", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "G.B. F.lli Bertoncello", + "part_name": "furnace with heating chamber" + } + }, + { + "bol_metadata": { + "bol_description": "HORNO ELECTRICO HORNO ELECTRICO SIN MARCA DMT-PHOENIX CHAMBER", + "origin_country": "CN", + "shipper": "henan dming technology co ltd" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "854231", + "850490", + "851419", + "854130" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0441", + "hs2_label": "85", + "hs4_label": "8514", + "hs6_label": "851419", + "id": "SH-0441", + "justification_text": "Resistance-heated industrial or laboratory furnaces and ovens are classified under 8514.19. Classified under HS 8514.19.", + "reference_ruling_ids": [], + "segment": "equipment", + "split": "train", + "tier1_description": "Electric chamber furnace for laboratory and dental-ceramic use. The compact unit encloses a refractory-insulated firing chamber heated by electric resistance elements with a digital programmable controller managing ramp, soak and cooling stages at firing temperatures up to about 1200 degrees C. Used for firing and glazing dental porcelain restorations and for general small-sample heat treatment, ashing and sintering work", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Henan Dming Technology", + "part_name": "horno electrico horno electrico SIN" + } + }, + { + "bol_metadata": { + "bol_description": "INDUSTRIAL OR LABORATORY ELECTRIC FURNACES AN D OVE - GLASS PROCESSING MACHINERY", + "origin_country": "IT", + "shipper": "keraglass srl" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "851419", + "854142", + "854141", + "854143" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0442", + "hs2_label": "85", + "hs4_label": "8514", + "hs6_label": "851419", + "id": "SH-0442", + "justification_text": "Resistance-heated industrial or laboratory furnaces and ovens are classified under 8514.19. Classified under HS 8514.19.", + "reference_ruling_ids": [], + "segment": "equipment", + "split": "train", + "tier1_description": "Industrial electric furnace for flat-glass processing, used for thermal treatments such as tempering, bending or decoration firing of glass sheets. The machine heats glass in an insulated chamber with electric resistance elements combining radiation and convection heating with electronic control of temperature profiles to achieve uniform heating and high optical quality in the finished glass. Designed for continuous or oscillating production lines", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Keraglass", + "part_name": "industrial or laboratory electric" + } + }, + { + "bol_metadata": { + "bol_description": "INDUSTRIAL OR LABORATORY ELECTRIC FURNACES AN D OVE - TC 3200-LEMA CHEMICAL TEMPERING OVEN HARMONIZED CODE :8514", + "origin_country": "IT", + "shipper": "lema srl" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "854151", + "854370", + "852691", + "851419" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0443", + "hs2_label": "85", + "hs4_label": "8514", + "hs6_label": "851419", + "id": "SH-0443", + "justification_text": "Resistance-heated industrial or laboratory furnaces and ovens are classified under 8514.19. Classified under HS 8514.19.", + "reference_ruling_ids": [], + "segment": "equipment", + "split": "train", + "tier1_description": "Industrial electric oven for the chemical tempering of glass, principally optical lenses and flat glass up to about 700 x 430 mm. It contains a stainless steel tank of molten potassium salt heated by electric resistors (about 16-22 kW installed) with bath temperature uniformity of roughly +/-5 C, performing ion-exchange strengthening cycles automatically without operator intervention during the cycle", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "LEMA", + "part_name": "industrial or laboratory electric" + } + }, + { + "bol_metadata": { + "bol_description": "MUFFLE FURNACE", + "origin_country": "IN", + "shipper": "mvtex science industries" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "854121", + "851419", + "854159", + "854190" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0444", + "hs2_label": "85", + "hs4_label": "8514", + "hs6_label": "851419", + "id": "SH-0444", + "justification_text": "Resistance-heated industrial or laboratory furnaces and ovens are classified under 8514.19. Classified under HS 8514.19.", + "reference_ruling_ids": [], + "segment": "equipment", + "split": "train", + "tier1_description": "Laboratory muffle furnace, an electrically heated box furnace in which resistance heating elements surround an insulated refractory chamber, isolating samples from direct contact with the elements. Typical units reach 900-1200 C and are used for ashing, ignition tests, heat treatment and sample calcination in laboratories with a hinged door and a thermostatic or digital temperature controller", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "MVTEX Science Industries", + "part_name": "muffle furnace" + } + }, + { + "bol_metadata": { + "bol_description": "RHTC 80/450/16 WITH CONTROLLER P 580 RC283 WANT - HIGH-TEMPERATURE TUBE FURNACE (1SET)", + "origin_country": "DE", + "shipper": "nabertherm gmbh" + }, + "boundary_note": "General industrial furnace or oven (8514.19) vs semiconductor processing equipment of Chapter 84 Note 11 (8486.20) for diffusion, oxidation, rapid thermal processing and annealing; the semiconductor-specific purpose decides.", + "candidate_set": { + "codes": [ + "854129", + "851419", + "854141", + "852351" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "furnace_boundary" + ], + "frozen_id": "v2.0.train.0445", + "hs2_label": "85", + "hs4_label": "8514", + "hs6_label": "851419", + "id": "SH-0445", + "justification_text": "Resistance-heated industrial or laboratory furnaces and ovens are classified under 8514.19. Classified under HS 8514.19.", + "reference_ruling_ids": [], + "segment": "equipment", + "split": "train", + "tier1_description": "High-temperature laboratory tube furnace with silicon carbide rod heating elements arranged parallel to the working tube, reaching a maximum temperature of 1600 C (working temperature 1500 C). It has a 450 mm heated tube length with an 80 mm tube diameter, about 11 kW connected load, integrated switchgear with programmable controller, and a dual-shell stainless steel housing; used for sintering, annealing and atmosphere processing of materials", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Nabertherm", + "part_name": "rhtc 80/450/16 with controller P 580" + } + }, + { + "bol_metadata": { + "bol_description": "LT 24/12 with Controller C -244H2ON2T Electrically heated muffle furnace with lift doorLT 24/12 with Controller C -244H2ON2T (SL NO-)", + "origin_country": "DE", + "shipper": "nabertherm gmbh" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "851419", + "851840", + "853669", + "854160" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0446", + "hs2_label": "85", + "hs4_label": "8514", + "hs6_label": "851419", + "id": "SH-0446", + "justification_text": "Resistance-heated industrial or laboratory furnaces and ovens are classified under 8514.19. Classified under HS 8514.19.", + "reference_ruling_ids": [], + "segment": "equipment", + "split": "train", + "tier1_description": "Electrically heated laboratory muffle furnace with a chamber, maximum temperature 1200 C, fitted with a vertical lift door that keeps the hot surface away from the operator and a programmable controller offering multiple programs and segments. It features a dual-shell stainless steel housing, adjustable air inlet and exhaust outlet, and is used for ashing, heat treatment and materials testing", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Nabertherm", + "part_name": "LT 24/12 with Controller C -244H2ON2T" + } + }, + { + "bol_metadata": { + "bol_description": "Resistance heat treatment furnace for training, Model: LH30/13/B500, Manufacturer:, 100% new", + "origin_country": "DE", + "shipper": "nabertherm gmbh" + }, + "boundary_note": "General industrial furnace or oven (8514.19) vs semiconductor processing equipment of Chapter 84 Note 11 (8486.20) for diffusion, oxidation, rapid thermal processing and annealing; the semiconductor-specific purpose decides.", + "candidate_set": { + "codes": [ + "854160", + "851419", + "854121", + "854233" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "furnace_boundary" + ], + "frozen_id": "v2.0.train.0447", + "hs2_label": "85", + "hs4_label": "8514", + "hs6_label": "851419", + "id": "SH-0447", + "justification_text": "Resistance-heated industrial or laboratory furnaces and ovens are classified under 8514.19. Classified under HS 8514.19.", + "reference_ruling_ids": [], + "segment": "equipment", + "split": "train", + "tier1_description": "Professional laboratory chamber furnace for heat treatment training with a chamber (inner dimensions about 320 x 320 x 320 mm), maximum temperature 1300 C and roughly 8 kW connected load. Heating elements on support tubes give five-sided heating with very good temperature uniformity with multi-layer refractory brick insulation and a programmable controller; supplied new, used for annealing, hardening and tempering of metal samples", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Nabertherm", + "part_name": "Resistance heat treatment furnace for" + } + }, + { + "bol_metadata": { + "bol_description": "RESISTANCE OVEN WITH INDIRECT HEATING LE 6/11/R7 LE062K17N1 ELECTRICALLY HEATED MUFFLE FURNACE ATTACHED AND PACKING LIST ATTACHED FDA LTO LIC NO CDRRHR-NCR-MDI-36029", + "origin_country": "DE", + "shipper": "nabertherm gmbh" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "850431", + "851419", + "854141", + "851840" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0448", + "hs2_label": "85", + "hs4_label": "8514", + "hs6_label": "851419", + "id": "SH-0448", + "justification_text": "Resistance-heated industrial or laboratory furnaces and ovens are classified under 8514.19. Classified under HS 8514.19.", + "reference_ruling_ids": [], + "segment": "equipment", + "split": "train", + "tier1_description": "Compact laboratory muffle furnace with indirect resistance heating, chamber and maximum temperature 1100 C (working temperature about 1050 C), weighing. Heating elements encased in quartz glass tubes heat the chamber from two sides; the unit has multi-layer fibre-plate insulation, a dual-shell textured stainless steel housing, a flap door usable as a work platform, rear exhaust outlet and a single-setpoint controller, used for ashing and heat treatment", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Nabertherm", + "part_name": "resistance oven with indirect heating" + } + }, + { + "bol_metadata": { + "bol_description": "HEATING ELEMENTS ELEMENTOS CALEFACTORES BACKER 222D2094P002", + "origin_country": "US", + "shipper": "backer ehp inc" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "851762", + "854143", + "851680", + "854142" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0449", + "hs2_label": "85", + "hs4_label": "8516", + "hs6_label": "851680", + "id": "SH-0449", + "justification_text": "Electric heating resistors and heating elements are covered by 8516.80. Classified under HS 8516.80.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "Electric tubular heating elements consisting of a coiled nickel-chromium resistance wire embedded in compacted magnesium oxide insulation inside a formed metal sheath with terminal pins for electrical connection. Such elements convert electrical energy directly into heat and are fitted into appliances and equipment such as ranges, ovens, dryers, and industrial heating apparatus as the primary heat source", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Backer EHP", + "part_name": "heating elements elementos calefactores" + } + }, + { + "bol_metadata": { + "bol_description": "8AI/5DI/4DO IOT I/O GATEWAY WITH NODE-RE-CIRCUIT MODULE", + "origin_country": "TW", + "shipper": "advantech co ltd" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "854130", + "854239", + "851762", + "854160" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0450", + "hs2_label": "85", + "hs4_label": "8517", + "hs6_label": "851762", + "id": "SH-0450", + "justification_text": "A Linux I/O gateway with processor, storage and networking is a processing unit of 8471.50, not merely an ADP accessory of 8473.30. Classified under HS 8517.62.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123003822", + "JP_CUSTOMS-123003823" + ], + "segment": "end_product", + "split": "train", + "tier1_description": "A compact Linux-based intelligent input/output gateway for edge data acquisition with eight analog input channels, five digital inputs and four digital outputs. It is programmable via a graphical flow-based environment or C API, performs edge logic, data logging and dashboard visualization, and transmits acquired field data to networks or cloud platforms through dual Ethernet ports, two RS-485 interfaces and USB connections", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Advantech", + "part_name": "8AI/5DI/4DO IOT I/O gateway with" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "854239", + "851762", + "851310", + "850450" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0451", + "hs2_label": "85", + "hs4_label": "8517", + "hs6_label": "851762", + "id": "SH-0451", + "justification_text": "The item is a CAN/RS485 communication interface board for data transmission. Heading 8517, subheading 851762 covers apparatus for communication in wired networks, not ADP accessories. Classified under HS 8517.62.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123002266", + "JP_CUSTOMS-123003822", + "JP_CUSTOMS-123003823" + ], + "segment": "end_product", + "split": "train", + "tier1_description": "RS485 and CAN bus communication expansion board in 40-pin HAT form factor for single-board computers, with onboard CAN controller over SPI plus CAN and RS485 transceivers, half-duplex RS485 with automatic TX/RX control, and TVS surge/transient protection (MPN: WAV-14882)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Waveshare", + "part_name": "WAV-14882" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "854159", + "850490", + "851762", + "854149" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0452", + "hs2_label": "85", + "hs4_label": "8517", + "hs6_label": "851762", + "id": "SH-0452", + "justification_text": "The item is a cellular/GNSS/Bluetooth communication HAT. Heading 8517, subheading 851762 covers apparatus for transmission or reception of data in wired or wireless networks. Classified under HS 8517.62.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123002266", + "JP_CUSTOMS-123003822", + "JP_CUSTOMS-123003823" + ], + "segment": "end_product", + "split": "train", + "tier1_description": "Multi-function cellular communication daughter board for a 40-pin single-board computer combining GSM/GPRS, GNSS positioning and Bluetooth, with 1.8V/3V SIM card slot, onboard 3.5mm audio connector and a real-time clock; supports voice calls, SMS, mobile data and GPS/GLONASS/Compass positioning (MPN: WAV-13460)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Waveshare", + "part_name": "WAV-13460" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "854141", + "851762", + "853650", + "854130" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0453", + "hs2_label": "85", + "hs4_label": "8517", + "hs6_label": "851762", + "id": "SH-0453", + "justification_text": "The item is a LoRa radio transceiver data module. Heading 8517, subheading 851762 covers wireless data communication apparatus, not ADP accessories. Classified under HS 8517.62.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123002266", + "JP_CUSTOMS-123003822", + "JP_CUSTOMS-123003823" + ], + "segment": "end_product", + "split": "train", + "tier1_description": "433MHz LoRa transceiver expansion board for a 40-pin single-board computer using spread-spectrum modulation for data transmission up to 5km over the serial port, with auto-repeating, wake-on-radio, carrier sensing and wireless configuration for long-range IoT networking (MPN: WAV-16804)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Waveshare", + "part_name": "WAV-16804" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "853890", + "851762", + "853669", + "854141" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0454", + "hs2_label": "85", + "hs4_label": "8517", + "hs6_label": "851762", + "id": "SH-0454", + "justification_text": "The item is a LTE/3G/2G/GNSS communication HAT. Heading 8517, subheading 851762 covers network communication apparatus, not ADP accessories. Classified under HS 8517.62.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123003822", + "JP_CUSTOMS-123003823" + ], + "segment": "end_product", + "split": "train", + "tier1_description": "LTE Cat-1 cellular communication expansion board (daughter board) for single-board computers, providing LTE-TDD (B38/B40/B41), 3G UMTS/HSPA+ and 2G GSM/GPRS/EDGE connectivity plus 16-channel GNSS (GPS/BeiDou/GLONASS) positioning; supports dial-up, SMS, TCP/UDP, HTTP and FTP via onboard USB and CP2102 USB-to-UART interface (MPN: WAV-17954)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Waveshare", + "part_name": "WAV-17954" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "851310", + "854231", + "854151", + "851762" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0455", + "hs2_label": "85", + "hs4_label": "8517", + "hs6_label": "851762", + "id": "SH-0455", + "justification_text": "The item is an NB-IoT cellular data communication HAT. Heading 8517, subheading 851762 covers wireless network communication apparatus. Classified under HS 8517.62.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123002266", + "JP_CUSTOMS-123003822", + "JP_CUSTOMS-123003823" + ], + "segment": "end_product", + "split": "train", + "tier1_description": "NB-IoT cellular communication expansion board (daughter board) for single-board computers, supporting multi-band NB-IoT (B1-B28) operation at uplink data rates up to 159 Kbps; 5V supply, 3.3V/5V logic, idle current ~4 mA. Handles TCP, UDP, LWM2M, CoAP, DNS, HTTP(S), MQTT(S) and TLS/SSL network protocols for low-power IoT connectivity (MPN: WAV-25349)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Waveshare", + "part_name": "WAV-25349" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "854110", + "851762", + "853610", + "854129" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0456", + "hs2_label": "85", + "hs4_label": "8517", + "hs6_label": "851762", + "id": "SH-0456", + "justification_text": "The item transmits, receives, or converts data in a wired or wireless network, such as Bluetooth, Ethernet, LoRa, or cellular. Heading 8517, subheading 851762 covers such communication apparatus. Classified under HS 8517.62.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123002266", + "JP_CUSTOMS-123003822", + "JP_CUSTOMS-123003823" + ], + "segment": "end_product", + "split": "train", + "tier1_description": "Bluetooth Low Energy UART communication module/breakout board for microcontrollers; provides a serial (UART) data link with hardware flow control for wireless connection to mobile devices; for embedded networking applications (MPN: ADA2479)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit", + "part_name": "ADA2479" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "854129", + "852351", + "851310", + "851762" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0457", + "hs2_label": "85", + "hs4_label": "8517", + "hs6_label": "851762", + "id": "SH-0457", + "justification_text": "The item transmits, receives, or converts data in a wired or wireless network, such as Bluetooth, Ethernet, LoRa, or cellular. Heading 8517, subheading 851762 covers such communication apparatus. Classified under HS 8517.62.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123003822", + "JP_CUSTOMS-123003823" + ], + "segment": "end_product", + "split": "train", + "tier1_description": "USB Bluetooth Low Energy (BLE 4.0) sniffer/capture module based on an nRF51822 RF SoC; passively receives BLE traffic and streams captured packets to a host for protocol analysis; firmware-reprogrammable via J-Link (MPN: ADA2269)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit", + "part_name": "ADA2269" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "854149", + "854151", + "854141", + "851762" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0458", + "hs2_label": "85", + "hs4_label": "8517", + "hs6_label": "851762", + "id": "SH-0458", + "justification_text": "The item transmits, receives, or converts data in a wired or wireless network, such as Bluetooth, Ethernet, LoRa, or cellular. Heading 8517, subheading 851762 covers such communication apparatus. Classified under HS 8517.62.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123002266", + "JP_CUSTOMS-123003822", + "JP_CUSTOMS-123003823" + ], + "segment": "end_product", + "split": "train", + "tier1_description": "Bluetooth Low Energy communication module/breakout board for microcontrollers using a 4-5 wire SPI interface (MISO, MOSI, SCK, CS, optional interrupt); supports UART-over-BLE service, AT command control and OTA firmware updates for embedded wireless links (MPN: ADA2633)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit", + "part_name": "ADA2633" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "851762", + "852351", + "852491", + "854442" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0459", + "hs2_label": "85", + "hs4_label": "8517", + "hs6_label": "851762", + "id": "SH-0459", + "justification_text": "The item transmits, receives, or converts data in a wired or wireless network, such as Bluetooth, Ethernet, LoRa, or cellular. Heading 8517, subheading 851762 covers such communication apparatus. Classified under HS 8517.62.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123002266", + "JP_CUSTOMS-123003822", + "JP_CUSTOMS-123003823" + ], + "segment": "end_product", + "split": "train", + "tier1_description": "Bluetooth 2.0 wireless serial communication module for microcontroller boards; dual-board design with onboard antenna, wide DC supply input (3.5-8V) plus 3.3V rail, status/link LED indicators and DIP pin interface for embedded wireless data transfer (MPN: TEL0026)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "DFRobot", + "part_name": "TEL0026" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "851762", + "853610", + "854129", + "853669" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0460", + "hs2_label": "85", + "hs4_label": "8517", + "hs6_label": "851762", + "id": "SH-0460", + "justification_text": "The item transmits, receives, or converts data in a wired or wireless network, such as Bluetooth, Ethernet, LoRa, or cellular. Heading 8517, subheading 851762 covers such communication apparatus. Classified under HS 8517.62.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123002266", + "JP_CUSTOMS-123003822", + "JP_CUSTOMS-123003823" + ], + "segment": "end_product", + "split": "train", + "tier1_description": "Handheld LoRa mesh-network radio transceiver with integrated GPS; built on a 240MHz dual-core 32-bit SoC (512KB SRAM, 8MB PSRAM, 4MB flash) with an SX1262 sub-GHz LoRa transceiver and BLE 5.0; 1.54-inch 200x200 monochrome E-Ink display; mesh-networking firmware preinstalled (MPN: ELILM13205D1)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Elecrow", + "part_name": "ELILM13205D1" + } + }, + { + "bol_metadata": null, + "boundary_note": "Audio-frequency amplifier apparatus (8518.40) vs amplifier integrated circuit (8542.33) vs other electrical machine with individual function (8543.70); apparatus vs component and the signal domain decide.", + "candidate_set": { + "codes": [ + "854130", + "854149", + "854159", + "851840" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "amplifier_boundary" + ], + "frozen_id": "v2.0.train.0461", + "hs2_label": "85", + "hs4_label": "8518", + "hs6_label": "851840", + "id": "SH-0461", + "justification_text": "The item is an audio-frequency Class D amplifier module. Heading 8518, subheading 851840 specifically covers audio-frequency electric amplifiers, not residual 8543. Classified under HS 8518.40.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "Mono Class D audio power amplifier module on a PCB, delivering up to 2.5 W into 4-8 ohm speakers from a 2.0-5.5 VDC supply, with over 90% efficiency, onboard volume trim potentiometer (24 dB default gain), and built-in thermal and over-current protection (MPN: ADA2130)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit", + "part_name": "ADA2130" + } + }, + { + "bol_metadata": { + "bol_description": "INTERNAL SSD AGAMMIXS70B CS ADATA GAMMIX 70 BLADE-512GB-COLOR BOX SEPARATED (PARTS FOR COMPUTER)(BRAND-XPG)PARTS FOR COMPUTER SYSTEMS", + "origin_country": "TW", + "shipper": "adata technology co ltd" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "852351", + "853890", + "854142", + "854160" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0462", + "hs2_label": "85", + "hs4_label": "8523", + "hs6_label": "852351", + "id": "SH-0462", + "justification_text": "Solid-state non-volatile storage devices, including SSD and flash storage goods, fall under 8523.51. Classified under HS 8523.51.", + "reference_ruling_ids": [ + "CROSS-N264697", + "CROSS-N302571", + "CROSS-N214920", + "CROSS-N264692", + "CROSS-N264694", + "CROSS-H168206", + "CROSS-H296912", + "CROSS-N048655", + "CROSS-N352864" + ], + "segment": "component", + "split": "train", + "tier1_description": "Internal solid-state drive of 512 GB capacity in M.2 2280 format with a PCIe Gen4 x4 NVMe interface, 3D NAND flash and a thin aluminium heat spreader. Sequential performance reaches about 7,400 MB/s read and 6,800 MB/s write with random performance up to 750K IOPS, supporting AES 256-bit encryption and end-to-end data protection. Fitted in personal computers and game consoles as non-volatile mass storage", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "ADATA", + "part_name": "internal SSD AGAMMIXS70B CS gammix 70" + } + }, + { + "bol_metadata": { + "bol_description": "INTERNAL SSD SMAR-980B-1TCS SSD MARS 980 BLADE 1TB COLOR BOXSEPARATED (PARTS FOR COMPUTER)(BRAND-XPG)PARTS FOR COMPUTER SYSTEMS", + "origin_country": "TW", + "shipper": "adata technology co ltd" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "852351", + "853610", + "850490", + "854141" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0463", + "hs2_label": "85", + "hs4_label": "8523", + "hs6_label": "852351", + "id": "SH-0463", + "justification_text": "Solid-state non-volatile storage devices, including SSD and flash storage goods, fall under 8523.51. Classified under HS 8523.51.", + "reference_ruling_ids": [ + "CROSS-N264697", + "CROSS-N302571", + "CROSS-N214920", + "CROSS-N264692", + "CROSS-N264694", + "CROSS-H168206", + "CROSS-H296912", + "CROSS-N048655", + "CROSS-N352864" + ], + "segment": "component", + "split": "train", + "tier1_description": "Internal solid-state drive of 1 TB capacity in M.2 2280 format using the PCIe Gen5 x4 NVMe 2.0 interface with 232-layer 3D TLC NAND flash and a DRAM cache, packaged in retail color boxes. Sequential transfer rates reach approximately 14,000 MB/s read and 13,000 MB/s write with random performance up to 2,000K IOPS and endurance around 740 TB written per terabyte of capacity. Installed in desktop and notebook computers or game consoles as non-volatile mass storage", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "ADATA", + "part_name": "internal SSD smar-980B-1TCS SSD mars" + } + }, + { + "bol_metadata": { + "bol_description": "SSD FLASH DRIVE", + "origin_country": "TW", + "shipper": "apacer technology inc" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "854149", + "852351", + "854129", + "854141" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0464", + "hs2_label": "85", + "hs4_label": "8523", + "hs6_label": "852351", + "id": "SH-0464", + "justification_text": "Solid-state non-volatile storage devices, including SSD and flash storage goods, fall under 8523.51. Classified under HS 8523.51.", + "reference_ruling_ids": [ + "CROSS-N264697", + "CROSS-N302571", + "CROSS-N048655", + "CROSS-N214920", + "CROSS-N264692", + "CROSS-N264694", + "CROSS-H168206", + "CROSS-H296912", + "CROSS-N028332" + ], + "segment": "component", + "split": "train", + "tier1_description": "Solid-state drive built from non-volatile NAND flash memory chips and a controller mounted on a printed circuit board within a standard drive form factor such as 2.5-inch SATA or M.2. The device stores data electronically with no moving parts, offering fast access times, low power draw and shock resistance, and is installed in computers and embedded or industrial systems as primary or auxiliary mass storage in capacities from tens of gigabytes to several terabytes", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Apacer", + "part_name": "SSD flash drive" + } + }, + { + "bol_metadata": { + "bol_description": "USB 3.2 GEN 1 FLASH DRIVE", + "origin_country": "TW", + "shipper": "apacer technology inc" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "854159", + "854233", + "854442", + "852351" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0465", + "hs2_label": "85", + "hs4_label": "8523", + "hs6_label": "852351", + "id": "SH-0465", + "justification_text": "Solid-state non-volatile storage devices, including SSD and flash storage goods, fall under 8523.51. Classified under HS 8523.51.", + "reference_ruling_ids": [ + "CROSS-N214920", + "CROSS-N264694", + "CROSS-H168206", + "CROSS-N048655", + "CROSS-N264692", + "CROSS-N028332", + "CROSS-N264697", + "CROSS-N302571" + ], + "segment": "component", + "split": "train", + "tier1_description": "Portable flash memory storage device with a USB 3.2 Gen 1 interface, containing NAND flash chips and a controller in a small plastic or metal casing with a standard Type-A connector. It functions as removable non-volatile storage for transferring and backing up files between computers and other host equipment with interface transfer rates up to 5 Gbit/s and capacities typically ranging from tens to hundreds of gigabytes", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Apacer", + "part_name": "USB 3.2 GEN 1 flash drive" + } + }, + { + "bol_metadata": { + "bol_description": "AS2280P4 M.2 PCIE 1TB,STANDARD", + "origin_country": "TW", + "shipper": "apacer technology inc" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "850440", + "854110", + "852351", + "854149" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0466", + "hs2_label": "85", + "hs4_label": "8523", + "hs6_label": "852351", + "id": "SH-0466", + "justification_text": "Solid-state non-volatile storage devices, including SSD and flash storage goods, fall under 8523.51. Classified under HS 8523.51.", + "reference_ruling_ids": [ + "CROSS-N214920", + "CROSS-N264692", + "CROSS-N264694", + "CROSS-N264697", + "CROSS-N302571", + "CROSS-H168206", + "CROSS-H296912", + "CROSS-N048655" + ], + "segment": "component", + "split": "train", + "tier1_description": "Internal solid-state drive of 1 TB capacity in single-sided M.2 2280 form factor, approximately 80 x 22 x 2.25 mm and 6.8 g, using the PCIe Gen3 x4 interface with the NVMe 1.3 protocol and 3D TLC NAND flash. Sequential read and write speeds reach 3,000 MB/s and 2,000 MB/s with up to 360,000 IOPS and a rated MTBF of 1.5 million hours. Used as non-volatile system and data storage in desktop and notebook computers", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Apacer", + "part_name": "AS2280P4 M.2 PCIE 1TB standard" + } + }, + { + "bol_metadata": { + "bol_description": "SOLID STATE DRIVE", + "origin_country": "US", + "shipper": "kingston digital international ltd" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "854143", + "852351", + "851419", + "853610" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0467", + "hs2_label": "85", + "hs4_label": "8523", + "hs6_label": "852351", + "id": "SH-0467", + "justification_text": "Solid-state non-volatile storage devices, including SSD and flash storage goods, fall under 8523.51. Classified under HS 8523.51.", + "reference_ruling_ids": [ + "CROSS-N048655", + "CROSS-N214920", + "CROSS-N264692", + "CROSS-N264694", + "CROSS-N264697", + "CROSS-N300189", + "CROSS-N302571", + "CROSS-H168206", + "CROSS-H296912" + ], + "segment": "component", + "split": "train", + "tier1_description": "An internal solid-state drive that stores data on non-volatile NAND flash memory chips managed by an integrated controller. With no moving parts it offers faster access times, lower power draw and greater shock resistance than a mechanical hard disk, and is used as primary or secondary mass storage in desktop and notebook computers", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Kingston", + "part_name": "solid state drive" + } + }, + { + "bol_metadata": { + "bol_description": "USB FLASH DRIVE", + "origin_country": "US", + "shipper": "kingston digital international ltd" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "852351", + "853610", + "853890", + "854130" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0468", + "hs2_label": "85", + "hs4_label": "8523", + "hs6_label": "852351", + "id": "SH-0468", + "justification_text": "Solid-state non-volatile storage devices, including SSD and flash storage goods, fall under 8523.51. Classified under HS 8523.51.", + "reference_ruling_ids": [ + "CROSS-N214920", + "CROSS-N264694", + "CROSS-H168206", + "CROSS-N048655", + "CROSS-N264692", + "CROSS-N264697", + "CROSS-N302571" + ], + "segment": "component", + "split": "train", + "tier1_description": "A portable USB flash drive consisting of NAND flash memory and a controller mounted in a small plug-in housing with a USB connector. It provides removable, rewritable non-volatile storage for transferring documents, photos, music and video between computers and other host devices, requiring no external power and retaining data when disconnected", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Kingston", + "part_name": "USB flash drive" + } + }, + { + "bol_metadata": { + "bol_description": ") SOLID STATE DRIVE KNX1FRJJ960G0J0LZ1 SOLID STATE DRIVE KNX1FRJJ960G0J0LZ1", + "origin_country": "JP", + "shipper": "kioxia corporation" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "853669", + "850431", + "852351", + "854149" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0469", + "hs2_label": "85", + "hs4_label": "8523", + "hs6_label": "852351", + "id": "SH-0469", + "justification_text": "Solid-state non-volatile storage devices, including SSD and flash storage goods, fall under 8523.51. Classified under HS 8523.51.", + "reference_ruling_ids": [ + "CROSS-N048655", + "CROSS-N214920", + "CROSS-N264692", + "CROSS-N264694", + "CROSS-N264697", + "CROSS-N300189", + "CROSS-N302571", + "CROSS-H052564", + "CROSS-H168206", + "CROSS-H296912", + "CROSS-N028332" + ], + "segment": "component", + "split": "train", + "tier1_description": "A 960 GB solid-state drive built on 3D NAND flash memory with an integrated controller, supplied as an internal storage device for data-center or client computing platforms. It provides non-volatile mass storage with high sequential and random input/output performance and no moving parts, replacing rotating hard disks for operating-system, application and data storage", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Kioxia", + "part_name": ") solid state drive KNX1FRJJ960G0J0LZ1" + } + }, + { + "bol_metadata": { + "bol_description": "MEMORY CARD, LMEX1L032GG4", + "origin_country": "JP", + "shipper": "kioxia singapore pte ltd" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "854149", + "852491", + "854232", + "852351" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0470", + "hs2_label": "85", + "hs4_label": "8523", + "hs6_label": "852351", + "id": "SH-0470", + "justification_text": "Solid-state non-volatile storage devices, including SSD and flash storage goods, fall under 8523.51. Classified under HS 8523.51.", + "reference_ruling_ids": [ + "CROSS-N048655", + "CROSS-N264694", + "CROSS-H168206", + "CROSS-N049115", + "CROSS-N214920", + "CROSS-N264692" + ], + "segment": "component", + "split": "train", + "tier1_description": "A 32 GB microSDHC flash memory card built with 3D NAND flash, rated Class 10 and UHS-I U1 with read speeds up to 100 MB/s. The removable card measures about 15 x 11 x 1 mm and provides non-volatile storage for photos and Full HD video in smartphones, tablets, action cameras and similar host devices", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Kioxia", + "part_name": "memory card LMEX1L032GG4" + } + }, + { + "bol_metadata": { + "bol_description": "SOLID STATE DRIVEITEM-51", + "origin_country": "JP", + "shipper": "kioxia corporation" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "854121", + "854129", + "852351", + "854149" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0471", + "hs2_label": "85", + "hs4_label": "8523", + "hs6_label": "852351", + "id": "SH-0471", + "justification_text": "Solid-state non-volatile storage devices, including SSD and flash storage goods, fall under 8523.51. Classified under HS 8523.51.", + "reference_ruling_ids": [ + "CROSS-N264694", + "CROSS-N300189", + "CROSS-H168206", + "CROSS-H296912", + "CROSS-N048655", + "CROSS-N214920", + "CROSS-N264692", + "CROSS-N264697", + "CROSS-N302571" + ], + "segment": "component", + "split": "train", + "tier1_description": "An internal solid-state drive that stores data on non-volatile 3D NAND flash memory governed by an onboard controller. It delivers faster boot and load times, silent operation and resistance to shock and vibration compared with mechanical drives, and serves as mass storage for operating systems, applications and user data in computers", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Kioxia", + "part_name": "solid state driveitem-51" + } + }, + { + "bol_metadata": { + "bol_description": "LNM620X001T-RNNNG M.2 2280 SSD 1TB", + "origin_country": "US", + "shipper": "lexar co., limited" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "852351", + "854290", + "850450", + "854149" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0472", + "hs2_label": "85", + "hs4_label": "8523", + "hs6_label": "852351", + "id": "SH-0472", + "justification_text": "Solid-state non-volatile storage devices, including SSD and flash storage goods, fall under 8523.51. Classified under HS 8523.51.", + "reference_ruling_ids": [ + "CROSS-N264697", + "CROSS-N302571", + "CROSS-N214920", + "CROSS-N264692", + "CROSS-H168206", + "CROSS-H296912", + "CROSS-N048655", + "CROSS-N264694" + ], + "segment": "component", + "split": "train", + "tier1_description": "An internal 1 TB solid-state drive in the M.2 2280 form factor (80 x 22 x 2.25 mm, about 9 g) using the PCIe Gen3 x4 interface and NVMe 1.4 protocol. Built with 3D TLC NAND flash and LDPC error correction, it reaches sequential reads up to 3,500 MB/s and serves as primary storage in desktop and notebook computers", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Lexar", + "part_name": "LNM620X001T-rnnng M.2 2280 SSD 1TB" + } + }, + { + "bol_metadata": { + "bol_description": "LNS100-1TRB 2.5INCH SSD 1TB", + "origin_country": "US", + "shipper": "lexar co., limited" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "853890", + "852351", + "854290", + "851419" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0473", + "hs2_label": "85", + "hs4_label": "8523", + "hs6_label": "852351", + "id": "SH-0473", + "justification_text": "Solid-state non-volatile storage devices, including SSD and flash storage goods, fall under 8523.51. Classified under HS 8523.51.", + "reference_ruling_ids": [ + "CROSS-N264697", + "CROSS-N302571", + "CROSS-N214920", + "CROSS-N264692", + "CROSS-N264694", + "CROSS-H168206", + "CROSS-H296912", + "CROSS-N048655" + ], + "segment": "component", + "split": "train", + "tier1_description": "An internal 1 TB solid-state drive in the 2.5-inch, 7 mm form factor with a SATA III 6 Gb/s interface. Built on 3D NAND flash with an integrated controller, it achieves read speeds up to 550 MB/s and an endurance rating of 480 TB written, providing shock-resistant non-volatile mass storage for desktop and laptop computers", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Lexar", + "part_name": "LNS100-1TRB 2.5INCH SSD 1TB" + } + }, + { + "bol_metadata": { + "bol_description": "LNS100-512RB 2.5INCH SSD 512GB", + "origin_country": "US", + "shipper": "lexar co., limited" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "852351", + "851310", + "854190", + "853610" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0474", + "hs2_label": "85", + "hs4_label": "8523", + "hs6_label": "852351", + "id": "SH-0474", + "justification_text": "Solid-state non-volatile storage devices, including SSD and flash storage goods, fall under 8523.51. Classified under HS 8523.51.", + "reference_ruling_ids": [ + "CROSS-N264697", + "CROSS-N302571", + "CROSS-N214920", + "CROSS-N264692", + "CROSS-H168206", + "CROSS-H296912", + "CROSS-N048655", + "CROSS-N264694" + ], + "segment": "component", + "split": "train", + "tier1_description": "An internal 512 GB solid-state drive in the 2.5-inch, 7 mm form factor using the SATA III 6 Gb/s interface. It stores data on 3D NAND flash managed by an onboard controller, delivering read speeds up to 550 MB/s with no moving parts, and is fitted in desktop and notebook computers as quiet, shock-resistant mass storage", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Lexar", + "part_name": "LNS100-512RB 2.5INCH SSD 512GB" + } + }, + { + "bol_metadata": { + "bol_description": "LNM620X512G-RNNNG M.2 2280 SSD 512GB", + "origin_country": "US", + "shipper": "lexar co., limited" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "852351", + "854149", + "851310", + "854233" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0475", + "hs2_label": "85", + "hs4_label": "8523", + "hs6_label": "852351", + "id": "SH-0475", + "justification_text": "Solid-state non-volatile storage devices, including SSD and flash storage goods, fall under 8523.51. Classified under HS 8523.51.", + "reference_ruling_ids": [ + "CROSS-N264697", + "CROSS-N302571", + "CROSS-N214920", + "CROSS-N264692", + "CROSS-H052564", + "CROSS-H168206", + "CROSS-H296912", + "CROSS-N048655", + "CROSS-N264694" + ], + "segment": "component", + "split": "train", + "tier1_description": "An internal 512 GB solid-state drive in the compact M.2 2280 form factor (80 x 22 mm) with a PCIe Gen3 x4 interface and NVMe protocol. Constructed from 3D TLC NAND flash with low-density parity-check error correction, it provides sequential read speeds up to about 3,300 MB/s as boot and application storage in desktop and notebook computers", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Lexar", + "part_name": "LNM620X512G-rnnng M.2 2280 SSD 512GB" + } + }, + { + "bol_metadata": { + "bol_description": "PORTABLE SSD", + "origin_country": "US", + "shipper": "lexar co., limited" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "852351", + "852491", + "853610", + "850450" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0476", + "hs2_label": "85", + "hs4_label": "8523", + "hs6_label": "852351", + "id": "SH-0476", + "justification_text": "Solid-state non-volatile storage devices, including SSD and flash storage goods, fall under 8523.51. 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It provides rewritable non-volatile storage for backing up and transporting files, withstanding shock and vibration better than portable hard disks because it has no moving parts", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Lexar", + "part_name": "portable SSD" + } + }, + { + "bol_metadata": { + "bol_description": "CA0N256G0-P00S11M Solid State Drive SATA,SB 262,256GB SOLID STATE DRIVE", + "origin_country": "TW", + "shipper": "phison electronics corp" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "851762", + "852351", + "854159", + "854143" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0477", + "hs2_label": "85", + "hs4_label": "8523", + "hs6_label": "852351", + "id": "SH-0477", + "justification_text": "Solid-state non-volatile storage devices, including SSD and flash storage goods, fall under 8523.51. 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Supplied as an OEM client storage device, it provides non-volatile mass storage for operating systems and applications in notebook and desktop computers, offering silent, low-power operation with no moving parts", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Phison Electronics", + "part_name": "CA0N256G0-P00S11M Solid State Drive" + } + }, + { + "bol_metadata": { + "bol_description": "2TB-U21-KIOXIA 3D BICS6 TLC P/N U59TG-344C (STORAGE DEVICE)", + "origin_country": "TW", + "shipper": "phison electronics corp" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "854290", + "854160", + "852351", + "850440" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0478", + "hs2_label": "85", + "hs4_label": "8523", + "hs6_label": "852351", + "id": "SH-0478", + "justification_text": "Solid-state non-volatile storage devices, including SSD and flash storage goods, fall under 8523.51. 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Supplied as an OEM module, it provides high-capacity non-volatile mass storage for client computing or embedded platforms, retaining data without power and offering faster access and greater shock tolerance than mechanical drives", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Phison Electronics", + "part_name": "2TB-U21-kioxia 3D BICS6 TLC P/N" + } + }, + { + "bol_metadata": { + "bol_description": "MEMORY CARD", + "origin_country": "TW", + "shipper": "phison electronics corp" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "851762", + "850450", + "852691", + "852351" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0479", + "hs2_label": "85", + "hs4_label": "8523", + "hs6_label": "852351", + "id": "SH-0479", + "justification_text": "Solid-state non-volatile storage devices, including SSD and flash storage goods, fall under 8523.51. Classified under HS 8523.51.", + "reference_ruling_ids": [ + "CROSS-N048655", + "CROSS-N264694", + "CROSS-H052564", + "CROSS-H168206", + "CROSS-N049115", + "CROSS-N214920", + "CROSS-N264692" + ], + "segment": "component", + "split": "train", + "tier1_description": "A removable flash memory card combining NAND flash memory and a controller in a thin plastic-encapsulated card format such as SD or microSD. It provides rewritable non-volatile storage for photos, video and application data in cameras, smartphones, tablets and other portable host devices, retaining its contents without power and tolerating shock and vibration", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Phison Electronics", + "part_name": "memory card" + } + }, + { + "bol_metadata": { + "bol_description": "MEMORY IC (SSD V8 512Gb TLC E1.S PM1753) MZTL97T6HFLA-00AGG(DATA STORAGE DEVICES) (FOR R&D EVALUATION NOT FOR SALE)MEMORY IC", + "origin_country": "KR", + "shipper": "samsung electronics co.ltd" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "854151", + "854231", + "852351", + "854160" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0480", + "hs2_label": "85", + "hs4_label": "8523", + "hs6_label": "852351", + "id": "SH-0480", + "justification_text": "Solid-state non-volatile storage devices, including SSD and flash storage goods, fall under 8523.51. Classified under HS 8523.51.", + "reference_ruling_ids": [ + "CROSS-N264697", + "CROSS-N302571", + "CROSS-N048655", + "CROSS-N214920", + "CROSS-N264692", + "CROSS-N264694", + "CROSS-H168206", + "CROSS-H296912" + ], + "segment": "component", + "split": "train", + "tier1_description": "Enterprise solid-state drive in the E1.S (EDSFF) form factor using triple-level-cell 3D NAND flash memory with a PCIe 5.0 x4 NVMe interface. The drive family reaches sequential read speeds up to 14,500 MB/s and includes power-loss protection and 256-bit hardware encryption. It provides non-volatile data storage in servers and data-center systems, this unit supplied for R&D evaluation", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Samsung Electronics", + "part_name": "memory IC (SSD V8 512Gb TLC E1.S" + } + }, + { + "bol_metadata": { + "bol_description": "MEMORY IC (SSD BM9C1a 1Tb V9Q) MZAMX2T0HDL1-00BL2 (DATA STORAGE DEVICES) (FOR R&D EVALUATION NOT FOR SALE)MEMORY IC", + "origin_country": "KR", + "shipper": "samsung electronics co.ltd" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "852351", + "854370", + "854231", + "854121" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0481", + "hs2_label": "85", + "hs4_label": "8523", + "hs6_label": "852351", + "id": "SH-0481", + "justification_text": "Solid-state non-volatile storage devices, including SSD and flash storage goods, fall under 8523.51. Classified under HS 8523.51.", + "reference_ruling_ids": [ + "CROSS-N264697", + "CROSS-N302571", + "CROSS-N048655", + "CROSS-N214920", + "CROSS-N264692", + "CROSS-N264694", + "CROSS-H052564", + "CROSS-H168206", + "CROSS-H296912" + ], + "segment": "component", + "split": "train", + "tier1_description": "Client solid-state drive with 1 TB capacity built on 3D NAND flash memory, in an M.2 module format with a PCIe Gen4 NVMe interface. The drive family delivers sequential read speeds around 5,000 MB/s and supports device-authentication security features. It serves as internal non-volatile mass storage for notebook and desktop computers; this unit was supplied for R&D evaluation", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Samsung Electronics", + "part_name": "memory IC (SSD BM9C1a 1Tb V9Q)" + } + }, + { + "bol_metadata": { + "bol_description": "AUTO EMMC (V6V85005AJ) KLMBG1REWF-B000000-PYBBV4 (DATASTORAGE DEVICES) (FOR TESTING PURPOSES)", + "origin_country": "KR", + "shipper": "samsung electronics co.., ltd" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "852351", + "854233", + "854141", + "854370" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0482", + "hs2_label": "85", + "hs4_label": "8523", + "hs6_label": "852351", + "id": "SH-0482", + "justification_text": "Solid-state non-volatile storage devices, including SSD and flash storage goods, fall under 8523.51. Classified under HS 8523.51.", + "reference_ruling_ids": [ + "CROSS-N048655", + "CROSS-N264694", + "CROSS-H168206", + "CROSS-N049115", + "CROSS-N214920", + "CROSS-N264692" + ], + "segment": "component", + "split": "train", + "tier1_description": "Automotive-grade embedded multimedia card (eMMC 5.1) with 32 GB of NAND flash memory and an integrated controller. It supports the HS400 high-speed interface up to 400 MB/s and includes error correction, wear leveling, and bad-block management for extended-temperature operation. Used as embedded non-volatile storage in vehicle telematics, instrument-cluster, and infotainment systems; supplied free of charge for testing", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Samsung Electronics", + "part_name": "auto EMMC (V6V85005AJ)" + } + }, + { + "bol_metadata": { + "bol_description": "MZ-77E1T0BW 1TB INTERNAL SOLID STATE DRIVE MEMORY CARD", + "origin_country": "KR", + "shipper": "m/s samsung electronics co. ltd" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "854121", + "852351", + "852691", + "851762" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0483", + "hs2_label": "85", + "hs4_label": "8523", + "hs6_label": "852351", + "id": "SH-0483", + "justification_text": "Solid-state non-volatile storage devices, including SSD and flash storage goods, fall under 8523.51. Classified under HS 8523.51.", + "reference_ruling_ids": [ + "CROSS-N214920", + "CROSS-N264692", + "CROSS-N264694", + "CROSS-N264697", + "CROSS-N300189", + "CROSS-N302571", + "CROSS-H168206", + "CROSS-H296912", + "CROSS-N048655" + ], + "segment": "component", + "split": "train", + "tier1_description": "Internal solid-state drive with 1 TB capacity in the 2.5-inch form factor using a SATA III 6 Gb/s interface and triple-level-cell 3D NAND flash. It achieves sequential read/write speeds of 560/530 MB/s with a write-acceleration buffer and is rated for 600 TB written. Used as a non-volatile storage upgrade or primary drive in desktop and laptop computers", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Samsung Electronics", + "part_name": "MZ-77E1T0BW 1TB internal solid state" + } + }, + { + "bol_metadata": { + "bol_description": "MZ-V9E1T0BW 1TB INTERNAL SOLID STATE DRIVE SOLID STATE DRIVE", + "origin_country": "KR", + "shipper": "m/s samsung electronics co. ltd" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "854232", + "850450", + "852351", + "854151" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0484", + "hs2_label": "85", + "hs4_label": "8523", + "hs6_label": "852351", + "id": "SH-0484", + "justification_text": "Solid-state non-volatile storage devices, including SSD and flash storage goods, fall under 8523.51. Classified under HS 8523.51.", + "reference_ruling_ids": [ + "CROSS-N048655", + "CROSS-N214920", + "CROSS-N264692", + "CROSS-N264694", + "CROSS-N264697", + "CROSS-N300189", + "CROSS-N302571", + "CROSS-H168206", + "CROSS-H296912" + ], + "segment": "component", + "split": "train", + "tier1_description": "Internal solid-state drive with 1 TB capacity in the M.2 2280 form factor, supporting PCIe 4.0 x4 and PCIe 5.0 x2 NVMe interfaces and built on 3D NAND flash memory. It reaches sequential read/write speeds up to 5,000/4,200 MB/s with smart thermal control and a heat-spreading label. Used as internal non-volatile mass storage in desktop and notebook computers", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Samsung Electronics", + "part_name": "MZ-V9E1T0BW 1TB internal solid state" + } + }, + { + "bol_metadata": { + "bol_description": "MB-MC512SA/IN 512GB MEMORY CARD MEMORY CARD", + "origin_country": "KR", + "shipper": "m/s samsung electronics co. ltd" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "854149", + "852491", + "854290", + "852351" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0485", + "hs2_label": "85", + "hs4_label": "8523", + "hs6_label": "852351", + "id": "SH-0485", + "justification_text": "Solid-state non-volatile storage devices, including SSD and flash storage goods, fall under 8523.51. Classified under HS 8523.51.", + "reference_ruling_ids": [ + "CROSS-N048655", + "CROSS-N264694", + "CROSS-H168206", + "CROSS-N049115", + "CROSS-N214920", + "CROSS-N264692" + ], + "segment": "component", + "split": "train", + "tier1_description": "MicroSDXC flash memory card with 512 GB capacity, rated UHS-I U3, Class 10, V30 and A2, achieving read speeds up to 160 MB/s. The card is waterproof, temperature-proof and X-ray-proof, and is supplied with a full-size SD adapter. It expands non-volatile storage in smartphones, tablets, cameras, and handheld gaming consoles for photos, 4K video, and applications", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Samsung Electronics", + "part_name": "MB-MC512SA/in 512GB memory card memory" + } + }, + { + "bol_metadata": { + "bol_description": "MICROSD FLASH STORAGE CARD SDSQUAB GN6MN,ULTRA 140MB/S,C10,UHS,U1,A1,TRIMAN LOGO,CARD SDSQUAB GN6MN", + "origin_country": "US", + "shipper": "sandisk uk limited" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "851310", + "854231", + "854370", + "852351" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0486", + "hs2_label": "85", + "hs4_label": "8523", + "hs6_label": "852351", + "id": "SH-0486", + "justification_text": "Solid-state non-volatile storage devices, including SSD and flash storage goods, fall under 8523.51. Classified under HS 8523.51.", + "reference_ruling_ids": [ + "CROSS-N048655", + "CROSS-N264694", + "CROSS-H052564", + "CROSS-H168206", + "CROSS-N049115", + "CROSS-N214920", + "CROSS-N264692" + ], + "segment": "component", + "split": "train", + "tier1_description": "MicroSDXC flash memory card with 64 GB capacity, rated UHS-I U1, Class 10 and A1 with read speeds up to 140 MB/s suited to full-HD video recording and faster application loading. The card is shockproof, waterproof, temperature-proof and X-ray-proof. It provides removable non-volatile storage for smartphones, tablets, dash cameras, and similar portable devices", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "SanDisk", + "part_name": "microsd flash storage card sdsquab" + } + }, + { + "bol_metadata": { + "bol_description": "DUAL FLASH DRIVE", + "origin_country": "US", + "shipper": "sandisk semiconductor sha ltd" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "850450", + "854233", + "852351", + "854151" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0487", + "hs2_label": "85", + "hs4_label": "8523", + "hs6_label": "852351", + "id": "SH-0487", + "justification_text": "Solid-state non-volatile storage devices, including SSD and flash storage goods, fall under 8523.51. Classified under HS 8523.51.", + "reference_ruling_ids": [ + "CROSS-N214920", + "CROSS-N264694", + "CROSS-H168206", + "CROSS-N048655", + "CROSS-N264692", + "CROSS-N264697", + "CROSS-N302571", + "CROSS-H296912" + ], + "segment": "component", + "split": "train", + "tier1_description": "Dual-connector USB flash drive containing NAND flash memory and a controller in a compact housing with two plug types, typically USB Type-A on one end and USB Type-C or micro-USB on the other. It allows files to be stored and transferred between computers, smartphones, and tablets without cables, providing portable non-volatile solid-state storage in capacities commonly ranging from 32 GB to 256 GB", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "SanDisk", + "part_name": "dual flash drive" + } + }, + { + "bol_metadata": { + "bol_description": "MICROSD FLASH STORAGE CARD", + "origin_country": "US", + "shipper": "sandisk semiconductor sha ltd" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "853610", + "854370", + "852351", + "850440" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0488", + "hs2_label": "85", + "hs4_label": "8523", + "hs6_label": "852351", + "id": "SH-0488", + "justification_text": "Solid-state non-volatile storage devices, including SSD and flash storage goods, fall under 8523.51. Classified under HS 8523.51.", + "reference_ruling_ids": [ + "CROSS-N048655", + "CROSS-N264694", + "CROSS-H168206", + "CROSS-N049115", + "CROSS-N214920", + "CROSS-N264692", + "CROSS-N302571" + ], + "segment": "component", + "split": "train", + "tier1_description": "MicroSD flash memory card consisting of NAND flash memory and a controller in a standardized 15 x 11 x 1 mm removable card format. Such cards typically offer capacities from 32 GB to 1 TB with UHS-I bus speeds and speed-class ratings for video recording. They provide removable non-volatile storage for smartphones, tablets, action cameras, drones, and other portable electronics", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "SanDisk", + "part_name": "microsd flash storage card" + } + }, + { + "bol_metadata": { + "bol_description": "MICRON SSD SPRINGSTEEN 4600 4T SAMPLE", + "origin_country": "TW", + "shipper": "silicon motion technology corp" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "854151", + "852351", + "854141", + "850450" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0489", + "hs2_label": "85", + "hs4_label": "8523", + "hs6_label": "852351", + "id": "SH-0489", + "justification_text": "Solid-state non-volatile storage devices, including SSD and flash storage goods, fall under 8523.51. Classified under HS 8523.51.", + "reference_ruling_ids": [ + "CROSS-N264697", + "CROSS-N302571", + "CROSS-N214920", + "CROSS-N264692", + "CROSS-N264694", + "CROSS-H168206", + "CROSS-H296912", + "CROSS-N048655" + ], + "segment": "component", + "split": "train", + "tier1_description": "Client solid-state drive sample with 4 TB capacity in the M.2 2280 form factor using a PCIe 5.0 x4 NVMe interface and triple-level-cell 3D NAND flash. The drive family reaches sequential read/write speeds up to 14,500/12,000 MB/s with hardware 256-bit encryption and host-controlled thermal management. It serves as high-performance internal non-volatile storage for workstation and AI-oriented personal computers", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Silicon Motion", + "part_name": "micron SSD springsteen 4600 4T sample" + } + }, + { + "bol_metadata": { + "bol_description": "CIS1-16-101055-01) SSD-SATA, CLIENT, 128GB RAW DENS (Partsfor Mfg of Router)", + "origin_country": "TW", + "shipper": "silicon motion inc" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "854159", + "852351", + "854141", + "854143" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0490", + "hs2_label": "85", + "hs4_label": "8523", + "hs6_label": "852351", + "id": "SH-0490", + "justification_text": "Solid-state non-volatile storage devices, including SSD and flash storage goods, fall under 8523.51. 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Such drives combine NAND flash memory with an integrated controller on a small module or 2.5-inch board and provide non-volatile storage for the router operating system, configuration data, and logging; this unit was supplied free of charge", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Silicon Motion", + "part_name": "CIS1-16-101055-01) SSD-SATA client" + } + }, + { + "bol_metadata": { + "bol_description": ") EMMC SAMPLE (R&D PURPOSE)", + "origin_country": "TW", + "shipper": "silicon motion inc" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "852351", + "851762", + "854160", + "854233" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0491", + "hs2_label": "85", + "hs4_label": "8523", + "hs6_label": "852351", + "id": "SH-0491", + "justification_text": "Solid-state non-volatile storage devices, including SSD and flash storage goods, fall under 8523.51. Classified under HS 8523.51.", + "reference_ruling_ids": [ + "CROSS-N048655", + "CROSS-N264694", + "CROSS-H168206", + "CROSS-N049115", + "CROSS-N214920", + "CROSS-N264692" + ], + "segment": "component", + "split": "train", + "tier1_description": "Embedded multimedia card (eMMC) engineering sample combining NAND flash memory and a management controller to the JEDEC eMMC standard. Such devices typically offer capacities from 4 GB to 256 GB with HS400 interface speeds up to 400 MB/s and built-in error correction and wear leveling. Used as soldered-down non-volatile storage in embedded systems; supplied free of charge for R&D", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Silicon Motion", + "part_name": ") EMMC sample (R&D purpose)" + } + }, + { + "bol_metadata": { + "bol_description": "FLASH CARD", + "origin_country": "TW", + "shipper": "team group inc" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "851419", + "852351", + "850450", + "851762" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0492", + "hs2_label": "85", + "hs4_label": "8523", + "hs6_label": "852351", + "id": "SH-0492", + "justification_text": "Solid-state non-volatile storage devices, including SSD and flash storage goods, fall under 8523.51. Classified under HS 8523.51.", + "reference_ruling_ids": [ + "CROSS-N048655", + "CROSS-N049115", + "CROSS-N264694", + "CROSS-H168206", + "CROSS-N214920", + "CROSS-N264692", + "CROSS-N302571", + "CROSS-N352864" + ], + "segment": "component", + "split": "train", + "tier1_description": "Flash memory card comprising NAND flash memory and a controller packaged in a standardized removable card format such as SD, microSD, or CompactFlash. Such cards typically provide capacities from 16 GB to 1 TB, retain data without power, and are rated by bus speed and video speed classes. They supply removable non-volatile storage for cameras, smartphones, tablets, game consoles, and industrial equipment", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Team Group", + "part_name": "flash card" + } + }, + { + "bol_metadata": { + "bol_description": "USB FLASH DISK", + "origin_country": "TW", + "shipper": "team group inc" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "853610", + "854160", + "850431", + "852351" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0493", + "hs2_label": "85", + "hs4_label": "8523", + "hs6_label": "852351", + "id": "SH-0493", + "justification_text": "Solid-state non-volatile storage devices, including SSD and flash storage goods, fall under 8523.51. Classified under HS 8523.51.", + "reference_ruling_ids": [ + "CROSS-N214920", + "CROSS-N264694", + "CROSS-H168206", + "CROSS-N048655", + "CROSS-N264692", + "CROSS-N264697", + "CROSS-N302571", + "CROSS-H296912", + "CROSS-N028332" + ], + "segment": "component", + "split": "train", + "tier1_description": "A USB flash drive: a portable solid-state non-volatile storage device consisting of NAND flash memory and a controller in a small plastic or metal housing with an integrated USB connector. It plugs into a computer USB port to store, transfer, and back up files such as documents, photos, and software without external power", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Team Group", + "part_name": "USB flash disk" + } + }, + { + "bol_metadata": { + "bol_description": "128GB EXTERNAL SOLID STATE DRIVE UN RECORDED MEDIA TS128GESD310C DT 27.12.23", + "origin_country": "TW", + "shipper": "transcend information inc" + }, + "boundary_note": "Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "850440", + "850490", + "854143", + "852351" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "storage_boundary" + ], + "frozen_id": "v2.0.train.0494", + "hs2_label": "85", + "hs4_label": "8523", + "hs6_label": "852351", + "id": "SH-0494", + "justification_text": "Solid-state non-volatile storage devices, including SSD and flash storage goods, fall under 8523.51. Classified under HS 8523.51.", + "reference_ruling_ids": [ + "CROSS-N214920", + "CROSS-H168206", + "CROSS-N264692", + "CROSS-N264697", + "CROSS-N300189", + "CROSS-N302571", + "CROSS-H296912", + "CROSS-N048655", + "CROSS-N264694" + ], + "segment": "component", + "split": "train", + "tier1_description": "A 128 GB portable external solid-state drive in a compact thumb-drive form factor with dual USB Type-C and Type-A connectors. It uses 3D NAND flash with an SLC cache, supports USB 3.2 Gen 2 (10 Gbps) transfer with read speeds up to about 1,050 MB/s, measures roughly 71 x 20 x 8 mm, and stores and transfers data for computers, tablets, and phones", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Transcend", + "part_name": "128GB external solid state drive UN" + } + }, + { + "bol_metadata": { + "bol_description": "1X20 CNTR. AUTOMOTIVE LCD MODULE", + "origin_country": "JP", + "shipper": "sharp electronics corporation" + }, + "boundary_note": "HS2022 flat-panel display module (8524.91) vs other optical appliance (9013.80) vs a complete data-processing machine (8471.30); whether the module is presented bare, as an optical device, or built into a machine decides.", + "candidate_set": { + "codes": [ + "853669", + "850431", + "852491", + "854159" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "display_module_boundary" + ], + "frozen_id": "v2.0.train.0495", + "hs2_label": "85", + "hs4_label": "8524", + "hs6_label": "852491", + "id": "SH-0495", + "justification_text": "An automotive LCD display module is a flat panel display module of heading 8524, not an other optical device of 9013.80. Classified under HS 8524.91.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "Automotive liquid-crystal display module, an assembled flat-panel LCD subassembly built for in-vehicle instrumentation. Comprises the liquid-crystal glass cell with driver electronics and backlight, providing visual output and meeting automotive durability requirements. Supplied as a complete display module for integration into vehicle dashboards", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Sharp", + "part_name": "1X20 cntr. automotive LCD module" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "852491", + "854110", + "852691", + "854232" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0496", + "hs2_label": "85", + "hs4_label": "8524", + "hs6_label": "852491", + "id": "SH-0496", + "justification_text": "The item is an LCD flat-panel display module with driver/control circuitry. Heading 8524 covers flat panel display modules, and 852491 covers liquid-crystal modules. Classified under HS 8524.91.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "Monochrome reflective memory-type flat-panel display module, 2.7 in diagonal, 400x240 pixel resolution, daylight-readable with low power consumption and LCD-class refresh rate. Mounted on an assembled breakout board with 3 V regulator and 5 V boost converter; no backlight (MPN: ADA4694)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit", + "part_name": "ADA4694" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "851840", + "852491", + "852691", + "853669" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0497", + "hs2_label": "85", + "hs4_label": "8524", + "hs6_label": "852491", + "id": "SH-0497", + "justification_text": "The item is an LCD flat-panel display module with driver/control circuitry. Heading 8524 covers flat panel display modules, and 852491 covers liquid-crystal modules. Classified under HS 8524.91.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "Character LCD display module, 20-character by 4-line format, white characters on blue background, with onboard I2C serial interface requiring only two signal lines plus power. Flat-panel display module for microcontroller-based applications (MPN: DFR0154)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "DFRobot", + "part_name": "DFR0154" + } + }, + { + "bol_metadata": { + "bol_description": "DS-VGPS-HSC- DEWESOFT-X-PROF PIN. .000 MEASURING EQUIPMENT", + "origin_country": "SI", + "shipper": "dewesoft doo" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "854159", + "854141", + "852691", + "854110" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0498", + "hs2_label": "85", + "hs4_label": "8526", + "hs6_label": "852691", + "id": "SH-0498", + "justification_text": "A GNSS receiver is radio navigational aid apparatus under 8526.91, not an electrical measuring instrument with recording device of 9030.84. Classified under HS 8526.91.", + "reference_ruling_ids": [], + "segment": "end_product", + "split": "train", + "tier1_description": "High-speed GNSS receiver and velocity/displacement measuring instrument for test and measurement. Using multi-constellation satellite signals at a 100 Hz update rate, it precisely measures position, ground speed and distance with optional real-time-kinematic correction for centimetre accuracy. Housed in a compact metal enclosure with USB, CAN and RS-232 data interfaces and onboard data logging, it is used in automotive, aerospace and vehicle dynamics testing to record speed and trajectory", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Dewesoft", + "part_name": "DS-vgps-HSC- -X-prof PIN. .000" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "852691", + "854231", + "854159", + "850440" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0499", + "hs2_label": "85", + "hs4_label": "8526", + "hs6_label": "852691", + "id": "SH-0499", + "justification_text": "The item is a GNSS/GPS positioning receiver board. Heading 8526, subheading 852691 covers radio navigational aid apparatus, not ADP accessories. Classified under HS 8526.91.", + "reference_ruling_ids": [], + "segment": "end_product", + "split": "train", + "tier1_description": "Dual-frequency (L1+L5) multi-GNSS positioning daughter board for a 40-pin single-board computer with built-in LNA and SAW filter, SBAS support and 1-10Hz update rate, delivering PVT positioning to ~1m CEP by tracking GPS/QZSS, BeiDou, Galileo and GLONASS signals for navigation applications (MPN: WAV-25278)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Waveshare", + "part_name": "WAV-25278" + } + }, + { + "bol_metadata": { + "bol_description": "0692-4000-02 FUSE 250V 4A THT RADIAL 8.35 X 7.7MM SLOW BLOW(ANNEXURE NO 001 SR NO 29)", + "origin_country": "US", + "shipper": "bel fuse macao commercial offshore ltd" + }, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "853650", + "854190", + "853669", + "853610" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0500", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853610", + "id": "SH-0500", + "justification_text": "Electrical fuses and fuse protectors for circuits are covered by 8536.10. Classified under HS 8536.10.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "A through-hole radial-lead miniature rated 4 A at 250 V with slow-blow (time-lag) characteristic, in a cylindrical body approximately 8.35 x 7.7 mm. The time-delay element tolerates brief inrush currents while opening on sustained overloads, providing overcurrent protection on printed circuit boards in power supplies and electronic equipment", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Bel Fuse", + "part_name": "0692-4000-02 250V 4A THT radial 8.35 X" + } + }, + { + "bol_metadata": { + "bol_description": "SWITCHES, OTHER, 60 V 100", + "origin_country": "CH", + "shipper": "abb oy, smart power" + }, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "853610", + "853650", + "854160", + "853669" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0501", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853650", + "id": "SH-0501", + "justification_text": "A low-voltage electrical switch is switching apparatus under 8536.50, not a part of heading 8538.90. Classified under HS 8536.50.", + "reference_ruling_ids": [ + "JP_CUSTOMS-124000051", + "JP_CUSTOMS-124002344", + "JP_CUSTOMS-124003598" + ], + "segment": "component", + "split": "train", + "tier1_description": "A low-voltage electrical switch for switching or controlling circuits rated around 60 volts and 100 amps, used in power and control applications. It is an electromechanical switching device with contacts that open or close to make or break current in control and distribution circuits operating well under 1000 volts. Supplied as a standalone switching component for power equipment", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "ABB", + "part_name": "switches other 60 V 100" + } + }, + { + "bol_metadata": { + "bol_description": "ST41942OOOO MOG-AXF1NO MMS AUXILLARY CONTACT", + "origin_country": "JP", + "shipper": "fuji electric fa components and systems co., ltd" + }, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "853669", + "853610", + "854190", + "853650" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0502", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853650", + "id": "SH-0502", + "justification_text": "An auxiliary contact block is a switching/contact apparatus of 8536.50, not merely a part of 8538.90. Classified under HS 8536.50.", + "reference_ruling_ids": [ + "JP_CUSTOMS-124000051", + "JP_CUSTOMS-124002344", + "JP_CUSTOMS-124003598" + ], + "segment": "component", + "split": "train", + "tier1_description": "Auxiliary contact block for a manual motor starter, an add-on module that mounts to the front or side of the starter body. It contains a normally-open auxiliary contact in an insulating housing with metal contact elements is mechanically linked to the starter's on/off operation to provide signalling or interlocking in motor-control circuits rated up to 1000 volts", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Fuji Electric", + "part_name": "ST41942OOOO MOG-AXF1NO MMS auxillary" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "853669", + "853650", + "853610", + "853890" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0503", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853650", + "id": "SH-0503", + "justification_text": "The item is an in-line on/off switch, not a static converter. Heading 8536, subheading 853650 covers electrical switches. Classified under HS 8536.50.", + "reference_ruling_ids": [ + "JP_CUSTOMS-124000051", + "JP_CUSTOMS-124002344", + "JP_CUSTOMS-124003598" + ], + "segment": "component", + "split": "train", + "tier1_description": "In-line on/off power switch for low-voltage DC supply lines, rated 125 V 2 A, fitted with a 5.5/2.1 mm DC barrel jack socket on one end and a matching barrel plug on other, for interrupting power between a supply and a powered device (MPN: 103461)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "The Pi Hut", + "part_name": "103461" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "853669", + "854143", + "853610", + "853650" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0504", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853650", + "id": "SH-0504", + "justification_text": "The item is a USB-C in-line on/off switch, not a static converter. Heading 8536, subheading 853650 covers electrical switches. Classified under HS 8536.50.", + "reference_ruling_ids": [ + "JP_CUSTOMS-124000051", + "JP_CUSTOMS-124002344", + "JP_CUSTOMS-124003598" + ], + "segment": "component", + "split": "train", + "tier1_description": "USB-C inline on/off power switch module designed to be inserted between a USB-C power supply and a single-board computer to toggle board power without unplugging the cable; rated for low-voltage DC power line use (MPN: VILP135)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Vilros", + "part_name": "VILP135" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "853650", + "850431", + "853669", + "853610" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0505", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853650", + "id": "SH-0505", + "justification_text": "The item is a Micro-USB in-line on/off switch, not a static converter. Heading 8536, subheading 853650 covers electrical switches. Classified under HS 8536.50.", + "reference_ruling_ids": [ + "JP_CUSTOMS-124000051", + "JP_CUSTOMS-124002344", + "JP_CUSTOMS-124003598" + ], + "segment": "component", + "split": "train", + "tier1_description": "Micro USB inline on/off power switch module designed to be inserted between a Micro USB power supply and a single-board computer to toggle board power; for low-voltage DC power line use, not compatible with USB-C boards (MPN: VILP167)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Vilros", + "part_name": "VILP167" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "853669", + "853610", + "854160", + "853650" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0506", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853650", + "id": "SH-0506", + "justification_text": "The item is an electrical switch, pushbutton, keypad, joystick switch, or dimmer for circuit control. Heading 8536 covers switches and similar circuit-control apparatus. Classified under HS 8536.50.", + "reference_ruling_ids": [ + "JP_CUSTOMS-124000051", + "JP_CUSTOMS-124002344", + "JP_CUSTOMS-124003598" + ], + "segment": "component", + "split": "train", + "tier1_description": "Assortment of large momentary tactile push-button switches with snap-on coloured caps, normally-open contacts that close momentarily when pressed, for through-hole PCB or breadboard mounting (MPN: ADA1009)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit", + "part_name": "ADA1009" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "853610", + "853650", + "854141", + "853669" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0507", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853650", + "id": "SH-0507", + "justification_text": "The item is an electrical switch, pushbutton, keypad, joystick switch, or dimmer for circuit control. Heading 8536 covers switches and similar circuit-control apparatus. Classified under HS 8536.50.", + "reference_ruling_ids": [ + "JP_CUSTOMS-124000051", + "JP_CUSTOMS-124002344", + "JP_CUSTOMS-124003598" + ], + "segment": "component", + "split": "train", + "tier1_description": "Slim momentary tactile pushbutton switches in a 6mm body (half the width of standard 6mm tactiles), through-hole PCB-mount with clicky actuation for board-level input/control. For low-voltage circuit switching (MPN: ADA1489)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit", + "part_name": "ADA1489" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "853669", + "853650", + "852691", + "853610" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0508", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853650", + "id": "SH-0508", + "justification_text": "The item is an electrical switch, pushbutton, keypad, joystick switch, or dimmer for circuit control. Heading 8536 covers switches and similar circuit-control apparatus. Classified under HS 8536.50.", + "reference_ruling_ids": [ + "JP_CUSTOMS-124000051", + "JP_CUSTOMS-124002344", + "JP_CUSTOMS-124003598" + ], + "segment": "component", + "split": "train", + "tier1_description": "Latching push-button power-switch breakout board using a 3A P-channel FET to connect/disconnect a DC load; press-on/press-off toggle operation over a 3V to 14VDC supply, with quiescent current draw of about 0.5uA. PCB module with IN/OUT/Ground terminals for low-voltage circuit switching (MPN: ADA1400)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit", + "part_name": "ADA1400" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "853650", + "853610", + "854149", + "853669" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0509", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853650", + "id": "SH-0509", + "justification_text": "The item is an electrical switch, pushbutton, keypad, joystick switch, or dimmer for circuit control. Heading 8536 covers switches and similar circuit-control apparatus. Classified under HS 8536.50.", + "reference_ruling_ids": [ + "JP_CUSTOMS-124000051", + "JP_CUSTOMS-124002344", + "JP_CUSTOMS-124003598" + ], + "segment": "component", + "split": "train", + "tier1_description": "Flexible membrane matrix keypad with 12 momentary keys in a 3x4 telephone-style grid, wired as a 3-column by 4-row scan matrix using 7 connection lines, with adhesive backing and a 7-pin header. Low-voltage tactile input device for circuit switching (MPN: ADA419)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit", + "part_name": "ADA419" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "853669", + "853610", + "853650", + "851762" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0510", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853650", + "id": "SH-0510", + "justification_text": "The item is an electrical switch, pushbutton, keypad, joystick switch, or dimmer for circuit control. Heading 8536 covers switches and similar circuit-control apparatus. Classified under HS 8536.50.", + "reference_ruling_ids": [ + "JP_CUSTOMS-124000051", + "JP_CUSTOMS-124002344", + "JP_CUSTOMS-124003598" + ], + "segment": "component", + "split": "train", + "tier1_description": "Compact 8-way arcade joystick using four snap-action microswitches for directional on/off output, with a Sanwa-compatible threaded ball-top and a 5-pin rear connection (GND plus four direction lines). Mechanical switching input device for low-voltage circuits (MPN: ADA480)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit", + "part_name": "ADA480" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "851680", + "853650", + "853669", + "853610" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0511", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853650", + "id": "SH-0511", + "justification_text": "The item is an electrical switch, pushbutton, keypad, joystick switch, or dimmer for circuit control. Heading 8536 covers switches and similar circuit-control apparatus. Classified under HS 8536.50.", + "reference_ruling_ids": [ + "JP_CUSTOMS-124000051", + "JP_CUSTOMS-124002344", + "JP_CUSTOMS-124003598" + ], + "segment": "component", + "split": "train", + "tier1_description": "Rigid numeric matrix keypad with 12 momentary keys in a 3x4 telephone-style grid, wired as a 3-column by 4-row scan matrix using 7 connection lines, supplied with header pins for board mounting. Low-voltage tactile input device for circuit switching (MPN: ADA3845)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit", + "part_name": "ADA3845" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "851762", + "853669", + "853610", + "853650" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0512", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853650", + "id": "SH-0512", + "justification_text": "The item is an electrical switch, pushbutton, keypad, joystick switch, or dimmer for circuit control. Heading 8536 covers switches and similar circuit-control apparatus. Classified under HS 8536.50.", + "reference_ruling_ids": [ + "JP_CUSTOMS-124000051", + "JP_CUSTOMS-124002344", + "JP_CUSTOMS-124003598" + ], + "segment": "component", + "split": "train", + "tier1_description": "Squeeze-action tactile on/off latching switch with flying lead wires, rated up to 14V and 2A, in a compact 16mm x 15mm x 6mm body. Designed for embedding in wearable and fabric assemblies for low-voltage power or mode toggling (MPN: ADA1092)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit", + "part_name": "ADA1092" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "853669", + "853650", + "853610", + "850440" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0513", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853650", + "id": "SH-0513", + "justification_text": "The item is an electrical switch, pushbutton, keypad, joystick switch, or dimmer for circuit control. Heading 8536 covers switches and similar circuit-control apparatus. Classified under HS 8536.50.", + "reference_ruling_ids": [ + "JP_CUSTOMS-124000051", + "JP_CUSTOMS-124002344", + "JP_CUSTOMS-124003598" + ], + "segment": "component", + "split": "train", + "tier1_description": "Two-position slide switch mounted on a small circuit board sized to a 2x3 building-brick footprint with brick-sized connection holes, intended for conductive-tape or conductive-thread interconnection. Reverses or controls power flow in low-voltage circuits (MPN: 104995)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Brown Dog Gadgets", + "part_name": "104995" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "853669", + "853650", + "854160", + "853610" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0514", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853650", + "id": "SH-0514", + "justification_text": "The item is an electrical switch, pushbutton, keypad, joystick switch, or dimmer for circuit control. Heading 8536 covers switches and similar circuit-control apparatus. Classified under HS 8536.50.", + "reference_ruling_ids": [ + "JP_CUSTOMS-124000051", + "JP_CUSTOMS-124002344", + "JP_CUSTOMS-124003598" + ], + "segment": "component", + "split": "train", + "tier1_description": "Jumbo momentary pushbutton mounted on a small circuit board sized to a 2x4 building-brick footprint with brick-sized connection holes, designed for conductive-tape or conductive-thread interconnection. Press-to-close low-voltage circuit switch (MPN: 104996)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Brown Dog Gadgets", + "part_name": "104996" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "853610", + "853650", + "850440", + "853669" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0515", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853650", + "id": "SH-0515", + "justification_text": "The item is an electrical switch, pushbutton, keypad, joystick switch, or dimmer for circuit control. Heading 8536 covers switches and similar circuit-control apparatus. Classified under HS 8536.50.", + "reference_ruling_ids": [ + "JP_CUSTOMS-124000051", + "JP_CUSTOMS-124002344", + "JP_CUSTOMS-124003598" + ], + "segment": "component", + "split": "train", + "tier1_description": "Emergency-stop mushroom push-button switch with 40mm red momentary operator, rated insulation voltage 660V and conventional thermal current 10A, 22mm panel mounting hole, plastic and metal construction, operating -25C to +55C. Manually operated switching apparatus for circuit interruption (MPN: FIT0156)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "DFRobot", + "part_name": "FIT0156" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "853650", + "853669", + "853610", + "854143" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0516", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853650", + "id": "SH-0516", + "justification_text": "The item is an electrical switch, pushbutton, keypad, joystick switch, or dimmer for circuit control. Heading 8536 covers switches and similar circuit-control apparatus. Classified under HS 8536.50.", + "reference_ruling_ids": [ + "JP_CUSTOMS-124000051", + "JP_CUSTOMS-124002344", + "JP_CUSTOMS-124003598" + ], + "segment": "component", + "split": "train", + "tier1_description": "LED-illuminated momentary pushbutton module with a transparent coloured cap; outputs a logic-high signal and lights an internal LED while pressed, returning low when released. Operating voltage 3.3-5V, mounted on a small breakout board for low-voltage circuit switching with visual feedback (MPN: DFR0785-B)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "DFRobot", + "part_name": "DFR0785-B" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V. Cable assembly fitted with connectors (8544.42) vs the connector itself (8536.69); whether the conductor is included decides.", + "candidate_set": { + "codes": [ + "853669", + "853650", + "853610", + "854143" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits", + "cable_vs_connector" + ], + "frozen_id": "v2.0.train.0517", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853669", + "id": "SH-0517", + "justification_text": "The item is a passive HDMI plug/socket adapter for electrical connection, not a processing unit. Heading 8536, subheading 853669 covers plugs and sockets. Classified under HS 8536.69.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "Passive video interface adapter connecting a micro-HDMI male plug to a standard HDMI female socket, supporting 4K-capable signal pass-through. Single-piece connector/coupling for joining display cables (MPN: VILP282)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Vilros", + "part_name": "VILP282" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "853650", + "853669", + "853610", + "854160" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0518", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853669", + "id": "SH-0518", + "justification_text": "GPIO riser headers are electrical pin-header connectors, not computer parts classified in 8473. Heading 8536, subheading 853669 covers plugs and sockets/connectors. Classified under HS 8536.69.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "Through-hole pin riser/booster header for 2.54 mm-pitch GPIO connections, used to raise spacing between a single-board computer and a stacked daughter board; 5 mm metal pins of 0.64 mm thickness on an 8.5 mm plastic body, 2x20 layout. Electrical pin-header connector (MPN: 104800)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "The Pi Hut", + "part_name": "104800" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "853610", + "850490", + "853669", + "853650" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0519", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853669", + "id": "SH-0519", + "justification_text": "The item is a 40-pin male electrical header connector. Heading 8536, subheading 853669 covers plugs and sockets/connectors, not ADP accessories. Classified under HS 8536.69.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "2x20 male pin header connector with standard 2.54 mm pin spacing, intended for solder mounting to a single-board computer or PCB to provide GPIO connection points for daughter boards and jumper wires. Through-hole electrical pin-header connector (MPN: 103210)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "The Pi Hut", + "part_name": "103210" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "853650", + "853890", + "853669", + "853610" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0520", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853669", + "id": "SH-0520", + "justification_text": "The item is a color-coded 40-pin electrical header connector. Heading 8536, subheading 853669 covers plugs and sockets/connectors, not ADP accessories. Classified under HS 8536.69.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "Colour-coded 2x20 male GPIO pin header connector at 2.54 mm pitch, with pins colour-keyed by signal type (5 V, 3.3 V, GND, reversed-I2C) for solder mounting to a single-board computer or PCB. Through-hole electrical pin-header connector (MPN: 102338)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "The Pi Hut", + "part_name": "102338" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "853650", + "853669", + "854239", + "853610" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0521", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853669", + "id": "SH-0521", + "justification_text": "The item is a right-angle GPIO socket/header connector. Heading 8536, subheading 853669 covers plugs and sockets/connectors, not ADP accessories. Classified under HS 8536.69.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "Right-angle 2x20 female GPIO header connector at 2.54 mm pitch, intended for solder mounting so a board or single-board computer sits at an angle relative to mating PCB. Through-hole right-angle electrical socket-header connector (MPN: 102876)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "The Pi Hut", + "part_name": "102876" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "853669", + "854151", + "853650", + "853610" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0522", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853669", + "id": "SH-0522", + "justification_text": "The items are straight 40-pin electrical header connectors. Heading 8536, subheading 853669 covers plugs and sockets/connectors, not ADP accessories. Classified under HS 8536.69.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "40-pin (2x20) straight male pin headers for board-to-board connection, 2.54mm pitch, for soldering onto single-board computer expansion ports; supplied in assorted colours, headers not pre-soldered (MPN: 102087)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "The Pi Hut", + "part_name": "102087" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "853650", + "853610", + "853669", + "852691" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0523", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853669", + "id": "SH-0523", + "justification_text": "The item is a DC barrel-plug to screw-terminal electrical adapter/connector, not a static converter. Heading 8536, subheading 853669 covers plugs and sockets/connectors. Classified under HS 8536.69.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "DC power adapter that converts a 2.1 mm centre-positive DC barrel plug to a two-position screw terminal block with labelled polarity, for connecting bare power-source wires to a barrel-jack-powered device (MPN: 104787)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "The Pi Hut", + "part_name": "104787" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "853610", + "853650", + "853669", + "851762" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0524", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853669", + "id": "SH-0524", + "justification_text": "The item is a passive microSD-to-SD card contact adapter, not storage media. Heading 8536, subheading 853669 covers electrical plugs/sockets/connectors. Classified under HS 8536.69.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "Passive microSD-to-SD card adapter. Mechanical carrier shell that accepts a microSD memory card and routes its contacts to a standard full-size SD slot; contains no active electronics and provides physical form-factor and electrical-contact conversion only (MPN: VILP323X20)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Vilros", + "part_name": "VILP323X20" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "853610", + "853669", + "850450", + "853650" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0525", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853669", + "id": "SH-0525", + "justification_text": "The item is an electrical plug, socket, jack, or board connector for circuits not over 1,000 V. Heading 8536, subheading 853669 covers plugs and sockets. Classified under HS 8536.69.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "Micro-B USB connectors for printed-circuit-board mounting; sturdy metal shell with four through-hole mounting tabs, also solderable in SMT reflow over the through holes. Connector dimensions approx. 8 x 5.8 x 3.4 mm (MPN: ADA4023)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit", + "part_name": "ADA4023" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V. Cable assembly fitted with connectors (8544.42) vs the connector itself (8536.69); whether the conductor is included decides.", + "candidate_set": { + "codes": [ + "850450", + "853669", + "853610", + "853650" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits", + "cable_vs_connector" + ], + "frozen_id": "v2.0.train.0526", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853669", + "id": "SH-0526", + "justification_text": "The item is an electrical plug, socket, jack, or board connector for circuits not over 1,000 V. Heading 8536, subheading 853669 covers plugs and sockets. Classified under HS 8536.69.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "50-pin flat-flexible-cable (FPC) connector with 0.5 mm pitch, top-contact, surface-mount design for fine-pitch board interconnection such as TFT display ribbon cables. Connector dimensions approx. 29 x 2 x 6 mm; weight approx. 0.5 g (MPN: ADA1773)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit", + "part_name": "ADA1773" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "853669", + "854231", + "853650", + "853610" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0527", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853669", + "id": "SH-0527", + "justification_text": "The item is an electrical plug, socket, jack, or board connector for circuits not over 1,000 V. Heading 8536, subheading 853669 covers plugs and sockets. Classified under HS 8536.69.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "MicroSD card socket connector, surface-mount, push-push insertion/eject mechanism, fine-pitch with contacts located on the underside for reflow soldering. Provides a removable memory-card interface for PCB integration, compatible with standard microSD/TransFlash media of any capacity (MPN: ADA1660)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit", + "part_name": "ADA1660" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "853650", + "854110", + "853669", + "853610" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0528", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853669", + "id": "SH-0528", + "justification_text": "The item is an electrical plug, socket, jack, or board connector for circuits not over 1,000 V. Heading 8536, subheading 853669 covers plugs and sockets. Classified under HS 8536.69.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "USB Type-C receptacle (power-only) jack connector, metal-bodied with four through-hole mounting tabs, suitable for SMT paste-over or through-hole soldering. Wired for power and CC pins only (two ground, two VBUS, CC1/CC2; no D+/D- data lines), for PCB board-mount power input (MPN: ADA4907)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit", + "part_name": "ADA4907" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "853650", + "853610", + "854159", + "853669" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0529", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853669", + "id": "SH-0529", + "justification_text": "The item is an electrical plug, socket, jack, or board connector for circuits not over 1,000 V. Heading 8536, subheading 853669 covers plugs and sockets. Classified under HS 8536.69.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "Edge-launch USB Type-C plug connector, surface-mount with four SMT mounting tabs, low-profile design for board-edge placement to plug directly into a USB-C port. For pick-and-place assembly onto PCBs (MPN: ADA4932)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit", + "part_name": "ADA4932" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V. Cable assembly fitted with connectors (8544.42) vs the connector itself (8536.69); whether the conductor is included decides.", + "candidate_set": { + "codes": [ + "853650", + "853669", + "854442", + "853610" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits", + "cable_vs_connector" + ], + "frozen_id": "v2.0.train.0530", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853669", + "id": "SH-0530", + "justification_text": "The item is an electrical plug, socket, jack, or board connector for circuits not over 1,000 V. Heading 8536, subheading 853669 covers plugs and sockets. Classified under HS 8536.69.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "Sewable USB Micro-B power-only jack connector, horizontally oriented and moulded into a flexible rubber base with sew-through holes for textile mounting, terminated with red (positive) and black (negative) power leads. No data lines connected; for low-voltage power input on wearable PCB projects (MPN: ADA6076)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit", + "part_name": "ADA6076" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "853669", + "854160", + "853650", + "853610" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0531", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853669", + "id": "SH-0531", + "justification_text": "The item is an electrical plug, socket, jack, or board connector for circuits not over 1,000 V. Heading 8536, subheading 853669 covers plugs and sockets. Classified under HS 8536.69.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "Breadboard-friendly 2.1mm DC barrel jack power connector (socket) with thin-pin terminals that snap into breadboards or perfboards and are also solderable to PCB pads. Accepts 2.1mm coaxial DC power plugs for low-voltage power input (MPN: 102862)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "The Pi Hut", + "part_name": "102862" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "852691", + "853610", + "853669", + "853650" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0532", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853669", + "id": "SH-0532", + "justification_text": "The item is an electrical plug, socket, jack, or board connector for circuits not over 1,000 V. Heading 8536, subheading 853669 covers plugs and sockets. Classified under HS 8536.69.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "2-pin right-angle SMT board-mount connector to JST-PH 2.0mm pitch standard, approximately 8 mm wide and 9 mm tall, for surface-mount soldering. Mates with single-cell lithium battery and battery-holder leads to provide a low-voltage power interface. Unit weight approx. 0.28 g (MPN: 105662)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "The Pi Hut", + "part_name": "105662" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "853650", + "851680", + "853610", + "853669" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0533", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853669", + "id": "SH-0533", + "justification_text": "The item is an electrical plug, socket, jack, or board connector for circuits not over 1,000 V. Heading 8536, subheading 853669 covers plugs and sockets. Classified under HS 8536.69.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "Panel-mount 2.1mm DC barrel jack power connector (socket) for enclosure walls up to 8 mm thick, with a long body, three solder eyes on a PCB spacer, and a plastic lip to conceal mounting hole. Accepts 2.1mm coaxial DC power plugs for low-voltage power input (MPN: 104349)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "The Pi Hut", + "part_name": "104349" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "853669", + "853610", + "853650", + "850431" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0534", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853669", + "id": "SH-0534", + "justification_text": "The item is an electrical plug, socket, jack, or board connector for circuits not over 1,000 V. Heading 8536, subheading 853669 covers plugs and sockets. Classified under HS 8536.69.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "Panel-mount 3.5mm (1/8 inch) TRS (tip-ring-sleeve) audio jack connector with gold-plated slim body, three solder contacts, and a panel-mounting hex nut. Used to carry stereo audio signals (tip = left, ring = right, sleeve = ground) at low voltage (MPN: 104360)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "The Pi Hut", + "part_name": "104360" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "853650", + "850490", + "853669", + "853610" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0535", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853669", + "id": "SH-0535", + "justification_text": "The item is an electrical plug, socket, jack, or board connector for circuits not over 1,000 V. Heading 8536, subheading 853669 covers plugs and sockets. Classified under HS 8536.69.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "2.54mm pitch shorting jumpers (shunts) for bridging adjacent header pins to enable or disable circuit options, with 30% glass-fibre PBT insulator body and phosphor-bronze contacts, for low-voltage board configuration (MPN: 104208)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "The Pi Hut", + "part_name": "104208" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "853669", + "853650", + "853610", + "854159" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0536", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853669", + "id": "SH-0536", + "justification_text": "The item is an electrical plug, socket, jack, or board connector for circuits not over 1,000 V. Heading 8536, subheading 853669 covers plugs and sockets. Classified under HS 8536.69.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "USB Micro-B female connector supplied with a plastic shell for press-fit panel-style mounting, featuring 5 pins with easy-to-solder tabs. Assembled dimensions approximately 10 x 9 x 4.5 mm; assembled weight approx. 0.6 g. Provides a low-voltage USB interface for DIY board projects (MPN: 103725)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "The Pi Hut", + "part_name": "103725" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 8536 splits switching and connection gear by function: fuses (8536.10), other switches (8536.50), plugs and sockets (8536.69), all for voltages not exceeding 1,000 V.", + "candidate_set": { + "codes": [ + "853669", + "850440", + "853610", + "853650" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8536_connection_splits" + ], + "frozen_id": "v2.0.train.0537", + "hs2_label": "85", + "hs4_label": "8536", + "hs6_label": "853669", + "id": "SH-0537", + "justification_text": "The item is an LED strip-to-wire electrical connector, not a lighting fitting. Heading 8536, subheading 853669 covers plugs and sockets/connectors. Classified under HS 8536.69.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "Solder-free 3-pin strip-to-wire LED strip connector for joining 10 mm-wide addressable LED strips to 18-22 AWG wires for power and data, with clamp-down terminals on both strip and wire sides. An electrical connecting/coupling device for low-voltage circuits (MPN: 104845)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "The Pi Hut", + "part_name": "104845" + } + }, + { + "bol_metadata": { + "bol_description": "SLAC ON FIXED MOUNT DO OR FRAME AND GAS", + "origin_country": "IE", + "shipper": "eaton industries austria gmbh" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "853890", + "854160", + "851419", + "854142" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0538", + "hs2_label": "85", + "hs4_label": "8538", + "hs6_label": "853890", + "id": "SH-0538", + "justification_text": "Dedicated parts of electrical switching, protecting or control apparatus of 8535, 8536 or 8537 fall under 8538.90. Classified under HS 8538.90.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "Fixed-mount enclosure frame and gas-related assembly for low-voltage switchgear, comprising a metal or molded mounting frame that holds switching and protection apparatus. Functions as a structural and connection sub-assembly used solely or principally with apparatus that makes, breaks or protects electrical circuits rated up to 1000 volts within industrial control gear", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Eaton", + "part_name": "slac on fixed mount DO or frame and gas" + } + }, + { + "bol_metadata": { + "bol_description": "VACUUM SWITCH TUBE (PARTS OF VACUUM CIRCUIT BREAKER) VACUUM CIRCUIT BREAKER", + "origin_country": "JP", + "shipper": "mitsubishi electric corporation" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "851419", + "853890", + "853610", + "852351" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0539", + "hs2_label": "85", + "hs4_label": "8538", + "hs6_label": "853890", + "id": "SH-0539", + "justification_text": "Dedicated parts of electrical switching, protecting or control apparatus of 8535, 8536 or 8537 fall under 8538.90. Classified under HS 8538.90.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "Vacuum switch tube (vacuum interrupter), a sealed ceramic-and-metal envelope enclosing fixed and moving contacts in a high vacuum. It is the arc-extinguishing element of a medium/high-voltage vacuum circuit breaker, interrupting current by quenching the arc in vacuum. Supplied as a component for assembly into switchgear rated well above 1000 volts", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Mitsubishi Electric", + "part_name": "vacuum switch tube (parts of vacuum" + } + }, + { + "bol_metadata": { + "bol_description": "SPINDLE DRIVE UNIT", + "origin_country": "JP", + "shipper": "mitsubishi electric corporation" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "850440", + "854370", + "853890", + "852351" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0540", + "hs2_label": "85", + "hs4_label": "8538", + "hs6_label": "853890", + "id": "SH-0540", + "justification_text": "Dedicated parts of electrical switching, protecting or control apparatus of 8535, 8536 or 8537 fall under 8538.90. Classified under HS 8538.90.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "Spindle drive unit, an electromechanical actuator sub-assembly combining a motor-driven threaded spindle with mechanical linkage. It converts rotary motion into linear travel to operate or position a mechanism. Where supplied as a dedicated operating component for switchgear, it serves as the mechanical drive that opens and closes the apparatus", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Mitsubishi Electric", + "part_name": "spindle drive unit" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90). Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line.", + "candidate_set": { + "codes": [ + "854142", + "854129", + "854160", + "854110" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings", + "8541_vs_8542" + ], + "frozen_id": "v2.0.train.0541", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854110", + "id": "SH-0541", + "justification_text": "Goods classified under HS 8541.10; corroborated by 16 customs rulings on comparable goods (EU-DE, EU-EN, EU-PL, US).", + "reference_ruling_ids": [ + "CROSS-958726", + "CROSS-960323", + "EBTI-EN-0133", + "EBTI-PL-PLPL-WIT-2007-01020", + "CROSS-838664", + "CROSS-896328", + "CROSS-I84611", + "CROSS-N287782", + "EBTI-DE-DEM/5403/08-1", + "EBTI-EN-0131", + "EBTI-EN-0132", + "EBTI-EN-0134", + "EBTI-EN-0135", + "EBTI-EN-0136", + "EBTI-EN-0137", + "EBTI-EN-0139" + ], + "segment": "component", + "split": "train", + "tier1_description": "A Zener voltage-reference diode rated 5.1 V with about 500 mW power dissipation in a SOD-123 surface-mount package, exploiting reverse-breakdown to maintain a fixed reference voltage. It is a monolithic silicon device, used for voltage regulation and clamping", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Diodes Incorporated", + "part_name": "Diode Zener 5.1V 500 mW SOD123" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90). Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line.", + "candidate_set": { + "codes": [ + "854110", + "854159", + "854130", + "854129" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings", + "8541_vs_8542" + ], + "frozen_id": "v2.0.train.0542", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854110", + "id": "SH-0542", + "justification_text": "Goods classified under HS 8541.10; corroborated by 19 customs rulings on comparable goods across 5 jurisdictions.", + "reference_ruling_ids": [ + "EBTI-PL-PLPL-WIT-2007-01020", + "EBTI-DE-DEM/5403/08-1", + "CROSS-958726", + "CROSS-960323", + "CROSS-838664", + "EBTI-EN-0134", + "EBTI-EN-0135", + "EBTI-EN-0136", + "EBTI-EN-0137", + "EBTI-EN-0139", + "EBTI-NL-NLRTD-2013-002382", + "CROSS-884779", + "CROSS-896328", + "CROSS-I84611", + "CROSS-N287782", + "EBTI-EN-0131", + "EBTI-EN-0132", + "EBTI-EN-0133", + "EBTI-EN-0138" + ], + "segment": "component", + "split": "train", + "tier1_description": "A general-purpose switching diode array rated 100 V and 215 mA in a 3-pin SOT-23 surface-mount package, integrating small-signal silicon diodes for switching, steering, and clamping. It is a monolithic semiconductor device, used in general signal-path circuits", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "onsemi", + "part_name": "Diode ARR General-Purpose 100V 215 mA" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90). Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line.", + "candidate_set": { + "codes": [ + "854160", + "854142", + "854110", + "854129" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings", + "8541_vs_8542" + ], + "frozen_id": "v2.0.train.0543", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854110", + "id": "SH-0543", + "justification_text": "Goods classified under HS 8541.10; corroborated by 19 customs rulings on comparable goods across 5 jurisdictions.", + "reference_ruling_ids": [ + "EBTI-PL-PLPL-WIT-2007-01020", + "EBTI-DE-DEM/5403/08-1", + "CROSS-958726", + "CROSS-960323", + "CROSS-838664", + "EBTI-EN-0134", + "EBTI-EN-0135", + "EBTI-EN-0136", + "EBTI-EN-0137", + "EBTI-EN-0139", + "EBTI-NL-NLRTD-2013-002382", + "CROSS-884779", + "CROSS-896328", + "CROSS-I84611", + "CROSS-N287782", + "EBTI-EN-0131", + "EBTI-EN-0132", + "EBTI-EN-0133", + "EBTI-EN-0138" + ], + "segment": "component", + "split": "train", + "tier1_description": "A general-purpose switching diode array rated 75 V and 300 mA in a 3-pin SOT-23 surface-mount package, integrating multiple small-signal silicon diodes for signal steering, clamping, and switching. It is a monolithic semiconductor device, used in general signal-path and protection circuits", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Diodes Incorporated", + "part_name": "Diode ARRAY General-Purpose 75V 300 mA" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90). Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line.", + "candidate_set": { + "codes": [ + "854142", + "854129", + "854110", + "854151" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings", + "8541_vs_8542" + ], + "frozen_id": "v2.0.train.0544", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854110", + "id": "SH-0544", + "justification_text": "Goods classified under HS 8541.10; corroborated by 18 customs rulings on comparable goods (EU-DE, EU-EN, EU-PL, US).", + "reference_ruling_ids": [ + "CROSS-958726", + "CROSS-960323", + "EBTI-EN-0133", + "EBTI-EN-0138", + "CROSS-896328", + "EBTI-PL-PLPL-WIT-2007-01020", + "CROSS-838664", + "CROSS-884779", + "CROSS-I84611", + "CROSS-N287782", + "EBTI-DE-DEM/5403/08-1", + "EBTI-EN-0131", + "EBTI-EN-0132", + "EBTI-EN-0134", + "EBTI-EN-0135", + "EBTI-EN-0136", + "EBTI-EN-0137", + "EBTI-EN-0139" + ], + "segment": "component", + "split": "train", + "tier1_description": "A standard silicon rectifier diode rated 1000 V and 1 A in a SOD-123FL surface-mount package, conducting in one direction to convert AC to DC. It is a monolithic silicon rectifier device, used in general AC-to-DC rectification", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "SMC Diode Solutions", + "part_name": "standard 1000V 1A SOD123FL" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90). Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line.", + "candidate_set": { + "codes": [ + "854142", + "854129", + "854151", + "854110" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings", + "8541_vs_8542" + ], + "frozen_id": "v2.0.train.0545", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854110", + "id": "SH-0545", + "justification_text": "Goods classified under HS 8541.10; corroborated by 18 customs rulings on comparable goods (EU-DE, EU-EN, EU-PL, US).", + "reference_ruling_ids": [ + "CROSS-958726", + "CROSS-960323", + "EBTI-EN-0133", + "EBTI-EN-0138", + "CROSS-896328", + "EBTI-PL-PLPL-WIT-2007-01020", + "CROSS-838664", + "CROSS-884779", + "CROSS-I84611", + "CROSS-N287782", + "EBTI-DE-DEM/5403/08-1", + "EBTI-EN-0131", + "EBTI-EN-0132", + "EBTI-EN-0134", + "EBTI-EN-0135", + "EBTI-EN-0136", + "EBTI-EN-0137", + "EBTI-EN-0139" + ], + "segment": "component", + "split": "train", + "tier1_description": "A standard silicon rectifier diode rated 1000 V and 1 A (A-405 axial package), conducting current in one direction to convert AC to DC and rated to 150 C operation. It is a monolithic silicon rectifier device, used in general AC-to-DC rectification", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Diotec Semiconductor", + "part_name": "Diode A-405 1000V 1A 150C" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90). Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line.", + "candidate_set": { + "codes": [ + "854110", + "854141", + "854143", + "854130" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings", + "8541_vs_8542" + ], + "frozen_id": "v2.0.train.0546", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854110", + "id": "SH-0546", + "justification_text": "Goods classified under HS 8541.10; corroborated by 18 customs rulings on comparable goods (EU-DE, EU-EN, EU-PL, US).", + "reference_ruling_ids": [ + "CROSS-958726", + "CROSS-960323", + "CROSS-896328", + "CROSS-884779", + "EBTI-PL-PLPL-WIT-2007-01020", + "CROSS-838664", + "CROSS-I84611", + "CROSS-N287782", + "EBTI-DE-DEM/5403/08-1", + "EBTI-EN-0131", + "EBTI-EN-0132", + "EBTI-EN-0133", + "EBTI-EN-0134", + "EBTI-EN-0135", + "EBTI-EN-0136", + "EBTI-EN-0137", + "EBTI-EN-0138", + "EBTI-EN-0139" + ], + "segment": "component", + "split": "train", + "tier1_description": "A Schottky barrier rectifier diode rated 40 V and 1 A in a DO-219AD surface-mount package, using a metal-semiconductor junction for low forward drop and fast switching. It is a monolithic silicon device, used in low-voltage rectification and switching circuits", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Vishay General Semiconductor - Diodes Division", + "part_name": "Diode Schottky 40V 1A DO219AD" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90). Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line.", + "candidate_set": { + "codes": [ + "854149", + "854141", + "854142", + "854110" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings", + "8541_vs_8542" + ], + "frozen_id": "v2.0.train.0547", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854110", + "id": "SH-0547", + "justification_text": "Goods classified under HS 8541.10; corroborated by 18 customs rulings on comparable goods (EU-DE, EU-EN, EU-PL, US).", + "reference_ruling_ids": [ + "CROSS-958726", + "CROSS-960323", + "CROSS-896328", + "CROSS-884779", + "EBTI-PL-PLPL-WIT-2007-01020", + "CROSS-838664", + "CROSS-I84611", + "CROSS-N287782", + "EBTI-DE-DEM/5403/08-1", + "EBTI-EN-0131", + "EBTI-EN-0132", + "EBTI-EN-0133", + "EBTI-EN-0134", + "EBTI-EN-0135", + "EBTI-EN-0136", + "EBTI-EN-0137", + "EBTI-EN-0138", + "EBTI-EN-0139" + ], + "segment": "component", + "split": "train", + "tier1_description": "A Schottky barrier rectifier diode rated 40 V and 750 mA in a 3-pin SOT-23 surface-mount package, using a metal-semiconductor junction for low forward voltage drop and fast switching. It is a monolithic silicon device, used in low-voltage rectification, freewheeling, and switching-regulator circuits", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Diodes Incorporated", + "part_name": "Diode Schottky 40V 750 mA SOT23-3" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90). Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line.", + "candidate_set": { + "codes": [ + "854151", + "854110", + "854160", + "854159" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings", + "8541_vs_8542" + ], + "frozen_id": "v2.0.train.0548", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854110", + "id": "SH-0548", + "justification_text": "Goods classified under HS 8541.10; corroborated by 16 customs rulings on comparable goods (EU-DE, EU-EN, EU-PL, US).", + "reference_ruling_ids": [ + "CROSS-958726", + "CROSS-960323", + "EBTI-PL-PLPL-WIT-2007-01020", + "CROSS-838664", + "CROSS-896328", + "CROSS-I84611", + "CROSS-N287782", + "EBTI-DE-DEM/5403/08-1", + "EBTI-EN-0131", + "EBTI-EN-0132", + "EBTI-EN-0133", + "EBTI-EN-0134", + "EBTI-EN-0135", + "EBTI-EN-0136", + "EBTI-EN-0137", + "EBTI-EN-0139" + ], + "segment": "component", + "split": "train", + "tier1_description": "A single varactor (variable-capacitance) diode rated 12 V in an SC-79 surface-mount package, whose junction capacitance varies with applied reverse voltage for electronic tuning. It is a monolithic silicon device, used in voltage-controlled oscillators, phase-locked loops, and RF frequency-tuning circuits", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Skyworks Solutions Inc.", + "part_name": "Diode varactor 12V single SC-79" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854149", + "854142", + "854129", + "854110" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0549", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854110", + "id": "SH-0549", + "justification_text": "Goods classified under HS 8541.10; corroborated by 19 customs rulings on comparable goods across 5 jurisdictions.", + "reference_ruling_ids": [ + "CROSS-958726", + "CROSS-960323", + "EBTI-EN-0138", + "EBTI-PL-PLPL-WIT-2007-01020", + "EBTI-DE-DEM/5403/08-1", + "EBTI-EN-0133", + "CROSS-838664", + "CROSS-884779", + "CROSS-896328", + "EBTI-EN-0131", + "EBTI-EN-0134", + "EBTI-EN-0135", + "EBTI-EN-0136", + "EBTI-EN-0137", + "EBTI-NL-NLRTD-2013-002382", + "CROSS-I84611", + "CROSS-N287782", + "EBTI-EN-0132", + "EBTI-EN-0139" + ], + "segment": "component", + "split": "train", + "tier1_description": "A single-phase bridge rectifier rated 600 V and 1 A, integrating four rectifier diodes in one package to convert single-phase alternating current into pulsating direct current. It is a monolithic/assembled silicon rectifier device, used in AC-to-DC power-supply input stages of electronic equipment", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Bourns Inc.", + "part_name": "Diode - Bridge Rectifier Single-Phase" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90). Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line.", + "candidate_set": { + "codes": [ + "854110", + "854159", + "854143", + "854121" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings", + "8541_vs_8542" + ], + "frozen_id": "v2.0.train.0550", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854121", + "id": "SH-0550", + "justification_text": "Goods classified under HS 8541.21; corroborated by 2 customs rulings on comparable goods (EU-DE).", + "reference_ruling_ids": [ + "EBTI-DE-DE16463/12-1", + "EBTI-DE-DEM/1939/08-1" + ], + "segment": "component", + "split": "train", + "tier1_description": "An N-channel junction field-effect transistor (JFET) rated 35 V in a 3-pin SOT-23 surface-mount package, dissipating under 1 W, providing high-input-impedance signal amplification and switching. It is a monolithic silicon device, used in low-noise analog front-end circuits", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "onsemi", + "part_name": "Transistor (<1 W) - JFET N-Channel 35V" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90). Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line.", + "candidate_set": { + "codes": [ + "854160", + "854121", + "854141", + "854130" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings", + "8541_vs_8542" + ], + "frozen_id": "v2.0.train.0551", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854121", + "id": "SH-0551", + "justification_text": "Goods classified under HS 8541.21; corroborated by 2 customs rulings on comparable goods (EU-DE).", + "reference_ruling_ids": [ + "EBTI-DE-DE16463/12-1", + "EBTI-DE-DEM/1939/08-1" + ], + "segment": "component", + "split": "train", + "tier1_description": "A small-signal bipolar transistor rated 40 V and 200 mA with about 625 mW power dissipation (under 1 W) in a surface-mount package, providing low-power signal amplification and switching. It is a monolithic silicon transistor, used in general signal-level amplification and switching circuits", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Central Semiconductor Corp", + "part_name": "Transistor (<1 W) - 40V 200 mA 625 mW" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854160", + "854121", + "854110", + "854141" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0552", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854121", + "id": "SH-0552", + "justification_text": "The product falls under HS 8541.21 (Transistors, dissipation rate under 1 W).", + "reference_ruling_ids": [ + "EBTI-DE-DE16463/12-1", + "EBTI-CZ-CZBTI48/114331/2025-580000-04/01", + "EBTI-DE-DEM/1939/08-1" + ], + "segment": "component", + "split": "train", + "tier1_description": "A PNP general-purpose bipolar junction transistor rated for about -40 V collector-emitter, in a metal TO-39 package. With moderate current handling and good switching speed, it is used for amplification, switching and driver stages in analog and industrial electronic circuits (part 2N2905)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Multicomp PRO", + "part_name": "2N2905" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854130", + "854141", + "854121", + "854143" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0553", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854121", + "id": "SH-0553", + "justification_text": "The product falls under HS 8541.21 (Transistors, dissipation rate under 1 W).", + "reference_ruling_ids": [ + "EBTI-DE-DE16463/12-1", + "EBTI-DE-DEM/1939/08-1" + ], + "segment": "component", + "split": "train", + "tier1_description": "An NPN general-purpose bipolar junction transistor rated for 45 V collector-emitter and 100 mA collector current, in a metal TO-18 package. A classic low-power audio and small-signal device, it is used for amplification and switching in analog circuits (part BC107B)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Multicomp PRO", + "part_name": "BC107B" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854110", + "854121", + "854151", + "854143" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0554", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854121", + "id": "SH-0554", + "justification_text": "The product falls under HS 8541.21 (Transistors, dissipation rate under 1 W).", + "reference_ruling_ids": [ + "EBTI-DE-DE16463/12-1", + "EBTI-DE-DEM/1939/08-1" + ], + "segment": "component", + "split": "train", + "tier1_description": "A digital (pre-biased/bias-resistor) bipolar transistor with integrated base resistors, rated for 50 V and 100 mA, in a small surface-mount package. The built-in resistors simplify logic-level switching and interfacing, saving board space in digital and load-switching circuits (part PDTC114ET). Part number PDTC114ET,215", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Nexperia", + "part_name": "PDTC114ET,215" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854151", + "854130", + "854121", + "854141" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0555", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854121", + "id": "SH-0555", + "justification_text": "The product falls under HS 8541.21 (Transistors, dissipation rate under 1 W).", + "reference_ruling_ids": [ + "EBTI-DE-DE16463/12-1", + "EBTI-DE-DEM/1939/08-1" + ], + "segment": "component", + "split": "train", + "tier1_description": "An NPN general-purpose bipolar junction transistor rated for 50 V collector-emitter, 100 mA collector current and 350 mW dissipation, in a through-hole TO-92 package. It is widely used for small-signal amplification and switching in analog and audio circuits (part BC182B)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Multicomp PRO", + "part_name": "BC182B" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854141", + "854149", + "854159", + "854121" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0556", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854121", + "id": "SH-0556", + "justification_text": "The product falls under HS 8541.21 (Transistors, dissipation rate under 1 W).", + "reference_ruling_ids": [ + "EBTI-DE-DE16463/12-1", + "EBTI-DE-DEM/1939/08-1" + ], + "segment": "component", + "split": "train", + "tier1_description": "An NPN bipolar junction transistor rated for 45 V collector-emitter and 500 mA collector current, in a 3-lead SOT-23 surface-mount package. With high current gain, it suits general-purpose switching, signal amplification and small-load driving in compact circuits (part BC817-40)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Multicomp PRO", + "part_name": "BC817-40" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854190", + "854142", + "854121", + "854159" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0557", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854121", + "id": "SH-0557", + "justification_text": "The product falls under HS 8541.21 (Transistors, dissipation rate under 1 W).", + "reference_ruling_ids": [ + "EBTI-DE-DE16463/12-1", + "EBTI-DE-DEM/1939/08-1" + ], + "segment": "component", + "split": "train", + "tier1_description": "An NPN high-voltage general-purpose bipolar junction transistor in a through-hole TO-92 package, rated for several hundred volts collector-emitter with modest current handling. It suits high-voltage small-signal amplification and switching in analog and industrial circuits (part MPSA42)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Multicomp PRO", + "part_name": "MPSA42" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854151", + "854160", + "854121", + "854149" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0558", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854121", + "id": "SH-0558", + "justification_text": "The product falls under HS 8541.21 (Transistors, dissipation rate under 1 W).", + "reference_ruling_ids": [ + "EBTI-DE-DE16463/12-1", + "EBTI-DE-DEM/1939/08-1" + ], + "segment": "component", + "split": "train", + "tier1_description": "An NPN pre-biased (bias-resistor) digital bipolar transistor with integrated 10 kohm input and base-emitter resistors, rated for 50 V and 100 mA, in a SOT-23 package. The built-in resistors enable direct logic-level switching in compact digital circuits (part MMUN2111LT1G)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Onsemi", + "part_name": "MMUN2111LT1G" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90). Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line.", + "candidate_set": { + "codes": [ + "854151", + "854142", + "854129", + "854121" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings", + "8541_vs_8542" + ], + "frozen_id": "v2.0.train.0559", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854129", + "id": "SH-0559", + "justification_text": "Goods classified under HS 8541.29; corroborated by 15 customs rulings on comparable goods (EU-EN, US).", + "reference_ruling_ids": [ + "CROSS-084659", + "CROSS-N353309", + "EBTI-EN-0140", + "EBTI-EN-0144", + "CROSS-K89192", + "CROSS-N099445", + "EBTI-EN-0143", + "EBTI-EN-0145", + "EBTI-EN-0146", + "CROSS-084660", + "CROSS-N025506", + "CROSS-N326955", + "CROSS-N336272", + "EBTI-EN-0141", + "EBTI-EN-0147" + ], + "segment": "component", + "split": "train", + "tier1_description": "A gallium-nitride (GaN) power transistor rated 100 V with about 0.022 ohm on-resistance supplied as a bare die, providing very fast switching for high-efficiency power conversion. It is a monolithic GaN power device, used in switch-mode power supplies and motor drives", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "EPC", + "part_name": "Transistor GaN DIE 100V .022 Ω" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90). Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line.", + "candidate_set": { + "codes": [ + "854190", + "854142", + "854151", + "854129" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings", + "8541_vs_8542" + ], + "frozen_id": "v2.0.train.0560", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854129", + "id": "SH-0560", + "justification_text": "Goods classified under HS 8541.29; corroborated by 17 customs rulings on comparable goods (EU-EN, JP, US).", + "reference_ruling_ids": [ + "CROSS-084659", + "EBTI-EN-0144", + "EBTI-EN-0140", + "EBTI-EN-0145", + "EBTI-EN-0146", + "CROSS-K89192", + "CROSS-N025506", + "CROSS-N099445", + "CROSS-N353309", + "EBTI-EN-0143", + "EBTI-EN-0141", + "EBTI-EN-0147", + "CROSS-084660", + "CROSS-N326955", + "CROSS-N336272", + "EBTI-EN-0142", + "JP_CUSTOMS-122000643" + ], + "segment": "component", + "split": "train", + "tier1_description": "An insulated-gate bipolar transistor (IGBT) rated 1200 V and 35 A in a TO-262 package, combining MOS gate control with bipolar conduction for efficient high-voltage, high-current switching. It is a monolithic silicon power device, used in motor drives, inverters, and power-conversion equipment", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Harris Corporation", + "part_name": "Transistor (>=1 W) - IGBT 1200V 35A" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90). Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line.", + "candidate_set": { + "codes": [ + "854190", + "854129", + "854143", + "854110" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings", + "8541_vs_8542" + ], + "frozen_id": "v2.0.train.0561", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854129", + "id": "SH-0561", + "justification_text": "Goods classified under HS 8541.29; corroborated by 17 customs rulings on comparable goods (EU-EN, JP, US).", + "reference_ruling_ids": [ + "CROSS-084659", + "EBTI-EN-0144", + "EBTI-EN-0140", + "EBTI-EN-0145", + "EBTI-EN-0146", + "CROSS-K89192", + "CROSS-N025506", + "CROSS-N099445", + "CROSS-N353309", + "EBTI-EN-0143", + "EBTI-EN-0141", + "EBTI-EN-0147", + "CROSS-084660", + "CROSS-N326955", + "CROSS-N336272", + "EBTI-EN-0142", + "JP_CUSTOMS-122000643" + ], + "segment": "component", + "split": "train", + "tier1_description": "A field-stop trench insulated-gate bipolar transistor (IGBT) rated 1200 V and 30 A in a TO-247N package, combining MOS gate control with bipolar conduction for efficient high-voltage switching. It is a monolithic silicon power device, used in inverters, motor drives, and welding equipment", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Rohm Semiconductor", + "part_name": "Transistor (>=1 W) - IGBT TRENCH FS" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90). Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line.", + "candidate_set": { + "codes": [ + "854129", + "854159", + "854110", + "854143" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings", + "8541_vs_8542" + ], + "frozen_id": "v2.0.train.0562", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854129", + "id": "SH-0562", + "justification_text": "Goods classified under HS 8541.29; corroborated by 17 customs rulings on comparable goods (EU-CZ, EU-EN, US).", + "reference_ruling_ids": [ + "CROSS-N099445", + "CROSS-084659", + "EBTI-EN-0143", + "CROSS-K89192", + "CROSS-N326041", + "CROSS-N353309", + "EBTI-EN-0140", + "CROSS-084660", + "CROSS-N025506", + "CROSS-N326955", + "CROSS-N336272", + "EBTI-CZ-CZBTI43/112203/2026-300000-ZI/01", + "EBTI-EN-0141", + "EBTI-EN-0144", + "EBTI-EN-0145", + "EBTI-EN-0146", + "EBTI-EN-0147" + ], + "segment": "component", + "split": "train", + "tier1_description": "An RF LDMOS (laterally-diffused MOSFET) power transistor operating from a 12.5 V supply in a PWRSO-10RF package, providing high-power amplification of high-frequency signals. It is a monolithic silicon power field-effect transistor, used in RF and broadcast power amplifiers", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "STMicroelectronics", + "part_name": "Transistor (>=1 W) - RF MOSFET LDMOS" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90). Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line.", + "candidate_set": { + "codes": [ + "854142", + "854190", + "854110", + "854129" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings", + "8541_vs_8542" + ], + "frozen_id": "v2.0.train.0563", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854129", + "id": "SH-0563", + "justification_text": "Goods classified under HS 8541.29; corroborated by 15 customs rulings on comparable goods (EU-EN, US).", + "reference_ruling_ids": [ + "CROSS-084659", + "CROSS-N353309", + "EBTI-EN-0140", + "CROSS-K89192", + "CROSS-N099445", + "EBTI-EN-0143", + "EBTI-EN-0144", + "EBTI-EN-0145", + "EBTI-EN-0146", + "CROSS-084660", + "CROSS-N025506", + "CROSS-N326955", + "CROSS-N336272", + "EBTI-EN-0141", + "EBTI-EN-0147" + ], + "segment": "component", + "split": "train", + "tier1_description": "A gallium-nitride (GaN) RF power transistor covering DC to 4 GHz with about 45 W output from a 48 V supply, amplifying high-frequency signals at high power. It is a monolithic GaN power device, used in radar, communications, and broadband RF amplifier stages", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Qorvo", + "part_name": "Transistor (>=1 W) - DC-4 GHz 45W 48V" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854110", + "854151", + "854160", + "854129" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0564", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854129", + "id": "SH-0564", + "justification_text": "Goods classified under HS 8541.29; corroborated by 18 customs rulings on comparable goods (EU-CZ, EU-EN, JP, US).", + "reference_ruling_ids": [ + "CROSS-084659", + "EBTI-EN-0144", + "CROSS-K89192", + "CROSS-N099445", + "EBTI-EN-0145", + "EBTI-EN-0146", + "EBTI-EN-0143", + "CROSS-N025506", + "CROSS-N353309", + "EBTI-EN-0140", + "CROSS-N326955", + "CROSS-N336272", + "EBTI-CZ-CZBTI43/112203/2026-300000-ZI/01", + "EBTI-EN-0142", + "CROSS-084660", + "EBTI-EN-0141", + "EBTI-EN-0147", + "JP_CUSTOMS-122000643" + ], + "segment": "component", + "split": "train", + "tier1_description": "An insulated-gate bipolar transistor (IGBT) power module rated 1200 V and 40 A in an AG-ECONO2 package, integrating IGBT and freewheeling-diode chips for high-voltage, high-current switching. It is an assembled power semiconductor module, used in motor drives and inverters", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Infineon Technologies", + "part_name": "Transistor (>=1 W) - IGBT Module 1200V" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90). Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line.", + "candidate_set": { + "codes": [ + "854151", + "854160", + "854141", + "854129" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings", + "8541_vs_8542" + ], + "frozen_id": "v2.0.train.0565", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854129", + "id": "SH-0565", + "justification_text": "Goods classified under HS 8541.29; corroborated by 16 customs rulings on comparable goods (EU-CZ, EU-EN, US).", + "reference_ruling_ids": [ + "CROSS-084659", + "CROSS-N099445", + "EBTI-EN-0140", + "CROSS-K89192", + "CROSS-N353309", + "EBTI-EN-0143", + "CROSS-N336272", + "EBTI-CZ-CZBTI43/112203/2026-300000-ZI/01", + "CROSS-084660", + "CROSS-N025506", + "CROSS-N326955", + "EBTI-EN-0141", + "EBTI-EN-0144", + "EBTI-EN-0145", + "EBTI-EN-0146", + "EBTI-EN-0147" + ], + "segment": "component", + "split": "train", + "tier1_description": "An RF power field-effect transistor designed to amplify high-frequency signals at power levels of at least 1 W, fabricated as a monolithic semiconductor device. It is used in radio-frequency power amplifier stages for communications and broadcast equipment", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Flip Electronics", + "part_name": "Transistor (>=1 W) - RF Power" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854151", + "854121", + "854129", + "854110" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0566", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854129", + "id": "SH-0566", + "justification_text": "The product falls under HS 8541.29 (Transistors, other).", + "reference_ruling_ids": [ + "CROSS-084659", + "EBTI-EN-0140", + "CROSS-K89192", + "CROSS-N099445", + "CROSS-N353309", + "EBTI-EN-0143", + "EBTI-EN-0144", + "EBTI-EN-0141", + "EBTI-EN-0145", + "CROSS-084660", + "CROSS-N025506", + "CROSS-N326955", + "CROSS-N336272", + "EBTI-EN-0142", + "EBTI-EN-0146", + "EBTI-EN-0147" + ], + "segment": "component", + "split": "train", + "tier1_description": "A PNP general-purpose bipolar power transistor rated for 80 V collector-emitter, 1.5 A collector current and 12.5 W dissipation. Supplied in a through-hole power package, it suits audio output stages, drivers and medium-power switching and amplification circuits (part BD140)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Multicomp PRO", + "part_name": "BD140" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854129", + "854190", + "854142", + "854151" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0567", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854129", + "id": "SH-0567", + "justification_text": "The product falls under HS 8541.29 (Transistors, other).", + "reference_ruling_ids": [ + "CROSS-084659", + "EBTI-EN-0140", + "EBTI-EN-0143", + "CROSS-K89192", + "CROSS-N099445", + "CROSS-N353309", + "EBTI-EN-0144", + "EBTI-EN-0141", + "EBTI-EN-0145", + "CROSS-084660", + "CROSS-N025506", + "CROSS-N326955", + "CROSS-N336272", + "EBTI-EN-0146", + "EBTI-EN-0147" + ], + "segment": "component", + "split": "train", + "tier1_description": "An NPN general-purpose bipolar power transistor rated for 100 V collector-emitter, 6 A collector current and 65 W dissipation. Supplied in a through-hole power package, it suits medium-power audio output, driver and switching applications (part BD243C)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Multicomp PRO", + "part_name": "BD243C" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854160", + "854159", + "854130", + "854110" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0568", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854130", + "id": "SH-0568", + "justification_text": "The product falls under HS 8541.30 (Thyristors, diacs and triacs).", + "reference_ruling_ids": [ + "EBTI-DE-DE12839/14-1", + "EBTI-CZ-CZ33-0743-2015", + "EBTI-EN-0148" + ], + "segment": "component", + "split": "train", + "tier1_description": "A DIAC bidirectional trigger diode with a breakover voltage near 28 to 36 V, in a surface-mount MiniMELF package. It produces a sharp trigger pulse to fire triacs and thyristors in phase-control dimmers, motor-speed controls and switching circuits (part TMMDB3)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Stmicroelectronics", + "part_name": "TMMDB3" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854151", + "854141", + "854130", + "854149" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0569", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854130", + "id": "SH-0569", + "justification_text": "The product falls under HS 8541.30 (Thyristors, diacs and triacs).", + "reference_ruling_ids": [ + "EBTI-CZ-CZ33-0743-2015", + "EBTI-DE-DE12839/14-1", + "EBTI-EN-0148" + ], + "segment": "component", + "split": "train", + "tier1_description": "A DIAC bidirectional trigger diode with a breakover voltage near 35 to 45 V, in a through-hole DO-35 package. It generates a sharp breakover pulse to trigger triacs and thyristors in dimmers, motor controls and phase-control circuits (part DB4)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Stmicroelectronics", + "part_name": "DB4" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90). Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line.", + "candidate_set": { + "codes": [ + "854142", + "854121", + "854130", + "854110" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings", + "8541_vs_8542" + ], + "frozen_id": "v2.0.train.0570", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854130", + "id": "SH-0570", + "justification_text": "The product falls under HS 8541.30 (Thyristors, diacs and triacs).", + "reference_ruling_ids": [ + "EBTI-DE-DE12839/14-1" + ], + "segment": "component", + "split": "train", + "tier1_description": "A sensitive-gate SCR (silicon-controlled rectifier) rated for 600 V and 4 A, in a TO-225AA package. Its low gate trigger current suits direct control from logic and small signals in switching, crowbar protection and small AC power-control circuits (part C106MG)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Littelfuse", + "part_name": "C106MG" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854130", + "854143", + "854151", + "854141" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0571", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854130", + "id": "SH-0571", + "justification_text": "The product falls under HS 8541.30 (Thyristors, diacs and triacs).", + "reference_ruling_ids": [ + "EBTI-DE-DE12839/14-1", + "EBTI-EN-0148", + "EBTI-EN-0149" + ], + "segment": "component", + "split": "train", + "tier1_description": "A high-power SCR (silicon-controlled rectifier) thyristor module rated for 1.2 kV and about 1.2 kA, in an isolated module package. It provides controlled high-current AC/DC switching and phase control for large motor drives, rectifiers and industrial power systems (part T9G0121203DH)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Powerex", + "part_name": "T9G0121203DH" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854190", + "854130", + "854149", + "854121" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0572", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854130", + "id": "SH-0572", + "justification_text": "The product falls under HS 8541.30 (Thyristors, diacs and triacs).", + "reference_ruling_ids": [ + "EBTI-DE-DE12839/14-1", + "EBTI-EN-0148", + "EBTI-EN-0149" + ], + "segment": "component", + "split": "train", + "tier1_description": "A transient-protection thyristor (overvoltage protector) with diac-style switching, in a surface-mount DO-214AA package. It crowbars damaging surges to protect telecom and signal lines, clamping overvoltage events to safeguard downstream electronics (part TISP4240M3BJR). Part number TISP4240M3BJR-S", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Bourns", + "part_name": "TISP4240M3BJR-S" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854130", + "854129", + "854142", + "854121" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0573", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854130", + "id": "SH-0573", + "justification_text": "The product falls under HS 8541.30 (Thyristors, diacs and triacs).", + "reference_ruling_ids": [ + "EBTI-DE-DE12839/14-1", + "EBTI-EN-0148", + "EBTI-EN-0149" + ], + "segment": "component", + "split": "train", + "tier1_description": "An SCR (silicon-controlled rectifier) thyristor rated for 1.2 kV and 55 A, in a through-hole TO-247AC package. It provides high-voltage controlled power switching and phase control in motor drives, heating controllers and industrial power circuits (part VS-40TPS12). Part number VS-40TPS12-M3", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Vishay", + "part_name": "VS-40TPS12-M3" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854110", + "854143", + "854130", + "854160" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0574", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854130", + "id": "SH-0574", + "justification_text": "The product falls under HS 8541.30 (Thyristors, diacs and triacs).", + "reference_ruling_ids": [ + "EBTI-DE-DE12839/14-1", + "EBTI-EN-0148", + "EBTI-EN-0149" + ], + "segment": "component", + "split": "train", + "tier1_description": "A SIDAC bidirectional thyristor with a breakover voltage near 95 to 113 V, capable of high pulse current, in a TO-92 package. It triggers directly from a rising voltage, switching loads in relaxation oscillators, ignition and high-voltage trigger circuits (part K1050E70)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Littelfuse", + "part_name": "K1050E70" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854142", + "854190", + "854159", + "854130" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0575", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854130", + "id": "SH-0575", + "justification_text": "The product falls under HS 8541.30 (Thyristors, diacs and triacs).", + "reference_ruling_ids": [ + "EBTI-DE-DE12839/14-1", + "EBTI-EN-0148", + "EBTI-EN-0149" + ], + "segment": "component", + "split": "train", + "tier1_description": "An SCR (silicon-controlled rectifier) thyristor rated for 600 V and 1 A, in a SOT-223 surface-mount package with sensitive-gate triggering. It suits low-power AC switching, crowbar protection and trigger control in compact circuits (part BT168GW). Part number BT168GW,115", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "WEEN Semiconductors", + "part_name": "BT168GW,115" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854159", + "854130", + "854121", + "854141" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0576", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854130", + "id": "SH-0576", + "justification_text": "The product falls under HS 8541.30 (Thyristors, diacs and triacs).", + "reference_ruling_ids": [ + "EBTI-CZ-CZ33-0743-2015", + "EBTI-DE-DE12839/14-1", + "EBTI-EN-0148" + ], + "segment": "component", + "split": "train", + "tier1_description": "A DIAC bidirectional trigger diode with a breakover voltage near 30 to 34 V, in a through-hole DO-35 package. It provides a sharp trigger pulse for firing triacs and thyristors in light dimmers, motor-speed controls and phase-control circuits (part DB3TG)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Stmicroelectronics", + "part_name": "DB3TG" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90). Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line. LED as a semiconductor device or module (8541.41) vs a finished luminaire or light fitting (9405.42); completeness as a lighting article decides.", + "candidate_set": { + "codes": [ + "854110", + "854141", + "854149", + "854159" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings", + "8541_vs_8542", + "led_device_vs_luminaire" + ], + "frozen_id": "v2.0.train.0577", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854141", + "id": "SH-0577", + "justification_text": "Goods classified under HS 8541.41; corroborated by 38 customs rulings on comparable goods (EU-DE, EU-EN, EU-PL, US).", + "reference_ruling_ids": [ + "EBTI-PL-PLBTIWIT-2022-000243", + "EBTI-EN-0032", + "EBTI-EN-0045", + "EBTI-EN-0059", + "CROSS-U0015", + "EBTI-DE-DEBTI12162/22-1", + "EBTI-DE-DEBTI18859/23-1", + "EBTI-DE-DEBTI57910/24-1", + "EBTI-EN-0030", + "EBTI-EN-0033", + "EBTI-EN-0034", + "EBTI-EN-0043", + "EBTI-EN-0044", + "EBTI-EN-0053", + "EBTI-EN-0057", + "EBTI-EN-0060", + "EBTI-EN-0063", + "EBTI-EN-0041", + "EBTI-EN-0042", + "EBTI-EN-0046", + "EBTI-EN-0047", + "EBTI-EN-0048", + "EBTI-EN-0049", + "EBTI-EN-0050", + "EBTI-EN-0051", + "EBTI-EN-0052", + "EBTI-EN-0054", + "EBTI-EN-0055", + "EBTI-EN-0056", + "EBTI-EN-0058", + "EBTI-EN-0061", + "EBTI-EN-0062", + "CROSS-N352476", + "EBTI-EN-0029", + "EBTI-EN-0040", + "EBTI-EN-0064", + "EBTI-EN-0065", + "EBTI-EN-0150" + ], + "segment": "component", + "split": "train", + "tier1_description": "An addressable RGB light-emitting diode module in which red, green, and blue dies share a package with a single-wire serial controller, allowing each pixel to be individually programmed for color and brightness and daisy-chained over one data line. It is a populated LED assembly, used as a programmable pixel element in decorative and indicator lighting", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit Industries LLC", + "part_name": "Light-Emitting Diode (LED) - ADDRESS" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90). Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line. LED as a semiconductor device or module (8541.41) vs a finished luminaire or light fitting (9405.42); completeness as a lighting article decides.", + "candidate_set": { + "codes": [ + "854129", + "854130", + "854151", + "854141" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings", + "8541_vs_8542", + "led_device_vs_luminaire" + ], + "frozen_id": "v2.0.train.0578", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854141", + "id": "SH-0578", + "justification_text": "Goods classified under HS 8541.41; corroborated by 42 customs rulings on comparable goods (EU-DE, EU-EN, EU-PL, US).", + "reference_ruling_ids": [ + "EBTI-EN-0045", + "EBTI-EN-0043", + "EBTI-EN-0044", + "EBTI-DE-DEBTI12162/22-1", + "EBTI-DE-DEBTI18859/23-1", + "EBTI-DE-DEBTI57910/24-1", + "EBTI-EN-0041", + "EBTI-EN-0046", + "EBTI-EN-0047", + "EBTI-EN-0048", + "EBTI-PL-PLBTIWIT-2022-000243", + "CROSS-U0015", + "EBTI-EN-0030", + "EBTI-EN-0032", + "EBTI-EN-0033", + "EBTI-EN-0150", + "EBTI-EN-0034", + "EBTI-EN-0042", + "EBTI-EN-0049", + "EBTI-EN-0050", + "EBTI-EN-0051", + "EBTI-EN-0052", + "EBTI-EN-0053", + "EBTI-EN-0054", + "EBTI-EN-0055", + "EBTI-EN-0057", + "EBTI-EN-0058", + "EBTI-EN-0060", + "EBTI-EN-0061", + "EBTI-EN-0062", + "EBTI-EN-0063", + "EBTI-EN-0064", + "EBTI-EN-0065", + "EBTI-EN-0056", + "EBTI-EN-0059", + "CROSS-N352476", + "CROSS-U0016", + "EBTI-EN-0029", + "EBTI-EN-0031", + "EBTI-EN-0035", + "EBTI-EN-0037", + "EBTI-EN-0040" + ], + "segment": "component", + "split": "train", + "tier1_description": "A populated linear printed-circuit board carrying Osram deep-ultraviolet (UV-C) light-emitting diodes with about 2 W total radiant output, generating germicidal short-wavelength ultraviolet light for microbial inactivation. It is an LED module assembly mounting one or more monolithic UV-C emitter dies on a board, used in air- and surface-disinfection fixtures", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "LTF technology LLC", + "part_name": "Light-Emitting Diode (LED) - UV-C" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90). Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line.", + "candidate_set": { + "codes": [ + "854110", + "854143", + "854141", + "854160" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings", + "8541_vs_8542" + ], + "frozen_id": "v2.0.train.0579", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854141", + "id": "SH-0579", + "justification_text": "Goods classified under HS 8541.41; corroborated by 44 customs rulings on comparable goods (EU-DE, EU-EN, EU-PL, US).", + "reference_ruling_ids": [ + "EBTI-DE-DEBTI12162/22-1", + "EBTI-DE-DEBTI18859/23-1", + "EBTI-DE-DEBTI57910/24-1", + "EBTI-EN-0032", + "EBTI-EN-0054", + "EBTI-EN-0150", + "EBTI-PL-PLBTIWIT-2022-000243", + "EBTI-EN-0041", + "EBTI-EN-0043", + "EBTI-EN-0044", + "EBTI-EN-0045", + "EBTI-EN-0046", + "EBTI-EN-0047", + "EBTI-EN-0048", + "EBTI-EN-0049", + "EBTI-EN-0050", + "EBTI-EN-0051", + "EBTI-EN-0053", + "EBTI-EN-0055", + "EBTI-EN-0061", + "EBTI-EN-0062", + "EBTI-EN-0065", + "CROSS-U0015", + "EBTI-EN-0030", + "EBTI-EN-0031", + "EBTI-EN-0033", + "EBTI-EN-0042", + "EBTI-EN-0056", + "EBTI-EN-0057", + "EBTI-EN-0058", + "CROSS-U0016", + "EBTI-EN-0029", + "EBTI-EN-0035", + "EBTI-EN-0036", + "EBTI-EN-0037", + "EBTI-EN-0039", + "EBTI-EN-0040", + "EBTI-EN-0060", + "EBTI-EN-0063", + "EBTI-EN-0064", + "CROSS-N352476", + "EBTI-EN-0034", + "EBTI-EN-0052", + "EBTI-EN-0059" + ], + "segment": "component", + "split": "train", + "tier1_description": "A deep-ultraviolet (UV-C) emitter light-emitting diode with a peak wavelength near 265 nm and about 50 mW radiant output, producing germicidal short-wavelength ultraviolet light at the disinfection efficiency peak from a single semiconductor die. It is a monolithic photo-emissive semiconductor device, used in air, surface, and water sterilization systems", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Stanley Electric Co", + "part_name": "Light-Emitting Diode (LED) - EMITTER" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90). Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line. LED as a semiconductor device or module (8541.41) vs a finished luminaire or light fitting (9405.42); completeness as a lighting article decides.", + "candidate_set": { + "codes": [ + "854149", + "854142", + "854151", + "854141" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings", + "8541_vs_8542", + "led_device_vs_luminaire" + ], + "frozen_id": "v2.0.train.0580", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854141", + "id": "SH-0580", + "justification_text": "Goods classified under HS 8541.41; corroborated by 38 customs rulings on comparable goods (EU-DE, EU-EN, EU-PL, US).", + "reference_ruling_ids": [ + "EBTI-PL-PLBTIWIT-2022-000243", + "EBTI-DE-DEBTI12162/22-1", + "EBTI-DE-DEBTI18859/23-1", + "EBTI-DE-DEBTI57910/24-1", + "EBTI-EN-0045", + "CROSS-U0015", + "EBTI-EN-0030", + "EBTI-EN-0032", + "EBTI-EN-0033", + "EBTI-EN-0043", + "EBTI-EN-0044", + "EBTI-EN-0057", + "EBTI-EN-0059", + "EBTI-EN-0034", + "EBTI-EN-0041", + "EBTI-EN-0046", + "EBTI-EN-0047", + "EBTI-EN-0048", + "EBTI-EN-0053", + "EBTI-EN-0060", + "EBTI-EN-0063", + "EBTI-EN-0042", + "EBTI-EN-0049", + "EBTI-EN-0050", + "EBTI-EN-0051", + "EBTI-EN-0052", + "EBTI-EN-0054", + "EBTI-EN-0055", + "EBTI-EN-0056", + "EBTI-EN-0058", + "EBTI-EN-0061", + "EBTI-EN-0062", + "EBTI-EN-0064", + "CROSS-N352476", + "EBTI-EN-0029", + "EBTI-EN-0040", + "EBTI-EN-0065", + "EBTI-EN-0150" + ], + "segment": "component", + "split": "train", + "tier1_description": "A ring-shaped lamp module populated with addressable RGB light-emitting diodes (WS2812 type), each integrating red, green, and blue dies with a single-wire serial controller so individual pixels can be set for color and brightness over one data line. It is a populated LED assembly used for programmable decorative and indicator lighting", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "DFRobot", + "part_name": "Light-Emitting Diode (LED) - WS2812-16" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90). Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line. LED as a semiconductor device or module (8541.41) vs a finished luminaire or light fitting (9405.42); completeness as a lighting article decides.", + "candidate_set": { + "codes": [ + "854190", + "854141", + "854149", + "854129" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings", + "8541_vs_8542", + "led_device_vs_luminaire" + ], + "frozen_id": "v2.0.train.0581", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854141", + "id": "SH-0581", + "justification_text": "Goods classified under HS 8541.41; corroborated by 38 customs rulings on comparable goods (EU-DE, EU-EN, EU-PL, US).", + "reference_ruling_ids": [ + "EBTI-PL-PLBTIWIT-2022-000243", + "EBTI-DE-DEBTI12162/22-1", + "EBTI-DE-DEBTI18859/23-1", + "EBTI-DE-DEBTI57910/24-1", + "EBTI-EN-0045", + "EBTI-EN-0030", + "EBTI-EN-0032", + "EBTI-EN-0033", + "EBTI-EN-0041", + "EBTI-EN-0043", + "EBTI-EN-0044", + "EBTI-EN-0046", + "EBTI-EN-0047", + "EBTI-EN-0048", + "EBTI-EN-0059", + "CROSS-U0015", + "EBTI-EN-0052", + "EBTI-EN-0053", + "EBTI-EN-0060", + "EBTI-EN-0063", + "EBTI-EN-0034", + "EBTI-EN-0054", + "EBTI-EN-0055", + "EBTI-EN-0057", + "EBTI-EN-0058", + "EBTI-EN-0061", + "EBTI-EN-0062", + "EBTI-EN-0064", + "CROSS-N352476", + "EBTI-EN-0029", + "EBTI-EN-0040", + "EBTI-EN-0042", + "EBTI-EN-0049", + "EBTI-EN-0050", + "EBTI-EN-0051", + "EBTI-EN-0056", + "EBTI-EN-0065", + "EBTI-EN-0150" + ], + "segment": "component", + "split": "train", + "tier1_description": "A hexagonal printed-circuit board populated with 37 addressable RGB light-emitting diodes (WS2812 type), each co-packaging red, green, and blue dies with a single-wire serial controller so every pixel is independently programmable over one data line. It is a populated LED assembly used for programmable decorative lighting and visual displays", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "M5Stack Technology Co., Ltd.", + "part_name": "Light-Emitting Diode (LED) - NEOHEX 37" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90). Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line. LED as a semiconductor device or module (8541.41) vs a finished luminaire or light fitting (9405.42); completeness as a lighting article decides.", + "candidate_set": { + "codes": [ + "854141", + "854190", + "854149", + "854142" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings", + "8541_vs_8542", + "led_device_vs_luminaire" + ], + "frozen_id": "v2.0.train.0582", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854141", + "id": "SH-0582", + "justification_text": "Goods classified under HS 8541.41; corroborated by 38 customs rulings on comparable goods (EU-DE, EU-EN, EU-PL, US).", + "reference_ruling_ids": [ + "EBTI-PL-PLBTIWIT-2022-000243", + "EBTI-DE-DEBTI18859/23-1", + "EBTI-EN-0030", + "EBTI-EN-0032", + "EBTI-EN-0033", + "EBTI-EN-0045", + "EBTI-DE-DEBTI12162/22-1", + "EBTI-DE-DEBTI57910/24-1", + "EBTI-EN-0041", + "EBTI-EN-0043", + "EBTI-EN-0044", + "EBTI-EN-0046", + "EBTI-EN-0047", + "EBTI-EN-0048", + "EBTI-EN-0053", + "EBTI-EN-0059", + "EBTI-EN-0060", + "EBTI-EN-0063", + "CROSS-U0015", + "EBTI-EN-0034", + "EBTI-EN-0052", + "EBTI-EN-0054", + "EBTI-EN-0055", + "EBTI-EN-0057", + "EBTI-EN-0058", + "EBTI-EN-0061", + "EBTI-EN-0062", + "CROSS-N352476", + "EBTI-EN-0029", + "EBTI-EN-0040", + "EBTI-EN-0042", + "EBTI-EN-0049", + "EBTI-EN-0050", + "EBTI-EN-0051", + "EBTI-EN-0056", + "EBTI-EN-0064", + "EBTI-EN-0065", + "EBTI-EN-0150" + ], + "segment": "component", + "split": "train", + "tier1_description": "A one-metre addressable RGB light-emitting diode strip populated with serially-controlled LEDs (each integrating red, green, and blue dies with a single-wire controller) so individual pixels are programmable over one data line. It is a populated flexible LED assembly, used for programmable decorative, accent, and display lighting", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Seeed Technology Co., Ltd", + "part_name": "Light-Emitting Diode (LED) - ADDRESS" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90). Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line.", + "candidate_set": { + "codes": [ + "854121", + "854141", + "854143", + "854149" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings", + "8541_vs_8542" + ], + "frozen_id": "v2.0.train.0583", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854141", + "id": "SH-0583", + "justification_text": "Goods classified under HS 8541.41; corroborated by 42 customs rulings on comparable goods (EU-DE, EU-EN, EU-PL, US).", + "reference_ruling_ids": [ + "EBTI-DE-DEBTI12162/22-1", + "EBTI-DE-DEBTI18859/23-1", + "EBTI-DE-DEBTI57910/24-1", + "EBTI-PL-PLBTIWIT-2022-000243", + "CROSS-U0015", + "EBTI-EN-0030", + "EBTI-EN-0032", + "EBTI-EN-0033", + "EBTI-EN-0045", + "EBTI-EN-0041", + "EBTI-EN-0043", + "EBTI-EN-0044", + "EBTI-EN-0046", + "EBTI-EN-0047", + "EBTI-EN-0048", + "EBTI-EN-0049", + "EBTI-EN-0053", + "EBTI-EN-0054", + "EBTI-EN-0055", + "EBTI-EN-0061", + "EBTI-EN-0062", + "EBTI-EN-0064", + "EBTI-EN-0065", + "EBTI-EN-0042", + "EBTI-EN-0050", + "EBTI-EN-0051", + "EBTI-EN-0052", + "EBTI-EN-0056", + "EBTI-EN-0057", + "EBTI-EN-0058", + "EBTI-EN-0060", + "EBTI-EN-0063", + "EBTI-EN-0031", + "EBTI-EN-0150", + "CROSS-N352476", + "EBTI-EN-0029", + "EBTI-EN-0034", + "EBTI-EN-0035", + "EBTI-EN-0036", + "EBTI-EN-0039", + "EBTI-EN-0040", + "EBTI-EN-0059" + ], + "segment": "component", + "split": "train", + "tier1_description": "A kit of 1 W chip-on-board (COB) light-emitting diodes spanning seven colors, each packaging one or more emitter dies bonded directly to the board substrate for high luminous density. They are monolithic photo-emissive semiconductor devices, used as high-brightness illumination and accent light sources", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Lumimax Optoelectronic Technology", + "part_name": "Light-Emitting Diode (LED) - LED 1W COB" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90). LED as a semiconductor device or module (8541.41) vs a finished luminaire or light fitting (9405.42); completeness as a lighting article decides.", + "candidate_set": { + "codes": [ + "854141", + "854159", + "854151", + "854130" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings", + "led_device_vs_luminaire" + ], + "frozen_id": "v2.0.train.0584", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854141", + "id": "SH-0584", + "justification_text": "The product falls under HS 8541.41 (Light-emitting diodes (LED).", + "reference_ruling_ids": [ + "EBTI-PL-PLBTIWIT-2022-000243", + "EBTI-DE-DEBTI18859/23-1", + "EBTI-EN-0049", + "EBTI-EN-0051", + "EBTI-DE-DEBTI12162/22-1", + "EBTI-DE-DEBTI57910/24-1", + "EBTI-EN-0030", + "EBTI-EN-0033", + "EBTI-EN-0042", + "EBTI-EN-0050", + "EBTI-EN-0032", + "EBTI-EN-0040", + "EBTI-EN-0041", + "EBTI-EN-0043", + "EBTI-EN-0044", + "EBTI-EN-0045", + "EBTI-EN-0046", + "EBTI-EN-0047", + "EBTI-EN-0048", + "EBTI-EN-0059", + "CROSS-U0015", + "CROSS-U0016", + "EBTI-EN-0029", + "EBTI-EN-0052", + "EBTI-EN-0053", + "EBTI-EN-0054", + "EBTI-EN-0055", + "EBTI-EN-0057", + "EBTI-EN-0058", + "EBTI-EN-0060", + "EBTI-EN-0061", + "EBTI-EN-0062", + "EBTI-EN-0063" + ], + "segment": "component", + "split": "train", + "tier1_description": "A 330 mm flexible digital RGB LED strip with 20 individually addressable LEDs, each with an integrated driver controlled over a single data line. It suits decorative, signage and project lighting with per-LED colour control (part MP-703-1065)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Multicomp PRO", + "part_name": "MP-703-1065" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854141", + "854149", + "854130", + "854151" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0585", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854141", + "id": "SH-0585", + "justification_text": "The product falls under HS 8541.41 (Light-emitting diodes (LED).", + "reference_ruling_ids": [ + "EBTI-EN-0041", + "EBTI-EN-0043", + "EBTI-EN-0044", + "EBTI-EN-0045", + "EBTI-EN-0046", + "EBTI-EN-0047", + "EBTI-EN-0048", + "CROSS-U0015", + "CROSS-U0016", + "EBTI-DE-DEBTI18859/23-1", + "EBTI-EN-0030", + "EBTI-EN-0033", + "EBTI-EN-0042", + "EBTI-EN-0049", + "EBTI-EN-0051", + "EBTI-EN-0052" + ], + "segment": "component", + "split": "train", + "tier1_description": "A breakout board carrying a 5 x 5 matrix of RGB LEDs with an integrated driver controlled over I2C. It provides a compact colour display for indicators, animations and status visualization in projects (part PIM435)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Pimoroni", + "part_name": "PIM435" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854142", + "854110", + "854159", + "854129" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0586", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854142", + "id": "SH-0586", + "justification_text": "This is a bare monocrystalline silicon photovoltaic cell sold one at a time for board-level integration, which matches subheading 8541.42 for photovoltaic cells not assembled into modules or panels. Classified under HS 8541.42.", + "reference_ruling_ids": [ + "EBTI-FR-FRBTIFR-BTI-2023-03370", + "EBTI-HU-HUBTIHU190000-2025-6066982418", + "EBTI-DE-DEBTI29503/22-1", + "EBTI-IT-ITBTIIT922104-2024-BTI0809" + ], + "segment": "component", + "split": "train", + "tier1_description": "Monocrystalline silicon photovoltaic cell, IXOLAR series, rated 24.5 mW maximum power with 5.53 V open circuit voltage, supplied as a bare unassembled cell for board level integration. Powers energy harvesting circuits, wireless sensors, and low power IoT devices from ambient light. Part number KXOB25-01X8F-TB", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "ANYSOLAR Ltd", + "part_name": "KXOB25-01X8F-TB" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854142", + "854110", + "854159", + "854129" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0587", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854142", + "id": "SH-0587", + "justification_text": "Tape-and-reel is just a delivery format for SMT assembly, not module assembly, so the cell is still an unassembled photovoltaic cell under subheading 8541.42. Reel packaging is normal for discrete. Classified under HS 8541.42.", + "reference_ruling_ids": [ + "EBTI-FR-FRBTIFR-BTI-2023-03370", + "EBTI-HU-HUBTIHU190000-2025-6066982418" + ], + "segment": "component", + "split": "train", + "tier1_description": "Bare monocrystalline silicon photovoltaic cell delivering 24.5 mW at 5.53 V open circuit, packaged on tape and reel for automated surface mount assembly. Unassembled high efficiency cell intended for direct soldering onto printed circuit boards in self powered electronics. Part number KXOB25-01X8F-TR", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "ANYSOLAR Ltd", + "part_name": "KXOB25-01X8F-TR" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854142", + "854110", + "854159", + "854129" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0588", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854142", + "id": "SH-0588", + "justification_text": "Sold as a single unassembled cell on reel, this monocrystalline photovoltaic cell falls under subheading 8541.42. The 26.3 mW output is a performance variant of the sibling part; both are discrete. Classified under HS 8541.42.", + "reference_ruling_ids": [ + "EBTI-HU-HUBTIHU190000-2025-6066982418", + "EBTI-FR-FRBTIFR-BTI-2023-03370", + "EBTI-DE-DEBTI29503/22-1", + "EBTI-IT-ITBTIIT922104-2024-BTI0809" + ], + "segment": "component", + "split": "train", + "tier1_description": "Monocrystalline photovoltaic cell, 23 by 8 by 1.8 mm, maximum power 26.3 mW, open circuit voltage 5.53 V, short circuit current 6.3 mA, operating range minus 40 to 90 degrees C. Unassembled solar cell for energy harvesting modules and battery charging in compact devices. Part number KXOB25-02X8F-TR", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "ANYSOLAR Ltd", + "part_name": "KXOB25-02X8F-TR" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90). Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line.", + "candidate_set": { + "codes": [ + "854142", + "854110", + "854159", + "854129" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings", + "8541_vs_8542" + ], + "frozen_id": "v2.0.train.0589", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854142", + "id": "SH-0589", + "justification_text": "Subheading 8541.42 applies because this is a single unassembled cell on reel. The internally series-connected segments that raise the voltage are part of the cell's own design, not module wiring. Classified under HS 8541.42.", + "reference_ruling_ids": [ + "EBTI-FR-FRBTIFR-BTI-2023-03370", + "EBTI-HU-HUBTIHU190000-2025-6066982418" + ], + "segment": "component", + "split": "train", + "tier1_description": "Third generation monocrystalline silicon photovoltaic cell rated 30 mW with 2.76 V open circuit voltage, presented as a discrete unassembled cell on reel. Series connected internal segments raise output voltage for direct supply of microcontroller and sensor loads. Part number GEN3", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "ANYSOLAR Ltd", + "part_name": "GEN3" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854142", + "854110", + "854159", + "854129" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0590", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854142", + "id": "SH-0590", + "justification_text": "Sold in bulk as bare cells for customer assembly, this photovoltaic cell sits in subheading 8541.42 for cells not assembled into modules or panels. The bulk packaging shows the cells ship individua. Classified under HS 8541.42.", + "reference_ruling_ids": [ + "EBTI-FR-FRBTIFR-BTI-2023-03370", + "EBTI-HU-HUBTIHU190000-2025-6066982418" + ], + "segment": "component", + "split": "train", + "tier1_description": "Monocrystalline photovoltaic cell measuring 22 by 7 by 1.8 mm, maximum power 22 mW, voltage at maximum power point 1.67 V, open circuit voltage 2.07 V, short circuit current 14 mA. Sold as a bare cell in bulk for assembly into customer products. Part number KXOB25-04X3F-TB", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "ANYSOLAR Ltd", + "part_name": "KXOB25-04X3F-TB" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854142", + "854110", + "854159", + "854129" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0591", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854142", + "id": "SH-0591", + "justification_text": "An unassembled monocrystalline photovoltaic cell on tape and reel meets subheading 8541.42. The uses listed, wireless sensors and shelf labels, are customer assembly projects, not finished modules. Classified under HS 8541.42.", + "reference_ruling_ids": [ + "EBTI-FR-FRBTIFR-BTI-2023-03370", + "EBTI-HU-HUBTIHU190000-2025-6066982418" + ], + "segment": "component", + "split": "train", + "tier1_description": "High efficiency monocrystalline silicon photovoltaic cell rated 30.7 mW at 2.07 V open circuit, supplied unassembled on tape and reel. Compact bare cell adopted in wireless sensor nodes, electronic shelf labels, and remote controls drawing power from indoor or outdoor light. Part number KXOB25-05X3F-TR", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "ANYSOLAR Ltd", + "part_name": "KXOB25-05X3F-TR" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854142", + "854110", + "854159", + "854129" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0592", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854142", + "id": "SH-0592", + "justification_text": "This single-junction bare cell at 690 mV is sold in bulk as an unassembled photovoltaic cell, which is the scope of subheading 8541.42. The single-segment design is why the voltage is lower than th. Classified under HS 8541.42.", + "reference_ruling_ids": [ + "EBTI-FR-FRBTIFR-BTI-2023-03370", + "EBTI-HU-HUBTIHU190000-2025-6066982418", + "EBTI-IT-ITBTIIT922104-2024-BTI0809" + ], + "segment": "component", + "split": "train", + "tier1_description": "Single junction monocrystalline photovoltaic cell, 22 by 7 by 1.8 mm, maximum power 24.5 mW, current at maximum power 43.9 mA, open circuit voltage 690 mV. Bare unassembled cell suited to boost converter based energy harvesting designs requiring higher current at low voltage. Part number KXOB25-12X1F-TB", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "ANYSOLAR Ltd", + "part_name": "KXOB25-12X1F-TB" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854142", + "854110", + "854159", + "854129" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0593", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854142", + "id": "SH-0593", + "justification_text": "Subheading 8541.42 applies because this is an unassembled photovoltaic cell on reel. Tape-and-reel is a packaging method, not module assembly, and the cell is meant for integration into the custome. Classified under HS 8541.42.", + "reference_ruling_ids": [ + "EBTI-FR-FRBTIFR-BTI-2023-03370", + "EBTI-HU-HUBTIHU190000-2025-6066982418", + "EBTI-DE-DEBTI29503/22-1" + ], + "segment": "component", + "split": "train", + "tier1_description": "Monocrystalline silicon photovoltaic cell rated 30.7 mW maximum power with 690 mV open circuit voltage, supplied as an unassembled component on tape and reel. The low voltage high current bare cell format pairs with harvesting power management circuits in miniature autonomous devices. Part number KXOB25-14X1F-TR", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "ANYSOLAR Ltd", + "part_name": "KXOB25-14X1F-TR" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854142", + "854110", + "854159", + "854129" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0594", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854142", + "id": "SH-0594", + "justification_text": "The thin-profile version is supplied on reel as a single unassembled cell, so it falls under subheading 8541.42 for photovoltaic cells not assembled into modules or panels. The reduced thickness is. Classified under HS 8541.42.", + "reference_ruling_ids": [ + "EBTI-HU-HUBTIHU190000-2025-6066982418", + "EBTI-FR-FRBTIFR-BTI-2023-03370", + "EBTI-DE-DEBTI29503/22-1" + ], + "segment": "component", + "split": "train", + "tier1_description": "Thin profile third generation monocrystalline photovoltaic cell rated 30.9 mW at 2.07 V, supplied unassembled on reel for surface mounting. The reduced thickness variant targets slim consumer devices and card format electronics powered by ambient light. Part number KXOB25-05X3TF-TR", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "ANYSOLAR Ltd", + "part_name": "KXOB25-05X3TF-TR" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854142", + "854110", + "854159", + "854129" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0595", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854142", + "id": "SH-0595", + "justification_text": "At 105.9 mW this large-area cell is still a single unassembled photovoltaic cell on tape and reel, so subheading 8541.42 applies. The higher power comes from the bigger active area, not from joinin. Classified under HS 8541.42.", + "reference_ruling_ids": [ + "EBTI-FR-FRBTIFR-BTI-2023-03370", + "EBTI-HU-HUBTIHU190000-2025-6066982418", + "EBTI-IT-ITBTIIT922104-2024-BTI0809" + ], + "segment": "component", + "split": "train", + "tier1_description": "Large area thin monocrystalline silicon photovoltaic cell delivering 105.9 mW at 4.15 V, presented as a bare unassembled cell on tape and reel. The higher power format supplies energy harvesting systems with greater load budgets such as asset trackers and e paper displays. Part number KXOB081K06TF-TR", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "ANYSOLAR Ltd", + "part_name": "KXOB081K06TF-TR" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854110", + "854143", + "854149", + "854130" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0596", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854149", + "id": "SH-0596", + "justification_text": "Goods classified under HS 8541.49; corroborated by 8 customs rulings on comparable goods (EU-DE, EU-EN, EU-NL).", + "reference_ruling_ids": [ + "EBTI-EN-0071", + "EBTI-DE-DEBTI51397/23-1", + "EBTI-EN-0077", + "EBTI-EN-0072", + "EBTI-EN-0074", + "EBTI-EN-0075", + "EBTI-EN-0073", + "EBTI-NL-BEBTIDT.50.004.046" + ], + "segment": "component", + "split": "train", + "tier1_description": "An optical ambient-light sensor responsive near 500 nm in a 6-pad SMD package, converting visible light intensity into an electrical signal. It is a monolithic photosensitive semiconductor device, used to measure ambient illumination for display and lighting control", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Broadcom Limited", + "part_name": "Photosensitive Semiconductor Device" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854149", + "854130", + "854151", + "854121" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0597", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854149", + "id": "SH-0597", + "justification_text": "Goods classified under HS 8541.49; corroborated by 8 customs rulings on comparable goods (EU-DE, EU-EN, EU-NL).", + "reference_ruling_ids": [ + "EBTI-EN-0071", + "EBTI-DE-DEBTI51397/23-1", + "EBTI-EN-0077", + "EBTI-EN-0073", + "EBTI-EN-0075", + "EBTI-NL-BEBTIDT.50.004.046", + "EBTI-EN-0072", + "EBTI-EN-0074" + ], + "segment": "component", + "split": "train", + "tier1_description": "A side-view photo sensor (phototransistor/photodiode) in a 2-pad SMD package, converting incident light into an electrical signal from a side-facing aperture. It is a monolithic photosensitive semiconductor device, used in optical detection and presence-sensing circuits", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Kingbright", + "part_name": "Photosensitive Semiconductor Device" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90). Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line.", + "candidate_set": { + "codes": [ + "854160", + "854129", + "854149", + "854130" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings", + "8541_vs_8542" + ], + "frozen_id": "v2.0.train.0598", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854149", + "id": "SH-0598", + "justification_text": "Goods classified under HS 8541.49; corroborated by 9 customs rulings on comparable goods (EU-DE, EU-EN, EU-NL).", + "reference_ruling_ids": [ + "EBTI-EN-0071", + "EBTI-DE-DEBTI51397/23-1", + "EBTI-EN-0077", + "EBTI-EN-0072", + "EBTI-EN-0075", + "EBTI-NL-BEBTIDT.50.004.046", + "EBTI-EN-0073", + "EBTI-EN-0074", + "EBTI-EN-0076" + ], + "segment": "component", + "split": "train", + "tier1_description": "A silicon dual photodiode in a roughly 2.1 x 0.6 mm package, converting incident light into a proportional electrical current across two photodiode elements. It is a monolithic photosensitive semiconductor device, used in optical sensing and light-measurement circuits", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Advanced Photonix", + "part_name": "Photosensitive Semiconductor Device" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854129", + "854149", + "854142", + "854160" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0599", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854149", + "id": "SH-0599", + "justification_text": "Goods classified under HS 8541.49; corroborated by 9 customs rulings on comparable goods (EU-DE, EU-EN, EU-NL).", + "reference_ruling_ids": [ + "EBTI-DE-DEBTI51397/23-1", + "EBTI-EN-0071", + "EBTI-EN-0075", + "EBTI-EN-0077", + "EBTI-EN-0072", + "EBTI-EN-0074", + "EBTI-EN-0073", + "EBTI-EN-0076", + "EBTI-NL-BEBTIDT.50.004.046" + ], + "segment": "component", + "split": "train", + "tier1_description": "A silicon photodetector, converting incident light into a proportional electrical signal via a photosensitive junction. It is a monolithic photosensitive semiconductor device, used in optical sensing and light-measurement applications", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Marktech Optoelectronics", + "part_name": "Photosensitive Semiconductor Device" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854149", + "854110", + "854160", + "854151" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0600", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854149", + "id": "SH-0600", + "justification_text": "The product falls under HS 8541.49 (Other photosensitive semiconductor devices).", + "reference_ruling_ids": [ + "EBTI-EN-0077", + "EBTI-EN-0071", + "EBTI-EN-0073", + "EBTI-EN-0075", + "EBTI-EN-0076" + ], + "segment": "component", + "split": "train", + "tier1_description": "A silicon PIN photodiode with peak spectral response near 940 nm in the near-infrared, in a surface-mount package. Its fast response suits infrared remote-control receivers, optical sensing and light-barrier detection in compact electronics (part SFH 2703)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "AMS Osram Group", + "part_name": "SFH 2703" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854151", + "854159", + "854141", + "854149" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0601", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854149", + "id": "SH-0601", + "justification_text": "The product falls under HS 8541.49 (Other photosensitive semiconductor devices).", + "reference_ruling_ids": [ + "EBTI-EN-0071", + "EBTI-EN-0073", + "EBTI-EN-0075", + "EBTI-EN-0076", + "EBTI-EN-0077", + "EBTI-NL-BEBTIDT.50.004.046" + ], + "segment": "component", + "split": "train", + "tier1_description": "A silicon phototransistor with peak response near 850 nm and a narrow 15-degree field of view, in a 5 mm (T-1 3/4) package. Its directional sensitivity suits infrared sensing, light barriers and reflective object detection (part BPV11)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Vishay", + "part_name": "BPV11" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854151", + "854149", + "854129", + "854121" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0602", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854149", + "id": "SH-0602", + "justification_text": "The product falls under HS 8541.49 (Other photosensitive semiconductor devices).", + "reference_ruling_ids": [ + "EBTI-NL-BEBTIDT.50.004.046", + "EBTI-EN-0071", + "EBTI-EN-0075" + ], + "segment": "component", + "split": "train", + "tier1_description": "An optocoupler with a photodarlington output in a 6-pin surface-mount package, providing galvanic isolation with high current-transfer ratio. It suits isolated signal coupling and low-speed switching in control and instrumentation circuits (part MOC8050SR2VM)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Onsemi", + "part_name": "MOC8050SR2VM" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854110", + "854143", + "854149", + "854141" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0603", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854149", + "id": "SH-0603", + "justification_text": "The product falls under HS 8541.49 (Other photosensitive semiconductor devices).", + "reference_ruling_ids": [ + "EBTI-DE-DEBTI51397/23-1", + "EBTI-EN-0071" + ], + "segment": "component", + "split": "train", + "tier1_description": "An analog-output ambient-light sensor with peak response near 500 nm, approximating the human eye, in a compact ChipLED package. It measures illuminance for automatic backlight and display brightness control in portable devices (part APDS-9005-020)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Broadcom", + "part_name": "apds-9005-020" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854129", + "854151", + "854160", + "854149" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0604", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854149", + "id": "SH-0604", + "justification_text": "The product falls under HS 8541.49 (Other photosensitive semiconductor devices).", + "reference_ruling_ids": [ + "EBTI-DE-DEBTI51397/23-1", + "EBTI-EN-0075", + "EBTI-EN-0076", + "EBTI-EN-0077", + "EBTI-EN-0073", + "EBTI-NL-BEBTIDT.50.004.046" + ], + "segment": "component", + "split": "train", + "tier1_description": "A silicon phototransistor rated for about 250 mW in a 3-lead TO-18 metal package, producing collector current proportional to incident light. It suits optical sensing, light barriers and encoder detection in industrial and consumer devices (part OP830SL)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "TT Electronics / Optek Technology", + "part_name": "OP830SL" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90). HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "854121", + "854151", + "854190", + "854141" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings", + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0605", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854151", + "id": "SH-0605", + "justification_text": "The product falls under HS 8541.51 (Semiconductor-based transducers).", + "reference_ruling_ids": [ + "EBTI-FR-FRBTIFR-BTI-2024-04294" + ], + "segment": "component", + "split": "train", + "tier1_description": "A Hall-effect switch sensor rated over -40 to 150 C, switching its output when magnetic flux crosses a threshold. Its wide temperature range suits automotive and industrial proximity, position and speed sensing (part SS443A-S)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Honeywell", + "part_name": "SS443A-S" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854129", + "854151", + "854190", + "854149" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0606", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854151", + "id": "SH-0606", + "justification_text": "The product falls under HS 8541.51 (Semiconductor-based transducers).", + "reference_ruling_ids": [ + "EBTI-FR-FRBTIFR-BTI-2024-04294" + ], + "segment": "component", + "split": "train", + "tier1_description": "An automotive-grade (AEC-Q100) giant-magnetoresistance angular sensor in an 8-pin SOIC, providing sine and cosine outputs of magnetic-field direction. It enables precise contactless angle sensing for steering, motors and rotary controls (part TLE5009E2010FUMA1)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Infineon", + "part_name": "TLE5009E2010FUMA1" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90). HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "854129", + "854149", + "854151", + "854121" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings", + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0607", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854151", + "id": "SH-0607", + "justification_text": "The product falls under HS 8541.51 (Semiconductor-based transducers).", + "reference_ruling_ids": [ + "EBTI-DE-DEBTI51580/21-1", + "EBTI-FR-FRBTIFR-BTI-2024-04572", + "EBTI-FR-FRBTIFR-BTI-2024-04294", + "EBTI-NL-BEBTIDT.50.007.319" + ], + "segment": "component", + "split": "train", + "tier1_description": "A MEMS thermal airflow sensor measuring flow up to about 1 litre per minute over -10 to 60 C, with a calibrated output. It suits low-flow air and gas metering in medical, HVAC and industrial systems (part D6F-P0010A2)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Omron Electronic Components", + "part_name": "D6F-P0010A2" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90). HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "854142", + "854143", + "854151", + "854141" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings", + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0608", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854151", + "id": "SH-0608", + "justification_text": "The product falls under HS 8541.51 (Semiconductor-based transducers).", + "reference_ruling_ids": [ + "EBTI-DE-DEBTI51580/21-1", + "EBTI-FR-FRBTIFR-BTI-2024-04572", + "EBTI-FR-FRBTIFR-BTI-2024-04294", + "EBTI-NL-BEBTIDT.50.007.319" + ], + "segment": "component", + "split": "train", + "tier1_description": "A MEMS yaw-rate gyroscope measuring angular rate up to about plus or minus 300 to 400 degrees per second on the Z axis, with a digital interface in a 16-pin SOIC. Its high stability suits platform stabilization, navigation and industrial motion sensing (part ADXRS453BRGZ)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Analog Devices", + "part_name": "ADXRS453BRGZ" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854160", + "854142", + "854159", + "854151" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0609", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854151", + "id": "SH-0609", + "justification_text": "The product falls under HS 8541.51 (Semiconductor-based transducers).", + "reference_ruling_ids": [ + "EBTI-FR-FRBTIFR-BTI-2024-04294", + "EBTI-FR-FRBTIFR-BTI-2024-04572" + ], + "segment": "component", + "split": "train", + "tier1_description": "A slotted Hall-effect sensor combining an emitter and Hall detector across a gap to sense a passing ferrous or magnetic vane. It detects rotation, position and indexing in encoders and industrial machinery (part OHB900)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "TT Electronics / Optek Technology", + "part_name": "OHB900" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854151", + "854110", + "854190", + "854129" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0610", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854151", + "id": "SH-0610", + "justification_text": "The product falls under HS 8541.51 (Semiconductor-based transducers).", + "reference_ruling_ids": [ + "EBTI-FR-FRBTIFR-BTI-2024-04294" + ], + "segment": "component", + "split": "train", + "tier1_description": "A magnetoresistive angle sensor IC operating from 3 to 3.6 V in a 16-pin QFN package, providing a digital output of magnetic-field direction. It enables accurate contactless angular position sensing for motors and rotary controls (part MA702GQ-P)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Monolithic Power Systems (mps)", + "part_name": "MA702GQ-P" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90). HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "854142", + "854130", + "854151", + "854141" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings", + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0611", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854151", + "id": "SH-0611", + "justification_text": "The product falls under HS 8541.51 (Semiconductor-based transducers).", + "reference_ruling_ids": [ + "EBTI-DE-DEBTI51580/21-1", + "EBTI-FR-FRBTIFR-BTI-2024-04572", + "EBTI-FR-FRBTIFR-BTI-2024-04294", + "EBTI-NL-BEBTIDT.50.007.319" + ], + "segment": "component", + "split": "train", + "tier1_description": "A MEMS differential pressure sensor measuring up to about 500 Pa, operating from 2.3 to 3.6 Vdc in a SIP package. Its thermal-flow-based sensing suits HVAC, filter-monitoring and airflow differential-pressure measurement (part D6F-PH5050AD4)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Omron Electronic Components", + "part_name": "D6F-PH5050AD4" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90). HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "854149", + "854151", + "854142", + "854121" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings", + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0612", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854151", + "id": "SH-0612", + "justification_text": "The product falls under HS 8541.51 (Semiconductor-based transducers).", + "reference_ruling_ids": [ + "EBTI-FR-FRBTIFR-BTI-2024-04294", + "EBTI-NL-BEBTIDT.50.007.319" + ], + "segment": "component", + "split": "train", + "tier1_description": "A miniature silicon piezoresistive gauge pressure sensor rated for about 250 psi with a single side port, providing an analog output from a 10 Vdc supply. It suits instrumentation, industrial and process pressure measurement (part 24PCGFM6G)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Honeywell", + "part_name": "24PCGFM6G" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854190", + "854130", + "854110", + "854151" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0613", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854151", + "id": "SH-0613", + "justification_text": "The product falls under HS 8541.51 (Semiconductor-based transducers).", + "reference_ruling_ids": [ + "EBTI-DE-DEBTI51580/21-1", + "EBTI-FR-FRBTIFR-BTI-2024-04294", + "EBTI-NL-BEBTIDT.50.007.319" + ], + "segment": "component", + "split": "train", + "tier1_description": "A three-axis MEMS accelerometer with selectable plus or minus 2, 4 and 8 g ranges and I2C/SPI interfaces, in a 24-pin package. It measures acceleration, tilt and vibration for industrial and motion-sensing applications (part IIS328DQTR)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Stmicroelectronics", + "part_name": "IIS328DQTR" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854121", + "854160", + "854143", + "854129" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0614", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854160", + "id": "SH-0614", + "justification_text": "The product falls under HS 8541.60 (Mounted piezo-electric crystals).", + "reference_ruling_ids": [ + "EBTI-DE-DEBTI27169/18-1", + "CROSS-800931", + "CROSS-R02518", + "EBTI-EN-0079", + "EBTI-PL-PLBTIWIT-2019-000550", + "CROSS-957334", + "CROSS-A84986" + ], + "segment": "component", + "split": "train", + "tier1_description": "A 32.768 kHz quartz crystal in a surface-mount package, with 50 ppm accuracy and a 12.5 pF load capacitance. It provides the low-frequency reference for real-time clocks, microcontrollers and timing functions (part Q13MC30610003)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Epson", + "part_name": "Q13MC30610003" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854160", + "854159", + "854149", + "854151" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0615", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854160", + "id": "SH-0615", + "justification_text": "The product falls under HS 8541.60 (Mounted piezo-electric crystals).", + "reference_ruling_ids": [ + "CROSS-957334", + "EBTI-EN-0079", + "EBTI-PL-PLBTIWIT-2019-000550", + "CROSS-800931", + "CROSS-R02518", + "EBTI-DE-DEBTI27169/18-1", + "CROSS-A84986", + "EBTI-DE-DEM/4479/07-1" + ], + "segment": "component", + "split": "train", + "tier1_description": "An 8 MHz quartz crystal in a 5 x 3.2 mm surface-mount package, with an 8 pF load capacitance and tight frequency tolerance. It provides a stable clock reference for microcontrollers, communication and timing circuits (part AA-8.000MALV). Part number AA-8.000MALV-T", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "TXC", + "part_name": "AA-8.000MALV-T" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854149", + "854130", + "854143", + "854160" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0616", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854160", + "id": "SH-0616", + "justification_text": "The product falls under HS 8541.60 (Mounted piezo-electric crystals).", + "reference_ruling_ids": [ + "EBTI-DE-DEBTI27169/18-1", + "CROSS-800931", + "CROSS-R02518", + "EBTI-EN-0079", + "EBTI-PL-PLBTIWIT-2019-000550", + "CROSS-957334", + "CROSS-A84986" + ], + "segment": "component", + "split": "train", + "tier1_description": "A 32.768 kHz cylindrical quartz crystal in a 6.2 x 2 mm radial package, with 20 ppm accuracy and a 12.5 pF load capacitance. It provides the precise reference for real-time clocks and low-power timing in compact devices (part CFS-20632768DZFB)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Citizen Finedevice", + "part_name": "CFS-20632768DZFB" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854129", + "854130", + "854110", + "854160" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0617", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854160", + "id": "SH-0617", + "justification_text": "The product falls under HS 8541.60 (Mounted piezo-electric crystals).", + "reference_ruling_ids": [ + "EBTI-DE-DEBTI27169/18-1", + "CROSS-800931", + "CROSS-R02518", + "EBTI-EN-0079", + "EBTI-PL-PLBTIWIT-2019-000550", + "CROSS-957334", + "CROSS-A84986" + ], + "segment": "component", + "split": "train", + "tier1_description": "A 32.768 kHz quartz crystal in a compact 4.1 x 1.5 mm surface-mount package, with 20 ppm accuracy and a 12.5 pF load capacitance. It supplies the timekeeping reference for real-time clocks and timing in portable electronics (part CM41532768DZFT)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Citizen Finedevice", + "part_name": "CM41532768DZFT" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854151", + "854143", + "854159", + "854160" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0618", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854160", + "id": "SH-0618", + "justification_text": "The product falls under HS 8541.60 (Mounted piezo-electric crystals).", + "reference_ruling_ids": [ + "EBTI-DE-DEBTI27169/18-1", + "CROSS-800931", + "CROSS-R02518", + "EBTI-EN-0079", + "EBTI-PL-PLBTIWIT-2019-000550", + "CROSS-957334", + "CROSS-A84986" + ], + "segment": "component", + "split": "train", + "tier1_description": "A 32.768 kHz quartz crystal in an 8 x 3.8 mm surface-mount package, with 20 ppm accuracy and a 12.5 pF load capacitance. It provides the timekeeping reference for real-time clocks and low-power timing functions (part RSM200S-32.768). Part number RSM200S-32.768-12.5-TR-NPB", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Raltron", + "part_name": "RSM200S-32.768-12.5-TR-NPB" + } + }, + { + "bol_metadata": null, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854129", + "854121", + "854142", + "854160" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0619", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854160", + "id": "SH-0619", + "justification_text": "The product falls under HS 8541.60 (Mounted piezo-electric crystals).", + "reference_ruling_ids": [ + "EBTI-DE-DEBTI27169/18-1", + "CROSS-800931", + "CROSS-R02518", + "EBTI-EN-0079", + "EBTI-PL-PLBTIWIT-2019-000550", + "CROSS-957334", + "CROSS-A84986" + ], + "segment": "component", + "split": "train", + "tier1_description": "A 32.768 kHz quartz crystal in a compact 3.2 x 1.5 mm surface-mount package, with 20 ppm accuracy and a 12.5 pF load capacitance. It supplies the precise reference for real-time clocks and timing in portable electronics (part RT3215-32.768). Part number RT3215-32.768-12.5-TR", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Raltron", + "part_name": "RT3215-32.768-12.5-TR" + } + }, + { + "bol_metadata": { + "bol_description": "790.908-11 CRYSTAL UNIT (FOR CAPTIVE CONSUMPTION)", + "origin_country": "JP", + "shipper": "asian ndk crystal sdn bhd" + }, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854160", + "854110", + "854142", + "854141" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0620", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854160", + "id": "SH-0620", + "justification_text": "Mounted piezoelectric crystals, including crystal units or oscillators, are covered by 8541.60. Classified under HS 8541.60.", + "reference_ruling_ids": [ + "CROSS-957334", + "CROSS-R02518", + "CROSS-800931", + "EBTI-DE-DEBTI27169/18-1", + "EBTI-EN-0079", + "EBTI-PL-PLBTIWIT-2019-000550", + "CROSS-A84986", + "CROSS-H025781", + "CROSS-N214738" + ], + "segment": "component", + "split": "train", + "tier1_description": "A. A precisely cut quartz blank is sealed with electrodes inside a hermetic ceramic or metal enclosure and provides a stable mechanical resonance used as a frequency-reference timing element in oscillator circuits of electronic equipment", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "NDK (Nihon Dempa Kogyo)", + "part_name": "790.908-11 crystal unit (for captive" + } + }, + { + "bol_metadata": { + "bol_description": "CIS1-19-100273-01)CRYSTAL-32. HZ (PARTS FOR MFG OF ROUTER)", + "origin_country": "JP", + "shipper": "asian ndk crystal sdn bhd" + }, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854142", + "854160", + "854190", + "854110" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0621", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854160", + "id": "SH-0621", + "justification_text": "Mounted piezoelectric crystals, including crystal units or oscillators, are covered by 8541.60. Classified under HS 8541.60.", + "reference_ruling_ids": [ + "EBTI-PL-PLBTIWIT-2019-000550", + "EBTI-DE-DEBTI27169/18-1", + "CROSS-957334", + "EBTI-DE-DEM/4479/07-1", + "EBTI-FR-FRBTIFR-BTI-2019-13540", + "EBTI-EN-0079", + "CROSS-800931", + "CROSS-R02518", + "CROSS-A84986", + "CROSS-F80316", + "CROSS-N214738" + ], + "segment": "component", + "split": "train", + "tier1_description": "A mounted piezo-electric crystal unit resonating at 32.768 kHz, the standard frequency for real-time clock timekeeping. A quartz tuning-fork blank is sealed with electrodes ; it serves as the frequency-reference element in timing and clock circuits, here for use in router manufacturing", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "NDK (Nihon Dempa Kogyo)", + "part_name": "CIS1-19-100273-01)crystal-32. HZ (parts" + } + }, + { + "bol_metadata": { + "bol_description": "DSX211S 26 MHZ MOUNTED PIEZO ELECTRIC CRYSTAL", + "origin_country": "JP", + "shipper": "daishinku singapore pte. ltd" + }, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90).", + "candidate_set": { + "codes": [ + "854149", + "854121", + "854160", + "854190" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8541_siblings" + ], + "frozen_id": "v2.0.train.0622", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854160", + "id": "SH-0622", + "justification_text": "Mounted piezoelectric crystals, including crystal units or oscillators, are covered by 8541.60. Classified under HS 8541.60.", + "reference_ruling_ids": [ + "EBTI-PL-PLBTIWIT-2019-000550", + "CROSS-957334", + "EBTI-DE-DEBTI27169/18-1", + "EBTI-DE-DEM/4479/07-1", + "EBTI-FR-FRBTIFR-BTI-2019-13540", + "CROSS-R02518", + "EBTI-EN-0079", + "CROSS-800931", + "CROSS-A84986", + "CROSS-F80316", + "CROSS-H025781", + "CROSS-N214738" + ], + "segment": "component", + "split": "train", + "tier1_description": "A surface-mount mounted piezo-electric crystal unit resonating at 26 MHz. A precision quartz blank with electrodes is sealed inside a compact hermetic ceramic ; it provides a stable reference frequency for oscillator and clock-generation circuits in communications and consumer electronics", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Daishinku (KDS)", + "part_name": "DSX211S 26 MHZ mounted piezo electric" + } + }, + { + "bol_metadata": { + "bol_description": "MOLDED LEAD FRAME", + "origin_country": "US", + "shipper": "amkor technology malaysia sdn bhd" + }, + "boundary_note": "Within heading 8541 the subheading turns on device type and operating characteristics: rectifier diodes vs transistors (with the 1 W dissipation threshold separating 8541.21 from 8541.29), thyristors, LED vs photovoltaic vs other photosensitive devices, the HS2022 semiconductor-transducer carve-out (8541.51), mounted piezo-electric crystals (8541.60), and parts (8541.90). Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line.", + "candidate_set": { + "codes": [ + "854190", + "854121", + "854110", + "854149" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8541_siblings", + "8541_vs_8542" + ], + "frozen_id": "v2.0.train.0623", + "hs2_label": "85", + "hs4_label": "8541", + "hs6_label": "854190", + "id": "SH-0623", + "justification_text": "Parts of semiconductor devices, photosensitive semiconductor devices or mounted piezoelectric crystals fall under 8541.90. Classified under HS 8541.90.", + "reference_ruling_ids": [ + "CROSS-955988", + "CROSS-950868", + "CROSS-955949", + "CROSS-N328203", + "EBTI-EN-0080", + "EBTI-EN-0082", + "EBTI-DE-DE13330/16-1", + "EBTI-DE-DEBTI43759/23-1", + "EBTI-NL-NLRTD-2010-003723", + "EBTI-PL-PLPL-WIT-2016-01694", + "EBTI-PL-PLPL-WIT-2016-01697", + "CROSS-957189", + "CROSS-N310335", + "EBTI-EN-0081", + "EBTI-EN-0083" + ], + "segment": "component", + "split": "train", + "tier1_description": "Molded lead frames for semiconductor packaging: thin stamped or etched metal carriers, typically copper alloy, partially encapsulated with molding compound. They provide the die-attach pad and the array of leads that support a semiconductor die and form the external electrical connections during assembly of integrated circuits and discrete devices", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Amkor Technology", + "part_name": "molded lead frame" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-30 00:00:00", + "bol_description": "IC (WITHOUT SOFTWARE)(LAMPIRAN A2 - NO.446)", + "consignee": "tf amd microelectronics penang sb", + "declared_hs": "8542310000", + "hs_verified": true, + "origin_country": "CHINA TAIWAN", + "port_dest": "PENANG GEORGETOWN", + "port_origin": "TAIPEI", + "shipper": "tsmc taichung" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading. Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line.", + "candidate_set": { + "codes": [ + "854231", + "854232", + "854290", + "854233" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function", + "8541_vs_8542" + ], + "frozen_id": "v2.0.train.0624", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854231", + "id": "SH-0624", + "justification_text": "Goods classified under HS 8542.31; corroborated by 30 customs rulings on comparable goods across 8 jurisdictions.", + "reference_ruling_ids": [ + "EBTI-DE-DEM/211/08-1", + "EBTI-IT-ITIT-2008-0119M-278100", + "EBTI-IT-ITIT-2008-0121M-278100", + "EBTI-IT-ITIT-2009-0448M-278100", + "EBTI-IT-ITIT-2009-0449M-278100", + "CROSS-N086783", + "EBTI-CZ-CZ05-0461-2011", + "EBTI-DE-DE19740/14-1", + "EBTI-FR-FRBTIFR-BTI-2023-00071", + "EBTI-NL-BED.T.305.471", + "EBTI-DE-DEBTI24920/18-1", + "EBTI-DE-DEM/1236/09-1", + "EBTI-DE-DEM/2806/07-1", + "EBTI-EN-0155", + "EBTI-NL-BEBTIDT.50.007.274", + "EBTI-PL-PLPL-WIT-2014-00620", + "CROSS-N088683", + "CROSS-N091160", + "CROSS-N281202", + "EBTI-EN-0154", + "EBTI-EN-0158", + "EBTI-EN-0151", + "EBTI-EN-0153", + "EBTI-EN-0157", + "EBTI-NL-BED.T.278.356", + "EBTI-NL-NLBTI2021-0675", + "EBTI-NL-NLRTD-2007-002822", + "EBTI-PL-PLPL-WIT-2015-01263", + "EBTI-EN-0152", + "EBTI-EN-0156" + ], + "segment": "component", + "split": "train", + "tier1_description": "Monolithic logic integrated circuit (without software): a foundry-fabricated digital IC for mounting on electronic boards, integrating many transistors to perform logic/control functions", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "TSMC", + "part_name": "IC (without software)(lampiran A2" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-03-28 00:00:00", + "bol_description": "IC chip (integrated electronic circuit) used to install on electronic circuit boards", + "consignee": "umc electronics vietnam limited", + "declared_hs": "85423100", + "hs_verified": true, + "origin_country": "PHILIPPINES", + "port_dest": "", + "port_origin": "", + "shipper": "umc electronics hong kong limited" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading. Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line.", + "candidate_set": { + "codes": [ + "854233", + "854231", + "854239", + "854290" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function", + "8541_vs_8542" + ], + "frozen_id": "v2.0.train.0625", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854231", + "id": "SH-0625", + "justification_text": "Goods classified under HS 8542.31; corroborated by 30 customs rulings on comparable goods across 8 jurisdictions.", + "reference_ruling_ids": [ + "EBTI-DE-DEM/211/08-1", + "EBTI-IT-ITIT-2008-0119M-278100", + "EBTI-IT-ITIT-2008-0121M-278100", + "EBTI-IT-ITIT-2009-0448M-278100", + "EBTI-IT-ITIT-2009-0449M-278100", + "CROSS-N086783", + "EBTI-CZ-CZ05-0461-2011", + "EBTI-DE-DE19740/14-1", + "EBTI-FR-FRBTIFR-BTI-2023-00071", + "EBTI-NL-BED.T.305.471", + "EBTI-DE-DEBTI24920/18-1", + "EBTI-DE-DEM/1236/09-1", + "EBTI-DE-DEM/2806/07-1", + "EBTI-EN-0155", + "EBTI-EN-0158", + "EBTI-NL-BEBTIDT.50.007.274", + "EBTI-PL-PLPL-WIT-2014-00620", + "CROSS-N088683", + "CROSS-N091160", + "CROSS-N281202", + "EBTI-EN-0154", + "EBTI-NL-BED.T.278.356", + "EBTI-PL-PLPL-WIT-2015-01263", + "EBTI-EN-0151", + "EBTI-EN-0153", + "EBTI-EN-0157", + "EBTI-NL-NLBTI2021-0675", + "EBTI-NL-NLRTD-2007-002822", + "EBTI-EN-0152", + "EBTI-EN-0156" + ], + "segment": "component", + "split": "train", + "tier1_description": "Monolithic logic integrated circuit: a foundry-fabricated digital IC for mounting on electronic boards, integrating many transistors to perform logic/control functions", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "UMC", + "part_name": "IC chip (integrated electronic circuit)" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-30 00:00:00", + "bol_description": "I.C. MICROCONTROLLER-STM32H753ZIT6/SADA,STM32H753ZIT6-EH1I022-00085-LF (INTEGRATED CIRCUITS)", + "consignee": "cyient dlm limited", + "declared_hs": "85423100", + "hs_verified": true, + "origin_country": "CHINA TAIWAN", + "port_dest": "", + "port_origin": "", + "shipper": "future electronics inc. distribution pte ltd" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854290", + "854233", + "854231", + "854232" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0626", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854231", + "id": "SH-0626", + "justification_text": "Goods classified under HS 8542.31; corroborated by 12 customs rulings on comparable goods (EU-DE, EU-EN, EU-NL, EU-PL).", + "reference_ruling_ids": [ + "EBTI-PL-PLPL-WIT-2015-01263", + "EBTI-EN-0153", + "EBTI-DE-DE19740/14-1", + "EBTI-DE-DEM/211/08-1", + "EBTI-EN-0151", + "EBTI-EN-0152", + "EBTI-NL-BED.T.305.471", + "EBTI-EN-0157", + "EBTI-EN-0158", + "EBTI-NL-BEBTIDT.50.007.274", + "EBTI-NL-NLRTD-2007-002822", + "EBTI-PL-PLPL-WIT-2014-00620" + ], + "segment": "component", + "split": "train", + "tier1_description": "A high-performance 32-bit microcontroller (type STM32H753ZIT6) built on a 480 MHz Arm Cortex-M7 core with double-precision FPU and L1 cache: it provides 2 MB dual-bank flash, up to ~1 MB RAM and an extensive set of timers and communication peripherals in a 144-pin LQFP, for industrial and embedded control", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Future Electronics", + "part_name": "I.C. microcontroller-STM32H753ZIT6/sada" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-30 00:00:00", + "bol_description": "511-STM32F407ZGT6 A455-028-2164-00 ARM MICROCONTROLLERS - MCU", + "consignee": "avalon technology and services private limited", + "declared_hs": "85423100", + "hs_verified": true, + "origin_country": "CHINA TAIWAN", + "port_dest": "", + "port_origin": "", + "shipper": "mouser electronics inc" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854232", + "854231", + "854233", + "854239" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0627", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854231", + "id": "SH-0627", + "justification_text": "Goods classified under HS 8542.31; corroborated by 8 customs rulings on comparable goods (EU-EN, EU-NL, EU-PL, US).", + "reference_ruling_ids": [ + "EBTI-EN-0153", + "EBTI-PL-PLPL-WIT-2015-01263", + "EBTI-NL-BED.T.305.471", + "EBTI-NL-NLRTD-2007-002822", + "CROSS-N015225", + "EBTI-EN-0151", + "EBTI-NL-BEBTIDT.50.007.274", + "EBTI-PL-PLPL-WIT-2014-00620" + ], + "segment": "component", + "split": "train", + "tier1_description": "A 32-bit microcontroller (type STM32F407ZGT6) based on a 168 MHz Arm Cortex-M4 core with single-precision FPU and DSP instructions: it integrates 1 MB flash, up to 192 KB SRAM and a wide range of peripherals in a 144-pin LQFP, used in motor-control, industrial and embedded-compute designs", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Mouser Electronics", + "part_name": "511-STM32F407ZGT6 A455-028-2164-00 ARM" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-30 00:00:00", + "bol_description": "STM32F412RET7 MICROCONTROLLERS & MICROPROCESSORS-STM32 CN -IC", + "consignee": "rikun manufacturing private limited", + "declared_hs": "85423100", + "hs_verified": true, + "origin_country": "SINGAPORE", + "port_dest": "", + "port_origin": "", + "shipper": "avnet asia pte. ltd" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854231", + "854239", + "854290", + "854233" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0628", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854231", + "id": "SH-0628", + "justification_text": "Goods classified under HS 8542.31; corroborated by 14 customs rulings on comparable goods across 6 jurisdictions.", + "reference_ruling_ids": [ + "EBTI-EN-0153", + "EBTI-PL-PLPL-WIT-2015-01263", + "EBTI-DE-DE19740/14-1", + "EBTI-DE-DEM/211/08-1", + "EBTI-EN-0151", + "EBTI-NL-BED.T.305.471", + "EBTI-NL-NLRTD-2007-002822", + "CROSS-N015225", + "EBTI-EN-0156", + "EBTI-EN-0157", + "EBTI-IT-ITIT-2009-0448M-278100", + "EBTI-IT-ITIT-2009-0449M-278100", + "EBTI-NL-BEBTIDT.50.007.274", + "EBTI-PL-PLPL-WIT-2014-00620" + ], + "segment": "component", + "split": "train", + "tier1_description": "A 32-bit microcontroller (type STM32F412RET7) based on a 100 MHz Arm Cortex-M4 core with single-precision FPU and DSP instructions: it integrates 512 KB flash and 256 KB SRAM with a wide range of communication and timer peripherals in a 64-pin package, for cost-sensitive embedded control designs", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Avnet", + "part_name": "STM32F412RET7 microcontrollers &" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-30 00:00:00", + "bol_description": "HVPIP / PRE QS/ SOC MICROPROCESSOR-INTEGRATED CIRCUIT ( QTY: )", + "consignee": "intel microelectronics m sdn bhd", + "declared_hs": "8542310000", + "hs_verified": true, + "origin_country": "MALAYSIA", + "port_dest": "PENANG GEORGETOWN", + "port_origin": "PENANG GEORGETOWN", + "shipper": "intel microelectronics m sdn bhd" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854239", + "854233", + "854232", + "854231" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0629", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854231", + "id": "SH-0629", + "justification_text": "Goods classified under HS 8542.31; corroborated by 7 customs rulings on comparable goods (EU-EN, EU-NL, EU-PL).", + "reference_ruling_ids": [ + "EBTI-EN-0156", + "EBTI-EN-0158", + "EBTI-NL-NLBTI2021-0675", + "EBTI-PL-PLPL-WIT-2015-01263", + "EBTI-EN-0151", + "EBTI-NL-BEBTIDT.50.007.274", + "EBTI-NL-NLRTD-2007-002822" + ], + "segment": "component", + "split": "train", + "tier1_description": "System-on-chip (SoC) microprocessor IC (pre-production/qualification sample): a multi-core processor integrating CPU and system functions for compute platforms", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Intel", + "part_name": "hvpip / PRE QS/ SOC" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-30 00:00:00", + "bol_description": "MICROCHIP-MCU 8-BIT PIC RISC 64KB FLASH 2.5V/3.3V/5V AUTOMOTIVE AEC-Q100 44-PIN QFN EP TUB(PART NO:PIC18F46K80-I/ML)", + "consignee": "bimatix private limited", + "declared_hs": "85423100", + "hs_verified": true, + "origin_country": "THAILAND", + "port_dest": "", + "port_origin": "", + "shipper": "arrow electronics asia s pte ltd" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854232", + "854231", + "854233", + "854290" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0630", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854231", + "id": "SH-0630", + "justification_text": "Goods classified under HS 8542.31; corroborated by 26 customs rulings on comparable goods across 8 jurisdictions.", + "reference_ruling_ids": [ + "EBTI-NL-BED.T.305.471", + "EBTI-DE-DE19740/14-1", + "EBTI-DE-DEM/211/08-1", + "EBTI-EN-0153", + "EBTI-PL-PLPL-WIT-2015-01263", + "CROSS-N086783", + "CROSS-N088683", + "CROSS-N091160", + "CROSS-N281202", + "EBTI-NL-BEBTIDT.50.007.274", + "EBTI-NL-NLRTD-2007-002822", + "EBTI-PL-PLPL-WIT-2014-00620", + "EBTI-CZ-CZ05-0461-2011", + "EBTI-DE-DEBTI24920/18-1", + "EBTI-DE-DEM/1236/09-1", + "EBTI-DE-DEM/2806/07-1", + "EBTI-EN-0155", + "EBTI-FR-FRBTIFR-BTI-2023-00071", + "EBTI-IT-ITIT-2008-0119M-278100", + "EBTI-IT-ITIT-2008-0121M-278100", + "EBTI-IT-ITIT-2009-0448M-278100", + "EBTI-IT-ITIT-2009-0449M-278100", + "EBTI-EN-0151", + "EBTI-EN-0154", + "EBTI-EN-0157", + "EBTI-EN-0158" + ], + "segment": "component", + "split": "train", + "tier1_description": "An 8-bit microcontroller IC (type PIC18F46K80, PIC18 family): a 64 MHz, 64 KB-flash automotive (AEC-Q100) MCU with integrated ECAN, a 12-bit ADC, comparators and extreme-low-power modes, operating 1.8-5.5 V in a 44-pin QFN, for embedded control applications", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Arrow Electronics", + "part_name": "microchip-MCU 8-BIT PIC RISC 64KB flash" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-30 00:00:00", + "bol_description": "AAA2121040000 IC MCU MPU PROC MOUNTED DICE DLMAK1CR4Q 1 SPC570S50E1C1MOR", + "consignee": "continental automotive components india private", + "declared_hs": "85423100", + "hs_verified": true, + "origin_country": "MALAYSIA", + "port_dest": "", + "port_origin": "", + "shipper": "stmicroelectronics asia pacific pte ltd" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854239", + "854232", + "854231", + "854233" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0631", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854231", + "id": "SH-0631", + "justification_text": "Goods classified under HS 8542.31; corroborated by 9 customs rulings on comparable goods (EU-DE, EU-EN, EU-NL, EU-PL).", + "reference_ruling_ids": [ + "EBTI-EN-0151", + "EBTI-DE-DE19740/14-1", + "EBTI-DE-DEM/211/08-1", + "EBTI-EN-0153", + "EBTI-NL-BED.T.305.471", + "EBTI-PL-PLPL-WIT-2015-01263", + "EBTI-EN-0155", + "EBTI-EN-0156", + "EBTI-NL-BEBTIDT.50.007.274" + ], + "segment": "component", + "split": "train", + "tier1_description": "A 32-bit automotive microcontroller supplied in mounted-dice form (type SPC570S50E1, Chorus family, Power Architecture core): an embedded MCU with on-chip flash and peripherals for automotive control applications, shipped as bare/mounted dice for assembly into a package", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "STMicroelectronics", + "part_name": "AAA2121040000 IC MCU MPU proc mounted" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-30 00:00:00", + "bol_description": "MSP430FR2033IPMR (MCU) other micro control unit IC", + "consignee": "incap contract manufacturing services private limi", + "declared_hs": "85423100", + "hs_verified": true, + "origin_country": "CHINA TAIWAN", + "port_dest": "", + "port_origin": "", + "shipper": "texas instruments southeast asia pte. ltd" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854231", + "854290", + "854239", + "854232" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0632", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854231", + "id": "SH-0632", + "justification_text": "Goods classified under HS 8542.31; corroborated by 10 customs rulings on comparable goods across 5 jurisdictions.", + "reference_ruling_ids": [ + "EBTI-NL-BED.T.305.471", + "EBTI-DE-DE19740/14-1", + "EBTI-DE-DEM/211/08-1", + "EBTI-EN-0153", + "EBTI-NL-NLRTD-2007-002822", + "EBTI-PL-PLPL-WIT-2015-01263", + "CROSS-N015225", + "EBTI-EN-0151", + "EBTI-EN-0152", + "EBTI-NL-BEBTIDT.50.007.274" + ], + "segment": "component", + "split": "train", + "tier1_description": "A 16-bit ultra-low-power microcontroller (type MSP430FR2033) with a 16 MHz RISC core, 16 KB ferroelectric RAM (FRAM), 2 KB SRAM, a 10-bit ADC and serial interfaces: used for low-power embedded control, with fast non-volatile FRAM writes and very low standby current", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Texas Instruments", + "part_name": "MSP430FR2033IPMR (MCU) other micro" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-30 00:00:00", + "bol_description": "KA1 IC 32BIT MCU RH850/F1KM 13-O6-ADA-1-0 (IC)R7F7016863AFP-C", + "consignee": "interface micro systems", + "declared_hs": "85423100", + "hs_verified": true, + "origin_country": "CHINA MAINLAND", + "port_dest": "", + "port_origin": "", + "shipper": "rabyte pte ltd" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854231", + "854233", + "854239", + "854290" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0633", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854231", + "id": "SH-0633", + "justification_text": "Goods classified under HS 8542.31; corroborated by 10 customs rulings on comparable goods (EU-DE, EU-EN, EU-NL, EU-PL).", + "reference_ruling_ids": [ + "EBTI-EN-0153", + "EBTI-DE-DE19740/14-1", + "EBTI-DE-DEM/211/08-1", + "EBTI-NL-BED.T.305.471", + "EBTI-PL-PLPL-WIT-2015-01263", + "EBTI-EN-0152", + "EBTI-EN-0155", + "EBTI-EN-0156", + "EBTI-NL-BEBTIDT.50.007.274", + "EBTI-NL-NLRTD-2007-002822" + ], + "segment": "component", + "split": "train", + "tier1_description": "A 32-bit automotive body-control microcontroller (type R7F7016863, RH850/F1KM-S1 family) with a 120 MHz G3KH core, on-chip flash (512 KB-1 MB), a CAN-FD interface and a broad peripheral set, used for automotive electrical-body and control applications. Supplied in a surface-mount package", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Rabyte", + "part_name": "KA1 IC 32BIT MCU RH850/F1KM" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-30 00:00:00", + "bol_description": "IC PLD FPGA UNPROGRAMMED", + "consignee": "jabil circuits sdn bhd", + "declared_hs": "8542310000", + "hs_verified": true, + "origin_country": "CHINA TAIWAN", + "port_dest": "BAYAN LEPAS", + "port_origin": "BAYAN LEPAS", + "shipper": "keysight technologies m sdn bhd" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854239", + "854233", + "854290", + "854231" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0634", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854231", + "id": "SH-0634", + "justification_text": "Goods classified under HS 8542.31; corroborated by 29 customs rulings on comparable goods across 8 jurisdictions.", + "reference_ruling_ids": [ + "CROSS-N086783", + "EBTI-EN-0154", + "EBTI-NL-BEBTIDT.50.007.274", + "EBTI-CZ-CZ05-0461-2011", + "EBTI-DE-DE19740/14-1", + "EBTI-DE-DEBTI24920/18-1", + "EBTI-DE-DEM/1236/09-1", + "EBTI-DE-DEM/211/08-1", + "EBTI-DE-DEM/2806/07-1", + "EBTI-FR-FRBTIFR-BTI-2023-00071", + "EBTI-IT-ITIT-2008-0119M-278100", + "EBTI-IT-ITIT-2008-0121M-278100", + "EBTI-IT-ITIT-2009-0448M-278100", + "EBTI-IT-ITIT-2009-0449M-278100", + "EBTI-NL-BED.T.305.471", + "CROSS-N088683", + "CROSS-N091160", + "CROSS-N281202", + "EBTI-EN-0156", + "EBTI-EN-0157", + "EBTI-PL-PLPL-WIT-2015-01263", + "EBTI-EN-0151", + "EBTI-EN-0153", + "EBTI-EN-0155", + "EBTI-EN-0158", + "EBTI-NL-BED.T.278.356", + "EBTI-NL-NLRTD-2007-002822", + "EBTI-PL-PLPL-WIT-2014-00620", + "EBTI-EN-0152" + ], + "segment": "component", + "split": "train", + "tier1_description": "Field-programmable gate array (FPGA / PLD), unprogrammed: a programmable-logic integrated circuit whose logic is user-configured after manufacture. It is supplied as a packaged electronic component for assembly onto a printed-circuit board or into a larger system, consistent with the bill-of-lading description", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Keysight Technologies", + "part_name": "IC PLD FPGA unprogrammed" + } + }, + { + "bol_metadata": { + "bol_description": "CPU) P4X-W53435X-SRM34-XCC SPR w5-3435X 1P 16C/32T 45MB 270W BI(1000) E5 4677 XCC", + "origin_country": "US", + "shipper": "supermicro computer inc" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading. Populated printed-circuit board: classifiable as an ADP part (8473.30), as the integrated circuit that dominates it (8542.31/32/39), or as a part of control apparatus (8538.90); Section XVI Note 2 governs the attribution.", + "candidate_set": { + "codes": [ + "854232", + "854239", + "854290", + "854231" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function", + "populated_board_boundary" + ], + "frozen_id": "v2.0.train.0635", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854231", + "id": "SH-0635", + "justification_text": "A CPU processor is a processor/controller integrated circuit under 8542.31, not an ADP part under 8473.30. Classified under HS 8542.31.", + "reference_ruling_ids": [ + "EBTI-CZ-CZ05-0461-2011", + "EBTI-DE-DEM/211/08-1", + "EBTI-EN-0151", + "EBTI-EN-0152", + "EBTI-EN-0158", + "EBTI-FR-FRBTIFR-BTI-2023-00071", + "EBTI-NL-BED.T.305.471", + "EBTI-NL-NLBTI2021-0675", + "EBTI-PL-PLPL-WIT-2014-00620", + "CROSS-N015225", + "EBTI-EN-0153", + "EBTI-EN-0154", + "EBTI-EN-0155", + "EBTI-EN-0156", + "EBTI-EN-0157", + "EBTI-NL-BEBTIDT.50.007.274", + "EBTI-PL-PLPL-WIT-2015-01263" + ], + "segment": "component", + "split": "train", + "tier1_description": "A workstation-class central processing unit with 16 cores and 32 threads, 3.1 GHz base frequency (4.7 GHz turbo), 45 MB cache, and 270 W thermal design power, built on a 4th-generation scalable server architecture for the LGA4677 socket. The monolithic processor supports DDR5 memory and PCIe Gen5 lanes and serves as the main computing element in single-socket workstations and servers", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Supermicro", + "part_name": "CPU) P4X-W53435X-SRM34-XCC SPR w5-3435X" + } + }, + { + "bol_metadata": { + "bol_description": "CPU) P4X-ICXW3335-SRKWS ICX- W-3335 1P 16C/32T 24M250W 4189 M1", + "origin_country": "US", + "shipper": "supermicro computer inc" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading. Populated printed-circuit board: classifiable as an ADP part (8473.30), as the integrated circuit that dominates it (8542.31/32/39), or as a part of control apparatus (8538.90); Section XVI Note 2 governs the attribution.", + "candidate_set": { + "codes": [ + "854290", + "854232", + "854233", + "854231" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function", + "populated_board_boundary" + ], + "frozen_id": "v2.0.train.0636", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854231", + "id": "SH-0636", + "justification_text": "A CPU processor is a processor/controller integrated circuit under 8542.31, not an ADP part under 8473.30. Classified under HS 8542.31.", + "reference_ruling_ids": [ + "EBTI-EN-0151", + "EBTI-EN-0155", + "EBTI-EN-0158", + "EBTI-NL-NLBTI2021-0675", + "CROSS-N015225", + "EBTI-EN-0152", + "EBTI-EN-0153", + "EBTI-EN-0154", + "EBTI-EN-0156", + "EBTI-EN-0157", + "EBTI-IT-ITIT-2008-0119M-278100", + "EBTI-IT-ITIT-2008-0121M-278100", + "EBTI-IT-ITIT-2009-0448M-278100", + "EBTI-IT-ITIT-2009-0449M-278100", + "EBTI-NL-BEBTIDT.50.007.274", + "EBTI-PL-PLPL-WIT-2015-01263" + ], + "segment": "component", + "split": "train", + "tier1_description": "A workstation central processing unit with 16 cores and 32 threads, 3.4 GHz base frequency (4.0 GHz turbo), 24 MB L3 cache, and 250 W thermal design power, fabricated on a 10 nm process for the LGA4189 socket. The processor supports up to 4 TB of eight-channel DDR4-3200 ECC memory and 64 PCIe Gen4 lanes, serving as the main computing element of single-socket workstations", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Supermicro", + "part_name": "CPU) P4X-ICXW3335-srkws ICX- W-3335 1P" + } + }, + { + "bol_metadata": { + "bol_description": "DIGITAL INTEGRATED CIRCUIT", + "origin_country": "DE", + "shipper": "infineon technologies asia pacific" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854233", + "854232", + "854239", + "854231" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0637", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854231", + "id": "SH-0637", + "justification_text": "Processor or controller integrated circuits are classified under 8542.31. Classified under HS 8542.31.", + "reference_ruling_ids": [ + "CROSS-N086783", + "EBTI-NL-BED.T.305.471", + "EBTI-CZ-CZ05-0461-2011", + "EBTI-DE-DEM/211/08-1", + "EBTI-EN-0154", + "EBTI-FR-FRBTIFR-BTI-2023-00071", + "EBTI-DE-DEBTI24920/18-1", + "EBTI-EN-0155", + "EBTI-NL-BEBTIDT.50.007.274", + "EBTI-DE-DE19740/14-1", + "EBTI-DE-DEM/1236/09-1", + "EBTI-DE-DEM/2806/07-1", + "EBTI-IT-ITIT-2008-0119M-278100", + "EBTI-IT-ITIT-2008-0121M-278100", + "EBTI-IT-ITIT-2009-0448M-278100", + "EBTI-IT-ITIT-2009-0449M-278100", + "EBTI-PL-PLPL-WIT-2014-00620", + "CROSS-N088683", + "CROSS-N091160", + "CROSS-N281202", + "EBTI-EN-0151", + "EBTI-EN-0158", + "EBTI-NL-BED.T.278.356", + "EBTI-EN-0153", + "EBTI-EN-0157", + "EBTI-NL-NLBTI2021-0675", + "EBTI-NL-NLRTD-2007-002822", + "EBTI-PL-PLPL-WIT-2015-01263", + "EBTI-EN-0152", + "EBTI-EN-0156" + ], + "segment": "component", + "split": "train", + "tier1_description": "A digital electronic integrated circuit fabricated on a monolithic semiconductor (silicon) die and. The device performs digital logic and signal-processing functions and is intended for assembly onto printed circuit boards in electronic equipment. No specific part number is given in the shipping record, so the precise functional class within the digital IC family cannot be confirmed", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Infineon", + "part_name": "digital integrated circuit" + } + }, + { + "bol_metadata": { + "bol_description": "INTEGRATED CIRCUITS (A1 ITEM : 518)", + "origin_country": "DE", + "shipper": "infineon technologies ag" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854233", + "854231", + "854290", + "854239" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0638", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854231", + "id": "SH-0638", + "justification_text": "Processor or controller integrated circuits are classified under 8542.31. Classified under HS 8542.31.", + "reference_ruling_ids": [ + "EBTI-NL-BED.T.305.471", + "CROSS-N086783", + "EBTI-CZ-CZ05-0461-2011", + "EBTI-DE-DEM/211/08-1", + "EBTI-FR-FRBTIFR-BTI-2023-00071", + "EBTI-DE-DEBTI24920/18-1", + "EBTI-NL-BEBTIDT.50.007.274", + "CROSS-N088683", + "CROSS-N091160", + "CROSS-N281202", + "EBTI-DE-DE19740/14-1", + "EBTI-DE-DEM/1236/09-1", + "EBTI-DE-DEM/2806/07-1", + "EBTI-IT-ITIT-2008-0119M-278100", + "EBTI-IT-ITIT-2008-0121M-278100", + "EBTI-IT-ITIT-2009-0448M-278100", + "EBTI-IT-ITIT-2009-0449M-278100", + "EBTI-PL-PLPL-WIT-2014-00620", + "EBTI-NL-NLRTD-2007-002822", + "EBTI-PL-PLPL-WIT-2015-01263", + "EBTI-EN-0154", + "EBTI-EN-0155", + "EBTI-EN-0157", + "EBTI-NL-BED.T.278.356", + "EBTI-EN-0151", + "EBTI-EN-0152", + "EBTI-EN-0153", + "EBTI-EN-0158", + "EBTI-EN-0156" + ], + "segment": "component", + "split": "train", + "tier1_description": "A monolithic electronic integrated circuit built on a semiconductor die and supplied in a packaged surface-mount form for assembly onto printed circuit boards. The unit is a finished electronic integrated circuit used in general electronic equipment. The shipping line gives only an internal item reference and no manufacturer part number, so the precise functional category within the integrated circuit family cannot be determined", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Infineon", + "part_name": "integrated circuits (A1 item : 518)" + } + }, + { + "bol_metadata": { + "bol_description": "MICROPROCESSOR/SOC/CONTROLLER IC", + "origin_country": "US", + "shipper": "intel corporation" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854233", + "854232", + "854231", + "854239" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0639", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854231", + "id": "SH-0639", + "justification_text": "Processor or controller integrated circuits are classified under 8542.31. Classified under HS 8542.31.", + "reference_ruling_ids": [ + "CROSS-N086783", + "EBTI-NL-BED.T.305.471", + "EBTI-DE-DEM/211/08-1", + "EBTI-CZ-CZ05-0461-2011", + "EBTI-DE-DE19740/14-1", + "EBTI-FR-FRBTIFR-BTI-2023-00071", + "EBTI-EN-0158", + "EBTI-IT-ITIT-2008-0119M-278100", + "EBTI-IT-ITIT-2008-0121M-278100", + "EBTI-IT-ITIT-2009-0448M-278100", + "EBTI-IT-ITIT-2009-0449M-278100", + "EBTI-DE-DEBTI24920/18-1", + "EBTI-DE-DEM/1236/09-1", + "EBTI-DE-DEM/2806/07-1", + "EBTI-EN-0151", + "EBTI-EN-0154", + "EBTI-NL-BEBTIDT.50.007.274", + "EBTI-NL-NLRTD-2007-002822", + "EBTI-PL-PLPL-WIT-2014-00620", + "CROSS-N088683", + "CROSS-N091160", + "CROSS-N281202", + "EBTI-EN-0155", + "EBTI-NL-NLBTI2021-0675", + "EBTI-PL-PLPL-WIT-2015-01263", + "EBTI-EN-0152", + "EBTI-EN-0153", + "EBTI-EN-0156", + "EBTI-EN-0157", + "EBTI-NL-BED.T.278.356" + ], + "segment": "component", + "split": "train", + "tier1_description": "A monolithic semiconductor integrated circuit functioning as a microprocessor, system-on-chip or controller, packaged for surface-mount assembly onto printed circuit boards. The device executes program instructions and provides processing and control functions for digital electronic systems. The product covers a large quantity of these processing/controller ICs; no individual part number is disclosed", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Intel", + "part_name": "microprocessor/SOC/controller IC" + } + }, + { + "bol_metadata": { + "bol_description": "IC UNITS - MICROPROCESSOR(BX)", + "origin_country": "US", + "shipper": "intel microelectronics m sdn bhd" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854290", + "854231", + "854233", + "854232" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0640", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854231", + "id": "SH-0640", + "justification_text": "Processor or controller integrated circuits are classified under 8542.31. Classified under HS 8542.31.", + "reference_ruling_ids": [ + "EBTI-NL-BED.T.305.471", + "CROSS-N086783", + "EBTI-CZ-CZ05-0461-2011", + "EBTI-DE-DEM/211/08-1", + "EBTI-FR-FRBTIFR-BTI-2023-00071", + "EBTI-EN-0151", + "EBTI-DE-DE19740/14-1", + "EBTI-DE-DEBTI24920/18-1", + "EBTI-DE-DEM/1236/09-1", + "EBTI-DE-DEM/2806/07-1", + "EBTI-EN-0154", + "EBTI-EN-0158", + "EBTI-IT-ITIT-2008-0119M-278100", + "EBTI-IT-ITIT-2008-0121M-278100", + "EBTI-IT-ITIT-2009-0448M-278100", + "EBTI-IT-ITIT-2009-0449M-278100", + "EBTI-NL-BEBTIDT.50.007.274", + "EBTI-PL-PLPL-WIT-2014-00620", + "CROSS-N088683", + "CROSS-N091160", + "CROSS-N281202", + "EBTI-EN-0155", + "EBTI-EN-0157", + "EBTI-NL-NLRTD-2007-002822", + "EBTI-EN-0152", + "EBTI-EN-0153", + "EBTI-EN-0156", + "EBTI-NL-BED.T.278.356", + "EBTI-PL-PLPL-WIT-2015-01263", + "EBTI-NL-NLBTI2021-0675" + ], + "segment": "component", + "split": "train", + "tier1_description": "A monolithic semiconductor integrated circuit functioning as a microprocessor, packaged as a finished electronic component for mounting on printed circuit boards. The device performs program execution and central processing functions in computing or embedded electronic equipment. The shipping record gives a packing quantity but no specific", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Intel", + "part_name": "IC units - microprocessor(BX)" + } + }, + { + "bol_metadata": { + "bol_description": "IC UNITS - INTEGRATED CIRCUIT", + "origin_country": "US", + "shipper": "intel technology sdn bhd" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854231", + "854239", + "854290", + "854233" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0641", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854231", + "id": "SH-0641", + "justification_text": "Processor or controller integrated circuits are classified under 8542.31. Classified under HS 8542.31.", + "reference_ruling_ids": [ + "EBTI-NL-BED.T.305.471", + "EBTI-CZ-CZ05-0461-2011", + "CROSS-N086783", + "EBTI-DE-DEBTI24920/18-1", + "EBTI-DE-DEM/211/08-1", + "EBTI-FR-FRBTIFR-BTI-2023-00071", + "EBTI-NL-BEBTIDT.50.007.274", + "EBTI-IT-ITIT-2008-0119M-278100", + "EBTI-IT-ITIT-2008-0121M-278100", + "EBTI-IT-ITIT-2009-0448M-278100", + "EBTI-IT-ITIT-2009-0449M-278100", + "EBTI-DE-DE19740/14-1", + "EBTI-DE-DEM/1236/09-1", + "EBTI-DE-DEM/2806/07-1", + "EBTI-EN-0154", + "EBTI-PL-PLPL-WIT-2014-00620", + "EBTI-PL-PLPL-WIT-2015-01263", + "CROSS-N088683", + "CROSS-N091160", + "CROSS-N281202", + "EBTI-EN-0151", + "EBTI-EN-0155", + "EBTI-EN-0156", + "EBTI-EN-0157", + "EBTI-EN-0158", + "EBTI-NL-NLRTD-2007-002822", + "EBTI-EN-0152", + "EBTI-EN-0153", + "EBTI-NL-BED.T.278.356", + "EBTI-NL-NLBTI2021-0675" + ], + "segment": "component", + "split": "train", + "tier1_description": "A monolithic semiconductor electronic integrated circuit supplied as a packaged component for assembly onto printed circuit boards in electronic equipment. From a manufacturer specializing in processors, the device is most likely a processing or controller IC, though the line item gives only a generic integrated-circuit description and a small piece count without a", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Intel", + "part_name": "IC units - integrated circuit" + } + }, + { + "bol_metadata": { + "bol_description": "BIT MICROPROCESSOR", + "origin_country": "US", + "shipper": "intel technology sdn bhd" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854233", + "854232", + "854231", + "854290" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0642", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854231", + "id": "SH-0642", + "justification_text": "Processor or controller integrated circuits are classified under 8542.31. Classified under HS 8542.31.", + "reference_ruling_ids": [ + "EBTI-NL-BED.T.305.471", + "CROSS-N086783", + "EBTI-CZ-CZ05-0461-2011", + "EBTI-DE-DEM/211/08-1", + "EBTI-EN-0151", + "EBTI-EN-0154", + "EBTI-FR-FRBTIFR-BTI-2023-00071", + "EBTI-PL-PLPL-WIT-2014-00620", + "CROSS-N088683", + "CROSS-N091160", + "CROSS-N281202", + "EBTI-EN-0153", + "EBTI-EN-0155", + "EBTI-EN-0158", + "EBTI-NL-BEBTIDT.50.007.274", + "EBTI-NL-NLRTD-2007-002822", + "EBTI-PL-PLPL-WIT-2015-01263", + "EBTI-DE-DE19740/14-1", + "EBTI-DE-DEBTI24920/18-1", + "EBTI-DE-DEM/1236/09-1", + "EBTI-DE-DEM/2806/07-1", + "EBTI-EN-0152", + "EBTI-EN-0157", + "EBTI-IT-ITIT-2008-0119M-278100", + "EBTI-IT-ITIT-2008-0121M-278100", + "EBTI-IT-ITIT-2009-0448M-278100", + "EBTI-IT-ITIT-2009-0449M-278100", + "EBTI-NL-NLBTI2021-0675" + ], + "segment": "component", + "split": "train", + "tier1_description": "A 64-bit monolithic semiconductor microprocessor integrated circuit, packaged for surface-mount assembly onto printed circuit boards. The device executes 64-bit program instructions and provides central processing functionality for computing platforms and embedded systems. The record states the device is a 64-bit microprocessor but supplies no specific", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Intel", + "part_name": "BIT microprocessor" + } + }, + { + "bol_metadata": { + "bol_description": "INTEGRATED CIRCUIT (P700121D-FR0000)", + "origin_country": "TW", + "shipper": "mediatek singapore pte.ltd" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854290", + "854233", + "854231", + "854239" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0643", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854231", + "id": "SH-0643", + "justification_text": "Processor or controller integrated circuits are classified under 8542.31. Classified under HS 8542.31.", + "reference_ruling_ids": [ + "CROSS-N086783", + "EBTI-NL-BED.T.305.471", + "EBTI-CZ-CZ05-0461-2011", + "EBTI-DE-DEM/211/08-1", + "EBTI-EN-0154", + "EBTI-EN-0155", + "EBTI-EN-0158", + "EBTI-FR-FRBTIFR-BTI-2023-00071", + "EBTI-PL-PLPL-WIT-2014-00620", + "CROSS-N088683", + "CROSS-N091160", + "CROSS-N281202", + "EBTI-EN-0157", + "EBTI-IT-ITIT-2008-0119M-278100", + "EBTI-IT-ITIT-2008-0121M-278100", + "EBTI-IT-ITIT-2009-0448M-278100", + "EBTI-IT-ITIT-2009-0449M-278100", + "EBTI-NL-NLRTD-2007-002822", + "EBTI-DE-DE19740/14-1", + "EBTI-DE-DEBTI24920/18-1", + "EBTI-DE-DEM/1236/09-1", + "EBTI-DE-DEM/2806/07-1", + "EBTI-EN-0151", + "EBTI-EN-0152", + "EBTI-EN-0153", + "EBTI-NL-BEBTIDT.50.007.274", + "EBTI-PL-PLPL-WIT-2015-01263", + "EBTI-EN-0156" + ], + "segment": "component", + "split": "train", + "tier1_description": "A monolithic semiconductor integrated circuit, most likely a system-on-chip or controller device for mobile or consumer-electronics applications, supplied in a packaged surface-mount form for board assembly. The unit provides processing and system-control functions. The line carries an internal product code (P700121D) that does not resolve to a public catalog part, so the exact device family is not confirmed", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "MediaTek", + "part_name": "integrated circuit (P700121D-FR0000)" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-23 00:00:00", + "bol_description": "(FOC) 8002676742 405579 HNB128G25MX009N SK HYNIX MEMORY IC (IC LPDDR5x MEMORIES) (FOR R&D PURPOSE)", + "consignee": "amd india private limited", + "declared_hs": "85423200", + "hs_verified": true, + "origin_country": "SOUTH KOREA", + "port_dest": "", + "port_origin": "", + "shipper": "sk hynix inc" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854290", + "854232", + "854239", + "854233" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0644", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854232", + "id": "SH-0644", + "justification_text": "Goods classified under HS 8542.32; corroborated by 4 customs rulings on comparable goods (EU-EN, EU-NL, US).", + "reference_ruling_ids": [ + "EBTI-EN-0159", + "EBTI-NL-NLRTD-2007-002125", + "CROSS-N312133", + "EBTI-EN-0160" + ], + "segment": "component", + "split": "train", + "tier1_description": "An LPDDR5X low-power mobile DRAM memory device (type HNB128G25MX009N): a high-bandwidth, low-power dynamic random-access memory used as working memory in mobile and AI/ML applications. Supplied for research and development use", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "SK hynix", + "part_name": "(FOC) 8002676742405579 HNB128G25MX009N" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-26 00:00:00", + "bol_description": "(FOC) 16-102412-01 ^ 64 GB NAND BICS3 EMBEDDED MULTIMEDIA CHIP(EEPROM) (IC,S)", + "consignee": "cisco systems india private limited", + "declared_hs": "85423200", + "hs_verified": true, + "origin_country": "JAPAN", + "port_dest": "", + "port_origin": "", + "shipper": "kioxia america, inc" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854239", + "854232", + "854231", + "854233" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0645", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854232", + "id": "SH-0645", + "justification_text": "Goods classified under HS 8542.32; corroborated by 5 customs rulings on comparable goods (EU-EN, EU-NL, US).", + "reference_ruling_ids": [ + "EBTI-EN-0159", + "CROSS-N007736", + "EBTI-NL-NLRTD-2007-002125", + "EBTI-EN-0160", + "CROSS-N312133" + ], + "segment": "component", + "split": "train", + "tier1_description": "An embedded NAND flash memory device (eMMC, 64 GB, BiCS3 3D NAND): a managed-NAND component combining 3D NAND flash and an MMC controller in a BGA package, providing non-volatile mass storage over the eMMC interface for embedded systems", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Kioxia", + "part_name": "(FOC) 16-102412-01 ^ 64 GB NAND BICS3" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-24 00:00:00", + "bol_description": "1107-002985 IC-UNIVERSAL FLASH STORAGE THGJFMT1E45BA (IC MEMORY FOR SAMSUNG MANUFACTURING)", + "consignee": "samsung india electronics private limited", + "declared_hs": "85423200", + "hs_verified": true, + "origin_country": "CHINA MAINLAND", + "port_dest": "", + "port_origin": "", + "shipper": "kioxia korea corporation" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading. Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "854239", + "854233", + "854232", + "854290" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function", + "storage_boundary" + ], + "frozen_id": "v2.0.train.0646", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854232", + "id": "SH-0646", + "justification_text": "Goods classified under HS 8542.32; corroborated by 5 customs rulings on comparable goods (EU-EN, EU-NL, US).", + "reference_ruling_ids": [ + "EBTI-EN-0159", + "CROSS-N007736", + "EBTI-NL-NLRTD-2007-002125", + "EBTI-EN-0160", + "CROSS-N312133" + ], + "segment": "component", + "split": "train", + "tier1_description": "A Universal Flash Storage (UFS) memory device (type THGJFMT1E45BA, UFS 4.0): a high-speed managed-NAND storage device combining BiCS 3D NAND flash and a controller in a JEDEC package, delivering interface speeds up to ~46 Gbps for mobile and embedded systems", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Kioxia", + "part_name": "1107-002985 IC-universal flash storage" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-17 00:00:00", + "bol_description": "INTEGRATED CIRCUIT PACKAGE", + "consignee": "smart modular technologies sdn bhd", + "declared_hs": "8542320000", + "hs_verified": true, + "origin_country": "CHINA TAIWAN", + "port_dest": "PENANG GEORGETOWN", + "port_origin": "TAIPEI", + "shipper": "macronix international co ltd" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854232", + "854290", + "854239", + "854231" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0647", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854232", + "id": "SH-0647", + "justification_text": "Goods classified under HS 8542.32; corroborated by 5 customs rulings on comparable goods (EU-EN, EU-NL, US).", + "reference_ruling_ids": [ + "EBTI-NL-NLRTD-2007-002125", + "EBTI-EN-0159", + "CROSS-N007736", + "EBTI-EN-0160", + "CROSS-N312133" + ], + "segment": "component", + "split": "train", + "tier1_description": "Memory integrated circuit (packaged): a monolithic memory IC (e.g. NOR/NAND flash) supplied in a surface-mount package", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Macronix", + "part_name": "integrated circuit package" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-30 00:00:00", + "bol_description": "NAND COMPONENT-NC17T-INTEGRATED CIRCUIT", + "consignee": "micron memory malaysia sdn bhd", + "declared_hs": "8542320000", + "hs_verified": true, + "origin_country": "SINGAPORE", + "port_dest": "KAMPONG TANJONG KUPANG", + "port_origin": "SINGAPORE", + "shipper": "micron semiconductor asia ops" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854232", + "854231", + "854233", + "854290" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0648", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854232", + "id": "SH-0648", + "justification_text": "Goods classified under HS 8542.32; corroborated by 4 customs rulings on comparable goods (EU-EN, EU-NL, US).", + "reference_ruling_ids": [ + "EBTI-EN-0159", + "EBTI-NL-NLRTD-2007-002125", + "EBTI-EN-0160", + "CROSS-N312133" + ], + "segment": "component", + "split": "train", + "tier1_description": "NAND flash memory component (type NC17T): a non-volatile NAND flash memory IC used for mass data storage", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Micron Technology", + "part_name": "NAND component-NC17T-integrated circuit" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-30 00:00:00", + "bol_description": "HAIR LINE CRACK (IC)", + "consignee": "micron semiconductor m sdn bhd", + "declared_hs": "8542320000", + "hs_verified": true, + "origin_country": "MALAYSIA", + "port_dest": "KAMPONG TANJONG KUPANG", + "port_origin": "SINGAPORE", + "shipper": "micron semi asia ops pte ltd" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854239", + "854290", + "854231", + "854232" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0649", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854232", + "id": "SH-0649", + "justification_text": "Goods classified under HS 8542.32; corroborated by 4 customs rulings on comparable goods (EU-EN, EU-NL, US).", + "reference_ruling_ids": [ + "EBTI-NL-NLRTD-2007-002125", + "EBTI-EN-0159", + "EBTI-EN-0160", + "CROSS-N312133" + ], + "segment": "component", + "split": "train", + "tier1_description": "Memory integrated circuit (defect/failure-analysis sample with a hairline crack): a packaged memory IC submitted as a cracked-package sample", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Micron Technology", + "part_name": "hair line crack (IC)" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-30 00:00:00", + "bol_description": "MEMORIES INTEGRATED CIRCUITS K4UBE3D4AM-TFCL03V P/N 3924491", + "consignee": "harman international india private limited", + "declared_hs": "85423200", + "hs_verified": true, + "origin_country": "SOUTH KOREA", + "port_dest": "", + "port_origin": "", + "shipper": "samsung semiconductor europe gmbh" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854290", + "854232", + "854239", + "854233" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0650", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854232", + "id": "SH-0650", + "justification_text": "Goods classified under HS 8542.32; corroborated by 4 customs rulings on comparable goods (EU-EN, EU-NL, US).", + "reference_ruling_ids": [ + "EBTI-NL-NLRTD-2007-002125", + "EBTI-EN-0159", + "EBTI-EN-0160", + "CROSS-N312133" + ], + "segment": "component", + "split": "train", + "tier1_description": "A 32 Gb LPDDR4X low-power mobile DRAM (type K4UBE3D4AM-TFCL): a high-bandwidth, low-power dynamic random-access memory used as working memory in mobile, automotive and embedded systems. Supplied as a packaged memory device", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Samsung Electronics", + "part_name": "memories integrated circuits" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-30 00:00:00", + "bol_description": "MEMORIES INTEGRATED CIRCUITS KLMBG4GEUF-B04PT57 P/N 4001842", + "consignee": "harman international india private limited", + "declared_hs": "85423200", + "hs_verified": true, + "origin_country": "SOUTH KOREA", + "port_dest": "", + "port_origin": "", + "shipper": "samsung semiconductor europe gmbh" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854290", + "854233", + "854232", + "854239" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0651", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854232", + "id": "SH-0651", + "justification_text": "Goods classified under HS 8542.32; corroborated by 5 customs rulings on comparable goods (EU-EN, EU-NL, US).", + "reference_ruling_ids": [ + "EBTI-NL-NLRTD-2007-002125", + "EBTI-EN-0159", + "CROSS-N007736", + "EBTI-EN-0160", + "CROSS-N312133" + ], + "segment": "component", + "split": "train", + "tier1_description": "An embedded NAND flash memory device (type KLMBG4GEUF, eMMC): a managed-NAND component combining MLC NAND flash and an on-chip MMC controller in a BGA package, providing non-volatile mass storage for mobile and embedded systems over the eMMC interface", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Samsung Electronics", + "part_name": "memories integrated circuits" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-29 00:00:00", + "bol_description": "1108-000714I IC-MEMORY MEMORY,KM2L9001CM-B518,FBGA,254P, (ICMEMORY FOR SAMSUNG MANUFACTURING)", + "consignee": "samsung india electronics private limited", + "declared_hs": "85423200", + "hs_verified": true, + "origin_country": "SOUTH KOREA", + "port_dest": "", + "port_origin": "", + "shipper": "samsung electronics co. ltd" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854232", + "854290", + "854239", + "854231" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0652", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854232", + "id": "SH-0652", + "justification_text": "Goods classified under HS 8542.32; corroborated by 4 customs rulings on comparable goods (EU-EN, EU-NL, US).", + "reference_ruling_ids": [ + "EBTI-NL-NLRTD-2007-002125", + "EBTI-EN-0159", + "EBTI-EN-0160", + "CROSS-N312133" + ], + "segment": "component", + "split": "train", + "tier1_description": "Memory integrated circuit (type KM2L9001CM, 254-ball FBGA): a packaged memory device used for data/working-memory storage", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Samsung Electronics", + "part_name": "1108-000714I IC-memory memory" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-28 00:00:00", + "bol_description": "IC-NOR FLASH W25Q40CLSSIP, 4MBIT, SOIC, 8P, (1107-002226)(INTEGRATED CIRCUIT)", + "consignee": "samsung india electronics private limited", + "declared_hs": "85423200", + "hs_verified": true, + "origin_country": "CHINA TAIWAN", + "port_dest": "", + "port_origin": "", + "shipper": "samsung electronics taiwan co ltd" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854232", + "854233", + "854231", + "854239" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0653", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854232", + "id": "SH-0653", + "justification_text": "Goods classified under HS 8542.32; corroborated by 4 customs rulings on comparable goods (EU-EN, EU-NL, US).", + "reference_ruling_ids": [ + "EBTI-EN-0159", + "EBTI-NL-NLRTD-2007-002125", + "CROSS-N312133", + "EBTI-EN-0160" + ], + "segment": "component", + "split": "train", + "tier1_description": "A serial NOR flash memory IC (type W25Q40, 4 Mbit, 8-pin SOIC): a low-pin-count dual/quad-SPI non-volatile flash organised as 2,048 pages of 256 bytes, operating from 2.7-3.6 V, used to store boot code and firmware with fast random read access", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Samsung Electronics", + "part_name": "IC-NOR flash W25Q40CLSSIP 4MBIT SOIC 8P" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-28 00:00:00", + "bol_description": "INTEGRATED CIRCUITS; IC-EMMC KLMAG1JETD-B041009,BGA,153P,TR,1 (PART NO: 1107-002758)", + "consignee": "samsung india electronics private limited", + "declared_hs": "85423200", + "hs_verified": true, + "origin_country": "SOUTH KOREA", + "port_dest": "", + "port_origin": "", + "shipper": "samsung electronics co., ltd" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854290", + "854232", + "854231", + "854239" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0654", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854232", + "id": "SH-0654", + "justification_text": "Goods classified under HS 8542.32; corroborated by 5 customs rulings on comparable goods (EU-EN, EU-NL, US).", + "reference_ruling_ids": [ + "EBTI-NL-NLRTD-2007-002125", + "EBTI-EN-0159", + "CROSS-N007736", + "EBTI-EN-0160", + "CROSS-N312133" + ], + "segment": "component", + "split": "train", + "tier1_description": "An embedded NAND flash memory device (type KLMAG1JETD-B041, eMMC 5.1, 16 GB): a managed-NAND component combining 128 Gb MLC NAND flash and an MMC controller in a 153-ball BGA package, providing HS400-capable non-volatile storage for mobile and embedded systems", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Samsung Electronics", + "part_name": "integrated circuits IC-EMMC" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-28 00:00:00", + "bol_description": "INTEGRATED CIRCUITS; IC-DDE4 SDRAM K4A4G165WF-BCTD,4266MBPSD (PART NO: 1105-003102)", + "consignee": "samsung india electronics private limited", + "declared_hs": "85423200", + "hs_verified": true, + "origin_country": "SOUTH KOREA", + "port_dest": "", + "port_origin": "", + "shipper": "samsung electronics co., ltd" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854233", + "854239", + "854290", + "854232" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0655", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854232", + "id": "SH-0655", + "justification_text": "Goods classified under HS 8542.32; corroborated by 5 customs rulings on comparable goods (EU-EN, EU-NL, US).", + "reference_ruling_ids": [ + "EBTI-NL-NLRTD-2007-002125", + "CROSS-N007736", + "EBTI-EN-0159", + "EBTI-EN-0160", + "CROSS-N312133" + ], + "segment": "component", + "split": "train", + "tier1_description": "A 4 Gb DDR4 SDRAM memory IC (type K4A4G165WF, 256M x16, F-die): a synchronous dynamic random-access memory device in a 96-ball FBGA package operating at 1.2 V, used as high-speed volatile working memory in computing and embedded systems", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Samsung Electronics", + "part_name": "integrated circuits IC-DDE4 sdram" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-28 00:00:00", + "bol_description": "1107-002989 IC-UNIVERSAL FLASH STORAGE KLUGG8NHHB-F0 (IC MEMORY FOR SAMSUNG MANUFACTURING)", + "consignee": "samsung india electronics private limited", + "declared_hs": "85423200", + "hs_verified": true, + "origin_country": "SOUTH KOREA", + "port_dest": "", + "port_origin": "", + "shipper": "samsung electronics co. ltd" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading. Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "854232", + "854239", + "854290", + "854233" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function", + "storage_boundary" + ], + "frozen_id": "v2.0.train.0656", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854232", + "id": "SH-0656", + "justification_text": "Goods classified under HS 8542.32; corroborated by 5 customs rulings on comparable goods (EU-EN, EU-NL, US).", + "reference_ruling_ids": [ + "CROSS-N007736", + "EBTI-EN-0159", + "EBTI-NL-NLRTD-2007-002125", + "EBTI-EN-0160", + "CROSS-N312133" + ], + "segment": "component", + "split": "train", + "tier1_description": "A Universal Flash Storage (UFS) memory device (type KLUGG8NHHB, UFS 4.0): a high-speed managed-NAND storage device combining 3D NAND flash and a controller in a ~9x13 mm JEDEC package, delivering high-bandwidth non-volatile storage for mobile and embedded systems", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Samsung Electronics", + "part_name": "1107-002989 IC-universal flash storage" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-30 00:00:00", + "bol_description": "P/N SPSUBY52KX8B-Z-BG63 DRAM CHIPS 16G DIE-COM FOC SHIPMENT", + "consignee": "micron semiconductor technology india private limi", + "declared_hs": "85423200", + "hs_verified": true, + "origin_country": "JAPAN", + "port_dest": "", + "port_origin": "", + "shipper": "micron semiconductor asia operations pte. ltd" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854239", + "854233", + "854231", + "854232" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0657", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854232", + "id": "SH-0657", + "justification_text": "Goods classified under HS 8542.32; corroborated by 4 customs rulings on comparable goods (EU-EN, EU-NL, US).", + "reference_ruling_ids": [ + "EBTI-NL-NLRTD-2007-002125", + "EBTI-EN-0159", + "CROSS-N312133", + "EBTI-EN-0160" + ], + "segment": "component", + "split": "train", + "tier1_description": "DRAM memory die (type SPSUBY52KX8B, 16 Gb): a dynamic-random-access-memory device supplied in die form for working-memory storage", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Micron Technology", + "part_name": "P/N SPSUBY52KX8B-Z-BG63 DRAM chips 16G" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-30 00:00:00", + "bol_description": "SLC NAND FLASH PARALLEL", + "consignee": "jabil circuit sdn bhd", + "declared_hs": "8542320000", + "hs_verified": true, + "origin_country": "THAILAND", + "port_dest": "TANJUNG KUPANG JOHOR", + "port_origin": "SINGAPORE", + "shipper": "arrow electronic asia s pte ltd" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854232", + "854290", + "854239", + "854233" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0658", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854232", + "id": "SH-0658", + "justification_text": "Goods classified under HS 8542.32; corroborated by 4 customs rulings on comparable goods (EU-EN, EU-NL, US).", + "reference_ruling_ids": [ + "EBTI-EN-0159", + "EBTI-NL-NLRTD-2007-002125", + "CROSS-N312133", + "EBTI-EN-0160" + ], + "segment": "component", + "split": "train", + "tier1_description": "SLC NAND flash memory IC (parallel interface): a single-level-cell non-volatile NAND flash device used for code/data storage in embedded systems", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Arrow Electronics", + "part_name": "SLC NAND flash parallel" + } + }, + { + "bol_metadata": null, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854233", + "854232", + "854290", + "854231" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0659", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854232", + "id": "SH-0659", + "justification_text": "The product falls under HS 8542.32 (Electronic integrated circuits: memories).", + "reference_ruling_ids": [ + "EBTI-NL-NLRTD-2007-002125", + "CROSS-N007736", + "EBTI-EN-0159", + "CROSS-N312133", + "EBTI-EN-0160" + ], + "segment": "component", + "split": "train", + "tier1_description": "A 32 GB TLC NAND flash memory device in a 153-ball BGA package, providing raw managed-NAND mass storage. It serves as embedded storage for industrial and embedded computing systems (part SFEM032GB1ED1TO). Part number SFEM032GB1ED1TO-I-5E-111-STD", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Swissbit", + "part_name": "SFEM032GB1ED1TO-I-5E-111-STD" + } + }, + { + "bol_metadata": { + "bol_description": "QSPI Flash memory chip, 8-SOIC to DIP, W25", + "origin_country": "US", + "shipper": "adafruit industries" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading. Populated printed-circuit board: classifiable as an ADP part (8473.30), as the integrated circuit that dominates it (8542.31/32/39), or as a part of control apparatus (8538.90); Section XVI Note 2 governs the attribution. Solid-state storage: a finished drive falls in 8523.51, the bare memory IC in 8542.32, and a memory module fitted for a data-processing machine in 8473.30; the level of assembly and presentation decides.", + "candidate_set": { + "codes": [ + "854232", + "854239", + "854231", + "854290" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function", + "populated_board_boundary", + "storage_boundary" + ], + "frozen_id": "v2.0.train.0660", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854232", + "id": "SH-0660", + "justification_text": "A flash memory IC on an adapter remains a memory integrated circuit of 8542.32, not an ADP part under 8473.30. Classified under HS 8542.32.", + "reference_ruling_ids": [ + "EBTI-EN-0159", + "EBTI-NL-NLRTD-2007-002125", + "EBTI-EN-0160", + "CROSS-N007736", + "CROSS-N312133" + ], + "segment": "component", + "split": "train", + "tier1_description": "A serial NOR flash memory integrated circuit that converts it to a 0.3-inch DIP footprint. The 3.3 V quad-SPI non-volatile memory is offered in capacities from 2 to 16 megabytes and provides program code and data storage for microcontroller systems during prototyping and socketed designs", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit Industries", + "part_name": "QSPI Flash memory chip 8-SOIC to DIP W25" + } + }, + { + "bol_metadata": { + "bol_description": "A2C0096630000 MEMORIES EEPROM MOUNTED DICE DSZAK1C48L 1 M95512 DRDW3TP K", + "origin_country": "Switzerland", + "shipper": "stmicroelectronics asia pacific pte ltd" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854231", + "854239", + "854233", + "854232" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0661", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854232", + "id": "SH-0661", + "justification_text": "EEPROM memory ICs are memory integrated circuits under 8542.32, not processors/controllers of 8542.31. Classified under HS 8542.32.", + "reference_ruling_ids": [ + "EBTI-NL-NLRTD-2007-002125", + "EBTI-EN-0159", + "CROSS-N312133", + "EBTI-EN-0160" + ], + "segment": "component", + "split": "train", + "tier1_description": "Serial EEPROM memory device, a 512-kilobit electrically erasable programmable read-only memory organized as by 8 bits and accessed over an SPI-compatible serial bus running up to 16 MHz. Built as a monolithic silicon memory die supplied in mounted form. Operates over a wide supply range and is used for non-volatile data storage in embedded and automotive electronics", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "STMicroelectronics", + "part_name": "A2C0096630000 memories EEPROM mounted" + } + }, + { + "bol_metadata": { + "bol_description": "ITEM / IC UNITS AS25F316MQ-10S1IN - 1 BOX", + "origin_country": "US", + "shipper": "alliance memory" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854231", + "854290", + "854232", + "854239" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0662", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854232", + "id": "SH-0662", + "justification_text": "Memory integrated circuits, including EEPROM or flash memory ICs, are classified under 8542.32. Classified under HS 8542.32.", + "reference_ruling_ids": [ + "EBTI-EN-0159", + "EBTI-NL-NLRTD-2007-002125", + "EBTI-EN-0160" + ], + "segment": "component", + "split": "train", + "tier1_description": "Serial NOR flash device, a 16-megabit non-volatile semiconductor with a single/dual/quad SPI interface operating at high clock speeds and. A monolithic silicon die used for code and data storage in embedded electronic systems", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Alliance Memory", + "part_name": "item / IC units AS25F316MQ-10S1IN" + } + }, + { + "bol_metadata": { + "bol_description": "IC UNITS-AS4C128M16D3LC-12BCN (JABIL", + "origin_country": "US", + "shipper": "alliance memory" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854231", + "854290", + "854233", + "854232" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0663", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854232", + "id": "SH-0663", + "justification_text": "Memory integrated circuits, including EEPROM or flash memory ICs, are classified under 8542.32. Classified under HS 8542.32.", + "reference_ruling_ids": [ + "EBTI-NL-NLRTD-2007-002125", + "EBTI-EN-0159" + ], + "segment": "component", + "split": "train", + "tier1_description": "DDR3 synchronous dynamic random-access device, a 2-gigabit DRAM organized with a 16-bit-wide parallel interface operating up to 800 MHz (1600 Mb/s per pin). A monolithic silicon die used as volatile working in computing and electronic systems", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Alliance Memory", + "part_name": "IC units-AS4C128M16D3LC-12BCN (jabil" + } + }, + { + "bol_metadata": null, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854239", + "854290", + "854232", + "854233" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0664", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854233", + "id": "SH-0664", + "justification_text": "Goods classified under HS 8542.33; corroborated by 8 customs rulings on comparable goods (EU-DE, EU-EN, EU-FR, EU-NL).", + "reference_ruling_ids": [ + "EBTI-FR-FRBTIFR-BTI-2017-08868", + "EBTI-DE-DE15030/09-1", + "EBTI-DE-DE21505/11-1", + "EBTI-NL-NLRTD-2013-002163", + "EBTI-DE-DE22792/14-1", + "EBTI-EN-0163", + "EBTI-EN-0161", + "EBTI-EN-0162" + ], + "segment": "component", + "split": "train", + "tier1_description": "A 40 V precision dual-channel CMOS operational amplifier integrated circuit, integrating two high-accuracy amplifiers on one die for low-offset DC signal conditioning. It is a monolithic analog amplifier IC, used in precision measurement and sensor front-end circuits", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Analog Devices Inc.", + "part_name": "Integrated Circuit (Amplifier) - 40V" + } + }, + { + "bol_metadata": null, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854290", + "854233", + "854239", + "854231" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0665", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854233", + "id": "SH-0665", + "justification_text": "Goods classified under HS 8542.33; corroborated by 8 customs rulings on comparable goods (EU-DE, EU-EN, EU-FR, EU-NL).", + "reference_ruling_ids": [ + "EBTI-EN-0163", + "EBTI-FR-FRBTIFR-BTI-2017-08868", + "EBTI-DE-DE15030/09-1", + "EBTI-DE-DE21505/11-1", + "EBTI-NL-NLRTD-2013-002163", + "EBTI-DE-DE22792/14-1", + "EBTI-EN-0161", + "EBTI-EN-0162" + ], + "segment": "component", + "split": "train", + "tier1_description": "A 100 V precision bidirectional current-sense amplifier integrated circuit, accurately measuring load current via a shunt at high common-mode voltage and reporting current of either direction. It is a monolithic analog amplifier IC, used in power-monitoring and motor-control current measurement", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "STMicroelectronics", + "part_name": "Integrated Circuit (Amplifier) - 100 V" + } + }, + { + "bol_metadata": null, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854232", + "854231", + "854233", + "854290" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0666", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854233", + "id": "SH-0666", + "justification_text": "Goods classified under HS 8542.33; corroborated by 8 customs rulings on comparable goods (EU-DE, EU-EN, EU-FR, EU-NL).", + "reference_ruling_ids": [ + "EBTI-FR-FRBTIFR-BTI-2017-08868", + "EBTI-DE-DE15030/09-1", + "EBTI-DE-DE21505/11-1", + "EBTI-EN-0163", + "EBTI-NL-NLRTD-2013-002163", + "EBTI-DE-DE22792/14-1", + "EBTI-EN-0161", + "EBTI-EN-0162" + ], + "segment": "component", + "split": "train", + "tier1_description": "A nano-capacitance, low-noise rail-to-rail input/output operational amplifier integrated circuit optimized for capacitive-source stability and full-supply-range operation. It is a monolithic analog amplifier IC, used in precision sensor and instrumentation front ends", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Rohm Semiconductor", + "part_name": "Integrated Circuit (Amplifier) - NANO" + } + }, + { + "bol_metadata": null, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading. Audio-frequency amplifier apparatus (8518.40) vs amplifier integrated circuit (8542.33) vs other electrical machine with individual function (8543.70); apparatus vs component and the signal domain decide.", + "candidate_set": { + "codes": [ + "854233", + "854239", + "854231", + "854232" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function", + "amplifier_boundary" + ], + "frozen_id": "v2.0.train.0667", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854233", + "id": "SH-0667", + "justification_text": "Goods classified under HS 8542.33; corroborated by 8 customs rulings on comparable goods (EU-DE, EU-EN, EU-FR, EU-NL).", + "reference_ruling_ids": [ + "EBTI-EN-0163", + "EBTI-FR-FRBTIFR-BTI-2017-08868", + "EBTI-NL-NLRTD-2013-002163", + "EBTI-DE-DE15030/09-1", + "EBTI-DE-DE21505/11-1", + "EBTI-DE-DE22792/14-1", + "EBTI-EN-0161", + "EBTI-EN-0162" + ], + "segment": "component", + "split": "train", + "tier1_description": "A fully integrated mono audio subsystem integrated circuit from Texas Instruments combining a Class-G ground-referenced headphone amplifier (about 25 mW) and a filterless Class-D loudspeaker amplifier (about 1.35 W) with an automatic level control noise gate for speaker protection, an earpiece switch, and I2C control on a single die. It is a monolithic mixed-signal IC in an ultra-small surface-mount package, used as the audio output stage in mobile phones and portable handheld devices", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "National Semiconductor", + "part_name": "Integrated Circuit (Amplifier)" + } + }, + { + "bol_metadata": null, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854231", + "854232", + "854290", + "854233" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0668", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854233", + "id": "SH-0668", + "justification_text": "Goods classified under HS 8542.33; corroborated by 8 customs rulings on comparable goods (EU-DE, EU-EN, EU-FR, EU-NL).", + "reference_ruling_ids": [ + "EBTI-EN-0163", + "EBTI-FR-FRBTIFR-BTI-2017-08868", + "EBTI-DE-DE15030/09-1", + "EBTI-DE-DE21505/11-1", + "EBTI-NL-NLRTD-2013-002163", + "EBTI-DE-DE22792/14-1", + "EBTI-EN-0161", + "EBTI-EN-0162" + ], + "segment": "component", + "split": "train", + "tier1_description": "A programmable-gain transimpedance amplifier (TIA) analog front end with an external configuration, converting and amplifying a current-mode sensor signal into a voltage with selectable gain. It is a monolithic analog amplifier IC, used in optical and current-output sensor signal chains", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Analog Devices Inc.", + "part_name": "Integrated Circuit (Amplifier)" + } + }, + { + "bol_metadata": null, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854231", + "854239", + "854233", + "854232" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0669", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854233", + "id": "SH-0669", + "justification_text": "Goods classified under HS 8542.33; corroborated by 8 customs rulings on comparable goods (EU-DE, EU-EN, EU-FR, EU-NL).", + "reference_ruling_ids": [ + "EBTI-FR-FRBTIFR-BTI-2017-08868", + "EBTI-DE-DE15030/09-1", + "EBTI-DE-DE21505/11-1", + "EBTI-EN-0163", + "EBTI-NL-NLRTD-2013-002163", + "EBTI-DE-DE22792/14-1", + "EBTI-EN-0161", + "EBTI-EN-0162" + ], + "segment": "component", + "split": "train", + "tier1_description": "A dual-channel 55 V low-noise zero-drift operational amplifier integrated circuit that continuously self-corrects input offset for high DC accuracy and stability over temperature. It is a monolithic analog amplifier IC, used in precision instrumentation and sensor signal-conditioning front ends", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Analog Devices Inc.", + "part_name": "Integrated Circuit (Amplifier) - 55V" + } + }, + { + "bol_metadata": null, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854290", + "854233", + "854232", + "854239" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0670", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854233", + "id": "SH-0670", + "justification_text": "Goods classified under HS 8542.33; corroborated by 8 customs rulings on comparable goods (EU-DE, EU-EN, EU-FR, EU-NL).", + "reference_ruling_ids": [ + "EBTI-FR-FRBTIFR-BTI-2017-08868", + "EBTI-DE-DE15030/09-1", + "EBTI-DE-DE21505/11-1", + "EBTI-NL-NLRTD-2013-002163", + "EBTI-EN-0162", + "EBTI-EN-0163", + "EBTI-DE-DE22792/14-1", + "EBTI-EN-0161" + ], + "segment": "component", + "split": "train", + "tier1_description": "A gallium-arsenide (GaAs) radio-frequency low-noise amplifier integrated circuit covering 1-8 GHz with an enable control, amplifying weak signals with a low noise figure across a wide band. It is a monolithic compound-semiconductor amplifier IC, used as a broadband RF/microwave receiver front-end gain stage", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Analog Devices Inc.", + "part_name": "Integrated Circuit (Amplifier) - 1-8" + } + }, + { + "bol_metadata": null, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading. Audio-frequency amplifier apparatus (8518.40) vs amplifier integrated circuit (8542.33) vs other electrical machine with individual function (8543.70); apparatus vs component and the signal domain decide.", + "candidate_set": { + "codes": [ + "854233", + "854290", + "854232", + "854239" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function", + "amplifier_boundary" + ], + "frozen_id": "v2.0.train.0671", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854233", + "id": "SH-0671", + "justification_text": "Goods classified under HS 8542.33; corroborated by 8 customs rulings on comparable goods (EU-DE, EU-EN, EU-FR, EU-NL).", + "reference_ruling_ids": [ + "EBTI-FR-FRBTIFR-BTI-2017-08868", + "EBTI-DE-DE15030/09-1", + "EBTI-DE-DE21505/11-1", + "EBTI-NL-NLRTD-2013-002163", + "EBTI-EN-0162", + "EBTI-EN-0163", + "EBTI-DE-DE22792/14-1", + "EBTI-EN-0161" + ], + "segment": "component", + "split": "train", + "tier1_description": "An ultra-low-noise radio-frequency low-noise amplifier (LNA) integrated circuit covering roughly 2.7-3.7 GHz, designed to boost weak received signals while adding minimal noise (low noise figure) at a receiver front end. It is a monolithic amplifier IC, used as the first gain stage in RF and microwave receivers to set system sensitivity", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Abracon LLC", + "part_name": "Integrated Circuit (Amplifier) - ULTRA" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-30 00:00:00", + "bol_description": "AD629ARZ-R7 SOIC HIGH CM VLTG DIFFERENCE AMPLIFIER (ELECTRONIC INTEGRATED CIRCUITS, AMPLIFIERS)", + "consignee": "electrohms private limited", + "declared_hs": "85423300", + "hs_verified": true, + "origin_country": "CHINA MAINLAND", + "port_dest": "", + "port_origin": "", + "shipper": "analog devices international u.c." + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854232", + "854290", + "854233", + "854239" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0672", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854233", + "id": "SH-0672", + "justification_text": "Goods classified under HS 8542.33; corroborated by 8 customs rulings on comparable goods (EU-DE, EU-EN, EU-FR, EU-NL).", + "reference_ruling_ids": [ + "EBTI-EN-0163", + "EBTI-DE-DE15030/09-1", + "EBTI-DE-DE21505/11-1", + "EBTI-DE-DE22792/14-1", + "EBTI-EN-0161", + "EBTI-FR-FRBTIFR-BTI-2017-08868", + "EBTI-NL-NLRTD-2013-002163", + "EBTI-EN-0162" + ], + "segment": "component", + "split": "train", + "tier1_description": "A high-common-mode-voltage difference amplifier IC (type AD629, 8-lead SOIC): a precision unity-gain difference amplifier that accurately measures small differential signals riding on common-mode voltages up to +/-270 V, with input protection to +/-500 V, used in current-shunt and high-side sensing", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Analog Devices", + "part_name": "AD629ARZ-R7 SOIC high CM vltg" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-05 00:00:00", + "bol_description": "CATALOG NO: EG8025 FOR - IC POWER AMPLIFIER MODULE", + "consignee": "unisem m berhad", + "declared_hs": "8542330000", + "hs_verified": true, + "origin_country": "UNITED STATES", + "port_dest": "PENANG GEORGETOWN", + "port_origin": "HONG KONG", + "shipper": "qorvo texas, llc" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading. Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line.", + "candidate_set": { + "codes": [ + "854290", + "854232", + "854233", + "854239" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function", + "8541_vs_8542" + ], + "frozen_id": "v2.0.train.0673", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854233", + "id": "SH-0673", + "justification_text": "Goods classified under HS 8542.33; corroborated by 8 customs rulings on comparable goods (EU-DE, EU-EN, EU-FR, EU-NL).", + "reference_ruling_ids": [ + "EBTI-FR-FRBTIFR-BTI-2017-08868", + "EBTI-DE-DE15030/09-1", + "EBTI-DE-DE21505/11-1", + "EBTI-DE-DE22792/14-1", + "EBTI-EN-0161", + "EBTI-EN-0162", + "EBTI-EN-0163", + "EBTI-NL-NLRTD-2013-002163" + ], + "segment": "component", + "split": "train", + "tier1_description": "Integrated circuit (catalogue EG8025): the part number EG8025 corresponds to a single-phase sine-wave-inverter SPWM controller IC with an on-chip SPWM generator, dead-time control and two built-in 600 V half-bridge MOSFET drivers, used to drive pure-sine-wave inverter power stages", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Qorvo", + "part_name": "catalog NO: EG8025 for - IC power" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-18 00:00:00", + "bol_description": "ULTRA WIDE BAND PA(100MHZ~1GHZ PA)", + "consignee": "sanmina-sci systems malaysia sd", + "declared_hs": "8542330000", + "hs_verified": true, + "origin_country": "MEXICO", + "port_dest": "PENANG GEORGETOWN", + "port_origin": "HONG KONG", + "shipper": "skyworks solutions inc" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading. Audio-frequency amplifier apparatus (8518.40) vs amplifier integrated circuit (8542.33) vs other electrical machine with individual function (8543.70); apparatus vs component and the signal domain decide.", + "candidate_set": { + "codes": [ + "854232", + "854233", + "854231", + "854290" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function", + "amplifier_boundary" + ], + "frozen_id": "v2.0.train.0674", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854233", + "id": "SH-0674", + "justification_text": "Goods classified under HS 8542.33; corroborated by 8 customs rulings on comparable goods (EU-DE, EU-EN, EU-FR, EU-NL).", + "reference_ruling_ids": [ + "EBTI-FR-FRBTIFR-BTI-2017-08868", + "EBTI-DE-DE15030/09-1", + "EBTI-DE-DE21505/11-1", + "EBTI-NL-NLRTD-2013-002163", + "EBTI-DE-DE22792/14-1", + "EBTI-EN-0161", + "EBTI-EN-0162", + "EBTI-EN-0163" + ], + "segment": "component", + "split": "train", + "tier1_description": "Ultra-wideband RF power amplifier IC (100 MHz - 1 GHz): a monolithic amplifier that boosts RF signals across a wide band for wireless/communication systems", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Skyworks Solutions", + "part_name": "ultra wide band PA(100MHZ~1GHZ PA)" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-23 00:00:00", + "bol_description": "AMPLIFIERS IC (MOUNTED/DICE) P/N 4024252 INTEGRATED CIRCUITS", + "consignee": "harman international india private limited", + "declared_hs": "85423300", + "hs_verified": true, + "origin_country": "MALAYSIA", + "port_dest": "", + "port_origin": "", + "shipper": "st microelectronics asia pacific pte ltd" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854290", + "854233", + "854232", + "854231" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0675", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854233", + "id": "SH-0675", + "justification_text": "Goods classified under HS 8542.33; corroborated by 9 customs rulings on comparable goods across 5 jurisdictions.", + "reference_ruling_ids": [ + "EBTI-FR-FRBTIFR-BTI-2017-08868", + "EBTI-DE-DE15030/09-1", + "EBTI-DE-DE21505/11-1", + "EBTI-DE-DE22792/14-1", + "EBTI-EN-0163", + "EBTI-NL-NLRTD-2013-002163", + "CROSS-N186896", + "EBTI-EN-0161", + "EBTI-EN-0162" + ], + "segment": "component", + "split": "train", + "tier1_description": "Amplifier integrated circuit (mounted dice; part 4024252): an amplifier IC supplied in bare-die/mounted-dice form for assembly into a package or module", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "STMicroelectronics", + "part_name": "amplifiers IC (mounted/dice) P/N" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-30 00:00:00", + "bol_description": "TLV9064IPWR AMPLIFIERS (MIL) INVOICE NO: 5518393216", + "consignee": "texas instruments india private limited", + "declared_hs": "85423300", + "hs_verified": true, + "origin_country": "MALAYSIA", + "port_dest": "", + "port_origin": "", + "shipper": "texas instruments southeast asia pl" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854239", + "854231", + "854233", + "854290" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0676", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854233", + "id": "SH-0676", + "justification_text": "Goods classified under HS 8542.33; corroborated by 8 customs rulings on comparable goods (EU-DE, EU-EN, EU-FR, EU-NL).", + "reference_ruling_ids": [ + "EBTI-FR-FRBTIFR-BTI-2017-08868", + "EBTI-DE-DE15030/09-1", + "EBTI-DE-DE21505/11-1", + "EBTI-DE-DE22792/14-1", + "EBTI-EN-0163", + "EBTI-NL-NLRTD-2013-002163", + "EBTI-EN-0161", + "EBTI-EN-0162" + ], + "segment": "component", + "split": "train", + "tier1_description": "A quad operational amplifier IC (type TLV9064): a four-channel low-voltage (1.8-5.5 V), 10 MHz, rail-to-rail-input/output CMOS op-amp with high capacitive-load drive, used for general-purpose signal conditioning in space- and cost-constrained designs", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Texas Instruments", + "part_name": "TLV9064IPWR amplifiers (MIL) invoice" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-30 00:00:00", + "bol_description": "(FOC) AMPLIFIERS (MIL) IC - PTAS6754QDKQRQ1 (FOC) DIODES EXCL PHOTOSENSITIVE OR LIGHT EMIT - TPD4E004DRY", + "consignee": "mistral solutions private limited", + "declared_hs": "85423300", + "hs_verified": true, + "origin_country": "MALAYSIA", + "port_dest": "", + "port_origin": "", + "shipper": "texas instruments southeast asia pl" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading. Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line.", + "candidate_set": { + "codes": [ + "854232", + "854290", + "854233", + "854231" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function", + "8541_vs_8542" + ], + "frozen_id": "v2.0.train.0677", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854233", + "id": "SH-0677", + "justification_text": "Goods classified under HS 8542.33; corroborated by 8 customs rulings on comparable goods (EU-DE, EU-EN, EU-FR, EU-NL).", + "reference_ruling_ids": [ + "EBTI-DE-DE15030/09-1", + "EBTI-DE-DE21505/11-1", + "EBTI-DE-DE22792/14-1", + "EBTI-FR-FRBTIFR-BTI-2017-08868", + "EBTI-EN-0163", + "EBTI-NL-NLRTD-2013-002163", + "EBTI-EN-0161", + "EBTI-EN-0162" + ], + "segment": "component", + "split": "train", + "tier1_description": "Amplifier and protection ICs: an amplifier IC (type PTAS6754) and an ESD-protection diode array (type TPD4E004), supplied for signal amplification and I/O protection", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Texas Instruments", + "part_name": "(FOC) amplifiers (MIL) IC" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-30 00:00:00", + "bol_description": "OPA333AIDBVT AMPLIFIERS (MIL) INVOICE NO: 5518393215", + "consignee": "texas instruments india private limited", + "declared_hs": "85423300", + "hs_verified": true, + "origin_country": "CHINA MAINLAND", + "port_dest": "", + "port_origin": "", + "shipper": "texas instruments southeast asia pl" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854232", + "854231", + "854290", + "854233" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0678", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854233", + "id": "SH-0678", + "justification_text": "Goods classified under HS 8542.33; corroborated by 8 customs rulings on comparable goods (EU-DE, EU-EN, EU-FR, EU-NL).", + "reference_ruling_ids": [ + "EBTI-EN-0163", + "EBTI-DE-DE15030/09-1", + "EBTI-DE-DE21505/11-1", + "EBTI-DE-DE22792/14-1", + "EBTI-FR-FRBTIFR-BTI-2017-08868", + "EBTI-NL-NLRTD-2013-002163", + "EBTI-EN-0161", + "EBTI-EN-0162" + ], + "segment": "component", + "split": "train", + "tier1_description": "A zero-drift CMOS operational amplifier IC (type OPA333): a single, high-precision auto-calibrating op-amp with very low offset (10 uV max) and near-zero drift, rail-to-rail output and 1.8-5.5 V supply, used for high-accuracy sensor and signal-conditioning front ends", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Texas Instruments", + "part_name": "OPA333AIDBVT amplifiers (MIL) invoice" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-29 00:00:00", + "bol_description": "TL061CDR ELECTRONIC INTEGRATED CIRCUITS AMPLIFIE IC INVOICENO:5518333659", + "consignee": "texas instruments india private limited", + "declared_hs": "85423300", + "hs_verified": true, + "origin_country": "MEXICO", + "port_dest": "", + "port_origin": "", + "shipper": "texas instruments asia limited" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading. Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line.", + "candidate_set": { + "codes": [ + "854231", + "854232", + "854239", + "854233" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function", + "8541_vs_8542" + ], + "frozen_id": "v2.0.train.0679", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854233", + "id": "SH-0679", + "justification_text": "Goods classified under HS 8542.33; corroborated by 8 customs rulings on comparable goods (EU-DE, EU-EN, EU-FR, EU-NL).", + "reference_ruling_ids": [ + "EBTI-FR-FRBTIFR-BTI-2017-08868", + "EBTI-DE-DE21505/11-1", + "EBTI-DE-DE15030/09-1", + "EBTI-DE-DE22792/14-1", + "EBTI-EN-0163", + "EBTI-NL-NLRTD-2013-002163", + "EBTI-EN-0161", + "EBTI-EN-0162" + ], + "segment": "component", + "split": "train", + "tier1_description": "A low-power JFET-input single operational amplifier IC (type TL061): a monolithic op-amp combining matched high-voltage JFET and bipolar transistors, with about 200 uA supply current, high input impedance, wide input range and ~3.5 V/us slew rate, for cost-sensitive signal conditioning", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Texas Instruments", + "part_name": "TL061CDR electronic integrated circuits" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-29 00:00:00", + "bol_description": "TLE2022CDR AMPLIFIERS (MIL) IC INVOICE NO:5518345289", + "consignee": "texas instruments india private limited", + "declared_hs": "85423300", + "hs_verified": true, + "origin_country": "MEXICO", + "port_dest": "", + "port_origin": "", + "shipper": "texas instruments southeast asia pl" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854231", + "854232", + "854233", + "854290" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0680", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854233", + "id": "SH-0680", + "justification_text": "Goods classified under HS 8542.33; corroborated by 8 customs rulings on comparable goods (EU-DE, EU-EN, EU-FR, EU-NL).", + "reference_ruling_ids": [ + "EBTI-FR-FRBTIFR-BTI-2017-08868", + "EBTI-DE-DE15030/09-1", + "EBTI-DE-DE21505/11-1", + "EBTI-DE-DE22792/14-1", + "EBTI-NL-NLRTD-2013-002163", + "EBTI-EN-0163", + "EBTI-EN-0161", + "EBTI-EN-0162" + ], + "segment": "component", + "split": "train", + "tier1_description": "A dual precision, low-power operational amplifier IC (type TLE2022): a bipolar-process op-amp with about 2 MHz unity-gain bandwidth and improved slew rate, designed for single-supply precision signal-conditioning and instrumentation applications", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Texas Instruments", + "part_name": "TLE2022CDR amplifiers (MIL) IC invoice" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-29 00:00:00", + "bol_description": "THS4551IRGTR ELECTRONIC INTEGRATED CIRCUITS AMPLIFIE IC INVOICE NO:5518333657TPS63002DRCR ELECTRONIC INTEGRATED CIRCUITS OTHER IC INVOICE", + "consignee": "texas instruments india private limited", + "declared_hs": "85423300", + "hs_verified": true, + "origin_country": "CHINA MAINLAND", + "port_dest": "", + "port_origin": "", + "shipper": "texas instruments asia limited" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854290", + "854232", + "854231", + "854233" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0681", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854233", + "id": "SH-0681", + "justification_text": "Goods classified under HS 8542.33; corroborated by 8 customs rulings on comparable goods (EU-DE, EU-EN, EU-FR, EU-NL).", + "reference_ruling_ids": [ + "EBTI-FR-FRBTIFR-BTI-2017-08868", + "EBTI-DE-DE21505/11-1", + "EBTI-DE-DE22792/14-1", + "EBTI-EN-0163", + "EBTI-DE-DE15030/09-1", + "EBTI-NL-NLRTD-2013-002163", + "EBTI-EN-0161", + "EBTI-EN-0162" + ], + "segment": "component", + "split": "train", + "tier1_description": "Amplifier and power ICs: a precision low-noise 150 MHz fully-differential amplifier (type THS4551, negative-rail input) that interfaces single-ended sources to high-precision ADCs, and a buck-boost DC-DC converter (type TPS63002) that regulates a stable output across input voltages above or below the output", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Texas Instruments", + "part_name": "THS4551IRGTR electronic integrated" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-29 00:00:00", + "bol_description": "OPA2343EA/2K5 AMPLIFIERS (MIL) IC INVOICE NO:5518345289 LM4120IM5-1.8/NOPB OTHER ELECTRONIC INTEGRATED CIRCUITS (MI", + "consignee": "texas instruments india private limited", + "declared_hs": "85423300", + "hs_verified": true, + "origin_country": "CHINA MAINLAND", + "port_dest": "", + "port_origin": "", + "shipper": "texas instruments southeast asia pl" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854233", + "854231", + "854232", + "854239" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0682", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854233", + "id": "SH-0682", + "justification_text": "Goods classified under HS 8542.33; corroborated by 8 customs rulings on comparable goods (EU-DE, EU-EN, EU-FR, EU-NL).", + "reference_ruling_ids": [ + "EBTI-FR-FRBTIFR-BTI-2017-08868", + "EBTI-DE-DE21505/11-1", + "EBTI-DE-DE22792/14-1", + "EBTI-DE-DE15030/09-1", + "EBTI-NL-NLRTD-2013-002163", + "EBTI-EN-0163", + "EBTI-EN-0161", + "EBTI-EN-0162" + ], + "segment": "component", + "split": "train", + "tier1_description": "An operational amplifier and a voltage-reference IC: a CMOS rail-to-rail dual op-amp (type OPA2343) for signal conditioning, and a precision low-dropout bandgap voltage reference (type LM4120, ~0.2% accuracy, up to 5 mA, SOT-23) that supplies a stable reference voltage to electronic circuits", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Texas Instruments", + "part_name": "OPA2343EA/2K5 amplifiers (MIL) IC" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-29 00:00:00", + "bol_description": "LF353MX/NOPB ELECTRONIC INTEGRATED CIRCUITS AMPLIFIE IC INVOICE NO:5518333664LM358N/NOPB ELECTRONIC INTEGRATED CIRCUITS AMPLIFIE IC INVOI", + "consignee": "texas instruments india private limited", + "declared_hs": "85423300", + "hs_verified": true, + "origin_country": "MALAYSIA", + "port_dest": "", + "port_origin": "", + "shipper": "texas instruments asia limited" + }, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854233", + "854231", + "854290", + "854232" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0683", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854233", + "id": "SH-0683", + "justification_text": "Goods classified under HS 8542.33; corroborated by 8 customs rulings on comparable goods (EU-DE, EU-EN, EU-FR, EU-NL).", + "reference_ruling_ids": [ + "EBTI-FR-FRBTIFR-BTI-2017-08868", + "EBTI-DE-DE21505/11-1", + "EBTI-DE-DE22792/14-1", + "EBTI-NL-NLRTD-2013-002163", + "EBTI-DE-DE15030/09-1", + "EBTI-EN-0163", + "EBTI-EN-0161", + "EBTI-EN-0162" + ], + "segment": "component", + "split": "train", + "tier1_description": "Dual operational amplifier ICs: a wide-bandwidth dual JFET-input op-amp (type LF353, ~4 MHz, 13 V/us, low input bias) and a dual general-purpose bipolar op-amp (type LM358, 16-32 V supply), used for signal conditioning, filtering and buffering in electronic circuits", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Texas Instruments", + "part_name": "LF353MX/nopb electronic integrated" + } + }, + { + "bol_metadata": null, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854231", + "854233", + "854232", + "854239" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0684", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854239", + "id": "SH-0684", + "justification_text": "Goods classified under HS 8542.39; corroborated by 44 customs rulings on comparable goods across 6 jurisdictions.", + "reference_ruling_ids": [ + "CROSS-N255420", + "EBTI-EN-0106", + "EBTI-NL-NLBTI2024-1373", + "EBTI-EN-0109", + "CROSS-N015568", + "EBTI-DE-DE14870/13-1", + "EBTI-DE-DE18892/11-1", + "EBTI-DE-DE19741/14-1", + "EBTI-DE-DE21719/11-1", + "EBTI-DE-DE22271/11-1", + "EBTI-DE-DE23505/11-1", + "EBTI-DE-DE7055/10-1", + "EBTI-DE-DEBTI30800/21-1", + "EBTI-DE-DEBTI46368/21-1", + "EBTI-EN-0087", + "EBTI-EN-0088", + "EBTI-EN-0089", + "EBTI-EN-0090", + "EBTI-EN-0091", + "EBTI-EN-0092", + "EBTI-EN-0093", + "EBTI-EN-0094", + "EBTI-EN-0095", + "EBTI-EN-0097", + "EBTI-PL-PLPL-WIT-2010-01165", + "EBTI-EN-0085", + "EBTI-EN-0086", + "EBTI-EN-0096", + "EBTI-EN-0098", + "EBTI-EN-0099", + "EBTI-EN-0100", + "EBTI-EN-0102", + "EBTI-EN-0103", + "EBTI-EN-0104", + "EBTI-EN-0105", + "EBTI-EN-0107", + "EBTI-FR-FR-RTC-2013-164421", + "EBTI-DE-DE15882/14-1", + "EBTI-DE-DEBTI25038/18-1", + "EBTI-DE-DEBTI4788/18-1", + "EBTI-DE-DEBTI6115/22-1", + "EBTI-DE-DEM/5554/08-1", + "EBTI-EN-0108", + "EBTI-PL-PLBTIWIT-2022-001182" + ], + "segment": "component", + "split": "train", + "tier1_description": "A single 2-input NAND logic-gate integrated circuit in a 5-pin SC70 package, performing the NAND Boolean function. 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It is a monolithic mixed-signal IC, used as a physical-layer interface in wired data links", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "3PEAK", + "part_name": "Integrated Circuit (Other): TRANSCEIVER" + } + }, + { + "bol_metadata": null, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854231", + "854239", + "854232", + "854290" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0689", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854239", + "id": "SH-0689", + "justification_text": "Goods classified under HS 8542.39; corroborated by 45 customs rulings on comparable goods across 6 jurisdictions.", + "reference_ruling_ids": [ + "CROSS-N255420", + "EBTI-EN-0106", + "EBTI-EN-0108", + "EBTI-EN-0109", + "EBTI-EN-0107", + "EBTI-EN-0091", + "EBTI-NL-NLBTI2024-1373", + "CROSS-N015568", + "EBTI-DE-DE18892/11-1", + "EBTI-DE-DE21719/11-1", + "EBTI-DE-DE22271/11-1", + "EBTI-DE-DE23505/11-1", + "EBTI-DE-DE7055/10-1", + "EBTI-DE-DEBTI30800/21-1", + "EBTI-DE-DEBTI46368/21-1", + "EBTI-EN-0092", + "EBTI-EN-0093", + "EBTI-EN-0094", + "EBTI-EN-0098", + "EBTI-PL-PLPL-WIT-2010-01165", + "CROSS-N216101", + "EBTI-EN-0086", + "EBTI-EN-0087", + "EBTI-EN-0088", + "EBTI-EN-0089", + "EBTI-EN-0090", + "EBTI-EN-0095", + "EBTI-EN-0097", + "EBTI-EN-0102", + "EBTI-EN-0103", + "EBTI-EN-0104", + "EBTI-EN-0105", + "EBTI-FR-FR-RTC-2013-164421", + "EBTI-DE-DE14870/13-1", + "EBTI-DE-DE15882/14-1", + "EBTI-DE-DE19741/14-1", + "EBTI-DE-DEBTI25038/18-1", + "EBTI-DE-DEBTI4788/18-1", + "EBTI-DE-DEBTI6115/22-1", + "EBTI-DE-DEM/5554/08-1", + "EBTI-EN-0085", + "EBTI-EN-0096", + "EBTI-EN-0099", + "EBTI-EN-0100", + "EBTI-PL-PLBTIWIT-2022-001182" + ], + "segment": "component", + "split": "train", + "tier1_description": "A DC motor-driver integrated circuit operating from 2.5-5.5 V in an 8-pad DFN package, integrating an H-bridge output stage to control the speed and direction of a small DC motor. It is a monolithic power IC, used in compact motorized and actuator applications", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Allegro MicroSystems", + "part_name": "Integrated Circuit (Other): MOTOR" + } + }, + { + "bol_metadata": null, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854239", + "854231", + "854290", + "854233" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0690", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854239", + "id": "SH-0690", + "justification_text": "Goods classified under HS 8542.39; corroborated by 46 customs rulings on comparable goods across 6 jurisdictions.", + "reference_ruling_ids": [ + "CROSS-N255420", + "EBTI-EN-0087", + "EBTI-EN-0088", + "EBTI-EN-0089", + "EBTI-EN-0090", + "EBTI-EN-0091", + "EBTI-EN-0092", + "EBTI-EN-0093", + "EBTI-EN-0094", + "EBTI-EN-0095", + "CROSS-N015568", + "EBTI-DE-DE18892/11-1", + "EBTI-DE-DE21719/11-1", + "EBTI-DE-DE22271/11-1", + "EBTI-DE-DE23505/11-1", + "EBTI-DE-DE7055/10-1", + "EBTI-DE-DEBTI30800/21-1", + "EBTI-DE-DEBTI46368/21-1", + "EBTI-EN-0085", + "EBTI-EN-0086", + "EBTI-EN-0097", + "EBTI-EN-0099", + "EBTI-EN-0100", + "EBTI-EN-0102", + "EBTI-EN-0104", + "EBTI-EN-0109", + "EBTI-NL-NLBTI2024-1373", + "EBTI-PL-PLPL-WIT-2010-01165", + "CROSS-N250554", + "EBTI-DE-DEBTI4788/18-1", + "EBTI-EN-0096", + "EBTI-EN-0098", + "EBTI-EN-0103", + "EBTI-EN-0105", + "EBTI-FR-FR-RTC-2013-164421", + "EBTI-DE-DE14870/13-1", + "EBTI-DE-DE15882/14-1", + "EBTI-DE-DE19741/14-1", + "EBTI-DE-DEBTI25038/18-1", + "EBTI-DE-DEBTI6115/22-1", + "EBTI-DE-DEM/5554/08-1", + "EBTI-EN-0101", + "EBTI-EN-0106", + "EBTI-EN-0107", + "EBTI-EN-0108", + "EBTI-PL-PLBTIWIT-2022-001182" + ], + "segment": "component", + "split": "train", + "tier1_description": "A 3-axis IoMT (medical-grade) MEMS accelerometer integrated circuit in a roughly 1.6 mm package, sensing linear acceleration and tilt along three axes for connected health and wearable devices. It is a monolithic MEMS sensor IC, used in motion and activity monitoring", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Memsic Inc.", + "part_name": "Integrated Circuit (Other) - 3-AXIS" + } + }, + { + "bol_metadata": null, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854239", + "854290", + "854231", + "854232" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0691", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854239", + "id": "SH-0691", + "justification_text": "Goods classified under HS 8542.39; corroborated by 44 customs rulings on comparable goods across 6 jurisdictions.", + "reference_ruling_ids": [ + "CROSS-N255420", + "EBTI-NL-NLBTI2024-1373", + "EBTI-PL-PLPL-WIT-2010-01165", + "CROSS-N015568", + "EBTI-DE-DE18892/11-1", + "EBTI-DE-DE21719/11-1", + "EBTI-DE-DE22271/11-1", + "EBTI-DE-DE23505/11-1", + "EBTI-DE-DE7055/10-1", + "EBTI-DE-DEBTI30800/21-1", + "EBTI-DE-DEBTI46368/21-1", + "EBTI-EN-0105", + "EBTI-EN-0109", + "EBTI-EN-0087", + "EBTI-EN-0088", + "EBTI-EN-0089", + "EBTI-EN-0090", + "EBTI-EN-0091", + "EBTI-EN-0092", + "EBTI-EN-0093", + "EBTI-EN-0094", + "EBTI-EN-0095", + "EBTI-EN-0097", + "EBTI-EN-0102", + "EBTI-EN-0103", + "EBTI-EN-0104", + "EBTI-FR-FR-RTC-2013-164421", + "EBTI-DE-DE14870/13-1", + "EBTI-DE-DE15882/14-1", + "EBTI-DE-DE19741/14-1", + "EBTI-DE-DEBTI25038/18-1", + "EBTI-DE-DEBTI4788/18-1", + "EBTI-DE-DEBTI6115/22-1", + "EBTI-DE-DEM/5554/08-1", + "EBTI-EN-0085", + "EBTI-EN-0086", + "EBTI-EN-0096", + "EBTI-EN-0098", + "EBTI-EN-0099", + "EBTI-EN-0100", + "EBTI-EN-0106", + "EBTI-EN-0107", + "EBTI-EN-0108", + "EBTI-PL-PLBTIWIT-2022-001182" + ], + "segment": "component", + "split": "train", + "tier1_description": "A single-timer oscillator integrated circuit configured for about 100 kHz in an 8-pin DIP package, generating a periodic timing/clock waveform. It is a monolithic mixed-signal IC, used for timing and pulse generation", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Texas Instruments", + "part_name": "Integrated Circuit (Other): Oscillator" + } + }, + { + "bol_metadata": null, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854290", + "854232", + "854233", + "854239" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0692", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854239", + "id": "SH-0692", + "justification_text": "Goods classified under HS 8542.39; corroborated by 46 customs rulings on comparable goods across 6 jurisdictions.", + "reference_ruling_ids": [ + "CROSS-N255420", + "EBTI-EN-0091", + "EBTI-EN-0092", + "EBTI-EN-0093", + "EBTI-EN-0094", + "EBTI-EN-0087", + "EBTI-EN-0088", + "EBTI-EN-0089", + "EBTI-EN-0090", + "EBTI-EN-0095", + "EBTI-EN-0109", + "EBTI-EN-0085", + "EBTI-EN-0086", + "EBTI-EN-0098", + "EBTI-PL-PLPL-WIT-2010-01165", + "CROSS-N015568", + "EBTI-DE-DE18892/11-1", + "EBTI-DE-DE21719/11-1", + "EBTI-DE-DE22271/11-1", + "EBTI-DE-DE23505/11-1", + "EBTI-DE-DE7055/10-1", + "EBTI-DE-DEBTI30800/21-1", + "EBTI-DE-DEBTI46368/21-1", + "EBTI-EN-0097", + "EBTI-EN-0099", + "EBTI-EN-0100", + "EBTI-NL-NLBTI2024-1373", + "CROSS-N250554", + "EBTI-DE-DEBTI4788/18-1", + "EBTI-EN-0096", + "EBTI-EN-0102", + "EBTI-EN-0104", + "EBTI-EN-0105", + "EBTI-EN-0107", + "EBTI-FR-FR-RTC-2013-164421", + "EBTI-DE-DE14870/13-1", + "EBTI-DE-DE15882/14-1", + "EBTI-DE-DE19741/14-1", + "EBTI-DE-DEBTI25038/18-1", + "EBTI-DE-DEBTI6115/22-1", + "EBTI-DE-DEM/5554/08-1", + "EBTI-EN-0101", + "EBTI-EN-0103", + "EBTI-EN-0106", + "EBTI-EN-0108", + "EBTI-PL-PLBTIWIT-2022-001182" + ], + "segment": "component", + "split": "train", + "tier1_description": "A 3-axis MEMS accelerometer integrated circuit with a selectable +/-2 to +/-8 g range and I2C/SPI interface in a 12-pad LGA package, sensing linear acceleration and tilt. It is a monolithic MEMS sensor IC, used in motion and orientation sensing", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "STMicroelectronics", + "part_name": "Integrated Circuit (Other)" + } + }, + { + "bol_metadata": null, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854239", + "854231", + "854232", + "854290" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0693", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854239", + "id": "SH-0693", + "justification_text": "Goods classified under HS 8542.39; corroborated by 44 customs rulings on comparable goods across 6 jurisdictions.", + "reference_ruling_ids": [ + "CROSS-N255420", + "EBTI-EN-0109", + "EBTI-NL-NLBTI2024-1373", + "EBTI-DE-DE22271/11-1", + "EBTI-DE-DE23505/11-1", + "CROSS-N015568", + "EBTI-DE-DE14870/13-1", + "EBTI-DE-DE18892/11-1", + "EBTI-DE-DE19741/14-1", + "EBTI-DE-DE21719/11-1", + "EBTI-DE-DE7055/10-1", + "EBTI-DE-DEBTI30800/21-1", + "EBTI-DE-DEBTI46368/21-1", + "EBTI-EN-0091", + "EBTI-EN-0097", + "EBTI-EN-0098", + "EBTI-EN-0105", + "EBTI-EN-0106", + "EBTI-PL-PLBTIWIT-2022-001182", + "EBTI-PL-PLPL-WIT-2010-01165", + "EBTI-EN-0086", + "EBTI-EN-0087", + "EBTI-EN-0088", + "EBTI-EN-0089", + "EBTI-EN-0090", + "EBTI-EN-0092", + "EBTI-EN-0093", + "EBTI-EN-0094", + "EBTI-EN-0095", + "EBTI-EN-0096", + "EBTI-EN-0099", + "EBTI-EN-0108", + "EBTI-FR-FR-RTC-2013-164421", + "EBTI-DE-DE15882/14-1", + "EBTI-DE-DEBTI25038/18-1", + "EBTI-DE-DEBTI4788/18-1", + "EBTI-DE-DEBTI6115/22-1", + "EBTI-DE-DEM/5554/08-1", + "EBTI-EN-0085", + "EBTI-EN-0100", + "EBTI-EN-0102", + "EBTI-EN-0103", + "EBTI-EN-0104", + "EBTI-EN-0107" + ], + "segment": "component", + "split": "train", + "tier1_description": "A 12-bit voltage-output digital-to-analog converter integrated circuit in a 6-pin SOT-23 package, converting a digital code into a proportional analog output voltage. It is a monolithic mixed-signal IC, used to generate analog control and reference signals", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Microchip Technology", + "part_name": "Integrated Circuit (Other)" + } + }, + { + "bol_metadata": null, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854239", + "854290", + "854232", + "854233" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0694", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854239", + "id": "SH-0694", + "justification_text": "Goods classified under HS 8542.39; corroborated by 44 customs rulings on comparable goods across 6 jurisdictions.", + "reference_ruling_ids": [ + "CROSS-N255420", + "EBTI-EN-0109", + "EBTI-NL-NLBTI2024-1373", + "CROSS-N015568", + "EBTI-DE-DE14870/13-1", + "EBTI-DE-DE18892/11-1", + "EBTI-DE-DE19741/14-1", + "EBTI-DE-DE21719/11-1", + "EBTI-DE-DE22271/11-1", + "EBTI-DE-DE23505/11-1", + "EBTI-DE-DE7055/10-1", + "EBTI-DE-DEBTI30800/21-1", + "EBTI-DE-DEBTI46368/21-1", + "EBTI-PL-PLPL-WIT-2010-01165", + "EBTI-EN-0087", + "EBTI-EN-0088", + "EBTI-EN-0089", + "EBTI-EN-0090", + "EBTI-EN-0091", + "EBTI-EN-0092", + "EBTI-EN-0093", + "EBTI-EN-0094", + "EBTI-EN-0095", + "EBTI-EN-0097", + "EBTI-EN-0105", + "EBTI-FR-FR-RTC-2013-164421", + "EBTI-DE-DE15882/14-1", + "EBTI-DE-DEBTI25038/18-1", + "EBTI-DE-DEBTI4788/18-1", + "EBTI-DE-DEBTI6115/22-1", + "EBTI-DE-DEM/5554/08-1", + "EBTI-EN-0085", + "EBTI-EN-0086", + "EBTI-EN-0096", + "EBTI-EN-0098", + "EBTI-EN-0099", + "EBTI-EN-0100", + "EBTI-EN-0102", + "EBTI-EN-0103", + "EBTI-EN-0104", + "EBTI-EN-0106", + "EBTI-EN-0107", + "EBTI-EN-0108", + "EBTI-PL-PLBTIWIT-2022-001182" + ], + "segment": "component", + "split": "train", + "tier1_description": "An 8-bit shift register integrated circuit with tri-state outputs in a 16-pad DHVQFN package, converting serial data to parallel outputs (or vice versa) for I/O expansion. It is a monolithic digital IC, used for serial-to-parallel data handling", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Nexperia USA Inc.", + "part_name": "Integrated Circuit (Other): Shift" + } + }, + { + "bol_metadata": null, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854231", + "854232", + "854233", + "854239" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0695", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854239", + "id": "SH-0695", + "justification_text": "Goods classified under HS 8542.39; corroborated by 44 customs rulings on comparable goods across 6 jurisdictions.", + "reference_ruling_ids": [ + "CROSS-N255420", + "EBTI-EN-0109", + "EBTI-EN-0091", + "EBTI-EN-0106", + "CROSS-N015568", + "EBTI-DE-DE18892/11-1", + "EBTI-DE-DE21719/11-1", + "EBTI-DE-DE22271/11-1", + "EBTI-DE-DE23505/11-1", + "EBTI-DE-DE7055/10-1", + "EBTI-DE-DEBTI30800/21-1", + "EBTI-DE-DEBTI46368/21-1", + "EBTI-EN-0086", + "EBTI-EN-0087", + "EBTI-EN-0088", + "EBTI-EN-0089", + "EBTI-EN-0090", + "EBTI-EN-0092", + "EBTI-EN-0093", + "EBTI-EN-0094", + "EBTI-EN-0095", + "EBTI-EN-0097", + "EBTI-EN-0098", + "EBTI-EN-0099", + "EBTI-EN-0100", + "EBTI-EN-0102", + "EBTI-EN-0104", + "EBTI-NL-NLBTI2024-1373", + "EBTI-PL-PLPL-WIT-2010-01165", + "EBTI-EN-0085", + "EBTI-EN-0096", + "EBTI-EN-0103", + "EBTI-EN-0105", + "EBTI-EN-0107", + "EBTI-EN-0108", + "EBTI-FR-FR-RTC-2013-164421", + "EBTI-DE-DE14870/13-1", + "EBTI-DE-DE15882/14-1", + "EBTI-DE-DE19741/14-1", + "EBTI-DE-DEBTI25038/18-1", + "EBTI-DE-DEBTI4788/18-1", + "EBTI-DE-DEBTI6115/22-1", + "EBTI-DE-DEM/5554/08-1", + "EBTI-PL-PLBTIWIT-2022-001182" + ], + "segment": "component", + "split": "train", + "tier1_description": "An 8:1 analog multiplexer integrated circuit with about 120 ohm on-resistance in a 16-pad DHVQFN package, selecting one of eight inputs onto a single output under logic control. It is a monolithic analog IC, used in signal selection and routing", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Nexperia USA Inc.", + "part_name": "Integrated Circuit (Other): Multiplexer" + } + }, + { + "bol_metadata": null, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading. Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line.", + "candidate_set": { + "codes": [ + "854232", + "854233", + "854290", + "854239" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function", + "8541_vs_8542" + ], + "frozen_id": "v2.0.train.0696", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854239", + "id": "SH-0696", + "justification_text": "Goods classified under HS 8542.39; corroborated by 45 customs rulings on comparable goods across 6 jurisdictions.", + "reference_ruling_ids": [ + "CROSS-N255420", + "EBTI-EN-0087", + "EBTI-EN-0088", + "EBTI-EN-0089", + "EBTI-EN-0090", + "EBTI-EN-0091", + "EBTI-EN-0092", + "EBTI-EN-0093", + "EBTI-EN-0094", + "EBTI-EN-0095", + "EBTI-EN-0105", + "EBTI-EN-0106", + "EBTI-EN-0108", + "EBTI-EN-0109", + "EBTI-NL-NLBTI2024-1373", + "CROSS-N015568", + "EBTI-DE-DE18892/11-1", + "EBTI-DE-DE21719/11-1", + "EBTI-DE-DE22271/11-1", + "EBTI-DE-DE23505/11-1", + "EBTI-DE-DE7055/10-1", + "EBTI-DE-DEBTI30800/21-1", + "EBTI-DE-DEBTI46368/21-1", + "EBTI-EN-0107", + "EBTI-PL-PLPL-WIT-2010-01165", + "EBTI-DE-DE19741/14-1", + "EBTI-EN-0085", + "EBTI-EN-0086", + "EBTI-EN-0097", + "EBTI-EN-0099", + "EBTI-EN-0103", + "EBTI-FR-FR-RTC-2013-164421", + "EBTI-DE-DE14870/13-1", + "EBTI-DE-DE15882/14-1", + "EBTI-DE-DEBTI25038/18-1", + "EBTI-DE-DEBTI4788/18-1", + "EBTI-DE-DEBTI6115/22-1", + "EBTI-DE-DEM/5554/08-1", + "EBTI-EN-0096", + "EBTI-EN-0098", + "EBTI-EN-0100", + "EBTI-EN-0102", + "EBTI-EN-0104", + "EBTI-PL-PLBTIWIT-2022-001182", + "EBTI-EN-0101" + ], + "segment": "component", + "split": "train", + "tier1_description": "A linear LED-driver integrated circuit with PWM dimming delivering up to about 200 mA in an 8-pin SOP package, regulating LED current for controlled brightness. It is a monolithic power IC, used to drive illumination and backlight LEDs", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Lumissil Microsystems", + "part_name": "Integrated Circuit (Other): LED Driver" + } + }, + { + "bol_metadata": null, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854232", + "854233", + "854239", + "854231" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0697", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854239", + "id": "SH-0697", + "justification_text": "Goods classified under HS 8542.39; corroborated by 44 customs rulings on comparable goods across 6 jurisdictions.", + "reference_ruling_ids": [ + "CROSS-N255420", + "EBTI-NL-NLBTI2024-1373", + "EBTI-EN-0109", + "CROSS-N015568", + "EBTI-DE-DE14870/13-1", + "EBTI-DE-DE18892/11-1", + "EBTI-DE-DE19741/14-1", + "EBTI-DE-DE21719/11-1", + "EBTI-DE-DE22271/11-1", + "EBTI-DE-DE23505/11-1", + "EBTI-DE-DE7055/10-1", + "EBTI-DE-DEBTI30800/21-1", + "EBTI-DE-DEBTI46368/21-1", + "EBTI-PL-PLPL-WIT-2010-01165", + "EBTI-FR-FR-RTC-2013-164421", + "EBTI-DE-DE15882/14-1", + "EBTI-DE-DEBTI25038/18-1", + "EBTI-DE-DEBTI4788/18-1", + "EBTI-DE-DEBTI6115/22-1", + "EBTI-DE-DEM/5554/08-1", + "EBTI-EN-0106", + "EBTI-PL-PLBTIWIT-2022-001182", + "EBTI-EN-0087", + "EBTI-EN-0088", + "EBTI-EN-0089", + "EBTI-EN-0090", + "EBTI-EN-0091", + "EBTI-EN-0092", + "EBTI-EN-0093", + "EBTI-EN-0094", + "EBTI-EN-0095", + "EBTI-EN-0097", + "EBTI-EN-0105", + "EBTI-EN-0108", + "EBTI-EN-0085", + "EBTI-EN-0086", + "EBTI-EN-0096", + "EBTI-EN-0098", + "EBTI-EN-0099", + "EBTI-EN-0100", + "EBTI-EN-0102", + "EBTI-EN-0103", + "EBTI-EN-0104", + "EBTI-EN-0107" + ], + "segment": "component", + "split": "train", + "tier1_description": "A single-pole double-throw (SPDT) analog switch integrated circuit with about 10 ohm on-resistance in a 6-pad DFN package, routing analog or digital signals between paths under logic control. It is a monolithic analog IC, used in signal-routing and multiplexing circuits", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Diodes Incorporated", + "part_name": "Integrated Circuit (Other): SWITCH SPDT" + } + }, + { + "bol_metadata": null, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854232", + "854239", + "854233", + "854231" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0698", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854239", + "id": "SH-0698", + "justification_text": "Goods classified under HS 8542.39; corroborated by 45 customs rulings on comparable goods across 6 jurisdictions.", + "reference_ruling_ids": [ + "CROSS-N255420", + "EBTI-EN-0106", + "EBTI-EN-0108", + "EBTI-EN-0109", + "CROSS-N015568", + "EBTI-EN-0107", + "EBTI-NL-NLBTI2024-1373", + "EBTI-DE-DE18892/11-1", + "EBTI-DE-DE21719/11-1", + "EBTI-DE-DE22271/11-1", + "EBTI-DE-DE23505/11-1", + "EBTI-DE-DE7055/10-1", + "EBTI-DE-DEBTI30800/21-1", + "EBTI-DE-DEBTI46368/21-1", + "EBTI-EN-0091", + "EBTI-EN-0103", + "EBTI-PL-PLPL-WIT-2010-01165", + "CROSS-N216101", + "EBTI-EN-0086", + "EBTI-EN-0087", + "EBTI-EN-0088", + "EBTI-EN-0089", + "EBTI-EN-0090", + "EBTI-EN-0092", + "EBTI-EN-0093", + "EBTI-EN-0094", + "EBTI-EN-0095", + "EBTI-EN-0097", + "EBTI-EN-0098", + "EBTI-EN-0102", + "EBTI-EN-0104", + "EBTI-EN-0105", + "EBTI-FR-FR-RTC-2013-164421", + "EBTI-DE-DE14870/13-1", + "EBTI-DE-DE15882/14-1", + "EBTI-DE-DE19741/14-1", + "EBTI-DE-DEBTI25038/18-1", + "EBTI-DE-DEBTI4788/18-1", + "EBTI-DE-DEBTI6115/22-1", + "EBTI-DE-DEM/5554/08-1", + "EBTI-EN-0085", + "EBTI-EN-0096", + "EBTI-EN-0099", + "EBTI-EN-0100", + "EBTI-PL-PLBTIWIT-2022-001182" + ], + "segment": "component", + "split": "train", + "tier1_description": "A brushed DC motor-driver integrated circuit in an 8-pin TSSOP package, integrating an H-bridge output stage to control the speed and direction of a brushed DC motor. It is a monolithic power IC, used in compact motorized devices", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Toshiba Semiconductor and Storage", + "part_name": "Integrated Circuit (Other): BRUSHED" + } + }, + { + "bol_metadata": null, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading. Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line.", + "candidate_set": { + "codes": [ + "854239", + "854290", + "854231", + "854232" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function", + "8541_vs_8542" + ], + "frozen_id": "v2.0.train.0699", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854239", + "id": "SH-0699", + "justification_text": "The product falls under HS 8542.39 (Electronic integrated circuits: other).", + "reference_ruling_ids": [ + "EBTI-DE-DE19741/14-1", + "EBTI-EN-0106", + "EBTI-EN-0109", + "CROSS-N015568", + "EBTI-DE-DE14870/13-1", + "EBTI-DE-DE15882/14-1", + "EBTI-DE-DE18892/11-1", + "EBTI-DE-DE21719/11-1", + "EBTI-DE-DE22271/11-1", + "EBTI-DE-DE23505/11-1", + "EBTI-DE-DE7055/10-1", + "EBTI-DE-DEBTI25038/18-1", + "EBTI-DE-DEBTI30800/21-1", + "EBTI-DE-DEBTI4788/18-1", + "EBTI-DE-DEBTI6115/22-1", + "EBTI-EN-0107", + "EBTI-EN-0108", + "EBTI-NL-NLBTI2024-1373", + "CROSS-N255420", + "EBTI-EN-0090", + "EBTI-EN-0091", + "EBTI-DE-DEBTI46368/21-1", + "EBTI-DE-DEM/5554/08-1", + "EBTI-EN-0087", + "EBTI-EN-0088", + "EBTI-EN-0089", + "EBTI-EN-0092", + "EBTI-EN-0093", + "EBTI-EN-0094", + "EBTI-EN-0095", + "EBTI-EN-0097", + "EBTI-EN-0103", + "EBTI-EN-0105", + "EBTI-FR-FR-RTC-2013-164421", + "EBTI-PL-PLBTIWIT-2022-001182", + "EBTI-PL-PLPL-WIT-2010-01165", + "EBTI-EN-0085", + "EBTI-EN-0086", + "EBTI-EN-0098", + "EBTI-EN-0101" + ], + "segment": "component", + "split": "train", + "tier1_description": "An N-channel enhancement-mode vertical DMOS power MOSFET (type ZVN4106F) rated for 60 V drain-source and about 200 mA continuous drain current, with on-resistance near 2.5 ohm at 10 V gate drive. Supplied in a 3-lead SOT-23 surface-mount package, it suits small-signal switching, interface and light load-driving tasks in compact, low-power electronic circuits", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Diodes Inc.", + "part_name": "ZVN4106F" + } + }, + { + "bol_metadata": null, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading. Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line.", + "candidate_set": { + "codes": [ + "854290", + "854233", + "854232", + "854239" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function", + "8541_vs_8542" + ], + "frozen_id": "v2.0.train.0700", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854239", + "id": "SH-0700", + "justification_text": "The product falls under HS 8542.39 (Electronic integrated circuits: other).", + "reference_ruling_ids": [ + "EBTI-EN-0107", + "EBTI-EN-0106", + "EBTI-EN-0108", + "EBTI-EN-0092", + "EBTI-EN-0087", + "EBTI-EN-0088", + "EBTI-EN-0089", + "EBTI-EN-0090", + "EBTI-EN-0091", + "EBTI-EN-0093", + "EBTI-EN-0094", + "EBTI-EN-0095", + "EBTI-EN-0105", + "EBTI-EN-0109", + "EBTI-DE-DEBTI25038/18-1", + "EBTI-EN-0085", + "EBTI-EN-0086", + "EBTI-EN-0097", + "EBTI-EN-0103", + "EBTI-NL-NLBTI2024-1373" + ], + "segment": "component", + "split": "train", + "tier1_description": "A two-channel isolated gate-driver IC for high-side and low-side switching of IGBTs, MOSFETs and SiC MOSFETs, in an 18-pin package. Providing galvanic isolation and high drive current, it controls half-bridge power stages in motor drives, inverters and high-voltage converters (part 2ED020I12FIXUMA1)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Infineon", + "part_name": "2ED020I12FIXUMA1" + } + }, + { + "bol_metadata": null, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading. Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line.", + "candidate_set": { + "codes": [ + "854233", + "854232", + "854231", + "854239" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function", + "8541_vs_8542" + ], + "frozen_id": "v2.0.train.0701", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854239", + "id": "SH-0701", + "justification_text": "The product falls under HS 8542.39 (Electronic integrated circuits: other).", + "reference_ruling_ids": [ + "EBTI-EN-0107", + "EBTI-EN-0106", + "EBTI-EN-0108", + "EBTI-EN-0092", + "EBTI-DE-DEBTI25038/18-1", + "EBTI-EN-0087", + "EBTI-EN-0088", + "EBTI-EN-0089", + "EBTI-EN-0090", + "EBTI-EN-0091", + "EBTI-EN-0093", + "EBTI-EN-0094", + "EBTI-EN-0095", + "EBTI-EN-0103", + "EBTI-EN-0105", + "EBTI-EN-0109", + "EBTI-EN-0085", + "EBTI-EN-0086", + "EBTI-EN-0097", + "EBTI-EN-0102", + "EBTI-EN-0104", + "EBTI-NL-NLBTI2024-1373" + ], + "segment": "component", + "split": "train", + "tier1_description": "A single-channel isolated gate-driver IC for Si and SiC power MOSFETs, in an 8-pin SOIC package. It provides galvanic isolation and high peak drive current to switch power transistors safely in motor drives, inverters and switched-mode power supplies (part 1EDB7275FXUMA1)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Infineon", + "part_name": "1EDB7275FXUMA1" + } + }, + { + "bol_metadata": null, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading. Discrete semiconductor device (8541) vs integrated circuit (8542): the deciding signal is integration of active circuitry beyond a single junction device on the die; multichip and hybrid modules sit on this line.", + "candidate_set": { + "codes": [ + "854290", + "854231", + "854239", + "854232" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function", + "8541_vs_8542" + ], + "frozen_id": "v2.0.train.0702", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854239", + "id": "SH-0702", + "justification_text": "The product falls under HS 8542.39 (Electronic integrated circuits: other).", + "reference_ruling_ids": [ + "EBTI-EN-0106", + "EBTI-EN-0107", + "EBTI-EN-0108", + "EBTI-EN-0109", + "EBTI-EN-0087", + "EBTI-EN-0088", + "EBTI-EN-0089", + "EBTI-EN-0090", + "EBTI-EN-0091", + "EBTI-EN-0092", + "EBTI-EN-0093", + "EBTI-EN-0094", + "EBTI-EN-0095", + "EBTI-EN-0105", + "EBTI-DE-DE23505/11-1", + "EBTI-DE-DEBTI25038/18-1", + "EBTI-EN-0085", + "EBTI-EN-0086", + "EBTI-EN-0097", + "EBTI-EN-0101", + "EBTI-EN-0103", + "EBTI-NL-NLBTI2024-1373" + ], + "segment": "component", + "split": "train", + "tier1_description": "A single-channel isolated high-side gate-driver IC for IGBTs and SiC MOSFETs, in a 16-pin DSO package. It provides galvanic isolation and strong drive current to control power switches in motor drives, inverters and high-voltage converter stages (part 1ED020I12F2). Part number 1ED020I12F2XUMA1", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Infineon", + "part_name": "1ED020I12F2XUMA1" + } + }, + { + "bol_metadata": null, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854233", + "854232", + "854239", + "854231" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0703", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854239", + "id": "SH-0703", + "justification_text": "The product falls under HS 8542.39 (Electronic integrated circuits: other).", + "reference_ruling_ids": [ + "CROSS-N015568", + "EBTI-EN-0101", + "EBTI-EN-0109", + "EBTI-PL-PLBTIWIT-2022-001182", + "EBTI-EN-0087", + "EBTI-EN-0088", + "EBTI-EN-0089", + "EBTI-EN-0090", + "EBTI-EN-0091", + "EBTI-EN-0092", + "EBTI-EN-0093", + "EBTI-EN-0094", + "EBTI-EN-0095", + "EBTI-EN-0097", + "EBTI-EN-0099", + "EBTI-EN-0103", + "EBTI-EN-0105", + "EBTI-EN-0106", + "EBTI-EN-0107" + ], + "segment": "component", + "split": "train", + "tier1_description": "An avalanche-photodiode bias controller IC providing a regulated, temperature-compensated high-voltage bias from 6 V to 75 V, in a 16-lead LFCSP package. It stabilizes APD gain in optical receivers, rangefinders and LiDAR systems (part ADL5317ACPZ). Part number ADL5317ACPZ-REEL7", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Analog Devices", + "part_name": "ADL5317ACPZ-REEL7" + } + }, + { + "bol_metadata": null, + "boundary_note": "Sibling subheadings within 8542 split integrated circuits by principal function: processors and controllers (8542.31), memories (8542.32), amplifiers (8542.33), other (8542.39); the device's primary function, not a secondary capability, settles the subheading.", + "candidate_set": { + "codes": [ + "854290", + "854231", + "854232", + "854239" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "8542_ic_function" + ], + "frozen_id": "v2.0.train.0704", + "hs2_label": "85", + "hs4_label": "8542", + "hs6_label": "854239", + "id": "SH-0704", + "justification_text": "The product falls under HS 8542.39 (Electronic integrated circuits: other).", + "reference_ruling_ids": [ + "EBTI-EN-0091", + "EBTI-EN-0086", + "EBTI-EN-0092", + "EBTI-EN-0093", + "EBTI-EN-0098", + "EBTI-EN-0105", + "EBTI-EN-0085", + "EBTI-EN-0087", + "EBTI-EN-0088", + "EBTI-EN-0089", + "EBTI-EN-0090", + "EBTI-EN-0094", + "EBTI-EN-0095", + "EBTI-EN-0106", + "EBTI-EN-0108", + "EBTI-NL-NLBTI2024-1373", + "EBTI-DE-DE19741/14-1", + "EBTI-EN-0099", + "EBTI-EN-0100", + "EBTI-EN-0101", + "EBTI-EN-0107", + "EBTI-EN-0109" + ], + "segment": "component", + "split": "train", + "tier1_description": "A continuous-wave laser-diode driver IC operating from a 2.4 to 6 V supply, in an 8-pin SOIC. It provides regulated, controlled drive current to stabilize laser-diode output in optical and sensing systems (part 2011658)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Laser Components", + "part_name": "2011658" + } + }, + { + "bol_metadata": { + "bol_description": "PIR motion sensor, 3 pin header", + "origin_country": "US", + "shipper": "adafruit industries" + }, + "boundary_note": "Audio-frequency amplifier apparatus (8518.40) vs amplifier integrated circuit (8542.33) vs other electrical machine with individual function (8543.70); apparatus vs component and the signal domain decide.", + "candidate_set": { + "codes": [ + "854160", + "854190", + "854233", + "854370" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "amplifier_boundary" + ], + "frozen_id": "v2.0.train.0705", + "hs2_label": "85", + "hs4_label": "8543", + "hs6_label": "854370", + "id": "SH-0705", + "justification_text": "A PIR motion-sensor module performs an individual electrical detection function and falls under 8543.70, not ADP parts of 8473.30. Classified under HS 8543.70.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123003718", + "JP_CUSTOMS-124000350", + "JP_CUSTOMS-124000351", + "JP_CUSTOMS-124000352", + "JP_CUSTOMS-124000510", + "JP_CUSTOMS-124000642", + "JP_CUSTOMS-124000927" + ], + "segment": "component", + "split": "train", + "tier1_description": "A passive infrared motion sensor module on a small printed circuit board with a three-pin header for power, ground, and signal. A pyroelectric sensing element behind a segmented dome lens detects changes in infrared radiation from people or animals moving up to several meters away and outputs a digital logic signal. Operating from low-voltage DC, it is used to trigger microcontroller projects, lighting, and alarm circuits", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit Industries", + "part_name": "PIR motion sensor 3 pin header" + } + }, + { + "bol_metadata": { + "bol_description": "STMICRO POWER IC DEVELOP TOOLS EVAL BOARD(ITEM NO.EVAL6498L)(LOAN BASIS)(FOR TESTING AND MEASURING EQUIPMENT)ST", + "origin_country": "US", + "shipper": "tektronix inc" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "850450", + "850490", + "854370", + "853890" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0706", + "hs2_label": "85", + "hs4_label": "8543", + "hs6_label": "854370", + "id": "SH-0706", + "justification_text": "An IC gate-driver evaluation board performs an individual electrical demonstration/control function and is not semiconductor test apparatus of 9030.82. Classified under HS 8543.70.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123003718", + "JP_CUSTOMS-124000350", + "JP_CUSTOMS-124000351", + "JP_CUSTOMS-124000352", + "JP_CUSTOMS-124000510", + "JP_CUSTOMS-124000642", + "JP_CUSTOMS-124000927" + ], + "segment": "component", + "split": "train", + "tier1_description": "Evaluation board for a high-voltage half-bridge gate-driver integrated circuit, supplied on a loan basis as a development tool. The printed circuit assembly lets engineers exercise the gate driver while it switches a power transistor with adjustable external components to assess driving performance under varied operating conditions", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Tektronix", + "part_name": "stmicro power IC develop tools eval" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "854370", + "851419", + "854151", + "850431" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0707", + "hs2_label": "85", + "hs4_label": "8543", + "hs6_label": "854370", + "id": "SH-0707", + "justification_text": "The item is a stepper-motor driver/control module with a specific electrical control function. Heading 8543 covers electrical apparatus with individual functions, not ADP accessories. 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Heading 8543 covers other electrical machines and apparatus with individual functions. Classified under HS 8543.70.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123003718", + "JP_CUSTOMS-124000350", + "JP_CUSTOMS-124000351", + "JP_CUSTOMS-124000352", + "JP_CUSTOMS-124000510", + "JP_CUSTOMS-124000642", + "JP_CUSTOMS-124000927" + ], + "segment": "component", + "split": "train", + "tier1_description": "Serial-input common-cathode LED display driver module interfacing a microprocessor to up to eight 7-segment digits, bar-graph displays, or 64 individual LEDs; SPI-controlled, cascadable for larger arrays, supplied on a breakout PCB (MPN: 104954)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "ModMyPi", + "part_name": "104954" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "854370", + "854142", + "854141", + "850440" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0709", + "hs2_label": "85", + "hs4_label": "8543", + "hs6_label": "854370", + "id": "SH-0709", + "justification_text": "The item is an electrical module with an individual function not more specifically provided elsewhere. Heading 8543 covers other electrical machines and apparatus with individual functions. Classified under HS 8543.70.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123003718", + "JP_CUSTOMS-124000350", + "JP_CUSTOMS-124000351", + "JP_CUSTOMS-124000352", + "JP_CUSTOMS-124000510", + "JP_CUSTOMS-124000642", + "JP_CUSTOMS-124000927" + ], + "segment": "component", + "split": "train", + "tier1_description": "All-in-one microcontroller-based driver/controller board for HUB75-style RGB LED matrix panels, with wireless connectivity and USB-C power input; mounts to the rear of a panel to generate scrolling signage and graphics (MPN: PIM727)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Pimoroni", + "part_name": "PIM727" + } + }, + { + "bol_metadata": null, + "boundary_note": "", + "candidate_set": { + "codes": [ + "854442", + "850431", + "852491", + "854370" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0710", + "hs2_label": "85", + "hs4_label": "8543", + "hs6_label": "854370", + "id": "SH-0710", + "justification_text": "The item is an electrical module with an individual function not more specifically provided elsewhere. Heading 8543 covers other electrical machines and apparatus with individual functions. Classified under HS 8543.70.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123003718", + "JP_CUSTOMS-124000350", + "JP_CUSTOMS-124000351", + "JP_CUSTOMS-124000352", + "JP_CUSTOMS-124000510", + "JP_CUSTOMS-124000642", + "JP_CUSTOMS-124000927" + ], + "segment": "component", + "split": "train", + "tier1_description": "Addressable LED strip driver board supporting 5 V and 12 V RGB LED types (WS2812/WS2813/WS2815), with a 4-pin 3.81 mm screw-terminal output and DC 12 V/5 V power input (12 V/2 A, 5 V/3 A), providing built-in protection for reliable operation (MPN: 106540)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Seeed", + "part_name": "106540" + } + }, + { + "bol_metadata": null, + "boundary_note": "Audio-frequency amplifier apparatus (8518.40) vs amplifier integrated circuit (8542.33) vs other electrical machine with individual function (8543.70); apparatus vs component and the signal domain decide.", + "candidate_set": { + "codes": [ + "854130", + "851310", + "854370", + "854233" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "amplifier_boundary" + ], + "frozen_id": "v2.0.train.0711", + "hs2_label": "85", + "hs4_label": "8543", + "hs6_label": "854370", + "id": "SH-0711", + "justification_text": "The item is an electrical module with an individual function not more specifically provided elsewhere. Heading 8543 covers other electrical machines and apparatus with individual functions. Classified under HS 8543.70.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123003718", + "JP_CUSTOMS-124000350", + "JP_CUSTOMS-124000351", + "JP_CUSTOMS-124000352", + "JP_CUSTOMS-124000510", + "JP_CUSTOMS-124000642", + "JP_CUSTOMS-124000927" + ], + "segment": "component", + "split": "train", + "tier1_description": "Low-power stereo audio CODEC module supporting stereo encoding/decoding and sound recording, with an integrated amplifier capable of driving speakers directly without an external amplifier; PCB module for microcontroller and single-board-computer audio projects (MPN: WAV-15019)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Waveshare", + "part_name": "WAV-15019" + } + }, + { + "bol_metadata": { + "bol_description": "ITEM)ADD-IN CARD, OTHER, FOR COMPUTER, NO ENC OMTP-CTIAaudio converter cable(FOR R&D PURPOSE)", + "origin_country": "US", + "shipper": "intel corporation" + }, + "boundary_note": "Cable assembly fitted with connectors (8544.42) vs the connector itself (8536.69); whether the conductor is included decides.", + "candidate_set": { + "codes": [ + "854442", + "854149", + "851680", + "854231" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "cable_vs_connector" + ], + "frozen_id": "v2.0.train.0712", + "hs2_label": "85", + "hs4_label": "8544", + "hs6_label": "854442", + "id": "SH-0712", + "justification_text": "A headset adapter cable is an insulated electric conductor with connectors under 8544.42, not an ADP part under 8473.30. Classified under HS 8544.42.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123003576", + "JP_CUSTOMS-124000050", + "JP_CUSTOMS-124000735" + ], + "segment": "component", + "split": "train", + "tier1_description": "A short adapter cable for headsets with a 3.5 mm four-conductor plug on one end and a 3.5 mm socket on the other, internally rewiring the microphone and ground contacts to convert between the two common headset pin-assignment standards. The insulated copper cable fitted with connectors lets a headset built to one wiring convention work with audio equipment using the other. Supplied free of charge for research and development testing", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Intel", + "part_name": "item)ADD-in card other for computer NO" + } + }, + { + "bol_metadata": { + "bol_description": "USB cable for PI / Xi 400, 5m(ACPIUSB5PCB5) USB CABLE FOR PI / XI 400, 5M(ACPIUSB5PCB5)", + "origin_country": "DE", + "shipper": "optris gmbh & co kg" + }, + "boundary_note": "Cable assembly fitted with connectors (8544.42) vs the connector itself (8536.69); whether the conductor is included decides.", + "candidate_set": { + "codes": [ + "854143", + "851680", + "854442", + "854141" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "cable_vs_connector" + ], + "frozen_id": "v2.0.train.0713", + "hs2_label": "85", + "hs4_label": "8544", + "hs6_label": "854442", + "id": "SH-0713", + "justification_text": "A USB cable is an insulated electric conductor with connectors under 8544.42, not a thermometer part of 9025.90. Classified under HS 8544.42.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123003576" + ], + "segment": "component", + "split": "train", + "tier1_description": "USB connection cable, 5 metres long, used to link an infrared thermal imaging camera to a computer for data transfer, configuration and power. Fitted with a multi-pin plug matched to the camera on one end and a USB-A connector on the other. A dedicated accessory cable for an industrial infrared temperature-imaging instrument", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Optris", + "part_name": "USB cable for PI / Xi 400" + } + }, + { + "bol_metadata": { + "bol_description": "ACCESSORIES FOR ELECTRICAL TESTING INSTRUMENT -108301538 /CONNECTION LEAD", + "origin_country": "GB", + "shipper": "megger germany gmbh" + }, + "boundary_note": "Cable assembly fitted with connectors (8544.42) vs the connector itself (8536.69); whether the conductor is included decides.", + "candidate_set": { + "codes": [ + "854130", + "851840", + "854442", + "851419" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "cable_vs_connector" + ], + "frozen_id": "v2.0.train.0714", + "hs2_label": "85", + "hs4_label": "8544", + "hs6_label": "854442", + "id": "SH-0714", + "justification_text": "A connection lead is an insulated electric conductor fitted with connectors under 8544.42, not a 9030.90 instrument accessory. Classified under HS 8544.42.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123003576", + "JP_CUSTOMS-124000050", + "JP_CUSTOMS-124000735" + ], + "segment": "component", + "split": "train", + "tier1_description": "A connection lead accessory for an electrical testing instrument, consisting of an insulated cable assembly with terminated connectors. It carries measurement or supply signals between the test instrument and the equipment under test, providing a reliable conductive path for electrical parameter measurement and diagnostics on power systems and electrical apparatus", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Megger", + "part_name": "accessories for electrical testing" + } + }, + { + "bol_metadata": { + "bol_description": "ACCESSORIES FOR ELECTRICAL TESTING INSTRUMENT -90019342 / VK 128, CONNECTION LEADS UHF TNC -BNC, 3M", + "origin_country": "GB", + "shipper": "megger germany gmbh" + }, + "boundary_note": "Cable assembly fitted with connectors (8544.42) vs the connector itself (8536.69); whether the conductor is included decides.", + "candidate_set": { + "codes": [ + "854143", + "854129", + "854442", + "850450" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "cable_vs_connector" + ], + "frozen_id": "v2.0.train.0715", + "hs2_label": "85", + "hs4_label": "8544", + "hs6_label": "854442", + "id": "SH-0715", + "justification_text": "A coaxial UHF/TNC/BNC connection lead is an insulated electric conductor with connectors under 8544.42, not a 9030.90 instrument accessory. Classified under HS 8544.42.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123003576", + "JP_CUSTOMS-124000050", + "JP_CUSTOMS-124000735" + ], + "segment": "component", + "split": "train", + "tier1_description": "A three-metre coaxial connection lead accessory for an electrical testing instrument, terminated with UHF/TNC and BNC connectors. The shielded cable transfers measurement and pulse signals between the test set and the cable or equipment under test, supporting reflectometry and fault-location diagnostics on power and communication cables with low signal loss", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Megger", + "part_name": "accessories for electrical testing" + } + }, + { + "bol_metadata": { + "bol_description": "ACCESSORIES FOR ELECTRICAL TESTING INSTRUMENT -2004993 / HVLEADS FOR AC TESTING 5M (UNSHIELDED)- DETAILS AS PER INVOIC", + "origin_country": "GB", + "shipper": "megger germany gmbh" + }, + "boundary_note": "Cable assembly fitted with connectors (8544.42) vs the connector itself (8536.69); whether the conductor is included decides.", + "candidate_set": { + "codes": [ + "854129", + "854442", + "851762", + "854159" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "cable_vs_connector" + ], + "frozen_id": "v2.0.train.0716", + "hs2_label": "85", + "hs4_label": "8544", + "hs6_label": "854442", + "id": "SH-0716", + "justification_text": "High-voltage leads with connectors are insulated electric conductors under 8544.42, not Chapter 90 parts. Classified under HS 8544.42.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123003576", + "JP_CUSTOMS-124000050", + "JP_CUSTOMS-124000735" + ], + "segment": "component", + "split": "train", + "tier1_description": "A five-metre unshielded high-voltage lead accessory used for AC testing with an electrical testing instrument. The heavily insulated cable connects the high-voltage output of a test set to the equipment under test, delivering AC test voltage for insulation and withstand testing of cables and electrical apparatus while maintaining operator safety isolation", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Megger", + "part_name": "accessories for electrical testing" + } + }, + { + "bol_metadata": { + "bol_description": "ACCESSORIES FOR ELECTRICAL TESTING INSTRUMENT -108301423 / NKG S-UK MAINS CONNECTION LEAD 2,5 M 16A (UK-VERSION)", + "origin_country": "GB", + "shipper": "megger germany gmbh" + }, + "boundary_note": "Cable assembly fitted with connectors (8544.42) vs the connector itself (8536.69); whether the conductor is included decides.", + "candidate_set": { + "codes": [ + "851762", + "853610", + "854442", + "850450" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "cable_vs_connector" + ], + "frozen_id": "v2.0.train.0717", + "hs2_label": "85", + "hs4_label": "8544", + "hs6_label": "854442", + "id": "SH-0717", + "justification_text": "A mains connection lead with connectors is an insulated electric conductor under 8544.42, not a 9030.90 measuring-instrument part. Classified under HS 8544.42.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123003576", + "JP_CUSTOMS-124000050", + "JP_CUSTOMS-124000735" + ], + "segment": "component", + "split": "train", + "tier1_description": "A mains power connection lead accessory for an electrical testing instrument, in a UK-plug configuration rated about 16 A with a length near 2.5 metres. The insulated three-core cord supplies grid power to the test set, enabling operation of the instrument during electrical diagnostic and measurement work. It is a region-specific power cordset sold as instrument accessory hardware", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Megger", + "part_name": "accessories for electrical testing" + } + }, + { + "bol_metadata": { + "bol_description": "ASM CABLE STG CNTRLR PWR COMM GTK", + "origin_country": "USA/Germany", + "shipper": "bruker m sdn bhd" + }, + "boundary_note": "Cable assembly fitted with connectors (8544.42) vs the connector itself (8536.69); whether the conductor is included decides.", + "candidate_set": { + "codes": [ + "850431", + "851840", + "854442", + "851419" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "cable_vs_connector" + ], + "frozen_id": "v2.0.train.0718", + "hs2_label": "85", + "hs4_label": "8544", + "hs6_label": "854442", + "id": "SH-0718", + "justification_text": "Stage-controller cables are insulated electric conductors with connectors under 8544.42, not complete measuring/checking instruments of 9031.80. Classified under HS 8544.42.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123003576", + "JP_CUSTOMS-124000050", + "JP_CUSTOMS-124000735" + ], + "segment": "component", + "split": "train", + "tier1_description": "A set of stage-controller power and communication cables for an automated metrology instrument. The cables supply electrical power and carry communication signals between the controller electronics and the positioning stage of the measuring tool. They are dedicated wiring components for the host measuring or checking instrument, supplied as spares rather than as a complete functioning device", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Bruker", + "part_name": "ASM cable STG cntrlr PWR comm GTK" + } + }, + { + "bol_metadata": { + "bol_description": "CELSIS MESSKABEL MIT FILTER -CELSIS MEASURING CABLE WITH FILTER (PARTS OF EQUIPMENTS FOR TESTING OF SEMICONDUCTOR DEVI", + "origin_country": "DE", + "shipper": "diotec semiconductor ag" + }, + "boundary_note": "Cable assembly fitted with connectors (8544.42) vs the connector itself (8536.69); whether the conductor is included decides.", + "candidate_set": { + "codes": [ + "854442", + "854121", + "854129", + "854142" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "cable_vs_connector" + ], + "frozen_id": "v2.0.train.0719", + "hs2_label": "85", + "hs4_label": "8544", + "hs6_label": "854442", + "id": "SH-0719", + "justification_text": "A measuring cable with filter and connectors is an insulated electric conductor under 8544.42, not a Chapter 90 part. Classified under HS 8544.42.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123003576", + "JP_CUSTOMS-124000050", + "JP_CUSTOMS-124000735" + ], + "segment": "component", + "split": "train", + "tier1_description": "A measuring cable assembly fitted with an integrated signal filter, used as a connection accessory between semiconductor test equipment and the device under test. It carries low-level electrical measurement signals while the in-line filter suppresses noise and interference. Constructed from shielded conductors with precision connectors, it is a dedicated part for benches and instruments used in checking and characterizing semiconductor components", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Diotec Semiconductor", + "part_name": "celsis messkabel MIT filter -celsis" + } + }, + { + "bol_metadata": null, + "boundary_note": "Cable assembly fitted with connectors (8544.42) vs the connector itself (8536.69); whether the conductor is included decides.", + "candidate_set": { + "codes": [ + "854129", + "854442", + "852351", + "854110" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "cable_vs_connector" + ], + "frozen_id": "v2.0.train.0720", + "hs2_label": "85", + "hs4_label": "8544", + "hs6_label": "854442", + "id": "SH-0720", + "justification_text": "The item is an insulated electric cable or lead fitted with connectors. Heading 8544, subheading 854442 covers such conductors for voltage not exceeding 1,000 V. Classified under HS 8544.42.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123003576", + "JP_CUSTOMS-124000050", + "JP_CUSTOMS-124000735" + ], + "segment": "component", + "split": "train", + "tier1_description": "Insulated jumper cable assembly, 150 mm (6 in) long, with 6 conductors at 0.1 in spacing terminated with female socket connectors on both ends, for low-voltage board-to-board interconnection (MPN: ADA206)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit", + "part_name": "ADA206" + } + }, + { + "bol_metadata": null, + "boundary_note": "Cable assembly fitted with connectors (8544.42) vs the connector itself (8536.69); whether the conductor is included decides.", + "candidate_set": { + "codes": [ + "854442", + "854143", + "852491", + "854141" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "cable_vs_connector" + ], + "frozen_id": "v2.0.train.0721", + "hs2_label": "85", + "hs4_label": "8544", + "hs6_label": "854442", + "id": "SH-0721", + "justification_text": "The item is an insulated electric cable or lead fitted with connectors. Heading 8544, subheading 854442 covers such conductors for voltage not exceeding 1,000 V. Classified under HS 8544.42.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123003576", + "JP_CUSTOMS-124000050", + "JP_CUSTOMS-124000735" + ], + "segment": "component", + "split": "train", + "tier1_description": "Pig-tail cable assemblies, each 12in (305mm) long, fitted with a 2-pin connector at 2.54mm (0.1in) pitch on one end that mates with standard 0.1in header pins. Insulated single-ended jumper leads for low-voltage prototyping connections (MPN: ADA1003)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit", + "part_name": "ADA1003" + } + }, + { + "bol_metadata": null, + "boundary_note": "Cable assembly fitted with connectors (8544.42) vs the connector itself (8536.69); whether the conductor is included decides.", + "candidate_set": { + "codes": [ + "854143", + "854442", + "850440", + "850431" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "cable_vs_connector" + ], + "frozen_id": "v2.0.train.0722", + "hs2_label": "85", + "hs4_label": "8544", + "hs6_label": "854442", + "id": "SH-0722", + "justification_text": "The item is an insulated electric cable or lead fitted with connectors. Heading 8544, subheading 854442 covers such conductors for voltage not exceeding 1,000 V. Classified under HS 8544.42.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123003576", + "JP_CUSTOMS-124000050", + "JP_CUSTOMS-124000735" + ], + "segment": "component", + "split": "train", + "tier1_description": "Insulated breadboard jumper leads built from 22 AWG multi-strand wire, approximately 214mm long, terminated with rigid male header pins at each end. Multi-colour low-voltage patch cables for solderless prototyping connections (MPN: FIT0154)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "DFRobot", + "part_name": "FIT0154" + } + }, + { + "bol_metadata": null, + "boundary_note": "Cable assembly fitted with connectors (8544.42) vs the connector itself (8536.69); whether the conductor is included decides.", + "candidate_set": { + "codes": [ + "854141", + "854442", + "850490", + "854160" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "cable_vs_connector" + ], + "frozen_id": "v2.0.train.0723", + "hs2_label": "85", + "hs4_label": "8544", + "hs6_label": "854442", + "id": "SH-0723", + "justification_text": "The item is an insulated electric cable or lead fitted with connectors. Heading 8544, subheading 854442 covers such conductors for voltage not exceeding 1,000 V. Classified under HS 8544.42.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123003576", + "JP_CUSTOMS-124000050", + "JP_CUSTOMS-124000735" + ], + "segment": "component", + "split": "train", + "tier1_description": "Insulated jumper leads built from 26 AWG multi-strand wire, approximately 210mm long, with a female socket on one end and a male pin on the other at 2.54mm pitch. Multi-colour female-to-male patch cables for low-voltage prototyping (MPN: FIT0365)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "DFRobot", + "part_name": "FIT0365" + } + }, + { + "bol_metadata": { + "bol_description": "OPTICAL COMPONENTS LENS PCX 12.5 X 40 NIR I TS", + "origin_country": "US", + "shipper": "edmund optics singapore pte ltd" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "902750", + "902910", + "903149", + "900190" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0724", + "hs2_label": "90", + "hs4_label": "9001", + "hs6_label": "900190", + "id": "SH-0724", + "justification_text": "Optical fibres, optical fibre bundles, polarising material and unmounted optical elements are covered by 9001.90. Classified under HS 9001.90.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "Plano-convex optical lens, 12.5 mm diameter with a 40 mm focal length, fabricated from optical glass and ground and polished, carrying a near-infrared anti-reflection coating. It is a positive focal-length element used to collect and focus light in imaging, laser, fibre optic, emitter and detector applications. The element is unmounted and optically worked", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Edmund Optics", + "part_name": "optical components lens PCX 12.5 X 40" + } + }, + { + "bol_metadata": { + "bol_description": "OPTICAL COMPONENTS MIRROR RA UV ENH AI 6.25 X 8.8MM", + "origin_country": "US", + "shipper": "edmund optics singapore pte ltd" + }, + "boundary_note": "Worked synthetic crystal (7104.99) vs element doped for use in electronics (3818.00) vs optical element (9001.90); working, doping and optical function decide.", + "candidate_set": { + "codes": [ + "900190", + "903090", + "902590", + "903190" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "crystal_substrate_boundary" + ], + "frozen_id": "v2.0.train.0725", + "hs2_label": "90", + "hs4_label": "9001", + "hs6_label": "900190", + "id": "SH-0725", + "justification_text": "Optical fibres, optical fibre bundles, polarising material and unmounted optical elements are covered by 9001.90. Classified under HS 9001.90.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "Right-angle optical mirror element approximately 6.25 by 8.8 mm with a UV-enhanced aluminium reflective coating on a glass substrate. It reflects and redirects light at a fixed angle within optical paths, used in imaging, laser and metrology assemblies. The component is an unmounted, optically worked reflective element supplied as a discrete optical building block", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Edmund Optics", + "part_name": "optical components mirror RA UV ENH AI" + } + }, + { + "bol_metadata": { + "bol_description": "TILE CALIBRATION & DUAL OFFSETS", + "origin_country": "US", + "shipper": "coherent aerospace & defense, inc" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "901380", + "903149", + "903039", + "902590" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0726", + "hs2_label": "90", + "hs4_label": "9013", + "hs6_label": "901380", + "id": "SH-0726", + "justification_text": "Other optical devices, appliances and instruments not more specifically provided are classified under 9013.80. Classified under HS 9013.80.", + "reference_ruling_ids": [], + "segment": "component", + "split": "train", + "tier1_description": "Optical calibration assembly providing tile calibration and dual offset references for a laser-based optical instrument. Comprises a calibrated optical fixture used to align and standardize beam positioning and offset values during instrument setup. Supplied as a precision optical calibration device for laser or beam-delivery systems", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Coherent", + "part_name": "tile calibration & dual offsets" + } + }, + { + "bol_metadata": { + "bol_description": "THERMOMETERS AND PYROMETERS,NOT COMBINED WITH OTHER INSTRUMENTS FOR INDUSTRIAL USE(OTHER DETAILS AS PER INVPCK) THERMOMETERS AND PYROMETERS, NOT COMBINED WITH OTHER INSTRUM", + "origin_country": "US", + "shipper": "advance energy lumasense technologies gmbh" + }, + "boundary_note": "HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "903033", + "902590", + "903090", + "902519" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0727", + "hs2_label": "90", + "hs4_label": "9025", + "hs6_label": "902519", + "id": "SH-0727", + "justification_text": "Thermometers, pyrometers and complete temperature sensors not combined with other instruments fall under 9025.19. Classified under HS 9025.19.", + "reference_ruling_ids": [], + "segment": "metrology", + "split": "train", + "tier1_description": "Non-contact infrared thermometers and pyrometers for industrial process temperature measurement, supplied as standalone instruments not combined with other apparatus. These electronic optical-radiation sensors detect emitted infrared energy to determine surface temperature of hot targets in manufacturing and process applications. Not liquid-filled direct-reading types", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Advanced Energy (LumaSense)", + "part_name": "thermometers and pyrometers NOT" + } + }, + { + "bol_metadata": { + "bol_description": "Infrared temperature sensor for measuring product surface temperature P/N: PM-MA-151-CT-BRT-3M (Device does not have LPWAN radio wave transmission and reception function) 100% new - CALEX brand", + "origin_country": "GB", + "shipper": "calex electronics limited" + }, + "boundary_note": "HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "903040", + "902519", + "903084", + "902590" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0728", + "hs2_label": "90", + "hs4_label": "9025", + "hs6_label": "902519", + "id": "SH-0728", + "justification_text": "Thermometers, pyrometers and complete temperature sensors not combined with other instruments fall under 9025.19. Classified under HS 9025.19.", + "reference_ruling_ids": [], + "segment": "metrology", + "split": "train", + "tier1_description": "Miniature non-contact infrared temperature sensor with a remote sensing head and separate electronics module, using 15:1 optics to measure the surface temperature of a target by detecting emitted infrared radiation. Provides 4-20 mA or RS485 Modbus output; this configuration has a 3-metre head-to-electronics cable. No radio transmission function. Electronic optical-radiation pyrometer for fixed industrial process monitoring", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Calex Electronics", + "part_name": "Infrared temperature sensor for" + } + }, + { + "bol_metadata": { + "bol_description": "EASYTRACK LOGGER", + "origin_country": "US", + "shipper": "datapaq c o fluke raytek gmbh" + }, + "boundary_note": "HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "902519", + "903084", + "902750", + "902590" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0729", + "hs2_label": "90", + "hs4_label": "9025", + "hs6_label": "902519", + "id": "SH-0729", + "justification_text": "Thermometers, pyrometers and complete temperature sensors not combined with other instruments fall under 9025.19. Classified under HS 9025.19.", + "reference_ruling_ids": [], + "segment": "metrology", + "split": "train", + "tier1_description": "Portable thermal-profiling temperature data logger with multiple thermocouple input channels that records product temperature versus time as it passes through curing or ovens. Battery-powered electronic logger with internal memory and two-button operation, measuring roughly -150 to 500 C; paired with PC software to verify cure profiles. Used for industrial coating and oven monitoring", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Datapaq (Fluke Process Instruments)", + "part_name": "easytrack logger" + } + }, + { + "bol_metadata": { + "bol_description": "FLUKE-572-2DUAL LASER IR THERMOMETER", + "origin_country": "US", + "shipper": "fluke south east asia pte ltd" + }, + "boundary_note": "HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "902519", + "903084", + "902750", + "902590" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0730", + "hs2_label": "90", + "hs4_label": "9025", + "hs6_label": "902519", + "id": "SH-0730", + "justification_text": "Thermometers, pyrometers and complete temperature sensors not combined with other instruments fall under 9025.19. Classified under HS 9025.19.", + "reference_ruling_ids": [], + "segment": "metrology", + "split": "train", + "tier1_description": "Handheld dual-laser infrared thermometer for high-temperature non-contact measurement with a 60:1 distance-to-spot ratio, adjustable emissivity, K-type thermocouple input and backlit display showing current, max, min and average readings. Measures roughly -30 to 900 C; includes data storage and USB interface. Used in metal, glass, cement and petrochemical process environments", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Fluke", + "part_name": "572-2DUAL laser IR thermometer" + } + }, + { + "bol_metadata": { + "bol_description": "PYROMETER CELLACAST PA 80 AF 6 SOUND ABSORBER J-SD1-1/4-SB", + "origin_country": "DE", + "shipper": "keller hcw gmbh" + }, + "boundary_note": "HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "902590", + "902519", + "903149", + "901380" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0731", + "hs2_label": "90", + "hs4_label": "9025", + "hs6_label": "902519", + "id": "SH-0731", + "justification_text": "Thermometers, pyrometers and complete temperature sensors not combined with other instruments fall under 9025.19. Classified under HS 9025.19.", + "reference_ruling_ids": [], + "segment": "metrology", + "split": "train", + "tier1_description": "Non-contact pyrometer instrument for measuring high temperatures of cast or molten material by detecting emitted infrared radiation, supplied with a small acoustic sound-absorber accessory. Standalone electronic optical temperature-measuring device for industrial foundry and process monitoring; not liquid-filled and not combined with other instruments", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Keller HCW", + "part_name": "pyrometer cellacast PA 80 AF 6 sound" + } + }, + { + "bol_metadata": { + "bol_description": "PYROMETER CELLATEMP PA 40 AF 1 FLAT GASKET", + "origin_country": "DE", + "shipper": "keller hcw gmbh" + }, + "boundary_note": "HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "902750", + "903082", + "902519", + "902590" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0732", + "hs2_label": "90", + "hs4_label": "9025", + "hs6_label": "902519", + "id": "SH-0732", + "justification_text": "Thermometers, pyrometers and complete temperature sensors not combined with other instruments fall under 9025.19. Classified under HS 9025.19.", + "reference_ruling_ids": [], + "segment": "metrology", + "split": "train", + "tier1_description": "Two-colour (ratio) non-contact pyrometer for industrial high-temperature measurement, determining target temperature from the ratio of emitted infrared radiation at two wavelengths for reduced sensitivity to dust, steam and partial obstruction. Digital instrument measuring roughly 500 to 3000 C with focusable optics; supplied with a flat sealing gasket. Standalone instrument not combined with other apparatus", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Keller HCW", + "part_name": "pyrometer cellatemp PA 40 AF 1 flat" + } + }, + { + "bol_metadata": { + "bol_description": "NON-INFRARED THERMOMETER INFRARED THERMOMETER PROBE COVER", + "origin_country": "TW", + "shipper": "polygreen hk co. ltd" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "903084", + "901380", + "902590", + "902519" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0733", + "hs2_label": "90", + "hs4_label": "9025", + "hs6_label": "902590", + "id": "SH-0733", + "justification_text": "A thermometer probe cover is a part/accessory of a thermometer or temperature instrument under 9025.90, not a complete thermometer of 9025.19. Classified under HS 9025.90.", + "reference_ruling_ids": [], + "segment": "metrology", + "split": "train", + "tier1_description": "Disposable probe cover for a handheld digital clinical-style thermometer. It is a thin moulded plastic sheath that fits over the temperature probe tip to provide a hygienic, single-use barrier between the instrument and the measurement site, protecting the sensor and preventing cross-contamination during repeated readings", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Polygreen", + "part_name": "NON-infrared thermometer infrared" + } + }, + { + "bol_metadata": { + "bol_description": "HFID 100% H2 FUEL 220V 50HZ P/N", + "origin_country": "GB", + "shipper": "servomex group limited" + }, + "boundary_note": "Heading 9027 separates gas and smoke analysis apparatus (9027.10) from other instruments using optical radiations (9027.50).", + "candidate_set": { + "codes": [ + "902910", + "902750", + "903039", + "902710" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9027_analysis_splits" + ], + "frozen_id": "v2.0.train.0734", + "hs2_label": "90", + "hs4_label": "9027", + "hs6_label": "902710", + "id": "SH-0734", + "justification_text": "A heated FID gas analyzer is gas or smoke analysis apparatus under 9027.10, not an optical-radiation analyzer of 9027.50. Classified under HS 9027.10.", + "reference_ruling_ids": [], + "segment": "metrology", + "split": "train", + "tier1_description": "Heated flame ionization detector gas analyzer configured to run on one hundred percent hydrogen fuel, mains powered at 220V 50Hz. The instrument continuously measures total hydrocarbon concentration in a gaseous sample stream by burning the sample in a hydrogen flame and detecting the resulting ionization current with an internally heated oven keeping the sample above its dew point. Used for emissions and process gas monitoring", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Servomex", + "part_name": "hfid 100% H2 fuel 220V 50HZ P/N" + } + }, + { + "bol_metadata": { + "bol_description": "Alcohol meter, Model: AL9000 Brand: Sentech, 100% new", + "origin_country": "KR", + "shipper": "sentech korea corp" + }, + "boundary_note": "Heading 9027 separates gas and smoke analysis apparatus (9027.10) from other instruments using optical radiations (9027.50).", + "candidate_set": { + "codes": [ + "903033", + "903039", + "902710", + "902750" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9027_analysis_splits" + ], + "frozen_id": "v2.0.train.0735", + "hs2_label": "90", + "hs4_label": "9027", + "hs6_label": "902710", + "id": "SH-0735", + "justification_text": "A breath alcohol analyzer is gas analysis apparatus under 9027.10, not residual measuring instruments of 9031.80. Classified under HS 9027.10.", + "reference_ruling_ids": [], + "segment": "metrology", + "split": "train", + "tier1_description": "A portable breath alcohol testing instrument that measures alcohol concentration in exhaled breath using a fuel-cell electrochemical sensor. The handheld unit reacts with ethanol to produce an electrical signal and reports breath alcohol level on a display with audio and warning indicators. It is designed for fast, repeated screening in law enforcement, workplace safety, and personal use, calibrated periodically for accuracy", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Sentech Korea", + "part_name": "Alcohol meter Model: AL9000 Brand: 100%" + } + }, + { + "bol_metadata": { + "bol_description": "Alcohol meter, Model: iBlow 10 (Comes with paper box) Brand: Sentech, 100% new", + "origin_country": "KR", + "shipper": "sentech korea corp" + }, + "boundary_note": "Heading 9027 separates gas and smoke analysis apparatus (9027.10) from other instruments using optical radiations (9027.50).", + "candidate_set": { + "codes": [ + "902750", + "902710", + "903149", + "903141" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9027_analysis_splits" + ], + "frozen_id": "v2.0.train.0736", + "hs2_label": "90", + "hs4_label": "9027", + "hs6_label": "902710", + "id": "SH-0736", + "justification_text": "A breath alcohol analyzer is gas analysis apparatus under 9027.10, not residual measuring instruments of 9031.80. Classified under HS 9027.10.", + "reference_ruling_ids": [], + "segment": "metrology", + "split": "train", + "tier1_description": "A rapid-screening breath alcohol analyzer engineered for high-volume testing of many subjects in quick succession. The handheld device uses an advanced electrochemical fuel-cell sensor to detect ethanol in exhaled breath, signaling pass, low, or high results via colored LED indicators and audible beeps with a short warm-up and instant analysis time. Used for workplace, logistics, and law-enforcement alcohol screening", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Sentech Korea", + "part_name": "Alcohol meter Model: iBlow 10 (Comes" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 9027 separates gas and smoke analysis apparatus (9027.10) from other instruments using optical radiations (9027.50).", + "candidate_set": { + "codes": [ + "902710", + "903040", + "902750", + "902519" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9027_analysis_splits" + ], + "frozen_id": "v2.0.train.0737", + "hs2_label": "90", + "hs4_label": "9027", + "hs6_label": "902710", + "id": "SH-0737", + "justification_text": "The item is an indoor air-quality sensor board with VOC/gas measurement as a principal function. Heading 9027, subheading 902710 covers gas or smoke analysis apparatus, not ADP processing units. Classified under HS 9027.10.", + "reference_ruling_ids": [], + "segment": "metrology", + "split": "train", + "tier1_description": "Wireless indoor environmental monitoring board with high-precision combined gas/temperature/humidity/pressure sensor (BME688) and a color light/luminance sensor, capable of measuring air quality via volatile organic and sulfur compounds, carbon monoxide and hydrogen, with wireless data transmission. Multi-parameter physical and chemical analysis apparatus (MPN: PIM630)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Pimoroni", + "part_name": "PIM630" + } + }, + { + "bol_metadata": { + "bol_description": "800TS-SN 800TS abs READER", + "origin_country": "US", + "shipper": "agilent technologies deutschland gmbh" + }, + "boundary_note": "Heading 9027 separates gas and smoke analysis apparatus (9027.10) from other instruments using optical radiations (9027.50).", + "candidate_set": { + "codes": [ + "902750", + "902710", + "902519", + "903084" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9027_analysis_splits" + ], + "frozen_id": "v2.0.train.0738", + "hs2_label": "90", + "hs4_label": "9027", + "hs6_label": "902750", + "id": "SH-0738", + "justification_text": "Optical-radiation instruments for physical or chemical analysis fall under 9027.50. Classified under HS 9027.50.", + "reference_ruling_ids": [], + "segment": "metrology", + "split": "train", + "tier1_description": "Benchtop absorbance microplate reader for laboratory and clinical assays in 6- to 384-well plate formats. It passes filtered light at several discrete visible/UV wavelengths through liquid samples and measures optical absorbance for ELISA, protein quantification, enzyme kinetics and cell-based assays with an onboard touch-screen interface and USB data export. The instrument uses optical radiation for photometric measurement", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Agilent Technologies", + "part_name": "800TS-SN 800TS abs reader" + } + }, + { + "bol_metadata": { + "bol_description": "G7162A 1260 Infinity III RI detector", + "origin_country": "US", + "shipper": "agilent technologies deutschland gmbh" + }, + "boundary_note": "Heading 9027 separates gas and smoke analysis apparatus (9027.10) from other instruments using optical radiations (9027.50).", + "candidate_set": { + "codes": [ + "902710", + "902750", + "903084", + "903082" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9027_analysis_splits" + ], + "frozen_id": "v2.0.train.0739", + "hs2_label": "90", + "hs4_label": "9027", + "hs6_label": "902750", + "id": "SH-0739", + "justification_text": "Optical-radiation instruments for physical or chemical analysis fall under 9027.50. Classified under HS 9027.50.", + "reference_ruling_ids": [], + "segment": "metrology", + "split": "train", + "tier1_description": "Refractive index detector module for liquid chromatography systems. It continuously measures the difference in refractive index between sample and reference flow cells using an optical light source and detector, enabling detection of non-UV-absorbing analytes such as carbohydrates, lipids and polymers, including gel-permeation and size-exclusion separations. Includes electronic temperature control of the optical unit for stable, reproducible signals", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Agilent Technologies", + "part_name": "G7162A 1260 Infinity III RI detector" + } + }, + { + "bol_metadata": { + "bol_description": "COUNTER CT6S-1P2T 24-48VDC/24VAC", + "origin_country": "KR", + "shipper": "autonics corporation" + }, + "boundary_note": "", + "candidate_set": { + "codes": [ + "902910", + "901380", + "903033", + "900190" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [], + "frozen_id": "v2.0.train.0740", + "hs2_label": "90", + "hs4_label": "9029", + "hs6_label": "902910", + "id": "SH-0740", + "justification_text": "Revolution counters, production counters, taximeters, odometers, pedometers and stroboscopes fall under 9029.10. Classified under HS 9029.10.", + "reference_ruling_ids": [], + "segment": "metrology", + "split": "train", + "tier1_description": "Programmable digital counter/timer with a six-digit LED display, panel-mounted in a DIN housing. Operates on 24-48V DC or 24V AC and counts pulses or measures elapsed time with multiple selectable output modes via screw terminal connection. A production/revolution counter used for industrial process counting and timing control", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Autonics", + "part_name": "counter CT6S-1P2T 24-48VDC/24VAC" + } + }, + { + "bol_metadata": { + "bol_description": "P/N:460-0020-Z-002) ACTIVE CURRENT SENSOR (P/F MFG OF UPS)", + "origin_country": "DE", + "shipper": "vacuumschmelze gmbh & co. kg" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90). HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "903090", + "903082", + "903033", + "903040" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits", + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0741", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903033", + "id": "SH-0741", + "justification_text": "An active current sensor measures electrical current and belongs in electrical measuring instruments of 9030.33, not transformers of 8504.31. Classified under HS 9030.33.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123001256" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "An active closed-loop (compensation-principle) current sensor used in uninterruptible power supply manufacture. A soft-magnetic core couples the conductor current to a compensation winding; an integrated magnetic-field probe and electronics drive the compensation current to null the core flux, yielding an output signal precisely proportional to the measured AC or DC current. It offers low offset drift, wide bandwidth, and galvanic isolation for current monitoring and control", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Vacuumschmelze", + "part_name": "P/N:460-0020-Z-002) active current" + } + }, + { + "bol_metadata": { + "bol_description": "PIN. .000 SIRIUS-8XLV+ - DEWESOFT-X-PROF (INSTRUEMENTTO MEASURE VOLTAGE)INSTRUEMENT TO MEASURE VOLTAGE", + "origin_country": "SI", + "shipper": "dewesoft d.o.o" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903040", + "903039", + "903082", + "903033" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0742", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903033", + "id": "SH-0742", + "justification_text": "Electrical meters or instruments for voltage, current, resistance or power, without recording device, fall under 9030.33. Classified under HS 9030.33.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123001256" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Eight-channel modular data acquisition instrument for measuring electrical voltage. Each isolated input handles voltage ranges from millivolts up to about plus/minus 200 V using 24-bit dual-core sigma-delta converters with anti-aliasing filters and simultaneous high-speed sampling, supplied with acquisition software. Used in test and measurement of analog voltage signals without an integral recording device", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Dewesoft", + "part_name": "PIN. .000 sirius-8XLV+ - -X-prof" + } + }, + { + "bol_metadata": { + "bol_description": "PIN. .051- IOLITE-R8R-051- DEWESOFT-X-PROF (INSTRUEMENT TO MEASURE VOLTAGE AND STRAIN)INSTRUEMENT TO MEASURE VOLTAGE AND STRAIN", + "origin_country": "SI", + "shipper": "dewesoft d.o.o" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903082", + "903040", + "903033", + "903084" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0743", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903033", + "id": "SH-0743", + "justification_text": "Electrical meters or instruments for voltage, current, resistance or power, without recording device, fall under 9030.33. Classified under HS 9030.33.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123001256" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Rugged rack-style modular data acquisition system combining voltage and strain measurement inputs in a multi-slot chassis. It conditions and digitizes analog electrical and bridge signals with 24-bit converters and supplied software for industrial and laboratory electrical-quantity measurement, without an integral recording device", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Dewesoft", + "part_name": "PIN. .051- iolite-R8R-051- -X-prof" + } + }, + { + "bol_metadata": { + "bol_description": "LVD2, VOLT LIGHT", + "origin_country": "US", + "shipper": "fluke corporation" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903033", + "903082", + "903090", + "903040" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0744", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903033", + "id": "SH-0744", + "justification_text": "Electrical meters or instruments for voltage, current, resistance or power, without recording device, fall under 9030.33. Classified under HS 9030.33.", + "reference_ruling_ids": [ + "JP_CUSTOMS-123001256" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Compact handheld voltage-detection light/indicator that visually signals the presence of electrical voltage in a circuit. A portable electrical test indicator used by technicians to confirm energized conductors during maintenance and safety checks", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Fluke", + "part_name": "LVD2 volt light" + } + }, + { + "bol_metadata": { + "bol_description": "ELML1410DE) MULTI LOAD METER RJ12 CONNECTION WITH DATA LOGGER & ETHERNET (REST. DETAILS AS PER)(ELML1410DE", + "origin_country": "AU", + "shipper": "eltech australia" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903040", + "903084", + "903090", + "903039" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0745", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903039", + "id": "SH-0745", + "justification_text": "An electrical load meter or data logger with memory/recording is better classified as other electrical measuring apparatus of 9030.39, not non-recording 9030.33. Classified under HS 9030.39.", + "reference_ruling_ids": [], + "segment": "metrology", + "split": "train", + "tier1_description": "Multi-channel electrical load meter with RJ12 connection, integrated data logger and Ethernet interface, used to measure and monitor electrical load (current/power) across several points. The instrument reads and stores electrical quantities for monitoring and analysis in industrial power applications", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Eltech", + "part_name": "ELML1410DE) multi load meter RJ12" + } + }, + { + "bol_metadata": { + "bol_description": "FLUKE-BT520 BATTERY ANALYZER", + "origin_country": "US", + "shipper": "fluke south east asia pte ltd" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90). HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "903090", + "903040", + "903082", + "903039" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits", + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0746", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903039", + "id": "SH-0746", + "justification_text": "A battery analyzer with memory/recording functions is other electrical measuring apparatus of 9030.39, not non-recording 9030.33. Classified under HS 9030.39.", + "reference_ruling_ids": [], + "segment": "metrology", + "split": "train", + "tier1_description": "Handheld battery analyzer for testing stationary batteries and battery banks. Measures battery internal resistance/impedance, DC and AC voltage and current, ripple voltage, frequency and temperature, storing results in onboard memory with interactive test probes. Used for troubleshooting and performance testing of individual cells or strings", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Fluke", + "part_name": "BT520 battery analyzer" + } + }, + { + "bol_metadata": { + "bol_description": "OPTICAL TIME DOMAIN REFLECTOMETER", + "origin_country": "JP", + "shipper": "yokogawa engineering asia pte. ltd" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903084", + "903033", + "903039", + "903040" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0747", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903040", + "id": "SH-0747", + "justification_text": "An optical time-domain reflectometer is telecommunications testing apparatus under 9030.40, not a chemical-analysis instrument of 9027.50. Classified under HS 9030.40.", + "reference_ruling_ids": [], + "segment": "metrology", + "split": "train", + "tier1_description": "Portable optical time-domain reflectometer for fiber-optic testing. The instrument launches light pulses into an optical fiber and analyzes back-scattered and reflected light to characterize fiber length, loss, splice and connector events along telecommunication cable links. Battery-operable handheld unit used for installation and maintenance of optical communication networks", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Yokogawa", + "part_name": "optical time domain reflectometer" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-07-16 00:00:00", + "bol_description": "PROBE CARD SPIDER DEVICE (P&A) CSAA1004 CANTILEVER Q3 6020", + "consignee": "chiptest engineering private limited", + "declared_hs": "90308200", + "hs_verified": true, + "origin_country": "SINGAPORE", + "port_dest": "CHENNAI AIR CARGO ACC INMAA4", + "port_origin": "SINGAPORE", + "shipper": "q3 probe pte ltd" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90). Manufacturing vs measuring function: machines that modify the wafer (8486) against instruments that measure or inspect without modifying it (9030.82, 9031.41, 9031.80); for in-line tools the principal function decides.", + "candidate_set": { + "codes": [ + "903082", + "903180", + "903090", + "903141" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9030_measurement_splits", + "process_vs_metrology" + ], + "frozen_id": "v2.0.train.0748", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903082", + "id": "SH-0748", + "justification_text": "Goods classified under HS 9030.82; corroborated by 10 customs rulings on comparable goods across 5 jurisdictions.", + "reference_ruling_ids": [ + "CROSS-H192481", + "EBTI-NL-NLRTD-2007-003541", + "CROSS-A89407", + "CROSS-K86983", + "CROSS-N325730", + "EBTI-FR-FR-PRO-2011-000421", + "CROSS-N325411", + "CROSS-R04578", + "EBTI-EN-0113", + "EBTI-DE-DEB/1328/05-1" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A cantilever probe card (Spider device, type CSAA1004, Q3 6020): a wafer-test interface carrying fine peripheral tungsten needles that make temporary electrical contact to each die's bond pads, allowing the tester to functionally test integrated circuits at wafer level before dicing", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Q3 Probe", + "part_name": "card spider device (P&A) CSAA1004" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-22 00:00:00", + "bol_description": "NETWORK PROTOCOL ANALYZER-PGY-13CEX-PD(V1.1)13C PROTOCOL EXRCI( QTY: 0", + "consignee": "intel microelectronics m sdn bhd", + "declared_hs": "9030829000", + "hs_verified": true, + "origin_country": "MALAYSIA", + "port_dest": "PENANG GEORGETOWN", + "port_origin": "PENANG GEORGETOWN", + "shipper": "intel microelectronics m sdn bhd" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903149", + "903090", + "903082", + "903141" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0749", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903082", + "id": "SH-0749", + "justification_text": "Goods classified under HS 9030.82; corroborated by 2 customs rulings on comparable goods (EU-EN, US).", + "reference_ruling_ids": [ + "EBTI-EN-0113", + "CROSS-H192481" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A MIPI I3C bus protocol analyzer and exerciser (type PGY-I3C-EX): a measuring instrument that passively captures and decodes I3C/I2C bus traffic and can also generate configurable controller/target traffic with error injection, used to validate and debug devices against the MIPI I3C specification", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Intel", + "part_name": "network protocol" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-11 00:00:00", + "bol_description": "POWER DEVICE ANALYZER FOR CIRCUIT DESIGN", + "consignee": "jabil circuit sdn bhd", + "declared_hs": "9030829000", + "hs_verified": true, + "origin_country": "MALAYSIA", + "port_dest": "BAYAN LEPAS", + "port_origin": "BAYAN LEPAS", + "shipper": "keysight technologies malaysia sdn" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903090", + "903141", + "903082", + "903190" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0750", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903082", + "id": "SH-0750", + "justification_text": "Goods classified under HS 9030.82; corroborated by 6 customs rulings on comparable goods (EU-EN, US).", + "reference_ruling_ids": [ + "CROSS-A89407", + "CROSS-E81071", + "CROSS-H192481", + "EBTI-EN-0113", + "CROSS-N325411", + "CROSS-N325730" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Power device analyzer (for circuit design): a parametric/curve-tracer instrument that characterises high-voltage/high-current power semiconductor devices", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Keysight Technologies", + "part_name": "power device analyzer for circuit design" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-28 00:00:00", + "bol_description": "PROBE - TEST PROBE E240101 P/N: 1151063 PROBE", + "consignee": "anora instrumentation private limited", + "declared_hs": "90308200", + "hs_verified": true, + "origin_country": "GERMANY", + "port_dest": "", + "port_origin": "", + "shipper": "feinmentall contact technologies" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903149", + "903090", + "903082", + "903190" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0751", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903082", + "id": "SH-0751", + "justification_text": "Goods classified under HS 9030.82; corroborated by 9 customs rulings on comparable goods (EU-EN, EU-FR, EU-NL, US).", + "reference_ruling_ids": [ + "CROSS-H192481", + "CROSS-E81071", + "CROSS-N325411", + "CROSS-N325730", + "CROSS-R04578", + "EBTI-EN-0113", + "EBTI-FR-FR-PRO-2011-000421", + "EBTI-NL-NLRTD-2007-003541", + "CROSS-A89407" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A test probe (type E240101, part 1151063): a contact probe accessory that makes temporary, repeatable electrical contact to a device or board under test, transferring tester signals to the device pads during electrical measurement", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "FormFactor", + "part_name": "probe - test probe E240101 P/N: 1151063" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-16 00:00:00", + "bol_description": "001 C1D TESTER(SIG C1D, E4450-A) 592-10475 002 C1D TESTER(SIG C1D, E4450-B) 003 C1D TESTER(SIG C1D, E4450-C) 004 C1D TESTER(SIG C1D, E4450-D) 005 C1D TESTER(SIG C1D, E4450-E) 006 FULL AUTO PROBER (ACCRETECH UF3000EX, E4450-F) F72002MM PO NO.4514889964 SHIPDOC NO.1962822 HS CODE :9030.82", + "consignee": "micron technology virginia mtv", + "declared_hs": "903082,9030820000", + "hs_verified": true, + "origin_country": "SOUTH KOREA", + "port_dest": "NEW YORK NEWARK AREA NEWARK NEW JERSEY", + "port_origin": "BUSAN", + "shipper": "micron memory japan, k.k" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90). Manufacturing vs measuring function: machines that modify the wafer (8486) against instruments that measure or inspect without modifying it (9030.82, 9031.41, 9031.80); for in-line tools the principal function decides.", + "candidate_set": { + "codes": [ + "903090", + "903180", + "903082", + "903141" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9030_measurement_splits", + "process_vs_metrology" + ], + "frozen_id": "v2.0.train.0752", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903082", + "id": "SH-0752", + "justification_text": "Goods classified under HS 9030.82; corroborated by 10 customs rulings on comparable goods across 5 jurisdictions.", + "reference_ruling_ids": [ + "CROSS-H192481", + "CROSS-A89407", + "CROSS-N325411", + "CROSS-N325730", + "CROSS-K86983", + "CROSS-R04578", + "EBTI-NL-NLRTD-2007-003541", + "EBTI-DE-DEB/1328/05-1", + "EBTI-EN-0113", + "EBTI-FR-FR-PRO-2011-000421" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Semiconductor wafer-test apparatus: a fully-automatic wafer prober (model UF3000EX) paired with C1D test heads. The prober steps a 200/300 mm wafer under probe needles at ~+/-1 um accuracy so the tester can electrically measure and verify each die before dicing", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Micron Technology", + "part_name": "001 C1D tester(SIG C1D E4450-A)" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-01-21 00:00:00", + "bol_description": "N8_ TPTAGIL36 4082F PARAMETRIC TEST SYSTEM (A1 ITEM : 86)", + "consignee": "infineon technologies kulim s/b", + "declared_hs": "9030829000", + "hs_verified": true, + "origin_country": "JAPAN", + "port_dest": "KULIM", + "port_origin": "KULIM", + "shipper": "infineon tech. kulim sdn.bhd" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903090", + "903149", + "903141", + "903082" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0753", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903082", + "id": "SH-0753", + "justification_text": "Goods classified under HS 9030.82; corroborated by 10 customs rulings on comparable goods across 5 jurisdictions.", + "reference_ruling_ids": [ + "CROSS-H192481", + "CROSS-A89407", + "CROSS-N325411", + "CROSS-N325730", + "CROSS-K86983", + "EBTI-EN-0113", + "CROSS-R04578", + "EBTI-DE-DEB/1328/05-1", + "EBTI-FR-FR-PRO-2011-000421", + "EBTI-NL-NLRTD-2007-003541" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Parametric test system (TPTAGIL36 4082F): a semiconductor parametric/DC-characterisation tester that measures device electrical parameters (I-V, leakage, threshold) at wafer level", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Infineon Technologies", + "part_name": "N8_ TPTAGIL364082F parametric test" + } + }, + { + "bol_metadata": { + "arrival_date": "2024-12-20 00:00:00", + "bol_description": "2600-PCT-4B_303208 HIGH VOLTAGE AND CURRENT PARAMETRIC CURVE TRACER(S/NO.4653345)", + "consignee": "tektronix india private limited", + "declared_hs": "90308200", + "hs_verified": true, + "origin_country": "CHINA MAINLAND", + "port_dest": "BANGALORE ACC INBLR4", + "port_origin": "PADANG", + "shipper": "tektronix international sales gmbh" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903082", + "903141", + "903090", + "903190" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0754", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903082", + "id": "SH-0754", + "justification_text": "Goods classified under HS 9030.82; corroborated by 6 customs rulings on comparable goods (EU-EN, EU-NL, US).", + "reference_ruling_ids": [ + "CROSS-H192481", + "CROSS-A89407", + "EBTI-EN-0113", + "CROSS-N325411", + "CROSS-N325730", + "EBTI-NL-NLRTD-2007-003541" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A high-voltage/high-current parametric curve tracer (type 2600-PCT-4B): a SourceMeter-SMU-based instrument that traces the I-V characteristics of power semiconductor devices (MOSFETs, IGBTs, diodes), with configurable ranges up to ~3 kV and ~10-100 A for breakdown, on-state and capacitance measurements. Serial 4653345", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Tektronix", + "part_name": "2600-PCT-4B 303208 high voltage and" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-09 00:00:00", + "bol_description": "MAXTC PP G4 -220V 50HZ FOR ATE/BENCH - S/N", + "consignee": "m/s m d mechanical devices ltd", + "declared_hs": "90308200", + "hs_verified": true, + "origin_country": "INDIA", + "port_dest": "TEL AVIV YAFO", + "port_origin": "INBLR4", + "shipper": "qualcomm india private limited" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903090", + "903141", + "903082", + "903190" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0755", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903082", + "id": "SH-0755", + "justification_text": "Goods classified under HS 9030.82; corroborated by 6 customs rulings on comparable goods (EU-FR, EU-NL, US).", + "reference_ruling_ids": [ + "CROSS-H192481", + "CROSS-N325411", + "CROSS-N325730", + "CROSS-A89407", + "EBTI-FR-FR-PRO-2011-000421", + "EBTI-NL-NLRTD-2007-003541" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Thermal-control unit (MAXTC PP G4, 220 V) for ATE/bench: a temperature-forcing unit that sets and holds a device's temperature during automated/bench test", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Qualcomm", + "part_name": "maxtc PP G4 -220V 50HZ for ATE/bench" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-30 00:00:00", + "bol_description": "AA,CRB,ARL-P DDR5SODIMM RVP,PPV (TESTER)(QTY: )", + "consignee": "intel technology sdn bhd", + "declared_hs": "9030829000", + "hs_verified": true, + "origin_country": "MALAYSIA", + "port_dest": "KULIM", + "port_origin": "PENANG GEORGETOWN", + "shipper": "intel technology sdn bhd" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903090", + "903190", + "903082", + "903149" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0756", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903082", + "id": "SH-0756", + "justification_text": "Goods classified under HS 9030.82; corroborated by 9 customs rulings on comparable goods (EU-EN, EU-FR, EU-NL, US).", + "reference_ruling_ids": [ + "CROSS-H192481", + "CROSS-N325411", + "CROSS-N325730", + "CROSS-A89407", + "CROSS-E81071", + "CROSS-R04578", + "EBTI-EN-0113", + "EBTI-FR-FR-PRO-2011-000421", + "EBTI-NL-NLRTD-2007-003541" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Reference/test board (ARL-P DDR5 SODIMM RVP, CRB): a reference validation platform board used to functionally test/validate a processor and its DDR5 memory interface during product development. It is supplied as a replacement or spare component for the parent semiconductor tool rather than as standalone equipment, and is fitted, consumed or maintained during normal tool operation", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Intel", + "part_name": "AA CRB ARL-P DDR5SODIMM RVP PPV (tester)" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-29 00:00:00", + "bol_description": "HPCC,INTEGRATED,FAB D,1.5,IMR,CONV(TESTER) (QTY: )", + "consignee": "intel technology sdn bhd", + "declared_hs": "9030829000", + "hs_verified": true, + "origin_country": "MALAYSIA", + "port_dest": "KULIM", + "port_origin": "PENANG GEORGETOWN", + "shipper": "intel technology sdn bhd" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903090", + "903149", + "903141", + "903082" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0757", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903082", + "id": "SH-0757", + "justification_text": "Goods classified under HS 9030.82; corroborated by 7 customs rulings on comparable goods (EU-EN, EU-FR, EU-NL, US).", + "reference_ruling_ids": [ + "CROSS-H192481", + "CROSS-N325730", + "CROSS-A89407", + "CROSS-N325411", + "EBTI-EN-0113", + "EBTI-FR-FR-PRO-2011-000421", + "EBTI-NL-NLRTD-2007-003541" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "High-density test interface unit (HPCC, integrated): an automated-test-equipment interface/controller unit used to test semiconductor devices at high parallelism. It is supplied as a replacement or spare component for the parent semiconductor tool rather than as standalone equipment, and is fitted, consumed or maintained during normal tool operation", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Intel", + "part_name": "hpcc integrated FAB D 1.5 IMR" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-29 00:00:00", + "bol_description": "AA,HDMT RCTC3,FAB A,IMR(TESTER) (QTY: )", + "consignee": "intel technology sdn bhd", + "declared_hs": "9030829000", + "hs_verified": true, + "origin_country": "MALAYSIA", + "port_dest": "KULIM", + "port_origin": "PENANG GEORGETOWN", + "shipper": "intel technology sdn bhd" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903180", + "903090", + "903149", + "903082" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0758", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903082", + "id": "SH-0758", + "justification_text": "Goods classified under HS 9030.82; corroborated by 8 customs rulings on comparable goods (EU-EN, EU-FR, EU-NL, US).", + "reference_ruling_ids": [ + "CROSS-H192481", + "CROSS-A89407", + "CROSS-N325411", + "CROSS-N325730", + "CROSS-R04578", + "EBTI-EN-0113", + "EBTI-FR-FR-PRO-2011-000421", + "EBTI-NL-NLRTD-2007-003541" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "High-density modular tester unit (HDMT RCTC3): an ATE module/unit that applies stimulus and measures responses to test semiconductor devices. It is supplied as a replacement or spare component for the parent semiconductor tool rather than as standalone equipment, and is fitted, consumed or maintained during normal tool operation", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Intel", + "part_name": "AA hdmt RCTC3 FAB A IMR(tester)" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-29 00:00:00", + "bol_description": "HBI,PSDB(TESTER) (QTY: )", + "consignee": "intel technology sdn bhd", + "declared_hs": "9030829000", + "hs_verified": true, + "origin_country": "MALAYSIA", + "port_dest": "KULIM", + "port_origin": "PENANG GEORGETOWN", + "shipper": "intel technology sdn bhd" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903090", + "903141", + "903082", + "903190" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0759", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903082", + "id": "SH-0759", + "justification_text": "Goods classified under HS 9030.82; corroborated by 10 customs rulings on comparable goods across 5 jurisdictions.", + "reference_ruling_ids": [ + "CROSS-H192481", + "CROSS-A89407", + "CROSS-N325411", + "CROSS-N325730", + "CROSS-E81071", + "EBTI-EN-0113", + "CROSS-R04578", + "EBTI-DE-DEB/1328/05-1", + "EBTI-FR-FR-PRO-2011-000421", + "EBTI-NL-NLRTD-2007-003541" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Tester power/sequencing board (HBI, PSDB): a power-sequencing/distribution board unit for a high-density semiconductor test system. It is supplied as a replacement or spare component for the parent semiconductor tool rather than as standalone equipment, and is fitted, consumed or maintained during normal tool operation", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Intel", + "part_name": "HBI psdb(tester)" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903082", + "903090", + "903033", + "903039" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0760", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903082", + "id": "SH-0760", + "justification_text": "The product falls under HS 9030.82 (Instruments for measuring semiconductor wafers or devices).", + "reference_ruling_ids": [ + "CROSS-H192481", + "CROSS-A89407", + "EBTI-EN-0113", + "CROSS-N325411", + "CROSS-N325730", + "EBTI-NL-NLRTD-2007-003541" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A bench analyzer instrument for testing triacs and thyristors, identifying device type, pinout and trigger characteristics. 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Classified under HS 9030.82.", + "reference_ruling_ids": [ + "CROSS-A89407", + "CROSS-H192481", + "CROSS-N325411", + "CROSS-N325730", + "EBTI-EN-0113", + "EBTI-FR-FR-PRO-2011-000421", + "EBTI-NL-NLRTD-2007-003541" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Thirty-six-month node-locked software subscription license tied to electronic test and measurement equipment used in semiconductor characterization. The line represents a time-limited right to use software on a single designated host, an intangible entitlement rather than a tangible product", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Keysight Technologies", + "part_name": "R 001-Y 36-months node-locked" + } + }, + { + "bol_metadata": { + "bol_description": "R-9AS-103 3 YEARS ON-SITE SYSTEM CALIBRATION AGREEMENT, COMMERCIAL GRADE, 2X PER YEAR", + "origin_country": "USA", + "shipper": "keysight technologies malaysia sdn bhd" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903040", + "903090", + "903082", + "903084" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "low", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0777", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903082", + "id": "SH-0777", + "justification_text": "The line describes calibration service or service contract charges, not imported merchandise; classify the underlying physical goods if separately imported. Classified under HS 9030.82.", + "reference_ruling_ids": [ + "CROSS-A89407", + "CROSS-N325411", + "CROSS-N325730", + "CROSS-H192481", + "EBTI-EN-0113", + "EBTI-DE-DEB/1328/05-1", + "EBTI-FR-FR-PRO-2011-000421", + "EBTI-NL-NLRTD-2007-003541" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Three-year on-site calibration agreement, commercial grade, providing twice-yearly scheduled calibration of an electronic measurement test system at the customer site. 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The equipment loads, aligns and positions semiconductor wafers and brings precision probe needles into contact with individual die so that connected test instruments can electrically measure and check device and integrated-circuit characteristics during production", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Rochester Electronics", + "part_name": "wafer probers" + } + }, + { + "bol_metadata": { + "bol_description": "OPUS3 SEMICS OPUS3 WAFER PROBER SYSTEM (TESTING EQUIPMENT)(1UNIT)PROBER SYSTEM USING FOR TESTING OF SEMICONDUCTOR DEVICS", + "origin_country": "KR", + "shipper": "semics, inc" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903033", + "903040", + "903082", + "903084" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0782", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903082", + "id": "SH-0782", + "justification_text": "Complete instruments for measuring or checking semiconductor wafers or devices are classified under 9030.82. 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It is used in laboratory, manufacturing and field environments for analysis of electrical energy, transient events and component performance with results stored for later review", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Hioki", + "part_name": "ОСЦИЛОСКОПИ СПЕКТРОАНАЛІЗАТОРИ ТА ІНШІ" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903039", + "903090", + "903082", + "903040" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0785", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0785", + "justification_text": "The product falls under HS 9030.90 (Parts/accessories of heading 9030 instruments).", + "reference_ruling_ids": [ + "CROSS-H268513", + "CROSS-859957", + "EBTI-PL-PLPL-WIT-2016-00809" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A BNC-to-probe-tip adapter accessory that connects a BNC instrument input to a fine probe tip for signal measurement. It provides a convenient coaxial probing interface for oscilloscopes and test instruments (part 013036700)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Tektronix", + "part_name": "013036700" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903082", + "903033", + "903090", + "903084" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0786", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0786", + "justification_text": "The product falls under HS 9030.90 (Parts/accessories of heading 9030 instruments).", + "reference_ruling_ids": [ + "CROSS-H268513" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "An AC/DC current probe amplifier covering DC to 100 MHz that conditions and powers a current-sensing probe for oscilloscope measurement. It enables wideband current waveform measurement in power-electronics and circuit testing (part TCPA300)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Tektronix", + "part_name": "TCPA300" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903033", + "903090", + "903040", + "903039" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0787", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0787", + "justification_text": "The product falls under HS 9030.90 (Parts/accessories of heading 9030 instruments).", + "reference_ruling_ids": [ + "CROSS-H268513", + "CROSS-859957", + "EBTI-PL-PLPL-WIT-2016-00809" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A three-channel power-supply adapter accessory that powers a set of AC/DC current probes from a single source. It simplifies powering and managing multiple current-measurement probes in oscilloscope and test setups (part N2779A)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Keysight Technologies", + "part_name": "N2779A" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903084", + "903082", + "903040", + "903090" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0788", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0788", + "justification_text": "The product falls under HS 9030.90 (Parts/accessories of heading 9030 instruments).", + "reference_ruling_ids": [ + "CROSS-H268513", + "CROSS-859957", + "EBTI-PL-PLPL-WIT-2016-00809" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A BNC jack probe adapter accessory that connects a test probe to BNC-input instruments such as oscilloscopes. It provides a convenient coaxial interface for signal measurement and probing in test and laboratory setups (part 0309-0006)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Beehive Electronics", + "part_name": "0309-0006" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90). HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "903082", + "903040", + "903090", + "903084" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits", + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0789", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0789", + "justification_text": "The product falls under HS 9030.90 (Parts/accessories of heading 9030 instruments).", + "reference_ruling_ids": [ + "CROSS-H268513", + "CROSS-859957", + "EBTI-PL-PLPL-WIT-2016-00809" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A test-accessory adapter for use with flexible AC current probes (models 24-3001 and 24-3002), converting the probe's banana-style output to a BNC connection. It lets the flexible current sensor interface with oscilloscopes, power recorders and other instruments fitted with BNC inputs, supporting AC current measurement in electrical and power-quality testing applications. Part number 2118.46", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "AEMC Instruments", + "part_name": "2118.46" + } + }, + { + "bol_metadata": { + "bol_description": "4-CH 1MS/1S 16BIT ISOLATION MODULE MODEL", + "origin_country": "JP", + "shipper": "yokogawa test & measurment corporation" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903033", + "903039", + "903040", + "903090" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0790", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0790", + "justification_text": "An isolated input module for an electrical measurement mainframe is a part/accessory of heading 9030 under 9030.90, not a complete 9030.40 telecom tester. Classified under HS 9030.90.", + "reference_ruling_ids": [ + "CROSS-H268513" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Four-channel isolated signal-input plug-in module with 16-bit resolution and high sampling rate (up to 10 MS/s), providing channel-to-channel galvanic isolation for high-voltage inputs up to several hundred volts. Designed to slot into a multi-channel waveform-recording measuring mainframe for testing power supplies and generators", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Yokogawa Test & Measurement", + "part_name": "4-CH 1MS/1S 16BIT isolation module model" + } + }, + { + "bol_metadata": { + "bol_description": "REPAIR / REPLACEMENT / CALIBRATION Part of Smart Bench Marker Testing & Automated QOS Monitoring System Computer SlideIn Module V3 Ser", + "origin_country": "DE", + "shipper": "rohde & schwarz pakistan pvt. limited" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903084", + "903090", + "903039", + "903033" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0791", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0791", + "justification_text": "A processing module for a network QoS monitoring system is a part/accessory of heading 9030 test apparatus, not a complete 9030.40 instrument. Classified under HS 9030.90.", + "reference_ruling_ids": [ + "CROSS-H268513", + "CROSS-859957" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Computer slide-in processing module forming part of a mobile-network drive-test and automated quality-of-service monitoring system. The rack-mounted module hosts the control and data-processing electronics that drive measurement instruments for benchmarking cellular network performance. Returned for repair, replacement or calibration as a subassembly of the larger telecom test platform", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Rohde & Schwarz", + "part_name": "repair / replacement / calibration Part" + } + }, + { + "bol_metadata": { + "bol_description": "HLA UHC4-T DC-SCALE", + "origin_country": "JP", + "shipper": "advantest europe gmbh" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903033", + "903082", + "903090", + "903039" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0792", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0792", + "justification_text": "A source/measure card is a module or accessory for electrical semiconductor test apparatus, not a complete 9030.82 tester. Classified under HS 9030.90.", + "reference_ruling_ids": [ + "CROSS-H268513", + "CROSS-859957" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Ultra-high-current DC source/measure card for a semiconductor system-on-chip automated test system. The pluggable instrument card delivers high-current programmable DC power to devices under test and measures their electrical response during production test of high-power chips such as AI accelerators, processors and GPUs. Subassembly that conditions and checks semiconductor device parameters", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Advantest", + "part_name": "HLA UHC4-T DC-scale" + } + }, + { + "bol_metadata": { + "bol_description": "TBR MSDPS DAUGHTER", + "origin_country": "Japan", + "shipper": "advantest singapore pte ltd" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903082", + "903084", + "903090", + "903039" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0793", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0793", + "justification_text": "A daughter board or measurement module is a part/accessory of semiconductor test apparatus under 9030.90, not a complete 9030.82 tester. Classified under HS 9030.90.", + "reference_ruling_ids": [ + "CROSS-H268513", + "CROSS-859957", + "CROSS-N004060", + "CROSS-M84952" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Daughter board / pluggable instrument module for a semiconductor automated test system, providing source and measurement channels used during electrical test of integrated-circuit devices. Functions as a subassembly that delivers stimulus and captures measurements when checking semiconductor wafers or packaged devices on the tester", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Advantest", + "part_name": "TBR msdps daughter" + } + }, + { + "bol_metadata": { + "bol_description": "BOTTOM GUIDING TURN", + "origin_country": "US", + "shipper": "cohu malaysia sdn bhd" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903082", + "903033", + "903039", + "903090" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0794", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0794", + "justification_text": "A guide component for semiconductor test equipment is a part/accessory of heading 9030 under 9030.90, not a complete 9030.82 tester. Classified under HS 9030.90.", + "reference_ruling_ids": [ + "CROSS-H268513", + "CROSS-859957" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Mechanical guide component for an automated semiconductor device test handler. The part directs and reorients packaged devices along the handler transport path during loading and unloading, forming a structural guiding element of the device-handling mechanism used in integrated-circuit testing", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Cohu", + "part_name": "bottom guiding turn" + } + }, + { + "bol_metadata": { + "bol_description": "UPG CPU050 TO RS01", + "origin_country": "US", + "shipper": "cohu malaysia sdn bhd" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903040", + "903033", + "903039", + "903090" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0795", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0795", + "justification_text": "A CPU or controller upgrade kit dedicated to semiconductor test equipment is a 9030.90 part/accessory, not a complete 9030.82 apparatus. Classified under HS 9030.90.", + "reference_ruling_ids": [ + "CROSS-H268513", + "CROSS-859957" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Processing-unit upgrade kit for an automated semiconductor device test handler, replacing the existing controller module with a newer revision. The kit comprises control electronics that govern handler motion sequencing and test-site operation, supplied as a field upgrade to the device-handling system used in integrated-circuit testing", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Cohu", + "part_name": "UPG CPU050 to RS01" + } + }, + { + "bol_metadata": { + "bol_description": "ACP40-GSG-1000,PROBE ACP,40 GHZ,GS,1000 AU", + "origin_country": "US", + "shipper": "formfactor inc" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903084", + "903039", + "903040", + "903090" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0796", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0796", + "justification_text": "Wafer probes are accessories for electrical semiconductor test instruments and fall under 9030.90, not complete 9030.82 apparatus. Classified under HS 9030.90.", + "reference_ruling_ids": [ + "CROSS-H268513", + "CROSS-N004060" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Air coplanar microwave wafer probe with a ground-signal-ground tip configuration rated to 40 GHz and a 2.92 mm precision coaxial connector. The compliant tip enables repeatable on-wafer contact for high-frequency electrical measurement and signal-integrity characterization of semiconductor devices at the wafer level", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "FormFactor", + "part_name": "ACP40-GSG-1000 probe ACP 40 GHZ GS 1000" + } + }, + { + "bol_metadata": { + "bol_description": "PROBE ACP 40", + "origin_country": "US", + "shipper": "formfactor" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903084", + "903040", + "903090", + "903033" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0797", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0797", + "justification_text": "Wafer probes are accessories for electrical semiconductor test instruments and fall under 9030.90, not complete 9030.82 apparatus. Classified under HS 9030.90.", + "reference_ruling_ids": [ + "CROSS-H268513", + "CROSS-N004060" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Air coplanar microwave wafer probe rated to 40 GHz with a compliant precision tip for on-wafer contact. The probe provides low-loss, repeatable high-frequency connection to semiconductor device pads for electrical measurement and characterization at the wafer level", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "FormFactor", + "part_name": "probe ACP 40" + } + }, + { + "bol_metadata": { + "bol_description": "PZ2130A-ATO-93382 SL/NO- 5-CHPRE", + "origin_country": "US", + "shipper": "keysight technologies india private limited" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903084", + "903090", + "903082", + "903040" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0798", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0798", + "justification_text": "A source/measure unit module is a part/accessory of electrical test instruments under 9030.90, not a complete 9030.82 apparatus. Classified under HS 9030.90.", + "reference_ruling_ids": [ + "CROSS-H268513" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "High-density precision source/measure unit module providing five channels in a compact rack form, sourcing up to 30 V and 500 mA with current resolution down to the picoampere range. Used to source voltage or current and simultaneously measure electrical parameters during semiconductor reliability and integrated-circuit testing on wafers and packaged devices", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Keysight Technologies", + "part_name": "PZ2130A-ATO-93382 SL/NO- 5-chpre" + } + }, + { + "bol_metadata": { + "bol_description": "CONVERT A 4200 MAINFRAME TO 4200A MAINFRAME(P/NO.4200A-MF-UP_424765)(FOR TESTING AND MEASURING EQUIPMENT)CONVERT A", + "origin_country": "US", + "shipper": "tektronix inc" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903082", + "903084", + "903090", + "903040" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "low", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0799", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0799", + "justification_text": "A parameter-analyzer upgrade kit is a part/accessory of 9030 instruments if physical; service-only elements are not classifiable as goods. Classified under HS 9030.90.", + "reference_ruling_ids": [ + "CROSS-H268513" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Upgrade kit and conversion service to migrate an earlier-generation semiconductor parameter analyzer mainframe to the current-generation mainframe. The upgrade enhances the testing-and-measuring instrument used for current-voltage and capacitance-voltage characterization of semiconductor devices and materials", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Tektronix", + "part_name": "convert A 4200 mainframe to 4200A" + } + }, + { + "bol_metadata": { + "bol_description": "MMCI TESTER MATRIX RACK (TEST EQUIP(ITEM: 4", + "origin_country": "USA", + "shipper": "teradyne gmbh" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903084", + "903090", + "903033", + "903040" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0800", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0800", + "justification_text": "A tester matrix rack subassembly is a part/accessory of electrical semiconductor test apparatus under 9030.90, not a complete 9030.82 tester. Classified under HS 9030.90.", + "reference_ruling_ids": [ + "CROSS-H268513", + "CROSS-859957", + "CROSS-N004060" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Tester matrix rack subassembly forming part of automated test equipment for semiconductor components. The rack houses signal-routing and switching matrix hardware that interconnects test instruments to the devices under test, supporting electrical measurement and checking of integrated circuits during production testing", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Teradyne", + "part_name": "mmci tester matrix rack (test" + } + }, + { + "bol_metadata": { + "bol_description": "DEVICE SUPPORT PLATE FOR IC HANDLING SYSTEM", + "origin_country": "US", + "shipper": "cohu gmbh" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90). Part attribution: an identifiable part of a specific machine (8486.90, 8538.90, 9030.90, 9031.90) vs a general-use metal article (7320.90, 7326.90, 7616.99); the Section XV exclusions and Section XVI Note 2 decide.", + "candidate_set": { + "codes": [ + "903040", + "903039", + "903090", + "903084" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits", + "parts_attribution" + ], + "frozen_id": "v2.0.train.0801", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0801", + "justification_text": "Parts and accessories of electrical measuring or checking instruments of heading 9030 fall under 9030.90. Classified under HS 9030.90.", + "reference_ruling_ids": [ + "CROSS-H268513", + "CROSS-859957" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Precision-machined support plate used in an automated integrated-circuit handling system to position and stabilize device during electrical test. Typically fabricated from aluminum or stainless steel with close tolerances and locating features, it serves as a structural change-kit component that holds the device under test in the correct orientation relative to the test contactor and pick-and-place mechanism", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Cohu", + "part_name": "device support plate for IC handling" + } + }, + { + "bol_metadata": { + "bol_description": "CAL PL ASSY MATRIX SH 1.00EA", + "origin_country": "US", + "shipper": "cohu malaysia sdn bhd" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903090", + "903039", + "903084", + "903033" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0802", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0802", + "justification_text": "Parts and accessories of electrical measuring or checking instruments of heading 9030 fall under 9030.90. Classified under HS 9030.90.", + "reference_ruling_ids": [ + "CROSS-H268513", + "CROSS-859957" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Calibration plate assembly with a matrix layout, used to verify and align an automated semiconductor test handler. The metal plate carries a grid of reference positions or fiducials enabling the handler vision and placement systems to be calibrated for accurate device pick, placement and contact. It functions as a precision setup and accuracy-checking accessory for the handling and test equipment", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Cohu", + "part_name": "CAL PL assy matrix SH 1" + } + }, + { + "bol_metadata": { + "bol_description": "KNOB INDEX` 25.00EA", + "origin_country": "US", + "shipper": "cohu malaysia sdn bhd" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903039", + "903084", + "903040", + "903090" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0803", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0803", + "justification_text": "Parts and accessories of electrical measuring or checking instruments of heading 9030 fall under 9030.90. Classified under HS 9030.90.", + "reference_ruling_ids": [ + "CROSS-H268513", + "CROSS-859957" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Indexing knob, an operator-adjustable control component used to set or lock discrete positions on an automated semiconductor test handler. Generally molded or machined with a knurled grip and a detent or graduated index mechanism, it allows manual fine positioning or fixture adjustment as part of the handler's setup hardware. It is a mechanical accessory of the test-handling machine", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Cohu", + "part_name": "knob index 25" + } + }, + { + "bol_metadata": { + "bol_description": "NEST NT-M D10 QFN2.25X2.25 235/235 526 2.00EA", + "origin_country": "US", + "shipper": "cohu malaysia sdn bhd" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903084", + "903090", + "903033", + "903039" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0804", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0804", + "justification_text": "Parts and accessories of electrical measuring or checking instruments of heading 9030 fall under 9030.90. Classified under HS 9030.90.", + "reference_ruling_ids": [ + "CROSS-H268513", + "CROSS-859957" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Device nest sized for a QFN of approximately 2.25 by 2.25 millimeters, used in an automated semiconductor test handler. The nest is a precision pocketed insert that cradles and aligns the leadless device under test, holding it in correct registration to the test contactor during pick-and-place electrical testing. It is a -specific change-kit component of the handler", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Cohu", + "part_name": "nest NT-M D10 QFN2.25X2.25 235/235 526 2" + } + }, + { + "bol_metadata": { + "bol_description": "LEAD BACKER TOP LOADER GRID ARRAY 16.00EA", + "origin_country": "US", + "shipper": "cohu malaysia sdn bhd" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903033", + "903082", + "903084", + "903090" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0805", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0805", + "justification_text": "Parts and accessories of electrical measuring or checking instruments of heading 9030 fall under 9030.90. Classified under HS 9030.90.", + "reference_ruling_ids": [ + "CROSS-H268513", + "CROSS-859957" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Top lead backer for grid-array, a precision insert used in a semiconductor test contactor or handler to support and present the leads or balls against the contact pins during electrical test. It backs the device from above to ensure uniform contact force and correct alignment of the grid-array terminals, functioning", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Cohu", + "part_name": "lead backer TOP loader grid array 16" + } + }, + { + "bol_metadata": { + "bol_description": "LEAD BACKER TOP QUAD FLAT NO LEAD 40.00EA", + "origin_country": "US", + "shipper": "cohu malaysia sdn bhd" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903082", + "903090", + "903039", + "903084" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0806", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0806", + "justification_text": "Parts and accessories of electrical measuring or checking instruments of heading 9030 fall under 9030.90. Classified under HS 9030.90.", + "reference_ruling_ids": [ + "CROSS-H268513", + "CROSS-859957" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Top lead backer for quad flat no-lead (QFN), a precision support insert used in a semiconductor test handler or contactor to hold and back the leadless device terminals against the contact pins during electrical test. It maintains uniform contact pressure and accurate terminal registration, serving", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Cohu", + "part_name": "lead backer TOP quad flat NO lead 40" + } + }, + { + "bol_metadata": { + "bol_description": "LB BASE 6DOF (LEAD BACKER BASE) - 3.00EA", + "origin_country": "US", + "shipper": "cohu malaysia sdn bhd" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903084", + "903090", + "903033", + "903040" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0807", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0807", + "justification_text": "Parts and accessories of electrical measuring or checking instruments of heading 9030 fall under 9030.90. Classified under HS 9030.90.", + "reference_ruling_ids": [ + "CROSS-H268513", + "CROSS-859957" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Lead backer base providing six degrees of freedom adjustment, a precision mounting platform used in a semiconductor test handler or contactor. The base supports the lead backer insert and allows fine alignment in multiple axes so the device terminals make consistent, planar contact with the test pins. It is a structural change-kit component of the automated test-handling machine", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Cohu", + "part_name": "LB base 6DOF (lead backer base) - 3" + } + }, + { + "bol_metadata": { + "bol_description": "BASE TRACK PLUNGER EXIT REAL PLUNGE TO BOARD 2.00EA", + "origin_country": "US", + "shipper": "cohu malaysia sdn bhd" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903090", + "903040", + "903039", + "903082" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0808", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0808", + "justification_text": "Parts and accessories of electrical measuring or checking instruments of heading 9030 fall under 9030.90. Classified under HS 9030.90.", + "reference_ruling_ids": [ + "CROSS-H268513", + "CROSS-859957", + "CROSS-M84952" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Base track plunger exit component, a precision mechanical guide used in an automated semiconductor test handler to direct a device as it is plunged from the track onto the contact board. It forms part of the device transport and contacting path, ensuring controlled motion and correct seating of the during test. It is a dedicated change-kit hardware part of the handler", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Cohu", + "part_name": "base track plunger exit real plunge to" + } + }, + { + "bol_metadata": { + "bol_description": "METER ACCESSORIES AC RECTIFIER", + "origin_country": "TW", + "shipper": "der ee electrical instrument co ltd" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903090", + "903039", + "903082", + "903040" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0809", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0809", + "justification_text": "Parts and accessories of electrical measuring or checking instruments of heading 9030 fall under 9030.90. Classified under HS 9030.90.", + "reference_ruling_ids": [ + "CROSS-H268513" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Meter accessories including an AC rectifier element, supplied for use with electrical measuring meters. The rectifier converts alternating current to direct current so AC quantities can be read on a measuring instrument, and the accessories support voltage, current and resistance measurement. These are auxiliary parts and accessories for electrical measuring and checking instruments", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "DER EE Electrical Instrument", + "part_name": "meter accessories AC rectifier" + } + }, + { + "bol_metadata": { + "bol_description": "Test Lid - MGR/MTL S682/MTL PS682", + "origin_country": "JP", + "shipper": "enplas tech solutions, inc" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903082", + "903039", + "903084", + "903090" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0810", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0810", + "justification_text": "Parts and accessories of electrical measuring or checking instruments of heading 9030 fall under 9030.90. Classified under HS 9030.90.", + "reference_ruling_ids": [ + "CROSS-H268513", + "CROSS-859957" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Hand test lid for an LGA socket with approximately 3837 contacts, a clamshell-style cover used on a manually operated semiconductor test socket. When closed by hand it presses the land-grid-array device against the socket contact pins to establish electrical connection for functional or characterization testing. It is a precision mechanical part of the test contactor assembly", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Enplas", + "part_name": "Hand Test Lid - MGR/MTL S682/MTL PS682" + } + }, + { + "bol_metadata": { + "bol_description": "STIFFENER PLATE", + "origin_country": "JP", + "shipper": "enplas tech solutions, inc" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903084", + "903040", + "903033", + "903090" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0811", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0811", + "justification_text": "Parts and accessories of electrical measuring or checking instruments of heading 9030 fall under 9030.90. Classified under HS 9030.90.", + "reference_ruling_ids": [ + "CROSS-H268513", + "CROSS-M84952", + "CROSS-859957" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Stiffener plate, a flat stainless-steel backing plate mounted to the underside of a semiconductor test or burn-in socket assembly. It reinforces the load board or socket structure to prevent warping and maintain planarity under contact and clamping forces during device testing. It is a precision structural part of the test-socket hardware used with semiconductor checking equipment", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Enplas", + "part_name": "stiffener plate" + } + }, + { + "bol_metadata": { + "bol_description": "Lake S BGA HDBI HTL", + "origin_country": "JP", + "shipper": "enplas tech solutions, inc" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903040", + "903090", + "903039", + "903082" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0812", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0812", + "justification_text": "Parts and accessories of electrical measuring or checking instruments of heading 9030 fall under 9030.90. Classified under HS 9030.90.", + "reference_ruling_ids": [ + "CROSS-H268513", + "CROSS-859957" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "BGA test socket interface for a ball-grid-array of approximately 1720 balls at 0.65 mm pitch, configured as a high-density burn-in or hi-fix test contactor. It seats the device and connects each solder ball to probe contact pins for electrical and reliability testing of an advanced processor. It is a precision -specific test-contactor component for semiconductor checking equipment", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Enplas", + "part_name": "BGA-1720(2114C)-0.65-001-01" + } + }, + { + "bol_metadata": { + "bol_description": "Change Kit - PEI- Molded", + "origin_country": "JP", + "shipper": "enplas tech solutions, inc" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90). HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "903039", + "903090", + "903084", + "903033" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits", + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0813", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0813", + "justification_text": "Parts and accessories of electrical measuring or checking instruments of heading 9030 fall under 9030.90. Classified under HS 9030.90.", + "reference_ruling_ids": [ + "CROSS-H268513", + "CROSS-859957", + "CROSS-M84952" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A molded high-burn-in change kit fabricated from polyetherimide (PEI) engineering plastic, configured as a device-specific module for high-density burn-in test equipment. The kit holds an integrated-circuit in position and transfers mechanical force and thermal load between the device and the test contactor during burn-in, ensuring stable electrical contact across temperature cycling. It is a consumable tooling component dedicated to semiconductor device testing apparatus", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Enplas", + "part_name": "HBI Change Kit - PEI- Molded" + } + }, + { + "bol_metadata": { + "bol_description": "HDBI Hand Test Lid", + "origin_country": "JP", + "shipper": "enplas tech solutions, inc" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90). Part attribution: an identifiable part of a specific machine (8486.90, 8538.90, 9030.90, 9031.90) vs a general-use metal article (7320.90, 7326.90, 7616.99); the Section XV exclusions and Section XVI Note 2 decide.", + "candidate_set": { + "codes": [ + "903039", + "903090", + "903040", + "903033" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits", + "parts_attribution" + ], + "frozen_id": "v2.0.train.0814", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0814", + "justification_text": "Parts and accessories of electrical measuring or checking instruments of heading 9030 fall under 9030.90. Classified under HS 9030.90.", + "reference_ruling_ids": [ + "CROSS-H268513", + "CROSS-859957" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A manually operated hand test lid designed for a high-density burn-in test fixture, identified by a ball-grid-array socket configuration with 0.7 mm contact pitch. The lid clamps over a semiconductor seated in the test socket, applying controlled downward force to maintain reliable electrical contact between the device terminals and the socket probes during functional or burn-in testing. It is a device-specific accessory for semiconductor test apparatus", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Enplas", + "part_name": "Battlemage-G21 HDBI Hand Test Lid" + } + }, + { + "bol_metadata": { + "bol_description": "Test Lid, Stainless Steel, Aluminum, Beryllium, Copper, 128x114x58mm, to hold Intel chip in test socket", + "origin_country": "JP", + "shipper": "enplas tech solutions, inc" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90). Part attribution: an identifiable part of a specific machine (8486.90, 8538.90, 9030.90, 9031.90) vs a general-use metal article (7320.90, 7326.90, 7616.99); the Section XV exclusions and Section XVI Note 2 decide.", + "candidate_set": { + "codes": [ + "903084", + "903090", + "903033", + "903039" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits", + "parts_attribution" + ], + "frozen_id": "v2.0.train.0815", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0815", + "justification_text": "Parts and accessories of electrical measuring or checking instruments of heading 9030 fall under 9030.90. Classified under HS 9030.90.", + "reference_ruling_ids": [ + "CROSS-H268513", + "CROSS-859957" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A manually operated hand test lid measuring approximately 128 x 114 x 58 mm, constructed from stainless steel, aluminium, and beryllium-copper alloy. Designed for a land-grid-array socket with 0.94 mm pitch, it holds a microprocessor within a test socket and applies clamping force to secure reliable electrical contact during device testing. The mixed-metal build provides rigidity, thermal management, and spring contact functionality for semiconductor test apparatus", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Enplas", + "part_name": "Hand Test Lid Stainless Steel Aluminum" + } + }, + { + "bol_metadata": { + "bol_description": "CHANGE KIT - PEI- MOLDED, device kit module, use to force and transfer thermal, for the HDBI machine", + "origin_country": "JP", + "shipper": "enplas tech solutions, inc" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90). HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "903082", + "903090", + "903033", + "903084" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits", + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0816", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0816", + "justification_text": "Parts and accessories of electrical measuring or checking instruments of heading 9030 fall under 9030.90. Classified under HS 9030.90.", + "reference_ruling_ids": [ + "CROSS-H268513", + "CROSS-859957", + "CROSS-M84952" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A molded device change kit made of polyetherimide (PEI) engineering resin, serving as an interchangeable module for high-density burn-in test machines. The kit positions an integrated-circuit and transfers applied force and thermal load to the device during burn-in, maintaining stable contact under elevated temperature. It functions as consumable, device-specific tooling within semiconductor burn-in and reliability test apparatus", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Enplas", + "part_name": "HBI CHANGE KIT - PEI- MOLDED device kit" + } + }, + { + "bol_metadata": { + "bol_description": "ALIGNMENT PLATE 1ea", + "origin_country": "TW", + "shipper": "enplas niching technology corp" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903084", + "903040", + "903090", + "903033" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0817", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0817", + "justification_text": "Parts and accessories of electrical measuring or checking instruments of heading 9030 fall under 9030.90. Classified under HS 9030.90.", + "reference_ruling_ids": [ + "CROSS-H268513", + "CROSS-859957" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "An alignment plate used in integrated-circuit test and burn-in sockets, a precision-machined or molded component that locates and centers a semiconductor over the socket contacts before testing. By guiding the device into correct position, it ensures accurate registration of the terminals to the probe pins, supporting reliable electrical contact in semiconductor test apparatus", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Enplas Niching Technology", + "part_name": "alignment plate" + } + }, + { + "bol_metadata": { + "bol_description": "Printed circuit board with electronic components assembled, used to measure and test the characteristics of sockets for microcircuit testing equipment, parts of Modus tester, 100% new", + "origin_country": "JP", + "shipper": "enplas semiconductor peripheral corporation" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903039", + "903090", + "903082", + "903033" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0818", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0818", + "justification_text": "Parts and accessories of electrical measuring or checking instruments of heading 9030 fall under 9030.90. Classified under HS 9030.90.", + "reference_ruling_ids": [ + "CROSS-H268513", + "CROSS-859957", + "CROSS-N004060", + "EBTI-NL-NLRTD-2012-000914", + "CROSS-M84952" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A printed circuit board assembled with electronic components, designed to measure and test the electrical characteristics of sockets used in microcircuit testing equipment. Functioning as a part of a tester platform, the populated board interfaces with the device under test and routes signals for measurement, supporting calibration and verification of semiconductor test sockets and apparatus", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Enplas", + "part_name": "Printed circuit board with electronic" + } + }, + { + "bol_metadata": { + "bol_description": "TOP PLATE", + "origin_country": "JP", + "shipper": "enplas semiconductor peripheral cor" + }, + "boundary_note": "Heading 9030 subheadings turn on the quantity measured and the instrument's specialisation: voltage/current/resistance/power meters without (9030.33) or with (9030.39) a recording device, telecommunications-specific instruments (9030.40), instruments for measuring semiconductor wafers or devices (9030.82), other recording instruments (9030.84), and parts (9030.90).", + "candidate_set": { + "codes": [ + "903084", + "903082", + "903090", + "903039" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9030_measurement_splits" + ], + "frozen_id": "v2.0.train.0819", + "hs2_label": "90", + "hs4_label": "9030", + "hs6_label": "903090", + "id": "SH-0819", + "justification_text": "Parts and accessories of electrical measuring or checking instruments of heading 9030 fall under 9030.90. Classified under HS 9030.90.", + "reference_ruling_ids": [ + "CROSS-H268513", + "CROSS-859957" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A top plate component for an integrated-circuit test or burn-in socket, a rigid machined or molded part that forms the upper structure of the socket assembly. It retains the contact mechanism and guides the clamping lid, providing the structural frame that holds a semiconductor against the socket contacts during device testing. It is a dedicated mechanical part of semiconductor test apparatus", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Enplas", + "part_name": "TOP plate" + } + }, + { + "bol_metadata": { + "bol_description": "chip packaging and appearance inspection machine; model: HEXA EVO+; S/N: , voltage 220V/50-60HZ; 1 PHASES; Manufacturer: SEMICONDUCTOR TECHNOLOGIES & INSTRUMENTS; NSX: 2020. Used product", + "origin_country": "USA/Korea", + "shipper": "amkor technology korea, inc" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903149", + "903141", + "903190", + "903180" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0820", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903141", + "id": "SH-0820", + "justification_text": "Optical instruments for inspecting semiconductor wafers, semiconductor devices, photomasks or reticles fall under 9031.41. Classified under HS 9031.41.", + "reference_ruling_ids": [ + "CROSS-962212", + "EBTI-EN-0164", + "CROSS-N348508", + "CROSS-C81315", + "CROSS-N276333", + "CROSS-817479", + "CROSS-D89035", + "CROSS-D88817", + "CROSS-H80004" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "An integrated semiconductor back-end machine that combines tape-and-reel packaging with automated visual appearance inspection of finished IC devices. It uses on-the-fly laser-based 3D and 2D camera imaging to detect and lead defects on ball-array, leaded, leadless and large-format devices, then tapes good parts into carrier reels. Single-phase 220V, used equipment combining optical inspection with component handling", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Amkor Technology", + "part_name": "Reel chip packaging and appearance" + } + }, + { + "bol_metadata": { + "bol_description": "OPTICAL INSTRUMENTS, INSPECTING SEMICONDUCTO", + "origin_country": "JP", + "shipper": "hitachi astemo, ltd" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903180", + "903149", + "903190", + "903141" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0821", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903141", + "id": "SH-0821", + "justification_text": "Optical instruments for inspecting semiconductor wafers, semiconductor devices, photomasks or reticles fall under 9031.41. Classified under HS 9031.41.", + "reference_ruling_ids": [ + "CROSS-962212", + "EBTI-EN-0164", + "CROSS-C81315", + "CROSS-D88817", + "CROSS-N276333" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Optical instrument designed for inspecting semiconductors, using optical imaging to examine wafers or devices for defects and dimensional conformity during fabrication. The appliance combines illumination, magnifying optics, and image-capture electronics to perform automated visual checking of microelectronic features. It is a precision floor or bench instrument used in semiconductor manufacturing quality control", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Hitachi Astemo", + "part_name": "optical instruments inspecting" + } + }, + { + "bol_metadata": { + "bol_description": "METER - HIGH RESISTANCE FOR INSPECTING SEMICONDUCTOR WAFERS OR D", + "origin_country": "Germany", + "shipper": "infineon technologies malaysia sd" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903149", + "903180", + "903190", + "903141" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0822", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903141", + "id": "SH-0822", + "justification_text": "A high-resistance meter measures electrical resistance and falls under electrical measuring instruments of 9030.33, not optical instruments of 9031.41. Classified under HS 9031.41.", + "reference_ruling_ids": [ + "CROSS-962212", + "CROSS-C81315", + "CROSS-N276333", + "EBTI-EN-0164", + "CROSS-D88817" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "High-resistance meter for inspecting semiconductor wafers or devices, an electrical instrument that measures very high resistance and insulation characteristics of microelectronic structures. It applies a controlled voltage and measures the resulting low current to evaluate dielectric and isolation properties during semiconductor testing, supplied as a precision bench instrument for fabrication quality control", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Infineon Technologies", + "part_name": "meter - high resistance for inspecting" + } + }, + { + "bol_metadata": { + "bol_description": "MODEL SERIES T3XX T7XX INSPECTION MACHINE", + "origin_country": "USA", + "shipper": "icos vision systems ltd/kla corporation" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903141", + "903190", + "903180", + "903149" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0823", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903141", + "id": "SH-0823", + "justification_text": "Optical instruments for inspecting semiconductor wafers, semiconductor devices, photomasks or reticles fall under 9031.41. Classified under HS 9031.41.", + "reference_ruling_ids": [ + "CROSS-962212", + "EBTI-EN-0164", + "CROSS-N348508", + "CROSS-817479", + "CROSS-D89035", + "CROSS-C81315", + "CROSS-N276333", + "CROSS-D88817" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Automated optical inspection machine of a packaged integrated-circuit component inspection series, providing fully automated 2D and 3D optical examination of finished IC. Using high-resolution cameras and structured illumination across multiple inspection stations, it measures coplanarity, lead and contact dimensions, and surface quality with integrated sorting and either tray or tape output for high-throughput packaging quality control", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "KLA Corporation", + "part_name": "model series T3XX T7XX inspection" + } + }, + { + "bol_metadata": { + "bol_description": "scanner used to check and remove defective products, model: T890; 115-230VAC/50-60Hz; Brand: KLA; NSX 2024. 100% new product", + "origin_country": "US", + "shipper": "kla-tencor singapore pte ltd" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903190", + "903141", + "903149", + "903180" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0824", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903141", + "id": "SH-0824", + "justification_text": "Optical instruments for inspecting semiconductor wafers, semiconductor devices, photomasks or reticles fall under 9031.41. Classified under HS 9031.41.", + "reference_ruling_ids": [ + "CROSS-962212", + "EBTI-EN-0164", + "CROSS-C81315", + "CROSS-N276333", + "CROSS-817479", + "CROSS-N348508", + "CROSS-B89229", + "CROSS-D88817", + "CROSS-D89035" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Automated optical scanner that inspects packaged integrated-circuit components and removes defective units. Using high-resolution cameras and patterned illumination, it performs 2D and 3D inspection of component surfaces and leads, then sorts and rejects nonconforming parts. Operating on 115-230V AC at 50-60Hz, it is a high-throughput floor unit for outgoing quality control in semiconductor packaging", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "KLA-Tencor", + "part_name": "Optical scanner used to check and" + } + }, + { + "bol_metadata": { + "bol_description": "SENSOR PHOTO \"SCREEN\" MODEL NO.: PT-R8600M-E", + "origin_country": "JP", + "shipper": "screen ga shanghai co., ltd" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903180", + "903141", + "903190", + "903149" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0825", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903141", + "id": "SH-0825", + "justification_text": "A thermal CTP platesetter is graphic-arts plate-making machinery under 8442.30, not a semiconductor optical inspection instrument. Classified under HS 9031.41.", + "reference_ruling_ids": [ + "CROSS-962212", + "CROSS-N348508", + "CROSS-D88817", + "CROSS-D89035", + "EBTI-EN-0164" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A thermal computer-to-plate platesetter used in commercial offset prepress. The machine images aluminium printing plates by scanning them with an array of infrared laser diodes driven by digital page data, exposing the plate emulsion to form the printing image before development. It accepts plate formats up to large B1 sizes at high throughput and is integrated into a graphic-arts prepress workflow", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "SCREEN GA", + "part_name": "sensor photo \" \" model NO.: PT-R8600M-E" + } + }, + { + "bol_metadata": { + "bol_description": "TR518 SII MANUFACTURING DEFECTS ANALYZER", + "origin_country": "TW", + "shipper": "test research inc" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903141", + "903149", + "903180", + "903190" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0826", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903141", + "id": "SH-0826", + "justification_text": "In-circuit or PCB electrical test systems measure/check electrical quantities and fall under 9030.33 absent recording-device detail, not optical 9031.41. Classified under HS 9031.41.", + "reference_ruling_ids": [ + "EBTI-EN-0164", + "CROSS-962212", + "CROSS-C81315", + "CROSS-D88817", + "CROSS-D89035", + "CROSS-G86065" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A manufacturing-defects analyzer (in-circuit/MDA tester) for assembled printed circuit boards. Using a bed-of-nails fixture and vectorless test technology, it electrically measures analog components and connections across thousands of test points to find opens, shorts, wrong or missing parts. The benchtop system runs on a PC interface and is used for fast electrical screening of populated boards in electronics production", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Test Research (TRI)", + "part_name": "TR518 SII manufacturing defects analyzer" + } + }, + { + "bol_metadata": { + "bol_description": "MANUFACTURING DEFECT ANALYZER SYSTEM TR518 SII MDA", + "origin_country": "SG", + "shipper": "testechnik pte. limited" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903149", + "903180", + "903190", + "903141" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0827", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903141", + "id": "SH-0827", + "justification_text": "In-circuit or PCB electrical test systems measure/check electrical quantities and fall under 9030.33 absent recording-device detail, not optical 9031.41. Classified under HS 9031.41.", + "reference_ruling_ids": [ + "EBTI-EN-0164", + "CROSS-962212", + "CROSS-C81315", + "CROSS-D88817", + "CROSS-G86065" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A manufacturing-defect analyzer system that performs electrical in-circuit testing of assembled printed circuit boards. Through a fixture contacting many test nodes, it measures component values and connectivity and uses vectorless techniques to detect opens, shorts and placement faults. The system includes a PC controller and test software for high-speed electrical quality screening on electronics assembly lines", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Testechnik", + "part_name": "manufacturing defect analyzer system" + } + }, + { + "bol_metadata": { + "bol_description": "LSI-MJ HX8394-F310PD200-NLP", + "origin_country": "JP", + "shipper": "toppan inc" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90). Manufacturing vs measuring function: machines that modify the wafer (8486) against instruments that measure or inspect without modifying it (9030.82, 9031.41, 9031.80); for in-line tools the principal function decides.", + "candidate_set": { + "codes": [ + "903149", + "903141", + "903190", + "903180" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits", + "process_vs_metrology" + ], + "frozen_id": "v2.0.train.0828", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903141", + "id": "SH-0828", + "justification_text": "A patterned photomask or reticle plate is photographic plate/film material under heading 3705, not an inspection instrument of 9031.41. Classified under HS 9031.41.", + "reference_ruling_ids": [ + "CROSS-962212", + "CROSS-C81315", + "CROSS-E80052", + "CROSS-N276333", + "EBTI-EN-0164", + "CROSS-D88817", + "CROSS-D89035", + "CROSS-H80004" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A photomask (reticle) used in LSI semiconductor and display-driver lithography. It consists of a precision-ground quartz or glass plate carrying a patterned opaque film that defines circuit features, transferred onto a wafer or display substrate by photolithographic exposure. The mask is a high-accuracy optical element manufactured to tight critical-dimension and defect tolerances for use in chip and panel fabrication", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Toppan", + "part_name": "LSI-MJ HX8394-F310PD200-NLP" + } + }, + { + "bol_metadata": { + "bol_description": "ADVANCED ROBOTIC VISION INSPECTION SYSTEM", + "origin_country": "Malaysia", + "shipper": "vitrox technologies sdn bhd" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903149", + "903180", + "903141", + "903190" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0829", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903141", + "id": "SH-0829", + "justification_text": "Optical instruments for inspecting semiconductor wafers, semiconductor devices, photomasks or reticles fall under 9031.41. Classified under HS 9031.41.", + "reference_ruling_ids": [ + "CROSS-962212", + "CROSS-C81315", + "EBTI-EN-0164", + "CROSS-N276333", + "CROSS-817479", + "CROSS-N348508", + "CROSS-D88817", + "CROSS-D89035" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "An advanced robotic optical inspection system for electronic and semiconductor. It combines machine-vision cameras, programmable illumination and robotic handling to automatically capture and analyse images of devices, detecting surface, placement and packaging defects. The automated system runs inspection software for high-throughput quality control of semiconductor and surface-mount production", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "ViTrox", + "part_name": "advanced robotic vision inspection" + } + }, + { + "bol_metadata": { + "bol_description": "PART ID: 9200-I120, ADVANCED OPTICAL INSPECTION SYSTEM (V510I XL) (S/N: 19220243FDL)PART", + "origin_country": "Malaysia", + "shipper": "vitrox technologies sdn bhd" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903141", + "903149", + "903190", + "903180" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0830", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903141", + "id": "SH-0830", + "justification_text": "Optical instruments for inspecting semiconductor wafers, semiconductor devices, photomasks or reticles fall under 9031.41. Classified under HS 9031.41.", + "reference_ruling_ids": [ + "EBTI-EN-0164", + "CROSS-962212", + "CROSS-C81315", + "CROSS-N276333", + "CROSS-817479", + "CROSS-D88817", + "CROSS-N348508", + "CROSS-D89035", + "CROSS-H89484" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "An advanced 3D automated optical inspection system for semiconductor advanced packaging and microelectronics. High-resolution cameras with structured illumination perform real 3D measurement to inspect highly reflective die and components, detecting micro-defects, placement and co-planarity faults. The inline platform uses AI-assisted programming and analysis software for high-speed inspection of semiconductor and surface-mount assemblies", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "ViTrox", + "part_name": "part ID: 9200-I120 advanced optical" + } + }, + { + "bol_metadata": { + "bol_description": "MODEL, SERIES T890", + "origin_country": "US", + "shipper": "kla-tencor singapore pte ltd" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903149", + "903141", + "903180", + "903190" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0831", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903141", + "id": "SH-0831", + "justification_text": "Optical inspection of packaged ICs or semiconductor devices is specifically covered by 9031.41, not residual optical instruments of 9031.49. Classified under HS 9031.41.", + "reference_ruling_ids": [ + "CROSS-962212", + "EBTI-EN-0164", + "CROSS-C81315", + "CROSS-N348508", + "CROSS-D88817", + "CROSS-N276333", + "CROSS-817479", + "CROSS-D89035", + "CROSS-H89484" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Automated optical inspection system for packaged integrated-circuit components. The machine uses multiple cameras with controlled lighting and 2D/3D imaging across parallel inspection stations to examine lead coplanarity, dimensions, marking and surface quality of finished IC, then sorts parts by result. Built as an enclosed automated cabinet with handling, optics and control computer, it performs high-throughput non-contact optical measurement and quality verification of semiconductor devices", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "KLA-Tencor", + "part_name": "model series T890" + } + }, + { + "bol_metadata": { + "bol_description": "disc error checker with synchronous accessories OPTELICS AI2 Serial: LM024B471; Voltage: AC200-240V, 50/60Hz; Current: 18.5A; Year of manufacture: 2024; Manufacturer: Lasertec Corporation.100% new product", + "origin_country": "JP", + "shipper": "lasertec corporation" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903149", + "903190", + "903180", + "903141" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0832", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903141", + "id": "SH-0832", + "justification_text": "Confocal wafer or substrate inspection designed for semiconductor wafers/devices falls under 9031.41 rather than residual optical 9031.49. Classified under HS 9031.41.", + "reference_ruling_ids": [ + "CROSS-962212", + "CROSS-C81315", + "EBTI-EN-0164", + "CROSS-N276333", + "CROSS-817479", + "CROSS-D88817", + "CROSS-N348508", + "CROSS-D89035" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A bench-top automatic inspection and review system built around confocal optics combined with deep-learning image classification. It performs high-speed surface defect inspection, defect mapping, and high-magnification review of small substrates and wafers on a single platform, detecting sub-micron defects and sorting them by type. Runs on 200-240V AC single-phase supply and is used for quality control in semiconductor and electronic component manufacturing", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Lasertec", + "part_name": "Optical disc error checker with" + } + }, + { + "bol_metadata": { + "bol_description": "LASER ELLIPSOMETER", + "origin_country": "SG", + "shipper": "elite solar technology viet nam company limited" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903180", + "903149", + "903190", + "903141" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0833", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903141", + "id": "SH-0833", + "justification_text": "A laser ellipsometer for semiconductor or solar wafer film metrology is an optical wafer measuring/checking instrument under 9031.41. Classified under HS 9031.41.", + "reference_ruling_ids": [ + "CROSS-962212", + "CROSS-D88817", + "EBTI-EN-0164", + "CROSS-C81315", + "CROSS-N276333", + "CROSS-H89484" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Laser ellipsometer for non-contact optical measurement of thin-film thickness and refractive index. The instrument directs a polarized laser beam onto a coated surface and analyzes the change in polarization on reflection to derive film properties to sub-nanometer precision. Widely used for process control of dielectric and optical coatings on semiconductor and solar wafers in fabrication laboratories", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "EliTe Solar", + "part_name": "laser ellipsometer" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903141", + "903190", + "903180", + "903149" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0834", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903141", + "id": "SH-0834", + "justification_text": "The Surfscan SP7 is a laser-scattering defect inspection system for unpatterned semiconductor wafers. Subheading 9031.41 was added in HS2022 specifically for instruments that inspect semiconductor. Classified under HS 9031.41.", + "reference_ruling_ids": [ + "CROSS-C81315", + "CROSS-962212", + "CROSS-D88817", + "CROSS-N276333", + "EBTI-EN-0164", + "CROSS-817479", + "CROSS-E80052", + "CROSS-N348508", + "CROSS-D89035", + "CROSS-H89484" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Automated laser scattering inspection system for unpatterned semiconductor wafers, detecting particles, scratches, slip lines, and stacking faults on bare wafers and films with real time defect classification. Deployed at silicon wafer producers and IC fabs for substrate qualification and process tool monitoring at leading edge nodes", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "KLA Corporation", + "part_name": "surfscan SP7 WFR insp SYS" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903141", + "903190", + "903180", + "903149" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0835", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903141", + "id": "SH-0835", + "justification_text": "The SP7XP does the same unpatterned wafer inspection as the SP7, just with higher sensitivity and machine learning classification. A performance upgrade doesn't change the classification; it stays. Classified under HS 9031.41.", + "reference_ruling_ids": [ + "CROSS-962212", + "CROSS-C81315", + "CROSS-N348508", + "EBTI-EN-0164", + "CROSS-817479", + "CROSS-D89035", + "CROSS-E80052", + "CROSS-N276333", + "CROSS-D88817" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Unpatterned wafer defect inspection system with enhanced sensitivity and throughput and machine learning based defect classification, qualifying starting substrates and monitoring processes and tools in EUV era logic and memory fabrication. Inspects bare silicon, smooth films, and rough films at production speed. Part number SP7XP", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "KLA Corporation", + "part_name": "SP7XP" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903141", + "903190", + "903180", + "903149" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0836", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903141", + "id": "SH-0836", + "justification_text": "The Surfscan SP5 inspects bare and film-coated semiconductor wafers using a deep-ultraviolet laser, which puts it under subheading 9031.41 as an instrument for inspecting semiconductor wafers. The. Classified under HS 9031.41.", + "reference_ruling_ids": [ + "EBTI-EN-0164", + "CROSS-962212", + "CROSS-C81315", + "CROSS-D88817", + "CROSS-817479", + "CROSS-E80052", + "CROSS-N276333", + "CROSS-N348508", + "CROSS-D89035", + "CROSS-H89484" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Deep ultraviolet laser based unpatterned wafer defect inspection system for process tool qualification and monitoring using blanket films and bare wafers. Provides high sensitivity particle and surface quality measurement supporting wafer shops, equipment makers, and integrated circuit fabs", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "KLA Corporation", + "part_name": "SP5 bare WFR insp" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903141", + "903190", + "903180", + "903149" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0837", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903141", + "id": "SH-0837", + "justification_text": "Subheading 9031.41 was introduced in HS2022 for high-sensitivity surface inspection systems for semiconductor wafers, and the SP3/Ax fits that description directly. The multi-channel optical setup. Classified under HS 9031.41.", + "reference_ruling_ids": [ + "CROSS-962212", + "CROSS-C81315", + "CROSS-N276333", + "CROSS-D88817", + "EBTI-EN-0164", + "CROSS-817479", + "CROSS-E80052", + "CROSS-N348508", + "CROSS-D89035", + "CROSS-H89484" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Unpatterned wafer inspection system with DUV laser source, concurrent darkfield and optional brightfield channels, and integrated surface quality monitoring. Captures yield critical and latent reliability defects to sub 40 nm sensitivity for incoming wafer control and tool monitoring in semiconductor fabs", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "KLA Corporation", + "part_name": "surfscan SP3 AX inspector" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90). Manufacturing vs measuring function: machines that modify the wafer (8486) against instruments that measure or inspect without modifying it (9030.82, 9031.41, 9031.80); for in-line tools the principal function decides.", + "candidate_set": { + "codes": [ + "903141", + "903190", + "903180", + "903149" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9031_inspection_splits", + "process_vs_metrology" + ], + "frozen_id": "v2.0.train.0838", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903141", + "id": "SH-0838", + "justification_text": "The Voyager 1015 inspects patterned semiconductor wafers in the lithography cell, and subheading 9031.41 covers wafer inspection at any stage, not just bare wafers. After-develop inspection is a st. Classified under HS 9031.41.", + "reference_ruling_ids": [ + "CROSS-962212", + "CROSS-C81315", + "CROSS-N276333", + "CROSS-817479", + "CROSS-D88817", + "CROSS-N348508", + "EBTI-EN-0164", + "CROSS-D89035", + "CROSS-H80004" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Laser scattering inspection system for patterned semiconductor wafers including after develop inspection within the lithography cell, where wafers remain reworkable. Novel illumination, collection, and sensor architecture raise defect sensitivity while suppressing nuisance signals during chip manufacture. Part number 1015", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "KLA Corporation", + "part_name": "1015" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90). Manufacturing vs measuring function: machines that modify the wafer (8486) against instruments that measure or inspect without modifying it (9030.82, 9031.41, 9031.80); for in-line tools the principal function decides.", + "candidate_set": { + "codes": [ + "903141", + "903190", + "903180", + "903149" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9031_inspection_splits", + "process_vs_metrology" + ], + "frozen_id": "v2.0.train.0839", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903141", + "id": "SH-0839", + "justification_text": "The PWG5 measures front and back planarity on patterned wafers at production speed, which is a form of wafer inspection covered by subheading 9031.41. Inline geometry measurement of semiconductor w. Classified under HS 9031.41.", + "reference_ruling_ids": [ + "CROSS-C81315", + "CROSS-E80052", + "CROSS-962212", + "CROSS-D88817", + "EBTI-EN-0164", + "CROSS-D89035", + "CROSS-H89484", + "CROSS-N276333" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Patterned wafer geometry system measuring front side and back side deviations from planarity simultaneously at inline speed, supporting 3D NAND, advanced DRAM, and logic manufacture. Feeds wafer shape data to analytics for rework, tool recalibration, and lithography correction decisions. Part number PWG5", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "KLA Corporation", + "part_name": "PWG5" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903141", + "903190", + "903180", + "903149" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0840", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903141", + "id": "SH-0840", + "justification_text": "The Camtek Eagle G5 does automated optical inspection and 3D bump metrology on semiconductor wafers in advanced packaging, which puts it in subheading 9031.41 as an instrument for inspecting semico. Classified under HS 9031.41.", + "reference_ruling_ids": [ + "CROSS-962212", + "CROSS-C81315", + "CROSS-N348508", + "CROSS-N276333", + "EBTI-EN-0164", + "CROSS-817479", + "CROSS-D88817", + "CROSS-E80052", + "CROSS-D89035" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Automated optical inspection and metrology system for semiconductor wafers in advanced packaging, performing high throughput two and three dimensional inspection of bumps, redistribution layers, and macro defects. Used by OSAT and fab back end lines for outgoing wafer quality control", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Camtek Ltd.", + "part_name": "eagle G5 AOI WFR" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903141", + "903190", + "903180", + "903149" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0841", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903141", + "id": "SH-0841", + "justification_text": "The eScan 1100 is an electron beam inspection system for patterned semiconductor wafers, resolving defects below the optical limit. Using electrons instead of light doesn't change the classificatio. Classified under HS 9031.41.", + "reference_ruling_ids": [ + "CROSS-962212", + "CROSS-C81315", + "EBTI-EN-0164", + "CROSS-N276333", + "CROSS-817479", + "CROSS-D88817", + "CROSS-N348508", + "CROSS-D89035" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Multibeam electron beam inspection system for patterned semiconductor wafers, resolving defects below the optical limit for critical layer verification where resolution outweighs throughput. Applied in process development and ramp for leading edge logic and memory nodes. Part number 1100", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "ASML", + "part_name": "1100" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903141", + "903190", + "903180", + "903149" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0842", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903141", + "id": "SH-0842", + "justification_text": "The Hitachi LS9300A is a laser dark-field scanner for non-patterned semiconductor wafer surfaces, which puts it under subheading 9031.41 as an instrument for inspecting semiconductor wafers. It doe. Classified under HS 9031.41.", + "reference_ruling_ids": [ + "CROSS-962212", + "CROSS-C81315", + "EBTI-EN-0164", + "CROSS-N276333", + "CROSS-D88817", + "CROSS-817479", + "CROSS-E80052", + "CROSS-N348508", + "CROSS-D89035" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Laser dark field inspection system for non patterned semiconductor wafer surfaces, detecting particles and crystalline defects on bare silicon during substrate manufacture and incoming quality control. Provides high speed full surface scanning with defect coordinate output for review. Part number LS9300A", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Hitachi High-Tech Corporation", + "part_name": "LS9300A" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903141", + "903190", + "903180", + "903149" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0843", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903141", + "id": "SH-0843", + "justification_text": "The Dragonfly G3 combines 2D and 3D inspection of patterned wafers, covering macro defects and bump metrology. Whether you call the main function inspection or metrology, it is an instrument for in. Classified under HS 9031.41.", + "reference_ruling_ids": [ + "CROSS-N348508", + "CROSS-962212", + "EBTI-EN-0164", + "CROSS-817479", + "CROSS-C81315", + "CROSS-N276333", + "CROSS-D88817", + "CROSS-D89035", + "CROSS-H89484" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Automated macro inspection platform combining two dimensional and three dimensional measurement on patterned wafers, covering bump height metrology and macro defect detection for advanced packaging and front end processes in a single pass. Supports inline sampling at production throughput", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Onto Innovation", + "part_name": "dragonfly G3 insp" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90). Manufacturing vs measuring function: machines that modify the wafer (8486) against instruments that measure or inspect without modifying it (9030.82, 9031.41, 9031.80); for in-line tools the principal function decides.", + "candidate_set": { + "codes": [ + "903141", + "903190", + "903180", + "903149" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9031_inspection_splits", + "process_vs_metrology" + ], + "frozen_id": "v2.0.train.0844", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903141", + "id": "SH-0844", + "justification_text": "Subheading 9031.41 expressly covers instruments for inspecting photomasks or reticles used in making semiconductor devices, and mask blank inspection is the upstream step in that chain. The M5350 f. Classified under HS 9031.41.", + "reference_ruling_ids": [ + "CROSS-962212", + "CROSS-C81315", + "CROSS-N276333", + "EBTI-EN-0164", + "CROSS-817479", + "CROSS-D88817", + "CROSS-E80052", + "CROSS-N348508", + "CROSS-D89035" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Inspection system for photomask blanks and related substrates used in semiconductor lithography, detecting sub resolution defects on mask blank surfaces prior to patterning. Mask blank inspection guards the reticle supply chain feeding advanced wafer exposure. Part number M5350", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Lasertec Corporation", + "part_name": "M5350" + } + }, + { + "bol_metadata": { + "bol_description": "LASER ENCODER (RLE10-SX-VB,RLE10-DX-VF", + "origin_country": "JP", + "shipper": "ushio inc" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903141", + "903180", + "903190", + "903149" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0845", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903149", + "id": "SH-0845", + "justification_text": "A laser encoder or interferometric position-measuring system is an optical measuring/checking instrument under 9031.49, not residual optical apparatus of 9013.80. Classified under HS 9031.49.", + "reference_ruling_ids": [ + "CROSS-960429", + "CROSS-H163998", + "EBTI-DE-DEB/305/08-1", + "EBTI-NL-BED.T.265.790", + "EBTI-DE-DEBTI2238/19-1", + "EBTI-DE-DEBTI23361/23-1", + "EBTI-DE-DEBTI23764/23-1", + "EBTI-FR-FRBTIFR-BTI-2024-04474", + "CROSS-H021136", + "EBTI-DE-DE15021/13-1", + "CROSS-H315818", + "EBTI-DE-DE7024/13-1", + "EBTI-DE-DEB/2412/05-1", + "EBTI-DE-DEB/2657/07-1", + "EBTI-DE-DEB/3364/07-1", + "EBTI-DE-DEBTI19768/21-1", + "CROSS-C80746", + "CROSS-D81305", + "CROSS-H014565", + "CROSS-N009766", + "CROSS-R04607" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Interferometric optical laser encoder system providing high-resolution, high-linearity linear position feedback for precision motion stages. The unit uses laser interferometry with fibre-optic beam delivery to remote launch heads containing the interferometer optics and fringe detector, achieving sub-nanometre resolution. Used for XY stage positioning in semiconductor, precision-manufacturing and research equipment", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Ushio", + "part_name": "laser encoder (RLE10-SX-VB RLE10-DX-VF" + } + }, + { + "bol_metadata": { + "bol_description": "FLK-IRR1-SOL,SOLAR IRRADIANCE METER", + "origin_country": "US", + "shipper": "fluke south east asia pte ltd" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90). HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "903190", + "903149", + "903141", + "903180" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits", + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0846", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903149", + "id": "SH-0846", + "justification_text": "A solar irradiance meter measures light/optical radiation and is an optical measuring/checking instrument under 9031.49, not an electrical meter of 9030.33. Classified under HS 9031.49.", + "reference_ruling_ids": [ + "CROSS-960429", + "EBTI-FR-FRBTIFR-BTI-2024-04474", + "CROSS-H163998", + "EBTI-DE-DEB/3364/07-1", + "EBTI-NL-BED.T.265.790", + "EBTI-DE-DE15021/13-1", + "EBTI-DE-DEB/2412/05-1", + "EBTI-DE-DEB/2657/07-1", + "EBTI-DE-DEBTI2238/19-1", + "EBTI-DE-DEBTI23361/23-1", + "EBTI-DE-DEBTI23764/23-1", + "CROSS-H315818", + "EBTI-DE-DE7024/13-1", + "EBTI-DE-DEB/1256/04-1" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Handheld solar irradiance meter measuring irradiance up to about 1400 W/m2, plus ambient and panel temperature, array inclination and orientation via built-in compass and tilt sensor. A compact instrument used to survey and commission photovoltaic installations per IEC 62446-1", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Fluke", + "part_name": "FLK-IRR1-SOL solar irradiance meter" + } + }, + { + "bol_metadata": { + "bol_description": "Automatic optical inspection machine for product & accessory quality inspection, used in electronic components manufacturing, CCIS-MACH-0003, Year of manufacture:2016 (expired)", + "origin_country": "US", + "shipper": "coilcraft industries singapore pte ltd" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903190", + "903141", + "903180", + "903149" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0847", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903149", + "id": "SH-0847", + "justification_text": "AOI for electronic components or accessories is an optical measuring/checking instrument of 9031.49 unless specifically for semiconductor wafers/devices or masks. Classified under HS 9031.49.", + "reference_ruling_ids": [ + "CROSS-960429", + "EBTI-FR-FRBTIFR-BTI-2024-04474", + "EBTI-NL-BED.T.265.790", + "CROSS-H315818", + "EBTI-DE-DEBTI23361/23-1", + "EBTI-DE-DEBTI23764/23-1", + "CROSS-H163998", + "EBTI-DE-DEBTI2238/19-1", + "EBTI-DE-DE15021/13-1", + "EBTI-DE-DE7024/13-1", + "EBTI-DE-DEB/2412/05-1", + "EBTI-DE-DEB/2657/07-1", + "EBTI-DE-DEB/3364/07-1", + "EBTI-DE-DEBTI19768/21-1" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "An automated optical inspection machine for verifying product and accessory quality in electronic-component manufacturing. It uses camera-based imaging and illumination to capture and analyze parts against reference standards, flagging defects on the production line. Comprises optics, cameras, a motorized stage and processing electronics; a benchtop or in-line AOI system. Year of manufacture 2016, used equipment", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Coilcraft", + "part_name": "Automatic optical inspection machine" + } + }, + { + "bol_metadata": { + "bol_description": "solder joint inspection machine (checking the gloss and warpage of PCB solder joints), model: KY8080, voltage: 220V, capacity 2.2kW, manufacturer: KOH YOUNG TECHNOLOGY Inc., year 2021, used goods", + "origin_country": "CN", + "shipper": "dbg technology co., ltd" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903149", + "903141", + "903190", + "903180" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0848", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903149", + "id": "SH-0848", + "justification_text": "3D solder-joint or PCB AOI is an optical measuring/checking instrument under 9031.49, not semiconductor-wafer/device inspection of 9031.41. Classified under HS 9031.49.", + "reference_ruling_ids": [ + "CROSS-960429", + "EBTI-FR-FRBTIFR-BTI-2024-04474", + "EBTI-DE-DE7024/13-1", + "CROSS-H163998", + "EBTI-NL-BED.T.265.790", + "CROSS-H315818", + "EBTI-DE-DEBTI23361/23-1", + "EBTI-DE-DEBTI23764/23-1", + "EBTI-DE-DE15021/13-1", + "EBTI-DE-DEB/2412/05-1", + "EBTI-DE-DEB/2657/07-1", + "EBTI-DE-DEB/3364/07-1", + "EBTI-DE-DEBTI19768/21-1", + "EBTI-DE-DEBTI2238/19-1" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A 3D automated optical inspection machine for checking solder joints on printed circuit boards. It projects structured light and uses multi-angle imaging to measure solder volume, height, gloss and board warpage with micron-level accuracy, applying warp-compensation algorithms to assess joint quality. Comprises optics, cameras, projectors and processing electronics; 220V single-phase, 2.2kW, used equipment", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "DBG Technology", + "part_name": "3D solder joint inspection machine" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-01-01 00:00:00", + "bol_description": "6300-0918-01 1.75UM STEP HEIGHT STANDARD 30557-35-01", + "consignee": "tata electronics private limited", + "declared_hs": "90318000", + "hs_verified": true, + "origin_country": "UNITED STATES", + "port_dest": "", + "port_origin": "", + "shipper": "zygo corporation" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903190", + "903141", + "903180", + "903149" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0849", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0849", + "justification_text": "Goods classified under HS 9031.80; corroborated by 60 customs rulings on comparable goods across 5 jurisdictions.", + "reference_ruling_ids": [ + "CROSS-957070", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "CROSS-089928", + "CROSS-966482", + "CROSS-N335815", + "CROSS-N357964", + "CROSS-N359967", + "CROSS-953551", + "CROSS-954657", + "CROSS-N332455", + "CROSS-952235", + "CROSS-H009364", + "CROSS-N308777", + "EBTI-DE-DE20855/16-1", + "EBTI-FR-FR-RTC-2014-000002", + "EBTI-FR-FRBTIFR-BTI-2019-17693", + "EBTI-FR-FRBTIFR-BTI-2020-01824", + "EBTI-FR-FRBTIFR-BTI-2021-04793", + "CROSS-952778", + "CROSS-958886", + "CROSS-961003", + "CROSS-966296", + "CROSS-H035572", + "CROSS-H154035", + "EBTI-CZ-CZ30-0470-2014", + "EBTI-DE-DE21303/13-1", + "EBTI-DE-DE24219/10-1", + "EBTI-DE-DE26126/16-1", + "EBTI-DE-DE27739/16-1", + "EBTI-DE-DE27963/16-1", + "EBTI-DE-DE996/16-1", + "EBTI-DE-DEB/1839/06-1", + "EBTI-DE-DEBTI14470/23-1", + "EBTI-DE-DEBTI18562/24-1", + "EBTI-DE-DEBTI26857/24-1", + "EBTI-DE-DEBTI28937/24-1", + "EBTI-DE-DEBTI29406/20-1", + "EBTI-FR-FR-RTC-2014-001975", + "EBTI-FR-FR-RTC-2014-003018", + "EBTI-FR-FR-RTC-2015-008284", + "EBTI-FR-FR-RTC-2016-002653", + "EBTI-FR-FR-RTC-2016-008749", + "EBTI-FR-FRBTIFR-BTI-2021-03787", + "EBTI-FR-FRBTIFR-BTI-2023-00955", + "EBTI-FR-FRBTIFR-BTI-2024-04000", + "EBTI-FR-FRBTIFR-BTI-2025-03379", + "EBTI-FR-FRBTIFR-BTI-2025-04624", + "EBTI-IT-ITBTI2018-0543M-314100", + "EBTI-IT-ITBTIIT-2017-0482M-134100", + "EBTI-IT-ITBTIIT922104-2021-BTI0658", + "CROSS-950196", + "CROSS-966185", + "CROSS-H097095", + "CROSS-H112722", + "CROSS-H244110", + "CROSS-N348625", + "EBTI-FR-FR-RTC-2014-005643", + "EBTI-FR-FR-RTC-2015-003153", + "EBTI-FR-FRBTIFR-BTI-2023-08091", + "EBTI-IT-ITBTI2018-0489M-274100" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Step-height standard (1.75 um; 6300-0918): a calibrated step-height reference artifact used to calibrate a 3D optical surface profiler. It serves as a traceable reference artifact for the periodic calibration and performance verification of the associated measuring or inspection instrument, rather than as production material", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Zygo Corporation", + "part_name": "6300-0918-011.75UM step height standard" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-01-01 00:00:00", + "bol_description": "6300-0912-01 30MM SIC REF STD CALIBRATED 011816-747", + "consignee": "tata electronics private limited", + "declared_hs": "90318000", + "hs_verified": true, + "origin_country": "UNITED STATES", + "port_dest": "", + "port_origin": "", + "shipper": "zygo corporation" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903190", + "903149", + "903141", + "903180" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0850", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0850", + "justification_text": "Goods classified under HS 9031.80; corroborated by 55 customs rulings on comparable goods across 5 jurisdictions.", + "reference_ruling_ids": [ + "CROSS-966482", + "CROSS-950196", + "CROSS-961003", + "CROSS-H035572", + "CROSS-N335815", + "CROSS-953551", + "CROSS-966185", + "CROSS-I87168", + "CROSS-N308777", + "CROSS-N357964", + "CROSS-N359967", + "EBTI-FR-FR-RTC-2014-000002", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "CROSS-089928", + "CROSS-952778", + "CROSS-966296", + "CROSS-H009364", + "CROSS-H154035", + "CROSS-N348625", + "EBTI-CZ-CZ30-0470-2014", + "EBTI-DE-DE20855/16-1", + "EBTI-DE-DE21303/13-1", + "EBTI-DE-DE24219/10-1", + "EBTI-DE-DE26126/16-1", + "EBTI-DE-DE27739/16-1", + "EBTI-DE-DE27963/16-1", + "EBTI-DE-DE996/16-1", + "EBTI-DE-DEB/1839/06-1", + "EBTI-DE-DEBTI18562/24-1", + "EBTI-DE-DEBTI26857/24-1", + "EBTI-DE-DEBTI28937/24-1", + "EBTI-DE-DEBTI29406/20-1", + "EBTI-FR-FR-RTC-2015-008284", + "EBTI-FR-FR-RTC-2016-002653", + "EBTI-FR-FRBTIFR-BTI-2021-03787", + "EBTI-FR-FRBTIFR-BTI-2021-04793", + "EBTI-FR-FRBTIFR-BTI-2023-01720", + "EBTI-FR-FRBTIFR-BTI-2023-08091", + "EBTI-FR-FRBTIFR-BTI-2024-04000", + "EBTI-FR-FRBTIFR-BTI-2024-04055", + "EBTI-FR-FRBTIFR-BTI-2025-03379", + "CROSS-875000", + "CROSS-952235", + "CROSS-952768", + "CROSS-957070", + "CROSS-958886", + "CROSS-H097095", + "CROSS-H112722", + "CROSS-H244110", + "CROSS-H315264", + "CROSS-N332455", + "EBTI-FR-FR-RTC-2014-005643", + "EBTI-FR-FRBTIFR-BTI-2019-17693", + "EBTI-FR-FRBTIFR-BTI-2020-01824", + "EBTI-IT-ITBTI2018-0489M-274100" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Calibrated reference flat (30 mm SiC; 6300-0912): a calibrated silicon-carbide reference standard used to calibrate a 3D optical surface profiler. It is supplied as a replacement or spare component for the parent semiconductor tool rather than as standalone equipment, and is fitted, consumed or maintained during normal tool operation", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Zygo Corporation", + "part_name": "6300-0912-0130MM SIC REF STD calibrated" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-01-01 00:00:00", + "bol_description": "6300-0526-02 NV6K 2.00XZ ZOOM TUBE ASSY", + "consignee": "tata electronics private limited", + "declared_hs": "90318000", + "hs_verified": true, + "origin_country": "UNITED STATES", + "port_dest": "", + "port_origin": "", + "shipper": "zygo corporation" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903180", + "903141", + "903149", + "903190" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0851", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0851", + "justification_text": "Goods classified under HS 9031.80; corroborated by 54 customs rulings on comparable goods (EU-CZ, EU-DE, EU-FR, US).", + "reference_ruling_ids": [ + "CROSS-N335815", + "CROSS-950196", + "CROSS-961003", + "CROSS-966482", + "CROSS-N357964", + "CROSS-H035572", + "CROSS-N359967", + "CROSS-953551", + "CROSS-966185", + "CROSS-H009364", + "CROSS-H154035", + "CROSS-I87168", + "CROSS-N308777", + "EBTI-FR-FR-RTC-2014-000002", + "CROSS-952778", + "CROSS-957070", + "CROSS-966296", + "CROSS-H097095", + "CROSS-H112722", + "CROSS-H244110", + "CROSS-N348625", + "EBTI-CZ-CZ30-0470-2014", + "EBTI-DE-DE20855/16-1", + "EBTI-DE-DE21303/13-1", + "EBTI-DE-DE24219/10-1", + "EBTI-DE-DE26126/16-1", + "EBTI-DE-DE27739/16-1", + "EBTI-DE-DE27963/16-1", + "EBTI-DE-DE996/16-1", + "EBTI-DE-DEB/1839/06-1", + "EBTI-DE-DEBTI18562/24-1", + "EBTI-DE-DEBTI26857/24-1", + "EBTI-DE-DEBTI28937/24-1", + "EBTI-DE-DEBTI29406/20-1", + "EBTI-FR-FR-RTC-2014-005643", + "EBTI-FR-FR-RTC-2015-008284", + "EBTI-FR-FR-RTC-2016-002653", + "EBTI-FR-FRBTIFR-BTI-2021-03787", + "EBTI-FR-FRBTIFR-BTI-2021-04793", + "EBTI-FR-FRBTIFR-BTI-2023-01720", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "EBTI-FR-FRBTIFR-BTI-2023-08091", + "EBTI-FR-FRBTIFR-BTI-2024-04000", + "EBTI-FR-FRBTIFR-BTI-2024-04055", + "EBTI-FR-FRBTIFR-BTI-2025-03379", + "CROSS-089928", + "CROSS-862381", + "CROSS-875000", + "CROSS-952235", + "CROSS-952768", + "CROSS-958886", + "CROSS-H315264", + "CROSS-N332455", + "EBTI-FR-FRBTIFR-BTI-2020-01824" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Zoom tube assembly (NV6K, 2.00XZ; 6300-0526): an optical zoom-tube part for a non-contact 3D optical surface profiler. It is supplied as a replacement or spare component for the parent semiconductor tool rather than as standalone equipment, and is fitted, consumed or maintained during normal tool operation", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Zygo Corporation", + "part_name": "6300-0526-02 NV6K 2.00XZ zoom tube assy" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-01-01 00:00:00", + "bol_description": "1670-000-020 LATERAL CALIBRATION STANDARD", + "consignee": "tata electronics private limited", + "declared_hs": "90318000", + "hs_verified": true, + "origin_country": "UNITED STATES", + "port_dest": "", + "port_origin": "", + "shipper": "zygo corporation" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903180", + "903141", + "903149", + "903190" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0852", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0852", + "justification_text": "Goods classified under HS 9031.80; corroborated by 57 customs rulings on comparable goods across 5 jurisdictions.", + "reference_ruling_ids": [ + "CROSS-966482", + "CROSS-957070", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "CROSS-089928", + "CROSS-N357964", + "CROSS-N359967", + "CROSS-952235", + "CROSS-953551", + "CROSS-954657", + "CROSS-H009364", + "CROSS-N332455", + "CROSS-N335815", + "CROSS-N308777", + "EBTI-DE-DE20855/16-1", + "EBTI-FR-FRBTIFR-BTI-2019-17693", + "EBTI-FR-FRBTIFR-BTI-2021-04793", + "CROSS-952778", + "CROSS-958886", + "CROSS-961003", + "CROSS-966296", + "CROSS-H035572", + "CROSS-H154035", + "EBTI-CZ-CZ30-0470-2014", + "EBTI-DE-DE21303/13-1", + "EBTI-DE-DE24219/10-1", + "EBTI-DE-DE26126/16-1", + "EBTI-DE-DE27739/16-1", + "EBTI-DE-DE27963/16-1", + "EBTI-DE-DE996/16-1", + "EBTI-DE-DEB/1839/06-1", + "EBTI-DE-DEBTI14470/23-1", + "EBTI-DE-DEBTI18562/24-1", + "EBTI-DE-DEBTI26857/24-1", + "EBTI-DE-DEBTI28937/24-1", + "EBTI-DE-DEBTI29406/20-1", + "EBTI-FR-FR-RTC-2014-000002", + "EBTI-FR-FR-RTC-2014-001975", + "EBTI-FR-FR-RTC-2014-003018", + "EBTI-FR-FR-RTC-2015-008284", + "EBTI-FR-FR-RTC-2016-002653", + "EBTI-FR-FR-RTC-2016-008749", + "EBTI-FR-FRBTIFR-BTI-2020-01824", + "EBTI-FR-FRBTIFR-BTI-2021-03787", + "EBTI-FR-FRBTIFR-BTI-2023-00955", + "EBTI-FR-FRBTIFR-BTI-2024-04000", + "EBTI-FR-FRBTIFR-BTI-2025-03379", + "EBTI-FR-FRBTIFR-BTI-2025-04624", + "EBTI-IT-ITBTI2018-0543M-314100", + "EBTI-IT-ITBTIIT-2017-0482M-134100", + "EBTI-IT-ITBTIIT922104-2021-BTI0658", + "CROSS-966185", + "CROSS-H097095", + "CROSS-H112722", + "CROSS-H244110", + "EBTI-FR-FR-RTC-2015-003153", + "EBTI-FR-FRBTIFR-BTI-2023-08091", + "EBTI-IT-ITBTI2018-0489M-274100" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Lateral calibration standard (1670-000-020): a calibrated lateral/magnification reference artifact used to calibrate an optical metrology instrument. It serves as a traceable reference artifact for the periodic calibration and performance verification of the associated measuring or inspection instrument, rather than as production material", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Zygo Corporation", + "part_name": "1670-000-020 lateral calibration" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-01-01 00:00:00", + "bol_description": "1373-000-003 200 LPMM FOCUS GRATING", + "consignee": "tata electronics private limited", + "declared_hs": "90318000", + "hs_verified": true, + "origin_country": "UNITED STATES", + "port_dest": "", + "port_origin": "", + "shipper": "zygo corporation" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903149", + "903190", + "903141", + "903180" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0853", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0853", + "justification_text": "Goods classified under HS 9031.80; corroborated by 60 customs rulings on comparable goods across 5 jurisdictions.", + "reference_ruling_ids": [ + "CROSS-089928", + "CROSS-966482", + "CROSS-957070", + "CROSS-N359967", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "CROSS-N357964", + "CROSS-953551", + "CROSS-954657", + "CROSS-N308777", + "CROSS-N332455", + "CROSS-N335815", + "CROSS-952235", + "CROSS-H009364", + "EBTI-DE-DE20855/16-1", + "EBTI-DE-DEBTI14470/23-1", + "EBTI-FR-FRBTIFR-BTI-2019-17693", + "EBTI-FR-FRBTIFR-BTI-2021-04793", + "CROSS-952778", + "CROSS-958886", + "CROSS-961003", + "CROSS-966296", + "CROSS-H035572", + "CROSS-H154035", + "EBTI-CZ-CZ30-0470-2014", + "EBTI-DE-DE21303/13-1", + "EBTI-DE-DE24219/10-1", + "EBTI-DE-DE26126/16-1", + "EBTI-DE-DE27739/16-1", + "EBTI-DE-DE27963/16-1", + "EBTI-DE-DE996/16-1", + "EBTI-DE-DEB/1839/06-1", + "EBTI-DE-DEBTI18562/24-1", + "EBTI-DE-DEBTI26857/24-1", + "EBTI-DE-DEBTI28937/24-1", + "EBTI-DE-DEBTI29406/20-1", + "EBTI-FR-FR-RTC-2014-000002", + "EBTI-FR-FR-RTC-2014-001975", + "EBTI-FR-FR-RTC-2014-003018", + "EBTI-FR-FR-RTC-2015-008284", + "EBTI-FR-FR-RTC-2016-002653", + "EBTI-FR-FR-RTC-2016-008749", + "EBTI-FR-FRBTIFR-BTI-2020-01824", + "EBTI-FR-FRBTIFR-BTI-2021-03787", + "EBTI-FR-FRBTIFR-BTI-2023-00955", + "EBTI-FR-FRBTIFR-BTI-2024-04000", + "EBTI-FR-FRBTIFR-BTI-2025-03379", + "EBTI-FR-FRBTIFR-BTI-2025-04624", + "EBTI-IT-ITBTI2018-0543M-314100", + "EBTI-IT-ITBTIIT-2017-0482M-134100", + "EBTI-IT-ITBTIIT922104-2021-BTI0658", + "CROSS-966185", + "CROSS-H097095", + "CROSS-H112722", + "CROSS-H244110", + "CROSS-H250531", + "CROSS-H315264", + "CROSS-N348625", + "EBTI-FR-FR-RTC-2015-003153", + "EBTI-FR-FRBTIFR-BTI-2023-08091", + "EBTI-IT-ITBTI2018-0489M-274100" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Focus grating standard (200 lp/mm; 1373-000-003): a calibrated grating artifact used to set focus/resolution on an optical metrology instrument. It serves as a traceable reference artifact for the periodic calibration and performance verification of the associated measuring or inspection instrument, rather than as production material", + "tier1_source": "BOL", + "tier2_classifiable": "no", + "tier2_minimal": { + "manufacturer": "Zygo Corporation", + "part_name": "1373-000-003200 lpmm focus grating" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-03-28 00:00:00", + "bol_description": "Interferometer Machine; Interferometer Machine, model: 70-DAMT-V3-A02-01, maker: DATA-PIXEL.220V, 30W 100% new, disassembled, details attached", + "consignee": "fujikura fiber optics vietnam ltd", + "declared_hs": "90318090", + "hs_verified": true, + "origin_country": "FRANCE", + "port_dest": "", + "port_origin": "", + "shipper": "seikoh giken co.,ltd" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903149", + "903141", + "903190", + "903180" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0854", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0854", + "justification_text": "Goods classified under HS 9031.80; corroborated by 25 customs rulings on comparable goods (EU-DE, EU-FR, EU-IT, US).", + "reference_ruling_ids": [ + "CROSS-957070", + "CROSS-954657", + "CROSS-089928", + "CROSS-H250531", + "CROSS-958886", + "CROSS-961003", + "CROSS-966482", + "CROSS-H035572", + "CROSS-N308777", + "CROSS-N332455", + "EBTI-IT-ITBTI2018-0489M-274100", + "CROSS-952235", + "CROSS-952778", + "CROSS-953551", + "CROSS-H009364", + "CROSS-H097095", + "CROSS-H112722", + "CROSS-N348625", + "CROSS-N357964", + "CROSS-N359967", + "EBTI-DE-DE20855/16-1", + "EBTI-FR-FRBTIFR-BTI-2021-03787", + "EBTI-FR-FRBTIFR-BTI-2021-04793", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "EBTI-FR-FRBTIFR-BTI-2023-08091" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Fibre end-face interferometer (model 70-DAMT-V3): an optical interferometric instrument that inspects/measures the end-face geometry of fibre-optic connectors. Disassembled", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Seikoh Giken", + "part_name": "Interferometer Machine Interferometer" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-03-27 00:00:00", + "bol_description": "F25MME0379-Interferometer:Connector end face checker ;DATA-PIXEL; model: DAISI-MT, s/n: 20/0459/00.00.00, 100-240VAC.1.0A", + "consignee": "fujikura fiber optics vietnam ltd", + "declared_hs": "90318090", + "hs_verified": true, + "origin_country": "FRANCE", + "port_dest": "", + "port_origin": "", + "shipper": "fujikura ltd" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903190", + "903180", + "903141", + "903149" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0855", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0855", + "justification_text": "Goods classified under HS 9031.80; corroborated by 20 customs rulings on comparable goods (EU-DE, EU-FR, EU-IT, US).", + "reference_ruling_ids": [ + "CROSS-957070", + "CROSS-089928", + "CROSS-954657", + "CROSS-961003", + "CROSS-966482", + "CROSS-N359967", + "EBTI-IT-ITBTI2018-0489M-274100", + "CROSS-952235", + "CROSS-953551", + "CROSS-958886", + "CROSS-H035572", + "CROSS-H097095", + "CROSS-H244110", + "CROSS-N308777", + "CROSS-N332455", + "CROSS-N348625", + "CROSS-N357964", + "EBTI-DE-DE20855/16-1", + "EBTI-FR-FRBTIFR-BTI-2021-04793", + "EBTI-FR-FRBTIFR-BTI-2023-01888" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Fibre-connector end-face interferometer (DAISI-MT): an optical interferometric instrument that inspects/measures the end-face geometry of fibre-optic connectors", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Fujikura", + "part_name": "F25MME0379-Interferometer:Connector end" + } + }, + { + "bol_metadata": { + "arrival_date": "2023-09-26 00:00:00", + "bol_description": "LASER ELLIPSOMETER SE 400ADV-300", + "consignee": "applied materials india private limited", + "declared_hs": "90318000", + "hs_verified": true, + "origin_country": "GERMANY", + "port_dest": "BANGALORE ACC INBLR4", + "port_origin": "FRANKFURT MAIN INT L", + "shipper": "sentech instruments gmbh" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903190", + "903141", + "903149", + "903180" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0856", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0856", + "justification_text": "Goods classified under HS 9031.80; corroborated by 22 customs rulings on comparable goods (EU-DE, EU-FR, US).", + "reference_ruling_ids": [ + "CROSS-966482", + "CROSS-957070", + "EBTI-FR-FRBTIFR-BTI-2022-07664", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "CROSS-089928", + "CROSS-954657", + "CROSS-961003", + "CROSS-N332455", + "EBTI-FR-FR-RTC-2016-008749", + "CROSS-952235", + "CROSS-H035572", + "CROSS-H154038", + "CROSS-H240792", + "CROSS-H244110", + "CROSS-N308777", + "CROSS-N348625", + "EBTI-DE-DE20855/16-1", + "EBTI-FR-FR-RTC-2014-001975", + "EBTI-FR-FRBTIFR-BTI-2020-01824", + "EBTI-FR-FRBTIFR-BTI-2021-04793", + "EBTI-FR-FRBTIFR-BTI-2022-07695", + "EBTI-FR-FRBTIFR-BTI-2023-08091" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A multiple-angle laser (HeNe) ellipsometer (SE 400adv): a thin-film metrology instrument that measures the thickness (to ~0.1 angstrom), refractive index and extinction coefficient of transparent thin films and layer stacks via polarised-light reflection at multiple incidence angles", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "SENTECH Instruments", + "part_name": "laser ellipsometer SE 400ADV-300" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-22 00:00:00", + "bol_description": "GROUND BOND TESTER MODEL 19572HIPOT AGM -", + "consignee": "tdk-lambda malaysia sdn bhd", + "declared_hs": "9031809000", + "hs_verified": true, + "origin_country": "THAILAND", + "port_dest": "PASIR GUDANG JOHOR", + "port_origin": "SAMUT PRAKAN SAHATHAI TERMINAL", + "shipper": "tdk thailand co ltd" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903180", + "903149", + "903141", + "903190" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0857", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0857", + "justification_text": "Goods classified under HS 9031.80; corroborated by 53 customs rulings on comparable goods (EU-CZ, EU-DE, EU-FR, US).", + "reference_ruling_ids": [ + "CROSS-966482", + "CROSS-961003", + "CROSS-089928", + "CROSS-N359967", + "CROSS-950196", + "CROSS-N357964", + "CROSS-952235", + "CROSS-952778", + "CROSS-954657", + "CROSS-957070", + "CROSS-966185", + "CROSS-H250531", + "CROSS-I87168", + "CROSS-N308777", + "CROSS-N335815", + "EBTI-DE-DE20855/16-1", + "EBTI-DE-DE24219/10-1", + "EBTI-FR-FRBTIFR-BTI-2021-04793", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "CROSS-953551", + "CROSS-966296", + "CROSS-H009364", + "CROSS-H035572", + "CROSS-H112722", + "CROSS-H154035", + "CROSS-H315264", + "EBTI-CZ-CZ30-0470-2014", + "EBTI-DE-DE21303/13-1", + "EBTI-DE-DE26126/16-1", + "EBTI-DE-DE27739/16-1", + "EBTI-DE-DE27963/16-1", + "EBTI-DE-DE996/16-1", + "EBTI-DE-DEB/1839/06-1", + "EBTI-DE-DEBTI18562/24-1", + "EBTI-DE-DEBTI26857/24-1", + "EBTI-DE-DEBTI28937/24-1", + "EBTI-DE-DEBTI29406/20-1", + "EBTI-FR-FR-RTC-2014-000002", + "EBTI-FR-FR-RTC-2015-008284", + "EBTI-FR-FR-RTC-2016-002653", + "EBTI-FR-FRBTIFR-BTI-2021-03787", + "EBTI-FR-FRBTIFR-BTI-2023-01720", + "EBTI-FR-FRBTIFR-BTI-2023-08091", + "EBTI-FR-FRBTIFR-BTI-2024-04000", + "EBTI-FR-FRBTIFR-BTI-2024-04055", + "EBTI-FR-FRBTIFR-BTI-2025-03379", + "CROSS-875000", + "CROSS-952768", + "CROSS-H097095", + "CROSS-H244110", + "CROSS-N332455", + "CROSS-N348625", + "EBTI-FR-FR-RTC-2014-005643" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Ground-bond / hipot safety tester (model 19572): an electrical-safety instrument that verifies protective-earth bonding and dielectric withstand (hipot) of equipment. It is supplied as a replacement or spare component for the parent semiconductor tool rather than as standalone equipment, and is fitted, consumed or maintained during normal tool operation", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "TDK", + "part_name": "ground bond tester model 19572HIPOT AGM" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-19 00:00:00", + "bol_description": "GPT-9804-AC/DC WITHSTANDING VOLTAGE/INSULATION RESISTANCE/GROUND BOND TESTER (FOR TESTING AND MEASURING PURPOSE)", + "consignee": "gw instek india llp", + "declared_hs": "90318000", + "hs_verified": true, + "origin_country": "CHINA TAIWAN", + "port_dest": "", + "port_origin": "", + "shipper": "good will instrument co.,ltd" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903190", + "903149", + "903141", + "903180" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0858", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0858", + "justification_text": "Goods classified under HS 9031.80; corroborated by 43 customs rulings on comparable goods (EU-CZ, EU-DE, EU-FR, US).", + "reference_ruling_ids": [ + "CROSS-089928", + "CROSS-961003", + "CROSS-954657", + "CROSS-966482", + "CROSS-N359967", + "EBTI-DE-DE20855/16-1", + "EBTI-DE-DE24219/10-1", + "EBTI-FR-FRBTIFR-BTI-2021-04793", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "CROSS-953551", + "CROSS-957070", + "CROSS-966185", + "CROSS-H009364", + "CROSS-N332455", + "CROSS-N357964", + "EBTI-CZ-CZ30-0470-2014", + "EBTI-DE-DE21303/13-1", + "EBTI-DE-DE26126/16-1", + "EBTI-DE-DE27739/16-1", + "EBTI-DE-DE27963/16-1", + "EBTI-DE-DE996/16-1", + "EBTI-DE-DEB/1839/06-1", + "EBTI-DE-DEBTI18562/24-1", + "EBTI-DE-DEBTI26857/24-1", + "EBTI-DE-DEBTI28937/24-1", + "EBTI-DE-DEBTI29406/20-1", + "EBTI-FR-FR-RTC-2014-000002", + "EBTI-FR-FR-RTC-2015-008284", + "EBTI-FR-FR-RTC-2016-002653", + "EBTI-FR-FRBTIFR-BTI-2021-03787", + "EBTI-FR-FRBTIFR-BTI-2023-08091", + "EBTI-FR-FRBTIFR-BTI-2024-04000", + "EBTI-FR-FRBTIFR-BTI-2024-04055", + "EBTI-FR-FRBTIFR-BTI-2025-03379", + "CROSS-950196", + "CROSS-952235", + "CROSS-952778", + "CROSS-H112722", + "CROSS-H244110", + "CROSS-H315264", + "CROSS-N308777", + "CROSS-N335815", + "EBTI-FR-FR-RTC-2014-005643" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A four-in-one electrical-safety tester (GPT-9804): an instrument that performs AC and DC withstanding-voltage (hipot, up to ~5 kV), insulation-resistance and ground-bond tests on equipment, with self-check, zero-crossing turn-on and fast abnormal-voltage cut-off for operator safety", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "GW Instek", + "part_name": "GPT-9804-AC/DC withstanding" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-04-19 00:00:00", + "bol_description": "GCT-9040 (USB)-AC GROUND BOND TESTER (FOR TESTING AND MEASURING PURPOSE)", + "consignee": "gw instek india llp", + "declared_hs": "90318000", + "hs_verified": true, + "origin_country": "CHINA TAIWAN", + "port_dest": "", + "port_origin": "", + "shipper": "good will instrument co.,ltd" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903141", + "903149", + "903180", + "903190" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0859", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0859", + "justification_text": "Goods classified under HS 9031.80; corroborated by 48 customs rulings on comparable goods across 5 jurisdictions.", + "reference_ruling_ids": [ + "CROSS-957070", + "CROSS-089928", + "CROSS-952235", + "CROSS-H009364", + "EBTI-FR-FR-RTC-2014-000002", + "CROSS-950196", + "CROSS-952778", + "CROSS-961003", + "CROSS-N308777", + "CROSS-N359967", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "CROSS-952768", + "CROSS-954657", + "CROSS-966482", + "CROSS-H112722", + "CROSS-H244110", + "CROSS-N332455", + "CROSS-N335815", + "CROSS-N348625", + "CROSS-N357964", + "EBTI-DE-DE20855/16-1", + "EBTI-DE-DE24219/10-1", + "EBTI-FR-FRBTIFR-BTI-2021-04793", + "EBTI-FR-FRBTIFR-BTI-2023-08091", + "EBTI-FR-FRBTIFR-BTI-2024-04055", + "CROSS-953551", + "CROSS-966185", + "CROSS-H097095", + "CROSS-H315264", + "EBTI-CZ-CZ30-0470-2014", + "EBTI-DE-DE21303/13-1", + "EBTI-DE-DE26126/16-1", + "EBTI-DE-DE27739/16-1", + "EBTI-DE-DE27963/16-1", + "EBTI-DE-DE996/16-1", + "EBTI-DE-DEB/1839/06-1", + "EBTI-DE-DEBTI18562/24-1", + "EBTI-DE-DEBTI26857/24-1", + "EBTI-DE-DEBTI28937/24-1", + "EBTI-DE-DEBTI29406/20-1", + "EBTI-FR-FR-RTC-2015-008284", + "EBTI-FR-FR-RTC-2016-002653", + "EBTI-FR-FRBTIFR-BTI-2021-03787", + "EBTI-FR-FRBTIFR-BTI-2024-04000", + "EBTI-FR-FRBTIFR-BTI-2025-03379", + "EBTI-IT-ITBTIIT-2017-0482M-134100", + "CROSS-H250531", + "EBTI-FR-FR-RTC-2014-005643" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "An AC ground-bond tester (GCT-9040): an electrical-safety instrument that measures the protective-earth bond resistance of equipment to verify safe grounding, part of a ground-bond/safety-test product family with USB data interface", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "GW Instek", + "part_name": "GCT-9040 (USB)-AC ground bond tester" + } + }, + { + "bol_metadata": { + "arrival_date": "2025-03-31 00:00:00", + "bol_description": "Automatic glue tester, manufacturer: CHEON WOO, model: BONDING MC VISION WINDOW, AC220V / 60HZ(50Hz)", + "consignee": "hansol electronics vietnam co., ltd", + "declared_hs": "90318090", + "hs_verified": true, + "origin_country": "SOUTH KOREA", + "port_dest": "", + "port_origin": "", + "shipper": "cong ty tnhh samsung electronics viet nam thai nguyen" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903180", + "903141", + "903190", + "903149" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0860", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0860", + "justification_text": "Goods classified under HS 9031.80; corroborated by 59 customs rulings on comparable goods across 5 jurisdictions.", + "reference_ruling_ids": [ + "CROSS-954657", + "CROSS-957070", + "CROSS-961003", + "CROSS-966482", + "CROSS-953551", + "CROSS-966185", + "CROSS-966296", + "CROSS-H035572", + "CROSS-H244110", + "CROSS-N357964", + "EBTI-IT-ITBTIIT-2017-0482M-134100", + "EBTI-IT-ITBTIIT922104-2021-BTI0658", + "CROSS-089928", + "CROSS-950196", + "CROSS-952778", + "CROSS-H250531", + "EBTI-DE-DE20855/16-1", + "EBTI-DE-DE24219/10-1", + "EBTI-DE-DE27963/16-1", + "EBTI-FR-FR-RTC-2014-000002", + "EBTI-FR-FR-RTC-2016-002653", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "CROSS-H009364", + "CROSS-H112722", + "CROSS-N335815", + "CROSS-N359967", + "EBTI-CZ-CZ30-0470-2014", + "EBTI-DE-DE21303/13-1", + "EBTI-DE-DE26126/16-1", + "EBTI-DE-DE27739/16-1", + "EBTI-DE-DE996/16-1", + "EBTI-DE-DEB/1839/06-1", + "EBTI-DE-DEBTI14470/23-1", + "EBTI-DE-DEBTI18562/24-1", + "EBTI-DE-DEBTI26857/24-1", + "EBTI-DE-DEBTI28937/24-1", + "EBTI-DE-DEBTI29406/20-1", + "EBTI-FR-FR-RTC-2014-001975", + "EBTI-FR-FR-RTC-2014-003018", + "EBTI-FR-FR-RTC-2015-008284", + "EBTI-FR-FR-RTC-2016-008749", + "EBTI-FR-FRBTIFR-BTI-2019-17693", + "EBTI-FR-FRBTIFR-BTI-2020-01824", + "EBTI-FR-FRBTIFR-BTI-2021-03787", + "EBTI-FR-FRBTIFR-BTI-2021-04793", + "EBTI-FR-FRBTIFR-BTI-2023-00955", + "EBTI-FR-FRBTIFR-BTI-2023-08091", + "EBTI-FR-FRBTIFR-BTI-2024-04000", + "EBTI-FR-FRBTIFR-BTI-2025-03379", + "EBTI-FR-FRBTIFR-BTI-2025-04624", + "EBTI-IT-ITBTI2018-0543M-314100", + "CROSS-952235", + "CROSS-958886", + "CROSS-H154035", + "CROSS-H315264", + "CROSS-N308777", + "CROSS-N332455", + "EBTI-FR-FR-RTC-2014-005643", + "EBTI-FR-FR-RTC-2015-003153" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Automatic adhesive/bond inspection tester (vision, for bonding window): a machine-vision measuring system that checks adhesive/glue dispensing on a bonding window", + "tier1_source": "BOL", + "tier2_classifiable": "partial", + "tier2_minimal": { + "manufacturer": "Samsung Electronics", + "part_name": "Automatic glue tester model: BONDING MC" + } + }, + { + "bol_metadata": { + "bol_description": "PIN. .000-SIRIUSI-8XACC - DEWESOFT-X-PROF (INSTRUEMENT TO MEASURE VIBRATION)INSTRUEMENT TO MEASURE VIBRATION", + "origin_country": "SI", + "shipper": "dewesoft d.o.o" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90). HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "903149", + "903190", + "903141", + "903180" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits", + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0861", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0861", + "justification_text": "A vibration or accelerometer DAQ system measures non-electrical physical quantities and falls under 9031.80, not electrical meters of 9030.33. Classified under HS 9031.80.", + "reference_ruling_ids": [ + "CROSS-H244110", + "CROSS-952235", + "CROSS-N335815", + "CROSS-957070", + "CROSS-952778", + "CROSS-N357964", + "CROSS-N359967", + "CROSS-952768", + "CROSS-H009364", + "CROSS-954657", + "CROSS-961003", + "CROSS-950196", + "CROSS-953551", + "CROSS-H154035", + "CROSS-H154038", + "CROSS-H240792", + "CROSS-N308777", + "EBTI-DE-DEBTI14470/23-1", + "CROSS-H250531", + "CROSS-N348625", + "CROSS-N356337", + "EBTI-IT-ITBTIIT-2017-0482M-134100", + "CROSS-H112722", + "CROSS-H315264", + "EBTI-DE-DEBTI28937/24-1", + "EBTI-DE-DEBTI29406/20-1", + "EBTI-FR-FRBTIFR-BTI-2019-17693", + "EBTI-FR-FRBTIFR-BTI-2023-08091", + "CROSS-966185", + "CROSS-966482", + "CROSS-C89056", + "CROSS-H035572", + "CROSS-H097095", + "EBTI-DE-DE20855/16-1", + "EBTI-DE-DE9293/15-1", + "EBTI-DE-DEB/1839/06-1", + "EBTI-FR-FR-RTC-2014-003018", + "EBTI-FR-FRBTIFR-BTI-2024-04000", + "EBTI-IT-ITBTIIT-2017-0602M-222100" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Eight-channel modular data acquisition front-end configured for vibration/acceleration measurement, accepting IEPE/accelerometer inputs. Built on 24-bit isolated signal-conditioning channels with high-speed simultaneous sampling and supplied acquisition software, it conditions and digitizes dynamic sensor signals for structural and machinery vibration analysis", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Dewesoft", + "part_name": "PIN. .000-siriusi-8XACC - -X-prof" + } + }, + { + "bol_metadata": { + "bol_description": "PIN. .000 IOLITERW-6XSTG (INSTRUEMENT TO MEASURE STRAIN)INSTRUEMENT TO MEASURE STRAIN", + "origin_country": "SI", + "shipper": "dewesoft d.o.o" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90). HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "903141", + "903180", + "903190", + "903149" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits", + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0862", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0862", + "justification_text": "A strain-gauge DAQ system measures mechanical strain through sensors and is an other measuring/checking instrument of 9031.80, not 9030.33 electrical meters. Classified under HS 9031.80.", + "reference_ruling_ids": [ + "CROSS-952235", + "CROSS-957070", + "CROSS-952768", + "CROSS-952778", + "CROSS-H244110", + "CROSS-N357964", + "CROSS-953551", + "EBTI-IT-ITBTIIT-2017-0482M-134100", + "CROSS-954657", + "CROSS-961003", + "CROSS-H009364", + "CROSS-N359967", + "CROSS-H112722", + "CROSS-N335815", + "EBTI-FR-FR-RTC-2014-003018", + "EBTI-IT-ITBTIIT922104-2021-BTI0658", + "CROSS-950196", + "CROSS-H097095", + "CROSS-H154035", + "CROSS-N308777", + "EBTI-DE-DEBTI28937/24-1", + "EBTI-FR-FR-RTC-2014-000002", + "EBTI-FR-FRBTIFR-BTI-2020-01824", + "EBTI-FR-FRBTIFR-BTI-2021-03787", + "EBTI-IT-ITBTI2018-0543M-314100", + "CROSS-089928", + "CROSS-E82962", + "CROSS-N332455", + "CROSS-N348625", + "EBTI-DE-DEBTI29406/20-1", + "CROSS-966185", + "CROSS-C80235", + "CROSS-H035572", + "CROSS-H154038", + "CROSS-H240792", + "CROSS-H315264", + "EBTI-CZ-CZ30-0470-2014", + "EBTI-DE-DE20855/16-1", + "EBTI-DE-DE21303/13-1", + "EBTI-DE-DE24219/10-1", + "EBTI-DE-DE26126/16-1", + "EBTI-DE-DE27739/16-1", + "EBTI-DE-DE27963/16-1", + "EBTI-DE-DE9293/15-1", + "EBTI-DE-DE996/16-1", + "EBTI-DE-DEB/1839/06-1", + "EBTI-DE-DEBTI14470/23-1", + "EBTI-DE-DEBTI18562/24-1", + "EBTI-DE-DEBTI26857/24-1", + "EBTI-FR-FR-RTC-2014-001975", + "EBTI-FR-FR-RTC-2015-008284", + "EBTI-FR-FR-RTC-2016-002653", + "EBTI-FR-FR-RTC-2016-008749", + "EBTI-FR-FRBTIFR-BTI-2019-17693", + "EBTI-FR-FRBTIFR-BTI-2021-04793", + "EBTI-FR-FRBTIFR-BTI-2023-00955", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "EBTI-FR-FRBTIFR-BTI-2024-04000", + "EBTI-FR-FRBTIFR-BTI-2024-04055", + "EBTI-FR-FRBTIFR-BTI-2025-03379", + "EBTI-FR-FRBTIFR-BTI-2025-04624", + "CROSS-958886", + "CROSS-H250531", + "EBTI-FR-FRBTIFR-BTI-2023-08091" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Modular distributed data acquisition unit with strain-gauge inputs for measuring mechanical strain. It provides bridge excitation and 24-bit conditioning across multiple isolated channels, digitizing low-level bridge signals for structural and load testing, supplied without an integral recording device", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Dewesoft", + "part_name": "PIN. .000 ioliterw-6XSTG (instruement" + } + }, + { + "bol_metadata": { + "bol_description": "1. ЦИФРОВОЙ МОДУЛЬ ВВОДА-ВЫВОДА ДАННЫХ МОДУЛЬ ПРЕОБРАЗОВАНИЯ АНАЛОГОВОГО СИГНАЛАZ.BLOXX 407,;МОДУЛЬ ПРЕОБРАЗОВАНИЯ АНАЛОГОВОГО СИГНАЛАZ.BLOXX 407 ЦИФРОВОЙ МОДУЛЬ ВВОДА/ВЫВОДА 2 4-ПРОВОДНЫХ PT100/1000 2 ЦИФРОВЫХ ДАТЧИКА СОСТОЯНИЯ ВХОДА 1 ЦИФРОВОЙ СЧЕТЧИК ВХОДА 0-1 КГЦ 1 ВСТРОЕННЫЙ ДАТЧИК ТЕМПЕРАТУРЫ ИНТЕРФЕЙС ПОЛЕВОЙ ШИНЫ RS 485 MODBUS RTU ИС ТОЧНИК ПИТАНИЯ 10-36 В/1 В", + "origin_country": "AT", + "shipper": "gantner instruments enviroment solutions gmbh" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90). HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "903149", + "903180", + "903141", + "903190" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits", + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0863", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0863", + "justification_text": "A DAQ measurement node for RTD/temperature and analog signals is a measuring/checking instrument under 9031.80 rather than a 9030.33 electrical meter. Classified under HS 9031.80.", + "reference_ruling_ids": [ + "CROSS-N359967", + "CROSS-952235", + "CROSS-950196", + "CROSS-957070", + "CROSS-H244110", + "CROSS-N357964", + "CROSS-952778", + "CROSS-H009364", + "CROSS-N308777", + "CROSS-N335815", + "CROSS-N348625", + "CROSS-H154035", + "EBTI-FR-FRBTIFR-BTI-2023-08091", + "CROSS-961003", + "CROSS-H112722", + "CROSS-H154038", + "CROSS-H240792", + "CROSS-H250531", + "CROSS-N332455", + "CROSS-N356337", + "CROSS-953551", + "CROSS-954657", + "CROSS-C89056", + "CROSS-H035572", + "EBTI-DE-DE21303/13-1", + "EBTI-DE-DEBTI18562/24-1", + "EBTI-FR-FR-RTC-2014-000002", + "EBTI-IT-ITBTIIT922104-2021-BTI0658", + "CROSS-089928", + "CROSS-966185", + "CROSS-966482", + "CROSS-H097095", + "CROSS-H315264", + "EBTI-DE-DE20855/16-1", + "EBTI-DE-DEB/1839/06-1", + "EBTI-DE-DEBTI14470/23-1", + "EBTI-DE-DEBTI29406/20-1", + "EBTI-FR-FRBTIFR-BTI-2019-17693", + "EBTI-FR-FRBTIFR-BTI-2021-03787", + "EBTI-FR-FRBTIFR-BTI-2023-01888" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Digital input/output and analog signal-conversion module with two 4-wire Pt100/1000 RTD temperature inputs, two digital status inputs, one digital counter input to 1 kHz, an embedded temperature sensor and an RS-485 Modbus-RTU fieldbus interface, powered at 10-36 V. Used as a distributed measurement node converting and transmitting analog sensor signals", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Gantner Instruments", + "part_name": "1. ЦИФРОВОЙ МОДУЛЬ ВВОДА-ВЫВОДА ДАННЫХ" + } + }, + { + "bol_metadata": { + "bol_description": "AVS AUTO VIBRATION SYSTEM 300MM L", + "origin_country": "USA", + "shipper": "applied materials india private limited" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90). HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "903190", + "903149", + "903141", + "903180" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits", + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0864", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0864", + "justification_text": "A wafer-shaped vibration measurement system measures vibration/acceleration and belongs in other measuring/checking instruments of 9031.80, not optical 9031.41. Classified under HS 9031.80.", + "reference_ruling_ids": [ + "CROSS-H244110", + "CROSS-N335815", + "CROSS-966185", + "CROSS-H009364", + "CROSS-N357964", + "CROSS-N359967", + "CROSS-952235", + "CROSS-966482", + "CROSS-950196", + "CROSS-953551", + "CROSS-957070", + "CROSS-961003", + "EBTI-FR-FR-RTC-2014-000002", + "CROSS-H035572", + "EBTI-FR-FRBTIFR-BTI-2024-04000", + "CROSS-952778", + "CROSS-954657", + "CROSS-966296", + "CROSS-N308777", + "EBTI-DE-DE20855/16-1", + "EBTI-DE-DEBTI28937/24-1", + "EBTI-FR-FR-RTC-2016-002653", + "EBTI-IT-ITBTIIT-2017-0482M-134100", + "EBTI-IT-ITBTIIT922104-2021-BTI0658", + "CROSS-H097095", + "CROSS-H315264", + "EBTI-DE-DE27963/16-1", + "EBTI-DE-DEB/1839/06-1", + "EBTI-DE-DEBTI14470/23-1", + "EBTI-DE-DEBTI29406/20-1", + "CROSS-H154035", + "CROSS-H154038", + "CROSS-H240792", + "CROSS-H250531", + "CROSS-N332455", + "CROSS-N348625", + "EBTI-CZ-CZ30-0470-2014", + "EBTI-DE-DE21303/13-1", + "EBTI-DE-DE24219/10-1", + "EBTI-DE-DE26126/16-1", + "EBTI-DE-DE27739/16-1", + "EBTI-DE-DE996/16-1", + "EBTI-DE-DEBTI18562/24-1", + "EBTI-DE-DEBTI26857/24-1", + "EBTI-FR-FR-RTC-2015-008284", + "EBTI-FR-FRBTIFR-BTI-2019-17693", + "EBTI-FR-FRBTIFR-BTI-2021-03787", + "EBTI-FR-FRBTIFR-BTI-2021-04793", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "EBTI-FR-FRBTIFR-BTI-2025-03379", + "CROSS-089928", + "CROSS-952768", + "CROSS-H112722", + "CROSS-N356337", + "EBTI-FR-FR-RTC-2014-001975", + "EBTI-FR-FR-RTC-2014-003018", + "EBTI-FR-FR-RTC-2016-008749", + "EBTI-FR-FRBTIFR-BTI-2020-01824", + "EBTI-FR-FRBTIFR-BTI-2023-00955", + "EBTI-FR-FRBTIFR-BTI-2023-08091", + "EBTI-FR-FRBTIFR-BTI-2024-04055", + "EBTI-FR-FRBTIFR-BTI-2025-04624", + "EBTI-IT-ITBTI2018-0543M-314100", + "CROSS-958886", + "CROSS-C89056", + "EBTI-IT-ITBTI2020-0049M-022300" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A wireless, wafer-shaped auto vibration measuring system in a 300mm form factor used to diagnose semiconductor process tools. The vacuum-compatible sensor disc measures acceleration in three axes in real time to detect wafer slides, bumps, scrapes and rough handling inside the equipment, logging data for analysis without opening the chamber. Comprises an accelerometer, electronics and battery in a thin carbon-fiber housing", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Applied Materials", + "part_name": "AVS auto vibration system 300MM L" + } + }, + { + "bol_metadata": { + "bol_description": "HIGH-PRECISION ELECTRON BEAM METROLOGY SYSTEM", + "origin_country": "Japan", + "shipper": "hitachi high-tech corporation" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903190", + "903141", + "903149", + "903180" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0865", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0865", + "justification_text": "Electron-beam metrology is non-optical measuring/checking apparatus under 9031.80, not optical inspection instruments of 9031.41. Classified under HS 9031.80.", + "reference_ruling_ids": [ + "CROSS-966482", + "CROSS-966185", + "CROSS-966296", + "CROSS-950196", + "CROSS-961003", + "CROSS-H035572", + "CROSS-H244110", + "CROSS-N357964", + "CROSS-N335815", + "EBTI-FR-FR-RTC-2014-000002", + "CROSS-089928", + "CROSS-H097095", + "CROSS-N308777", + "EBTI-IT-ITBTIIT-2017-0482M-134100", + "EBTI-IT-ITBTIIT922104-2021-BTI0658", + "CROSS-954657", + "CROSS-H315264", + "CROSS-I87168", + "CROSS-N359967", + "EBTI-FR-FR-RTC-2016-002653", + "EBTI-FR-FRBTIFR-BTI-2021-03787", + "EBTI-IT-ITBTI2018-0543M-314100", + "CROSS-952768", + "CROSS-953551", + "CROSS-H154035", + "CROSS-N332455", + "EBTI-FR-FR-RTC-2014-003018", + "EBTI-FR-FRBTIFR-BTI-2018-03117", + "EBTI-FR-FRBTIFR-BTI-2020-01824", + "EBTI-FR-FRBTIFR-BTI-2023-01720", + "CROSS-875000", + "CROSS-952778", + "CROSS-C80235", + "CROSS-H009364", + "CROSS-H112722", + "CROSS-N348625", + "EBTI-DE-DE20855/16-1", + "EBTI-DE-DE27963/16-1", + "EBTI-FR-FR-RTC-2015-003153", + "EBTI-FR-FRBTIFR-BTI-2023-00955", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "EBTI-FR-FRBTIFR-BTI-2023-08091" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Precision electron-beam metrology system for semiconductor manufacturing, using a focused electron beam to image and measure critical dimensions and overlay on wafers and photomasks at nanometer scale. The tool combines an electron column, wafer/reticle stage, vacuum chamber, and image-processing electronics to perform automated dimensional inspection of patterned features during device fabrication", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Hitachi High-Tech", + "part_name": "precision electron beam metrology system" + } + }, + { + "bol_metadata": { + "bol_description": "MODEL,ALPHASTEP D-600 WITH ACCESSORIES PART NO. 0550777-000SERIAL NO. (FOR RESEARCH AND DEVELOPMENT PURPOSE)MODEL,ALPHASTEP D-600 SERIAL NO", + "origin_country": "US", + "shipper": "kla-tencor singapore pte ltd" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90). HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "903149", + "903141", + "903180", + "903190" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits", + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0866", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0866", + "justification_text": "A stylus surface profiler is a contact measuring instrument under 9031.80, not an optical measuring/checking instrument of 9031.49. Classified under HS 9031.80.", + "reference_ruling_ids": [ + "CROSS-N335815", + "CROSS-950196", + "CROSS-H244110", + "CROSS-N308777", + "CROSS-N357964", + "CROSS-N359967", + "CROSS-966482", + "CROSS-N332455", + "CROSS-952235", + "CROSS-961003", + "CROSS-H035572", + "CROSS-H250531", + "EBTI-FR-FRBTIFR-BTI-2020-01824", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "CROSS-952778", + "CROSS-954657", + "CROSS-957070", + "CROSS-H009364", + "CROSS-H154035", + "CROSS-N348625", + "CROSS-N356337", + "CROSS-089928", + "CROSS-966185", + "CROSS-H112722", + "CROSS-H154038", + "CROSS-H240792", + "EBTI-DE-DE20855/16-1", + "EBTI-DE-DEBTI14470/23-1", + "EBTI-DE-DEBTI28937/24-1", + "EBTI-FR-FR-RTC-2016-008749", + "EBTI-FR-FRBTIFR-BTI-2019-17693", + "CROSS-953551", + "CROSS-C89056", + "EBTI-DE-DE9293/15-1", + "EBTI-DE-DEB/1839/06-1", + "EBTI-DE-DEBTI29406/20-1", + "EBTI-FR-FR-RTC-2014-000002", + "EBTI-FR-FR-RTC-2014-005643", + "EBTI-FR-FRBTIFR-BTI-2021-04793", + "EBTI-FR-FRBTIFR-BTI-2023-08091", + "EBTI-FR-FRBTIFR-BTI-2024-04000", + "EBTI-IT-ITBTIIT-2017-0482M-134100", + "EBTI-IT-ITBTIIT-2017-0602M-222100" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Stylus surface profiler used to measure step height, film thickness, roughness and surface profile in research and production. A fine-tipped stylus traverses the sample on a motorized stage while an optical-lever sensor records vertical deflection at nanometer resolution, producing 2D and 3D profiles. The instrument includes precision optics, adjustable contact force and analysis software, supporting measurement on materials ranging from soft photoresist to hard films", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "KLA-Tencor", + "part_name": "model alphastep D-600 with accessories" + } + }, + { + "bol_metadata": { + "bol_description": "CARL ZEISS MAKE CO-ORDINATE MEASURING MACH", + "origin_country": "DE", + "shipper": "carl zeiss india bangalore private limited" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903190", + "903141", + "903180", + "903149" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0867", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0867", + "justification_text": "Other measuring or checking instruments not more specifically provided are classified under 9031.80. Classified under HS 9031.80.", + "reference_ruling_ids": [ + "CROSS-957070", + "CROSS-953551", + "CROSS-N335815", + "CROSS-N357964", + "CROSS-089928", + "CROSS-952778", + "CROSS-966482", + "CROSS-H035572", + "CROSS-N359967", + "CROSS-954657", + "CROSS-N332455", + "CROSS-966185", + "CROSS-N308777", + "EBTI-FR-FR-RTC-2014-000002", + "CROSS-952235", + "CROSS-958886", + "EBTI-FR-FRBTIFR-BTI-2021-03787", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "EBTI-FR-FRBTIFR-BTI-2023-08091", + "CROSS-950196", + "CROSS-961003", + "CROSS-E82962", + "CROSS-H009364", + "CROSS-H097095", + "CROSS-H154035", + "CROSS-N348625", + "EBTI-DE-DE20855/16-1", + "EBTI-DE-DE996/16-1", + "EBTI-DE-DEBTI29406/20-1", + "EBTI-FR-FRBTIFR-BTI-2020-01824", + "EBTI-FR-FRBTIFR-BTI-2021-04793", + "CROSS-966296", + "CROSS-H154038", + "CROSS-H240792", + "CROSS-H244110", + "CROSS-H250531", + "EBTI-CZ-CZ30-0470-2014", + "EBTI-DE-DE21303/13-1", + "EBTI-DE-DE24219/10-1", + "EBTI-DE-DE26126/16-1", + "EBTI-DE-DE27739/16-1", + "EBTI-DE-DE27963/16-1", + "EBTI-DE-DEB/1839/06-1", + "EBTI-DE-DEBTI14470/23-1", + "EBTI-DE-DEBTI18562/24-1", + "EBTI-DE-DEBTI26857/24-1", + "EBTI-DE-DEBTI28937/24-1", + "EBTI-FR-FR-RTC-2014-001975", + "EBTI-FR-FR-RTC-2014-003018", + "EBTI-FR-FR-RTC-2015-008284", + "EBTI-FR-FR-RTC-2016-002653", + "EBTI-FR-FR-RTC-2016-008749", + "EBTI-FR-FRBTIFR-BTI-2019-17693", + "EBTI-FR-FRBTIFR-BTI-2023-00955", + "EBTI-FR-FRBTIFR-BTI-2024-04000", + "EBTI-FR-FRBTIFR-BTI-2024-04055", + "EBTI-FR-FRBTIFR-BTI-2025-03379", + "EBTI-FR-FRBTIFR-BTI-2025-04624", + "EBTI-IT-ITBTI2018-0489M-274100", + "EBTI-IT-ITBTI2018-0543M-314100", + "EBTI-IT-ITBTIIT-2017-0482M-134100", + "EBTI-IT-ITBTIIT922104-2021-BTI0658", + "CROSS-862381", + "CROSS-952768", + "CROSS-H112722", + "CROSS-H315264", + "EBTI-FR-FR-RTC-2014-005643", + "EBTI-FR-FR-RTC-2015-003153" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Coordinate measuring machine (CMM) used for dimensional inspection of manufactured parts. The instrument employs a tactile probe mounted on a multi-axis moving structure to capture point coordinates on a workpiece surface, then computes geometric features, form, position and tolerances. Built on a granite reference table with precision linear guideways and scales, it serves quality control in machining, automotive and general metalworking laboratories", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Carl Zeiss", + "part_name": "make CO-ordinate measuring mach" + } + }, + { + "bol_metadata": { + "bol_description": "CARL ZEISS MAKE CO-ORDINATE Model: CMM SPE", + "origin_country": "DE", + "shipper": "carl zeiss india bangalore private limited" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903141", + "903149", + "903180", + "903190" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0868", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0868", + "justification_text": "Other measuring or checking instruments not more specifically provided are classified under 9031.80. Classified under HS 9031.80.", + "reference_ruling_ids": [ + "CROSS-N335815", + "CROSS-957070", + "CROSS-H009364", + "CROSS-N357964", + "CROSS-N359967", + "CROSS-952778", + "CROSS-953551", + "CROSS-954657", + "CROSS-H112722", + "CROSS-N308777", + "CROSS-089928", + "CROSS-950196", + "CROSS-958886", + "CROSS-961003", + "CROSS-966185", + "CROSS-H035572", + "CROSS-N348625", + "EBTI-DE-DE26126/16-1", + "EBTI-DE-DEBTI18562/24-1", + "EBTI-FR-FRBTIFR-BTI-2023-08091", + "CROSS-952235", + "CROSS-966482", + "CROSS-H097095", + "CROSS-H154035", + "CROSS-H250531", + "CROSS-N332455", + "EBTI-DE-DEBTI14470/23-1", + "EBTI-FR-FR-RTC-2014-000002", + "EBTI-FR-FR-RTC-2014-003018", + "EBTI-FR-FRBTIFR-BTI-2020-01824", + "EBTI-FR-FRBTIFR-BTI-2021-03787", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "EBTI-FR-FRBTIFR-BTI-2024-04000", + "EBTI-IT-ITBTIIT-2017-0482M-134100", + "CROSS-H244110", + "EBTI-CZ-CZ30-0470-2014", + "EBTI-DE-DE20855/16-1", + "EBTI-DE-DE21303/13-1", + "EBTI-DE-DE24219/10-1", + "EBTI-DE-DE27739/16-1", + "EBTI-DE-DE27963/16-1", + "EBTI-DE-DE996/16-1", + "EBTI-DE-DEB/1839/06-1", + "EBTI-DE-DEBTI26857/24-1", + "EBTI-DE-DEBTI28937/24-1", + "EBTI-DE-DEBTI29406/20-1", + "EBTI-FR-FR-RTC-2014-001975", + "EBTI-FR-FR-RTC-2015-008284", + "EBTI-FR-FR-RTC-2016-002653", + "EBTI-FR-FR-RTC-2016-008749", + "EBTI-FR-FRBTIFR-BTI-2019-17693", + "EBTI-FR-FRBTIFR-BTI-2021-04793", + "EBTI-FR-FRBTIFR-BTI-2023-00955", + "EBTI-FR-FRBTIFR-BTI-2024-04055", + "EBTI-FR-FRBTIFR-BTI-2025-03379", + "EBTI-FR-FRBTIFR-BTI-2025-04624", + "EBTI-IT-ITBTI2018-0543M-314100", + "EBTI-IT-ITBTIIT922104-2021-BTI0658", + "CROSS-952768", + "EBTI-DE-DE9293/15-1", + "EBTI-FR-FR-RTC-2014-005643", + "EBTI-IT-ITBTIIT-2017-0602M-222100" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Coordinate measuring machine of the bridge or gantry type for high-accuracy dimensional metrology. A contact scanning probe travels on three orthogonal axes over a granite base to record surface points, which software converts into measurements of size, form and geometric tolerance. Used in production quality assurance to verify machined components against engineering drawings in industrial measuring rooms", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Carl Zeiss", + "part_name": "make CO-ordinate Model: CMM SPE" + } + }, + { + "bol_metadata": { + "bol_description": "ZEISS CNC COORDINATE MEASURING MACHINE (AS PER INV.)", + "origin_country": "DE", + "shipper": "carl zeiss imt shanghai co., ltd" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90). HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "903180", + "903141", + "903149", + "903190" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits", + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0869", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0869", + "justification_text": "Other measuring or checking instruments not more specifically provided are classified under 9031.80. Classified under HS 9031.80.", + "reference_ruling_ids": [ + "CROSS-957070", + "CROSS-N357964", + "CROSS-089928", + "CROSS-H035572", + "CROSS-N359967", + "CROSS-954657", + "CROSS-N335815", + "CROSS-950196", + "CROSS-953551", + "CROSS-966185", + "EBTI-FR-FR-RTC-2014-000002", + "EBTI-FR-FRBTIFR-BTI-2023-08091", + "CROSS-952778", + "CROSS-966482", + "CROSS-H009364", + "CROSS-H154035", + "CROSS-H244110", + "CROSS-961003", + "CROSS-966296", + "CROSS-N308777", + "CROSS-N348625", + "EBTI-DE-DE20855/16-1", + "EBTI-FR-FRBTIFR-BTI-2021-03787", + "EBTI-FR-FRBTIFR-BTI-2024-04055", + "EBTI-IT-ITBTIIT-2017-0482M-134100", + "EBTI-IT-ITBTIIT922104-2021-BTI0658", + "CROSS-958886", + "CROSS-N332455", + "CROSS-N356337", + "EBTI-DE-DE27963/16-1", + "EBTI-DE-DEB/1839/06-1", + "EBTI-DE-DEBTI14470/23-1", + "EBTI-DE-DEBTI29406/20-1", + "EBTI-FR-FR-RTC-2016-002653", + "EBTI-FR-FRBTIFR-BTI-2020-01824", + "EBTI-FR-FRBTIFR-BTI-2023-00955", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "CROSS-952235", + "CROSS-H097095", + "CROSS-H315264", + "EBTI-CZ-CZ30-0470-2014", + "EBTI-DE-DE21303/13-1", + "EBTI-DE-DE24219/10-1", + "EBTI-DE-DE26126/16-1", + "EBTI-DE-DE27739/16-1", + "EBTI-DE-DE996/16-1", + "EBTI-DE-DEBTI18562/24-1", + "EBTI-DE-DEBTI26857/24-1", + "EBTI-DE-DEBTI28937/24-1", + "EBTI-FR-FR-RTC-2014-001975", + "EBTI-FR-FR-RTC-2014-003018", + "EBTI-FR-FR-RTC-2015-008284", + "EBTI-FR-FR-RTC-2016-008749", + "EBTI-FR-FRBTIFR-BTI-2019-17693", + "EBTI-FR-FRBTIFR-BTI-2021-04793", + "EBTI-FR-FRBTIFR-BTI-2024-04000", + "EBTI-FR-FRBTIFR-BTI-2025-03379", + "EBTI-FR-FRBTIFR-BTI-2025-04624", + "EBTI-IT-ITBTI2018-0543M-314100", + "CROSS-C89056", + "CROSS-H112722", + "CROSS-H154038", + "CROSS-H240792", + "CROSS-H250531", + "EBTI-FR-FR-RTC-2014-005643", + "EBTI-FR-FR-RTC-2015-003153", + "EBTI-FR-FRBTIFR-BTI-2018-03117" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "CNC-controlled coordinate measuring machine for automated dimensional inspection of precision components. The system moves a probing sensor along computer-controlled axes over a stable measuring volume to acquire surface coordinates, calculating dimensions, geometric form and positional tolerances. Constructed with a rigid frame, linear encoders and temperature-stable structure, it supports repeatable quality control in manufacturing environments", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Carl Zeiss Industrial Metrology", + "part_name": "CNC coordinate measuring machine (as" + } + }, + { + "bol_metadata": { + "bol_description": "O-INSPECT HTS: MEASURING MACHINE WITH ASSECCOIRES", + "origin_country": "DE", + "shipper": "carl zeiss industrielle messtechnik" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90). HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "903149", + "903141", + "903190", + "903180" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits", + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0870", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0870", + "justification_text": "Other measuring or checking instruments not more specifically provided are classified under 9031.80. Classified under HS 9031.80.", + "reference_ruling_ids": [ + "CROSS-N357964", + "CROSS-N335815", + "CROSS-952778", + "CROSS-N359967", + "CROSS-957070", + "CROSS-H035572", + "CROSS-966482", + "CROSS-N308777", + "CROSS-950196", + "CROSS-953551", + "CROSS-961003", + "CROSS-966185", + "CROSS-H154035", + "CROSS-H244110", + "EBTI-DE-DEBTI18562/24-1", + "EBTI-FR-FR-RTC-2016-002653", + "CROSS-952235", + "CROSS-954657", + "CROSS-N332455", + "EBTI-FR-FR-RTC-2014-003018", + "EBTI-FR-FRBTIFR-BTI-2023-08091", + "EBTI-FR-FRBTIFR-BTI-2024-04000", + "CROSS-089928", + "CROSS-H009364", + "CROSS-H112722", + "EBTI-CZ-CZ30-0470-2014", + "EBTI-DE-DE20855/16-1", + "EBTI-DE-DE26126/16-1", + "EBTI-DE-DE27963/16-1", + "EBTI-DE-DEB/1839/06-1", + "EBTI-DE-DEBTI14470/23-1", + "EBTI-DE-DEBTI28937/24-1", + "EBTI-DE-DEBTI29406/20-1", + "EBTI-FR-FR-RTC-2014-001975", + "EBTI-FR-FRBTIFR-BTI-2021-03787", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "EBTI-FR-FRBTIFR-BTI-2025-04624", + "EBTI-IT-ITBTI2018-0489M-274100", + "EBTI-IT-ITBTIIT-2017-0482M-134100", + "CROSS-952768", + "CROSS-958886", + "CROSS-H097095", + "CROSS-H315264", + "CROSS-N348625", + "EBTI-FR-FR-RTC-2014-000002", + "EBTI-FR-FR-RTC-2014-005643", + "EBTI-FR-FRBTIFR-BTI-2020-01824", + "CROSS-966296", + "CROSS-H250531", + "EBTI-DE-DE21303/13-1", + "EBTI-DE-DE24219/10-1", + "EBTI-DE-DE27739/16-1", + "EBTI-DE-DE996/16-1", + "EBTI-DE-DEBTI26857/24-1", + "EBTI-FR-FR-RTC-2015-008284", + "EBTI-FR-FR-RTC-2016-008749", + "EBTI-FR-FRBTIFR-BTI-2019-17693", + "EBTI-FR-FRBTIFR-BTI-2021-04793", + "EBTI-FR-FRBTIFR-BTI-2022-07664", + "EBTI-FR-FRBTIFR-BTI-2022-07695", + "EBTI-FR-FRBTIFR-BTI-2023-00955", + "EBTI-FR-FRBTIFR-BTI-2023-01720", + "EBTI-FR-FRBTIFR-BTI-2024-04055", + "EBTI-FR-FRBTIFR-BTI-2025-03379", + "EBTI-IT-ITBTI2018-0543M-314100", + "EBTI-IT-ITBTI2020-0049M-022300", + "EBTI-IT-ITBTIIT-2017-0602M-222100", + "EBTI-IT-ITBTIIT922104-2021-BTI0658", + "CROSS-H154038", + "CROSS-H240792", + "EBTI-FR-FR-RTC-2015-003153" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Multisensor measuring machine combining optical imaging and tactile scanning sensors for dimensional inspection of small precision parts. A camera with zoom optics and a contact probe acquire surface data on CNC-driven axes over a granite base, enabling measurement of size, form and tolerances on plastic and metal components. Supplied with accessories; used in laboratory and production quality assurance", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Carl Zeiss Industrial Metrology", + "part_name": "O-inspect HTS: measuring machine with" + } + }, + { + "bol_metadata": { + "bol_description": "CMM O-INSPECT HTS: MEASURING MACHINE AND ACCESSOIRES", + "origin_country": "DE", + "shipper": "carl zeiss industrielle messtechnik" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903141", + "903190", + "903149", + "903180" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0871", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0871", + "justification_text": "Other measuring or checking instruments not more specifically provided are classified under 9031.80. Classified under HS 9031.80.", + "reference_ruling_ids": [ + "CROSS-957070", + "CROSS-952778", + "CROSS-953551", + "CROSS-N332455", + "CROSS-089928", + "CROSS-H035572", + "CROSS-N335815", + "CROSS-N359967", + "CROSS-952235", + "CROSS-958886", + "CROSS-966185", + "CROSS-N348625", + "CROSS-N357964", + "EBTI-FR-FRBTIFR-BTI-2023-08091", + "CROSS-954657", + "CROSS-H009364", + "CROSS-N308777", + "EBTI-FR-FR-RTC-2014-000002", + "EBTI-FR-FR-RTC-2016-002653", + "EBTI-FR-FRBTIFR-BTI-2021-03787", + "EBTI-IT-ITBTIIT-2017-0482M-134100", + "CROSS-952768", + "CROSS-961003", + "CROSS-H097095", + "CROSS-H112722", + "EBTI-DE-DEBTI14470/23-1", + "EBTI-FR-FRBTIFR-BTI-2024-04000", + "EBTI-IT-ITBTIIT922104-2021-BTI0658", + "CROSS-950196", + "CROSS-H154035", + "EBTI-CZ-CZ30-0470-2014", + "EBTI-DE-DE20855/16-1", + "EBTI-DE-DE21303/13-1", + "EBTI-DE-DE24219/10-1", + "EBTI-DE-DE26126/16-1", + "EBTI-DE-DE27739/16-1", + "EBTI-DE-DE27963/16-1", + "EBTI-DE-DE996/16-1", + "EBTI-DE-DEB/1839/06-1", + "EBTI-DE-DEBTI18562/24-1", + "EBTI-DE-DEBTI26857/24-1", + "EBTI-DE-DEBTI28937/24-1", + "EBTI-DE-DEBTI29406/20-1", + "EBTI-FR-FR-RTC-2014-001975", + "EBTI-FR-FR-RTC-2014-003018", + "EBTI-FR-FR-RTC-2015-008284", + "EBTI-FR-FR-RTC-2016-008749", + "EBTI-FR-FRBTIFR-BTI-2019-17693", + "EBTI-FR-FRBTIFR-BTI-2020-01824", + "EBTI-FR-FRBTIFR-BTI-2021-04793", + "EBTI-FR-FRBTIFR-BTI-2023-00955", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "EBTI-FR-FRBTIFR-BTI-2024-04055", + "EBTI-FR-FRBTIFR-BTI-2025-03379", + "EBTI-FR-FRBTIFR-BTI-2025-04624", + "EBTI-IT-ITBTI2018-0543M-314100", + "CROSS-966482", + "CROSS-H154038", + "CROSS-H240792", + "CROSS-H244110", + "CROSS-H250531", + "EBTI-DE-DE9293/15-1", + "EBTI-IT-ITBTIIT-2017-0602M-222100" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Multisensor coordinate measuring machine and accessories for combined optical and contact dimensional. The unit integrates an image-processing camera with zoom lens and a high-accuracy tactile scanning probe on CNC axes, measuring features, profiles and geometric tolerances of intricate workpieces. Mounted on a temperature-stable granite frame and driven by software for industrial quality control", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Carl Zeiss Industrial Metrology", + "part_name": "CMM O-inspect HTS: measuring machine" + } + }, + { + "bol_metadata": { + "bol_description": "CMM O-INSPECT HTS: ZEISS CNC MULTISENSOR COORDINATE MEASURING MACHINE", + "origin_country": "DE", + "shipper": "carl zeiss industrielle messtechnik" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903141", + "903190", + "903180", + "903149" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0872", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0872", + "justification_text": "Other measuring or checking instruments not more specifically provided are classified under 9031.80. Classified under HS 9031.80.", + "reference_ruling_ids": [ + "CROSS-N357964", + "CROSS-953551", + "CROSS-957070", + "CROSS-966185", + "CROSS-966482", + "CROSS-H035572", + "CROSS-958886", + "CROSS-089928", + "CROSS-952778", + "CROSS-954657", + "CROSS-N332455", + "CROSS-N335815", + "CROSS-N359967", + "EBTI-DE-DE26126/16-1", + "EBTI-DE-DEBTI18562/24-1", + "EBTI-FR-FR-RTC-2016-002653", + "EBTI-FR-FRBTIFR-BTI-2021-03787", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "CROSS-H009364", + "EBTI-FR-FR-RTC-2014-003018", + "EBTI-FR-FRBTIFR-BTI-2023-08091", + "EBTI-FR-FRBTIFR-BTI-2024-04000", + "CROSS-961003", + "CROSS-966296", + "CROSS-N308777", + "EBTI-CZ-CZ30-0470-2014", + "EBTI-DE-DE20855/16-1", + "EBTI-DE-DE21303/13-1", + "EBTI-DE-DE24219/10-1", + "EBTI-DE-DE27739/16-1", + "EBTI-DE-DE27963/16-1", + "EBTI-DE-DE996/16-1", + "EBTI-DE-DEB/1839/06-1", + "EBTI-DE-DEBTI14470/23-1", + "EBTI-DE-DEBTI26857/24-1", + "EBTI-DE-DEBTI28937/24-1", + "EBTI-DE-DEBTI29406/20-1", + "EBTI-FR-FR-RTC-2014-000002", + "EBTI-FR-FR-RTC-2014-001975", + "EBTI-FR-FR-RTC-2015-008284", + "EBTI-FR-FR-RTC-2016-008749", + "EBTI-FR-FRBTIFR-BTI-2019-17693", + "EBTI-FR-FRBTIFR-BTI-2020-01824", + "EBTI-FR-FRBTIFR-BTI-2021-04793", + "EBTI-FR-FRBTIFR-BTI-2023-00955", + "EBTI-FR-FRBTIFR-BTI-2025-03379", + "EBTI-FR-FRBTIFR-BTI-2025-04624", + "EBTI-IT-ITBTI2018-0489M-274100", + "EBTI-IT-ITBTI2018-0543M-314100", + "EBTI-IT-ITBTIIT-2017-0482M-134100", + "EBTI-IT-ITBTIIT922104-2021-BTI0658", + "CROSS-952235", + "CROSS-H112722", + "CROSS-H154035", + "CROSS-H244110", + "CROSS-H250531", + "CROSS-N348625", + "EBTI-FR-FR-RTC-2015-003153" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "CNC multisensor coordinate measuring machine providing automated optical and tactile dimensional inspection. A motorized camera with switchable zoom and a contact scanning probe operate on computer-controlled axes to capture geometry of precision parts and compute form and positional tolerances. Built on a thermally stable granite base with linear encoders; used for production and laboratory quality assurance", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Carl Zeiss Industrial Metrology", + "part_name": "CMM O-inspect HTS: CNC multisensor" + } + }, + { + "bol_metadata": { + "bol_description": "RUGOS METRO, CONTROLS, 32-D0566 PROFILOMETER (BARTON COMB) USO: LAB. DE GEOTECNIA E ING.CIVIL RUGOS METRO O PERFIL METRO (PEINE DE BARTON DE 15CM) MATERIAL: METAL-ACERO // CODIGO: 32-D0566,FORMA DE PAGO: CREDITO A 30 DIAS DE LA FECHA DE LA FACTUR", + "origin_country": "IT", + "shipper": "controls spa" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903141", + "903180", + "903149", + "903190" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0873", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0873", + "justification_text": "Other measuring or checking instruments not more specifically provided are classified under 9031.80. Classified under HS 9031.80.", + "reference_ruling_ids": [ + "CROSS-957070", + "CROSS-N335815", + "EBTI-DE-DEBTI18562/24-1", + "EBTI-FR-FRBTIFR-BTI-2020-01824", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "CROSS-953551", + "CROSS-961003", + "CROSS-H009364", + "CROSS-N357964", + "CROSS-N359967", + "EBTI-FR-FR-RTC-2014-000002", + "EBTI-FR-FRBTIFR-BTI-2021-03787", + "EBTI-IT-ITBTIIT-2017-0482M-134100", + "CROSS-089928", + "CROSS-952778", + "CROSS-954657", + "CROSS-H035572", + "CROSS-H112722", + "CROSS-H154035", + "CROSS-H244110", + "CROSS-H315264", + "CROSS-N308777", + "CROSS-N332455", + "EBTI-CZ-CZ30-0470-2014", + "EBTI-DE-DE20855/16-1", + "EBTI-DE-DE21303/13-1", + "EBTI-DE-DE24219/10-1", + "EBTI-DE-DE26126/16-1", + "EBTI-DE-DE27739/16-1", + "EBTI-DE-DE27963/16-1", + "EBTI-DE-DE996/16-1", + "EBTI-DE-DEB/1839/06-1", + "EBTI-DE-DEBTI14470/23-1", + "EBTI-DE-DEBTI26857/24-1", + "EBTI-DE-DEBTI28937/24-1", + "EBTI-DE-DEBTI29406/20-1", + "EBTI-FR-FR-RTC-2014-001975", + "EBTI-FR-FR-RTC-2014-003018", + "EBTI-FR-FR-RTC-2015-008284", + "EBTI-FR-FR-RTC-2016-002653", + "EBTI-FR-FR-RTC-2016-008749", + "EBTI-FR-FRBTIFR-BTI-2019-17693", + "EBTI-FR-FRBTIFR-BTI-2021-04793", + "EBTI-FR-FRBTIFR-BTI-2023-00955", + "EBTI-FR-FRBTIFR-BTI-2024-04000", + "EBTI-FR-FRBTIFR-BTI-2025-03379", + "EBTI-FR-FRBTIFR-BTI-2025-04624", + "EBTI-IT-ITBTI2018-0489M-274100", + "EBTI-IT-ITBTI2018-0543M-314100", + "EBTI-IT-ITBTIIT922104-2021-BTI0658", + "CROSS-950196", + "CROSS-952235", + "CROSS-958886", + "CROSS-H097095", + "CROSS-H250531", + "CROSS-N348625", + "EBTI-FR-FR-RTC-2014-005643" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Profilometer of the Barton comb type for measuring surface roughness profiles of rock specimens in geotechnical and civil engineering laboratories. A row of fine steel pins, about 150 to 300 mm long, conforms to the contour of a sample surface to record its profile and determine the joint roughness coefficient. Manufactured from steel; a manual mechanical measuring gauge", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Controls S.p.A.", + "part_name": "rugos metro controls 32-D0566" + } + }, + { + "bol_metadata": { + "bol_description": "Sensor, MPL 502-V-2, for electronic components manufacturing machine,Manufacturer on innovation, Item No. 51-0005-0, 100% brand new", + "origin_country": "US", + "shipper": "onto innovation incorporated" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90). HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "903141", + "903190", + "903180", + "903149" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits", + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0874", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0874", + "justification_text": "Other measuring or checking instruments not more specifically provided are classified under 9031.80. Classified under HS 9031.80.", + "reference_ruling_ids": [ + "CROSS-957070", + "CROSS-954657", + "CROSS-N357964", + "CROSS-952235", + "CROSS-N335815", + "CROSS-N359967", + "CROSS-089928", + "CROSS-953551", + "CROSS-961003", + "CROSS-N308777", + "EBTI-FR-FR-RTC-2014-000002", + "CROSS-950196", + "EBTI-FR-FRBTIFR-BTI-2023-08091", + "CROSS-952778", + "CROSS-H244110", + "CROSS-H009364", + "CROSS-H154035", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "CROSS-966185", + "CROSS-N332455", + "EBTI-DE-DE20855/16-1", + "EBTI-DE-DEBTI28937/24-1", + "EBTI-DE-DEBTI29406/20-1", + "CROSS-H035572", + "EBTI-DE-DE27739/16-1", + "EBTI-DE-DE27963/16-1", + "EBTI-DE-DE996/16-1", + "EBTI-FR-FR-RTC-2016-002653", + "EBTI-FR-FRBTIFR-BTI-2024-04055", + "CROSS-H250531", + "CROSS-H315264", + "CROSS-N348625", + "EBTI-DE-DEB/1839/06-1", + "EBTI-FR-FR-RTC-2015-008284", + "EBTI-FR-FRBTIFR-BTI-2021-03787", + "EBTI-IT-ITBTIIT-2017-0482M-134100", + "EBTI-IT-ITBTIIT922104-2021-BTI0658", + "CROSS-966482", + "CROSS-H097095", + "CROSS-H112722", + "EBTI-CZ-CZ30-0470-2014", + "EBTI-DE-DE21303/13-1", + "EBTI-DE-DE24219/10-1", + "EBTI-DE-DE26126/16-1", + "EBTI-DE-DEBTI18562/24-1", + "EBTI-DE-DEBTI26857/24-1", + "EBTI-FR-FRBTIFR-BTI-2019-17693", + "EBTI-FR-FRBTIFR-BTI-2021-04793", + "EBTI-FR-FRBTIFR-BTI-2024-04000", + "EBTI-FR-FRBTIFR-BTI-2025-03379", + "EBTI-IT-ITBTI2018-0543M-314100", + "CROSS-952768", + "CROSS-H154038", + "CROSS-H240792", + "CROSS-N356337", + "EBTI-DE-DEBTI14470/23-1", + "EBTI-FR-FRBTIFR-BTI-2022-07695", + "CROSS-958886", + "CROSS-966296", + "EBTI-DE-DE9293/15-1", + "EBTI-FR-FR-RTC-2014-001975", + "EBTI-FR-FR-RTC-2014-003018", + "EBTI-FR-FR-RTC-2016-008749", + "EBTI-FR-FRBTIFR-BTI-2020-01824", + "EBTI-FR-FRBTIFR-BTI-2023-00955", + "EBTI-FR-FRBTIFR-BTI-2023-01720", + "EBTI-FR-FRBTIFR-BTI-2025-04624", + "CROSS-C89056", + "EBTI-FR-FR-RTC-2014-005643" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A sensor unit designed for use in machinery that manufactures electronic components, supplied as a 100% new replacement part. It functions as a measuring or detecting element integrated into automated production equipment, converting a monitored physical condition into an electrical signal used by the machine's control system to regulate and verify the manufacturing process", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Onto Innovation", + "part_name": "Sensor MPL 502-V-2 for electronic" + } + }, + { + "bol_metadata": { + "bol_description": "Position sensor, used for electronic components manufacturing machines, Product code , Manufacturer DE&T Co., Ltd, 100% new product", + "origin_country": "US", + "shipper": "onto innovation southeast asia pte. limited" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90). HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "903190", + "903141", + "903180", + "903149" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits", + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0875", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0875", + "justification_text": "Other measuring or checking instruments not more specifically provided are classified under 9031.80. Classified under HS 9031.80.", + "reference_ruling_ids": [ + "CROSS-954657", + "CROSS-N335815", + "CROSS-957070", + "CROSS-950196", + "CROSS-952778", + "CROSS-N357964", + "CROSS-N359967", + "EBTI-FR-FR-RTC-2014-000002", + "CROSS-089928", + "CROSS-952235", + "CROSS-961003", + "CROSS-H035572", + "CROSS-H244110", + "CROSS-N308777", + "CROSS-966185", + "CROSS-953551", + "CROSS-H009364", + "CROSS-H154035", + "CROSS-H315264", + "EBTI-DE-DEBTI29406/20-1", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "EBTI-FR-FRBTIFR-BTI-2023-08091", + "EBTI-DE-DE20855/16-1", + "EBTI-DE-DE996/16-1", + "EBTI-DE-DEBTI28937/24-1", + "CROSS-966482", + "CROSS-H112722", + "CROSS-H250531", + "CROSS-N332455", + "EBTI-DE-DE27739/16-1", + "EBTI-DE-DE27963/16-1", + "EBTI-FR-FR-RTC-2016-002653", + "EBTI-FR-FRBTIFR-BTI-2024-04055", + "EBTI-IT-ITBTIIT-2017-0482M-134100", + "EBTI-IT-ITBTIIT922104-2021-BTI0658", + "CROSS-H097095", + "CROSS-N348625", + "CROSS-N356337", + "EBTI-DE-DEB/1839/06-1", + "EBTI-FR-FR-RTC-2015-008284", + "EBTI-FR-FRBTIFR-BTI-2021-03787", + "EBTI-FR-FRBTIFR-BTI-2022-07695", + "CROSS-966296", + "CROSS-H154038", + "CROSS-H240792", + "EBTI-CZ-CZ30-0470-2014", + "EBTI-DE-DE21303/13-1", + "EBTI-DE-DE24219/10-1", + "EBTI-DE-DE26126/16-1", + "EBTI-DE-DE9293/15-1", + "EBTI-DE-DEBTI18562/24-1", + "EBTI-DE-DEBTI26857/24-1", + "EBTI-FR-FRBTIFR-BTI-2019-17693", + "EBTI-FR-FRBTIFR-BTI-2021-04793", + "EBTI-FR-FRBTIFR-BTI-2023-01720", + "EBTI-FR-FRBTIFR-BTI-2024-04000", + "EBTI-FR-FRBTIFR-BTI-2025-03379", + "EBTI-IT-ITBTI2018-0543M-314100", + "CROSS-862381", + "CROSS-952768", + "CROSS-958886", + "CROSS-C89056", + "EBTI-DE-DEBTI14470/23-1", + "EBTI-FR-FR-RTC-2014-005643" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A position sensor supplied as a new replacement part for machines used in electronic component manufacturing. It detects the location or displacement of a moving element within automated production equipment and converts it into an electrical signal for the machine's control system, enabling precise positioning, feedback and verification during assembly or handling operations", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Onto Innovation", + "part_name": "Position sensor used for electronic" + } + }, + { + "bol_metadata": { + "bol_description": "Robot position or motion sensor, Product code 81-0112-0, Manufacturer DE&T Co, 100% new product", + "origin_country": "US", + "shipper": "onto innovation southeast asia pte limited" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90). HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "903190", + "903141", + "903149", + "903180" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits", + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0876", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0876", + "justification_text": "Other measuring or checking instruments not more specifically provided are classified under 9031.80. Classified under HS 9031.80.", + "reference_ruling_ids": [ + "CROSS-950196", + "CROSS-954657", + "CROSS-089928", + "CROSS-H244110", + "CROSS-N335815", + "CROSS-966185", + "CROSS-N308777", + "EBTI-FR-FR-RTC-2014-000002", + "CROSS-957070", + "CROSS-H035572", + "CROSS-N359967", + "CROSS-952235", + "CROSS-961003", + "CROSS-H009364", + "CROSS-H154035", + "CROSS-N357964", + "EBTI-DE-DEBTI29406/20-1", + "CROSS-952778", + "CROSS-953551", + "EBTI-DE-DE20855/16-1", + "EBTI-DE-DE996/16-1", + "EBTI-DE-DEBTI28937/24-1", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "CROSS-966482", + "CROSS-H250531", + "CROSS-H315264", + "EBTI-DE-DE27739/16-1", + "EBTI-DE-DE27963/16-1", + "EBTI-FR-FR-RTC-2016-002653", + "EBTI-FR-FRBTIFR-BTI-2024-04000", + "EBTI-IT-ITBTIIT-2017-0482M-134100", + "EBTI-IT-ITBTIIT922104-2021-BTI0658", + "CROSS-H154038", + "CROSS-H240792", + "CROSS-N356337", + "EBTI-DE-DEB/1839/06-1", + "EBTI-FR-FR-RTC-2015-008284", + "EBTI-FR-FRBTIFR-BTI-2021-03787", + "EBTI-FR-FRBTIFR-BTI-2022-07695", + "EBTI-FR-FRBTIFR-BTI-2023-08091", + "CROSS-966296", + "CROSS-H112722", + "CROSS-N348625", + "EBTI-CZ-CZ30-0470-2014", + "EBTI-DE-DE21303/13-1", + "EBTI-DE-DE24219/10-1", + "EBTI-DE-DE26126/16-1", + "EBTI-DE-DE9293/15-1", + "EBTI-DE-DEBTI18562/24-1", + "EBTI-DE-DEBTI26857/24-1", + "EBTI-FR-FRBTIFR-BTI-2019-17693", + "EBTI-FR-FRBTIFR-BTI-2021-04793", + "EBTI-FR-FRBTIFR-BTI-2023-01720", + "EBTI-FR-FRBTIFR-BTI-2024-04055", + "EBTI-FR-FRBTIFR-BTI-2025-03379", + "EBTI-IT-ITBTI2018-0543M-314100", + "EBTI-IT-ITBTI2020-0049M-022300", + "CROSS-862381", + "CROSS-958886", + "CROSS-C89056", + "CROSS-H097095", + "CROSS-N332455", + "EBTI-DE-DEBTI14470/23-1", + "EBTI-FR-FR-RTC-2014-005643", + "EBTI-FR-FRBTIFR-BTI-2025-04624" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A robot position or motion sensor supplied as a new component for electronic component manufacturing equipment. It detects the position or movement of a robotic actuator or handling mechanism within an automated machine and converts the measured displacement into an electrical signal, providing feedback to the motion-control system for accurate positioning and process verification", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Onto Innovation", + "part_name": "Robot position or motion sensor Product" + } + }, + { + "bol_metadata": { + "bol_description": "Position sensor, used for electronic component manufacturing machine, Item code 80-1218-0, Manufacturer onto innovation, 100% new", + "origin_country": "US", + "shipper": "onto innovation incorporated" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90). HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "903141", + "903149", + "903190", + "903180" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits", + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0877", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0877", + "justification_text": "Other measuring or checking instruments not more specifically provided are classified under 9031.80. Classified under HS 9031.80.", + "reference_ruling_ids": [ + "CROSS-954657", + "CROSS-957070", + "CROSS-N335815", + "CROSS-089928", + "CROSS-950196", + "CROSS-952235", + "CROSS-952778", + "CROSS-953551", + "CROSS-961003", + "CROSS-H244110", + "CROSS-N308777", + "CROSS-N357964", + "CROSS-N359967", + "EBTI-FR-FR-RTC-2014-000002", + "CROSS-H035572", + "CROSS-966185", + "CROSS-H009364", + "CROSS-H154035", + "CROSS-H315264", + "EBTI-DE-DEBTI28937/24-1", + "EBTI-DE-DEBTI29406/20-1", + "CROSS-H112722", + "CROSS-N332455", + "EBTI-DE-DE20855/16-1", + "EBTI-DE-DE996/16-1", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "EBTI-FR-FRBTIFR-BTI-2023-08091", + "CROSS-966482", + "EBTI-DE-DE27739/16-1", + "EBTI-DE-DE27963/16-1", + "EBTI-DE-DE9293/15-1", + "EBTI-DE-DEBTI26857/24-1", + "EBTI-FR-FR-RTC-2016-002653", + "EBTI-FR-FRBTIFR-BTI-2024-04055", + "EBTI-FR-FRBTIFR-BTI-2025-03379", + "EBTI-IT-ITBTIIT-2017-0482M-134100", + "EBTI-IT-ITBTIIT922104-2021-BTI0658", + "CROSS-H097095", + "CROSS-H250531", + "CROSS-N348625", + "CROSS-N356337", + "EBTI-DE-DEB/1839/06-1", + "EBTI-FR-FR-RTC-2015-008284", + "EBTI-FR-FRBTIFR-BTI-2021-03787", + "EBTI-FR-FRBTIFR-BTI-2022-07695", + "CROSS-952768", + "CROSS-958886", + "CROSS-966296", + "CROSS-H154038", + "CROSS-H240792", + "EBTI-CZ-CZ30-0470-2014", + "EBTI-DE-DE21303/13-1", + "EBTI-DE-DE24219/10-1", + "EBTI-DE-DE26126/16-1", + "EBTI-DE-DEBTI18562/24-1", + "EBTI-FR-FRBTIFR-BTI-2018-03117", + "EBTI-FR-FRBTIFR-BTI-2019-17693", + "EBTI-FR-FRBTIFR-BTI-2021-04793", + "EBTI-FR-FRBTIFR-BTI-2023-00955", + "EBTI-FR-FRBTIFR-BTI-2023-01720", + "EBTI-FR-FRBTIFR-BTI-2024-04000", + "EBTI-IT-ITBTI2018-0543M-314100", + "CROSS-862381", + "CROSS-C89056", + "EBTI-DE-DEBTI14470/23-1", + "EBTI-FR-FR-RTC-2014-005643" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A position sensor provided as a new replacement part for machines used in electronic component manufacturing. It measures the location or displacement of a moving machine element and outputs a proportional electrical signal used by the equipment's control system for positioning feedback and process checking during automated assembly or handling", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Onto Innovation", + "part_name": "Position sensor used for electronic" + } + }, + { + "bol_metadata": { + "bol_description": "Pressure sensor, used for the production of electronic components,sku 51-0005-0 manufacturer MPL, 100% brand new", + "origin_country": "US", + "shipper": "onto innovation dba nanometrics" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90). HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "903190", + "903149", + "903141", + "903180" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits", + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0878", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0878", + "justification_text": "Other measuring or checking instruments not more specifically provided are classified under 9031.80. Classified under HS 9031.80.", + "reference_ruling_ids": [ + "CROSS-950196", + "CROSS-961003", + "CROSS-957070", + "CROSS-N335815", + "CROSS-089928", + "CROSS-954657", + "CROSS-H244110", + "CROSS-N308777", + "CROSS-N357964", + "CROSS-N359967", + "EBTI-FR-FR-RTC-2014-000002", + "CROSS-952235", + "CROSS-952778", + "CROSS-966185", + "EBTI-FR-FRBTIFR-BTI-2023-08091", + "CROSS-H009364", + "CROSS-H035572", + "CROSS-953551", + "EBTI-DE-DEBTI28937/24-1", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "EBTI-FR-FRBTIFR-BTI-2024-04055", + "EBTI-DE-DE20855/16-1", + "EBTI-DE-DEBTI29406/20-1", + "CROSS-966482", + "CROSS-H112722", + "CROSS-H154035", + "CROSS-N332455", + "EBTI-DE-DE27739/16-1", + "EBTI-DE-DE27963/16-1", + "EBTI-DE-DE996/16-1", + "EBTI-FR-FR-RTC-2016-002653", + "EBTI-IT-ITBTI2018-0543M-314100", + "CROSS-H097095", + "CROSS-H250531", + "CROSS-N348625", + "CROSS-N356337", + "EBTI-DE-DEB/1839/06-1", + "EBTI-DE-DEBTI14470/23-1", + "EBTI-FR-FR-RTC-2015-008284", + "EBTI-FR-FRBTIFR-BTI-2021-03787", + "EBTI-FR-FRBTIFR-BTI-2022-07695", + "CROSS-966296", + "CROSS-H154038", + "CROSS-H240792", + "CROSS-H315264", + "EBTI-CZ-CZ30-0470-2014", + "EBTI-DE-DE21303/13-1", + "EBTI-DE-DE24219/10-1", + "EBTI-DE-DE26126/16-1", + "EBTI-DE-DE9293/15-1", + "EBTI-DE-DEBTI18562/24-1", + "EBTI-DE-DEBTI26857/24-1", + "EBTI-FR-FRBTIFR-BTI-2019-17693", + "EBTI-FR-FRBTIFR-BTI-2021-04793", + "EBTI-FR-FRBTIFR-BTI-2023-01720", + "EBTI-FR-FRBTIFR-BTI-2024-04000", + "EBTI-FR-FRBTIFR-BTI-2025-03379", + "EBTI-IT-ITBTIIT-2017-0482M-134100", + "EBTI-IT-ITBTIIT922104-2021-BTI0658", + "CROSS-952768", + "CROSS-958886", + "CROSS-C89056", + "EBTI-FR-FR-RTC-2014-005643" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A pressure sensor supplied as a new replacement part for equipment used in the production of electronic components. It senses applied pressure within an automated manufacturing machine and converts it into a proportional electrical signal for the control system, enabling pressure monitoring, feedback and process verification during fabrication or handling operations", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Onto Innovation", + "part_name": "Pressure sensor used for the production" + } + }, + { + "bol_metadata": { + "bol_description": "Safety sensor, used for manufacturing electronic components,The production of DE&T co.,ltd., code ,100% brand new", + "origin_country": "US", + "shipper": "onto innovation dba nanometrics" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90). HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "903190", + "903180", + "903141", + "903149" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits", + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0879", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0879", + "justification_text": "Other measuring or checking instruments not more specifically provided are classified under 9031.80. Classified under HS 9031.80.", + "reference_ruling_ids": [ + "CROSS-957070", + "CROSS-952235", + "CROSS-N357964", + "CROSS-950196", + "CROSS-952778", + "CROSS-N335815", + "CROSS-N359967", + "EBTI-FR-FR-RTC-2014-000002", + "CROSS-954657", + "CROSS-089928", + "CROSS-N308777", + "CROSS-H035572", + "EBTI-FR-FRBTIFR-BTI-2023-08091", + "CROSS-953551", + "CROSS-966185", + "CROSS-H244110", + "CROSS-961003", + "CROSS-H009364", + "CROSS-H154035", + "EBTI-DE-DEBTI29406/20-1", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "EBTI-FR-FRBTIFR-BTI-2024-04055", + "CROSS-H315264", + "EBTI-DE-DE20855/16-1", + "EBTI-DE-DE996/16-1", + "EBTI-DE-DEBTI28937/24-1", + "EBTI-FR-FRBTIFR-BTI-2023-01720", + "CROSS-H250531", + "CROSS-N332455", + "EBTI-DE-DE27739/16-1", + "EBTI-DE-DE27963/16-1", + "EBTI-FR-FR-RTC-2016-002653", + "CROSS-966482", + "CROSS-H097095", + "CROSS-H112722", + "CROSS-N348625", + "CROSS-N356337", + "EBTI-DE-DEB/1839/06-1", + "EBTI-FR-FR-RTC-2015-008284", + "EBTI-FR-FRBTIFR-BTI-2021-03787", + "EBTI-FR-FRBTIFR-BTI-2022-07695", + "CROSS-966296", + "CROSS-H154038", + "CROSS-H240792", + "EBTI-CZ-CZ30-0470-2014", + "EBTI-DE-DE21303/13-1", + "EBTI-DE-DE24219/10-1", + "EBTI-DE-DE26126/16-1", + "EBTI-DE-DE9293/15-1", + "EBTI-DE-DEBTI18562/24-1", + "EBTI-DE-DEBTI26857/24-1", + "EBTI-FR-FRBTIFR-BTI-2019-17693", + "EBTI-FR-FRBTIFR-BTI-2021-04793", + "EBTI-FR-FRBTIFR-BTI-2022-07664", + "EBTI-FR-FRBTIFR-BTI-2024-04000", + "EBTI-FR-FRBTIFR-BTI-2025-03379", + "EBTI-FR-FRBTIFR-BTI-2025-04624", + "EBTI-IT-ITBTI2018-0543M-314100", + "EBTI-IT-ITBTIIT-2017-0482M-134100", + "EBTI-IT-ITBTIIT922104-2021-BTI0658", + "CROSS-862381", + "CROSS-952768", + "CROSS-958886", + "CROSS-C89056", + "EBTI-DE-DEBTI14470/23-1", + "EBTI-FR-FR-RTC-2014-005643", + "EBTI-FR-FR-RTC-2015-003153" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A safety sensor supplied as a new component for machines used in manufacturing electronic components. It monitors a safety-relevant condition such as guard position or presence within automated production equipment and outputs an electrical signal to the machine's control system, providing detection and verification functions that support safe and reliable operation", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Onto Innovation", + "part_name": "Safety sensor used for manufacturing" + } + }, + { + "bol_metadata": { + "bol_description": "Ultrasonic concrete defect testing machine, model: PL-200, brand: Screening, S/N: UP01-001-0520", + "origin_country": "CH", + "shipper": "screening eagle singapore pte ltd" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90). HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "903190", + "903180", + "903141", + "903149" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits", + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0880", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0880", + "justification_text": "Other measuring or checking instruments not more specifically provided are classified under 9031.80. Classified under HS 9031.80.", + "reference_ruling_ids": [ + "CROSS-957070", + "CROSS-N357964", + "CROSS-089928", + "CROSS-961003", + "CROSS-H035572", + "CROSS-N308777", + "CROSS-N332455", + "CROSS-N359967", + "CROSS-N335815", + "CROSS-N348625", + "CROSS-952235", + "CROSS-953551", + "CROSS-966482", + "CROSS-H250531", + "CROSS-954657", + "CROSS-H097095", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "CROSS-950196", + "CROSS-952768", + "CROSS-952778", + "CROSS-966185", + "CROSS-E82962", + "CROSS-H009364", + "CROSS-H315264", + "EBTI-DE-DE21303/13-1", + "CROSS-966296", + "EBTI-DE-DE27739/16-1", + "EBTI-DE-DE9293/15-1", + "EBTI-DE-DEBTI28937/24-1", + "EBTI-FR-FRBTIFR-BTI-2024-04055", + "EBTI-FR-FRBTIFR-BTI-2025-04624", + "CROSS-C80235", + "CROSS-H154035", + "CROSS-H154038", + "CROSS-H240792", + "CROSS-H244110", + "EBTI-DE-DE20855/16-1", + "EBTI-DE-DEBTI14470/23-1", + "EBTI-FR-FR-RTC-2015-003153", + "EBTI-FR-FRBTIFR-BTI-2021-04793", + "EBTI-FR-FRBTIFR-BTI-2023-08091", + "EBTI-IT-ITBTI2018-0543M-314100", + "EBTI-IT-ITBTIIT-2017-0482M-134100", + "EBTI-IT-ITBTIIT922104-2021-BTI0658" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A portable ultrasonic pulse-velocity testing instrument for non-destructive evaluation of concrete and other solid materials such as rock, wood, and ceramics. It transmits ultrasonic pulses through the material and measures transit time to assess structural integrity, detect voids, cracks, and defects, and estimate compressive strength and elastic modulus. The unit features a touchscreen display with multiple scan modes and a paired transducer set. Used in civil and construction quality inspection", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Screening Eagle Technologies", + "part_name": "Ultrasonic concrete defect testing" + } + }, + { + "bol_metadata": { + "bol_description": "Measuring and cutting tool with 6 blades used to cut and measure adhesion in paint manufacturing industry, distance between blades 2mm, made in Germany. 100% new", + "origin_country": "CH", + "shipper": "screening eagle singapore pte ltd" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903141", + "903180", + "903190", + "903149" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0881", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0881", + "justification_text": "Other measuring or checking instruments not more specifically provided are classified under 9031.80. Classified under HS 9031.80.", + "reference_ruling_ids": [ + "CROSS-953551", + "CROSS-N357964", + "CROSS-089928", + "EBTI-DE-DEBTI28937/24-1", + "CROSS-954657", + "CROSS-957070", + "CROSS-961003", + "CROSS-E82962", + "CROSS-H244110", + "CROSS-I87168", + "CROSS-N308777", + "CROSS-952778", + "CROSS-H009364", + "CROSS-H035572", + "CROSS-H154035", + "CROSS-H154038", + "CROSS-H240792", + "CROSS-N332455", + "CROSS-N335815", + "EBTI-CZ-CZ30-0470-2014", + "EBTI-DE-DE20855/16-1", + "EBTI-DE-DE21303/13-1", + "EBTI-DE-DE24219/10-1", + "EBTI-DE-DE26126/16-1", + "EBTI-DE-DE27739/16-1", + "EBTI-DE-DE27963/16-1", + "EBTI-DE-DE9293/15-1", + "EBTI-DE-DE996/16-1", + "EBTI-DE-DEB/1839/06-1", + "EBTI-DE-DEBTI14470/23-1", + "EBTI-DE-DEBTI18562/24-1", + "EBTI-DE-DEBTI26857/24-1", + "EBTI-DE-DEBTI29406/20-1", + "EBTI-FR-FR-RTC-2014-000002", + "EBTI-FR-FR-RTC-2014-001975", + "EBTI-FR-FR-RTC-2014-003018", + "EBTI-FR-FR-RTC-2015-008284", + "EBTI-FR-FR-RTC-2016-002653", + "EBTI-FR-FR-RTC-2016-008749", + "EBTI-FR-FRBTIFR-BTI-2019-17693", + "EBTI-FR-FRBTIFR-BTI-2020-01824", + "EBTI-FR-FRBTIFR-BTI-2021-03787", + "EBTI-FR-FRBTIFR-BTI-2021-04793", + "EBTI-FR-FRBTIFR-BTI-2023-00955", + "EBTI-FR-FRBTIFR-BTI-2023-01720", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "EBTI-FR-FRBTIFR-BTI-2024-04000", + "EBTI-FR-FRBTIFR-BTI-2024-04055", + "EBTI-FR-FRBTIFR-BTI-2025-03379", + "EBTI-FR-FRBTIFR-BTI-2025-04624", + "EBTI-IT-ITBTI2018-0543M-314100", + "EBTI-IT-ITBTIIT-2017-0482M-134100", + "EBTI-IT-ITBTIIT922104-2021-BTI0658", + "CROSS-875000", + "CROSS-950196", + "CROSS-952235", + "CROSS-958886", + "CROSS-C80235", + "CROSS-H097095", + "CROSS-H112722", + "CROSS-N348625", + "CROSS-N359967" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A cross-cut adhesion testing tool used in the paint and coatings industry to assess the bond strength of single- or multi-coat films on a substrate. It features a multi-blade cutting head with six parallel hardened blades spaced 2 mm apart, which scores a lattice grid into the coating per standardized methods; the result is graded by inspecting flaking. The cutting head ensures constant parallel guidance for reproducible results", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Screening Eagle Technologies", + "part_name": "Measuring and cutting tool with 6" + } + }, + { + "bol_metadata": { + "bol_description": "MEASURING INSTRUMENTS- (EQUOTIP 550/) MEASURING INSTRUMENTS- (EQUOTIP 550)", + "origin_country": "CH", + "shipper": "screening eagle singapore pte ltd" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903190", + "903141", + "903149", + "903180" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0882", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0882", + "justification_text": "Other measuring or checking instruments not more specifically provided are classified under 9031.80. Classified under HS 9031.80.", + "reference_ruling_ids": [ + "CROSS-953551", + "CROSS-961003", + "CROSS-H244110", + "CROSS-N335815", + "CROSS-950196", + "CROSS-957070", + "CROSS-966482", + "CROSS-N357964", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "CROSS-N308777", + "CROSS-N359967", + "EBTI-FR-FR-RTC-2014-000002", + "CROSS-089928", + "CROSS-954657", + "CROSS-N332455", + "EBTI-DE-DEBTI28937/24-1", + "EBTI-IT-ITBTI2018-0543M-314100", + "EBTI-IT-ITBTIIT-2017-0482M-134100", + "CROSS-952235", + "CROSS-952778", + "CROSS-H035572", + "CROSS-H097095", + "EBTI-DE-DE9293/15-1", + "EBTI-FR-FRBTIFR-BTI-2019-17693", + "EBTI-FR-FRBTIFR-BTI-2020-01824", + "EBTI-FR-FRBTIFR-BTI-2021-03787", + "EBTI-IT-ITBTIIT922104-2021-BTI0658", + "CROSS-952768", + "CROSS-H154035", + "CROSS-N348625", + "EBTI-DE-DE27739/16-1", + "EBTI-DE-DE996/16-1", + "EBTI-DE-DEBTI29406/20-1", + "EBTI-FR-FR-RTC-2014-003018", + "EBTI-FR-FR-RTC-2016-002653", + "EBTI-FR-FRBTIFR-BTI-2024-04055", + "EBTI-FR-FRBTIFR-BTI-2025-04624", + "CROSS-966185", + "CROSS-E82962", + "CROSS-H009364", + "EBTI-DE-DE20855/16-1", + "EBTI-DE-DEBTI14470/23-1", + "EBTI-FR-FRBTIFR-BTI-2021-04793", + "EBTI-FR-FRBTIFR-BTI-2023-08091", + "EBTI-FR-FRBTIFR-BTI-2024-04000", + "CROSS-966296", + "CROSS-C80235", + "CROSS-H112722", + "CROSS-H315264", + "EBTI-CZ-CZ30-0470-2014", + "EBTI-DE-DE21303/13-1", + "EBTI-DE-DE24219/10-1", + "EBTI-DE-DE26126/16-1", + "EBTI-DE-DE27963/16-1", + "EBTI-DE-DEB/1839/06-1", + "EBTI-DE-DEBTI18562/24-1", + "EBTI-DE-DEBTI26857/24-1", + "EBTI-FR-FR-RTC-2014-001975", + "EBTI-FR-FR-RTC-2015-008284", + "EBTI-FR-FR-RTC-2016-008749", + "EBTI-FR-FRBTIFR-BTI-2022-07695", + "EBTI-FR-FRBTIFR-BTI-2023-00955", + "EBTI-FR-FRBTIFR-BTI-2023-01720", + "EBTI-FR-FRBTIFR-BTI-2025-03379", + "EBTI-IT-ITBTI2018-0489M-274100", + "CROSS-958886", + "CROSS-H154038", + "CROSS-H240792", + "CROSS-H250531", + "EBTI-FR-FR-RTC-2014-005643", + "EBTI-FR-FR-RTC-2015-003153", + "EBTI-IT-ITBTIIT-2017-0602M-222100" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A portable electronic metal hardness testing instrument offering multiple measurement methods including dynamic rebound (Leeb), static Rockwell, and ultrasonic contact impedance. It uses an interchangeable impact device or probe to measure the surface hardness of metal parts and presents results on a rugged full-color touchscreen unit with reporting software. Used for hardness inspection of manufactured, polished, and heat-treated metal components on site or in the lab", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Screening Eagle Technologies", + "part_name": "measuring instruments- (equotip 550/)" + } + }, + { + "bol_metadata": { + "bol_description": "Ultrasonic concrete defect testing machine (Including: Sensor, handle, main machine, power source, marker pen, user manual, product certificate, carrying case), model: PD8050, 100% new", + "origin_country": "CH", + "shipper": "screening eagle singapore pte ltd" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90). HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "903190", + "903149", + "903180", + "903141" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits", + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0883", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0883", + "justification_text": "Other measuring or checking instruments not more specifically provided are classified under 9031.80. Classified under HS 9031.80.", + "reference_ruling_ids": [ + "CROSS-957070", + "CROSS-H035572", + "CROSS-N308777", + "CROSS-N357964", + "CROSS-N359967", + "CROSS-953551", + "CROSS-N335815", + "CROSS-N348625", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "CROSS-966482", + "CROSS-089928", + "CROSS-950196", + "CROSS-952235", + "CROSS-954657", + "CROSS-H009364", + "CROSS-H154035", + "CROSS-H244110", + "EBTI-FR-FR-RTC-2014-000002", + "CROSS-952768", + "CROSS-961003", + "CROSS-966185", + "CROSS-E82962", + "CROSS-H154038", + "CROSS-H240792", + "CROSS-H250531", + "CROSS-N356337", + "EBTI-FR-FRBTIFR-BTI-2024-04055", + "CROSS-966296", + "CROSS-H315264", + "CROSS-N332455", + "EBTI-DE-DE20855/16-1", + "EBTI-DE-DE9293/15-1", + "EBTI-DE-DEBTI28937/24-1", + "EBTI-FR-FR-RTC-2015-003153", + "EBTI-FR-FR-RTC-2016-008749", + "EBTI-FR-FRBTIFR-BTI-2023-08091", + "EBTI-FR-FRBTIFR-BTI-2025-04624", + "CROSS-952778", + "CROSS-C80235", + "CROSS-C89056", + "EBTI-DE-DEB/1839/06-1", + "EBTI-DE-DEBTI14470/23-1", + "EBTI-DE-DEBTI29406/20-1", + "EBTI-FR-FR-RTC-2014-005643", + "EBTI-FR-FR-RTC-2016-002653", + "EBTI-FR-FRBTIFR-BTI-2020-01824", + "EBTI-FR-FRBTIFR-BTI-2021-04793", + "EBTI-IT-ITBTIIT-2017-0482M-134100", + "EBTI-IT-ITBTIIT-2017-0602M-222100", + "EBTI-IT-ITBTIIT922104-2021-BTI0658" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A wireless ultrasonic pulse-echo imaging instrument for non-destructive structural inspection of concrete from a single accessible surface. It detects subsurface voids, delamination, honeycombing, cracks, pipes, and prestress ducts, measures element thickness and pulse velocity, and reconstructs A-scan, B-scan, and 3D images. The kit comprises a sensor array, handle, main unit, power source, marker, manual, certificate, and carrying case. Used in civil engineering condition assessment", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Screening Eagle Technologies", + "part_name": "Ultrasonic concrete defect testing" + } + }, + { + "bol_metadata": { + "bol_description": "PROCEQ CALIBRATION RESIPOD CALIBRATION", + "origin_country": "CH", + "shipper": "screening eagle singapore pte ltd" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903149", + "903141", + "903190", + "903180" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0884", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0884", + "justification_text": "Other measuring or checking instruments not more specifically provided are classified under 9031.80. Classified under HS 9031.80.", + "reference_ruling_ids": [ + "CROSS-089928", + "CROSS-957070", + "CROSS-954657", + "CROSS-953551", + "CROSS-961003", + "CROSS-N357964", + "CROSS-952235", + "CROSS-N335815", + "CROSS-950196", + "CROSS-H009364", + "CROSS-H035572", + "CROSS-N308777", + "CROSS-N332455", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "CROSS-952768", + "CROSS-952778", + "CROSS-N008478", + "CROSS-N348625", + "CROSS-N359967", + "EBTI-DE-DE20855/16-1", + "EBTI-FR-FR-RTC-2014-000002", + "EBTI-FR-FR-RTC-2014-003018", + "EBTI-FR-FRBTIFR-BTI-2020-01824", + "EBTI-FR-FRBTIFR-BTI-2021-04793", + "EBTI-IT-ITBTIIT-2017-0482M-134100", + "EBTI-IT-ITBTIIT922104-2021-BTI0658", + "CROSS-966482", + "EBTI-CZ-CZ30-0470-2014", + "EBTI-DE-DE21303/13-1", + "EBTI-DE-DE24219/10-1", + "EBTI-DE-DE26126/16-1", + "EBTI-DE-DE27739/16-1", + "EBTI-DE-DE27963/16-1", + "EBTI-DE-DE996/16-1", + "EBTI-DE-DEB/1839/06-1", + "EBTI-DE-DEBTI14470/23-1", + "EBTI-DE-DEBTI18562/24-1", + "EBTI-DE-DEBTI26857/24-1", + "EBTI-DE-DEBTI28937/24-1", + "EBTI-DE-DEBTI29406/20-1", + "EBTI-FR-FR-RTC-2014-001975", + "EBTI-FR-FR-RTC-2014-005643", + "EBTI-FR-FR-RTC-2015-008284", + "EBTI-FR-FR-RTC-2016-002653", + "EBTI-FR-FR-RTC-2016-008749", + "EBTI-FR-FRBTIFR-BTI-2019-17693", + "EBTI-FR-FRBTIFR-BTI-2021-03787", + "EBTI-FR-FRBTIFR-BTI-2023-00955", + "EBTI-FR-FRBTIFR-BTI-2024-04000", + "EBTI-FR-FRBTIFR-BTI-2025-03379", + "EBTI-FR-FRBTIFR-BTI-2025-04624", + "EBTI-IT-ITBTI2018-0543M-314100", + "CROSS-958886", + "CROSS-H097095", + "CROSS-H112722", + "CROSS-H154035", + "CROSS-H154038", + "CROSS-H240792", + "CROSS-H244110", + "CROSS-H250531", + "CROSS-H315264", + "EBTI-FR-FRBTIFR-BTI-2023-08091" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A portable concrete electrical-resistivity measuring instrument using a four-point Wenner probe to measure the surface resistivity of concrete in a fully non-destructive test. The integrated handheld unit injects current and measures potential across fixed probe spacing to estimate corrosion risk and chloride-penetration resistance. This line item covers the instrument and its calibration. Used for durability assessment of reinforced concrete structures", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Screening Eagle Technologies", + "part_name": "proceq calibration resipod calibration" + } + }, + { + "bol_metadata": { + "bol_description": "TRANSDUCER LVDT 601119-00", + "origin_country": "DE", + "shipper": "sentech" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90). HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "903180", + "903149", + "903190", + "903141" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits", + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0885", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0885", + "justification_text": "Other measuring or checking instruments not more specifically provided are classified under 9031.80. Classified under HS 9031.80.", + "reference_ruling_ids": [ + "CROSS-950196", + "CROSS-954657", + "CROSS-957070", + "CROSS-H244110", + "CROSS-N357964", + "CROSS-952778", + "CROSS-N335815", + "CROSS-N359967", + "CROSS-952235", + "CROSS-953551", + "CROSS-H154035", + "EBTI-FR-FR-RTC-2014-000002", + "CROSS-089928", + "CROSS-961003", + "CROSS-H009364", + "CROSS-N308777", + "CROSS-N348625", + "CROSS-H112722", + "CROSS-H154038", + "CROSS-H240792", + "CROSS-N356337", + "CROSS-H035572", + "CROSS-H250531", + "CROSS-H315264", + "CROSS-N332455", + "EBTI-DE-DE20855/16-1", + "EBTI-DE-DEBTI28937/24-1", + "EBTI-DE-DEBTI29406/20-1", + "EBTI-FR-FR-RTC-2014-005643", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "EBTI-FR-FRBTIFR-BTI-2023-08091", + "EBTI-FR-FRBTIFR-BTI-2024-04055", + "CROSS-862381", + "CROSS-966185", + "CROSS-966482", + "CROSS-C89056", + "CROSS-H097095", + "EBTI-DE-DE27963/16-1", + "EBTI-DE-DE996/16-1", + "EBTI-DE-DEB/1839/06-1", + "EBTI-DE-DEBTI14470/23-1", + "EBTI-FR-FR-RTC-2015-008284", + "EBTI-FR-FRBTIFR-BTI-2022-07695" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A linear variable differential transformer (LVDT) position sensor that converts linear mechanical displacement into a proportional electrical signal. The contactless transducer uses electromagnetic coupling between a movable core and surrounding coils to provide highly reliable, repeatable position or gauging measurement. It offers high linearity over its stroke range and is used in industrial automation, gauging, and control applications where displacement must be measured electrically", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "SENTECH Instruments", + "part_name": "transducer lvdt 601119-00" + } + }, + { + "bol_metadata": { + "bol_description": "SENSOR,PHOTOELECTRIC (PARTS FOR SOLAR INGOT & WAFER MACHINE OF SOLAR MODULE LINE)PARTS FOR SOLAR INGOT & WAFER MACHINE OF SOLAR MODULE LINE", + "origin_country": "CN", + "shipper": "wuxi autowell supply chain" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90). HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "903141", + "903180", + "903190", + "903149" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits", + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0886", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0886", + "justification_text": "Other measuring or checking instruments not more specifically provided are classified under 9031.80. Classified under HS 9031.80.", + "reference_ruling_ids": [ + "CROSS-957070", + "CROSS-954657", + "CROSS-H244110", + "CROSS-N359967", + "CROSS-966185", + "CROSS-N308777", + "CROSS-N335815", + "EBTI-FR-FR-RTC-2014-000002", + "EBTI-FR-FRBTIFR-BTI-2023-08091", + "CROSS-952778", + "CROSS-966482", + "CROSS-H154035", + "CROSS-089928", + "CROSS-N332455", + "CROSS-N357964", + "CROSS-950196", + "CROSS-H035572", + "CROSS-H097095", + "CROSS-N348625", + "CROSS-952235", + "CROSS-953551", + "CROSS-966296", + "CROSS-H009364", + "EBTI-IT-ITBTIIT922104-2021-BTI0658", + "CROSS-961003", + "CROSS-H112722", + "CROSS-N356337", + "EBTI-FR-FRBTIFR-BTI-2021-03787", + "EBTI-FR-FRBTIFR-BTI-2022-07695", + "CROSS-C89056", + "CROSS-H154038", + "CROSS-H240792", + "CROSS-H250531", + "CROSS-H315264", + "EBTI-DE-DE20855/16-1", + "EBTI-DE-DE21303/13-1", + "EBTI-DE-DEBTI29406/20-1", + "EBTI-FR-FR-RTC-2014-003018", + "EBTI-FR-FRBTIFR-BTI-2020-01824", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "EBTI-FR-FRBTIFR-BTI-2024-04055", + "EBTI-IT-ITBTI2018-0489M-274100", + "EBTI-IT-ITBTI2018-0543M-314100", + "EBTI-IT-ITBTIIT-2017-0482M-134100", + "CROSS-862381", + "CROSS-952768", + "CROSS-958886", + "CROSS-C80235", + "EBTI-DE-DE27963/16-1", + "EBTI-DE-DE996/16-1", + "EBTI-DE-DEB/1839/06-1", + "EBTI-DE-DEBTI14470/23-1", + "EBTI-DE-DEBTI28937/24-1", + "EBTI-FR-FR-RTC-2014-005643", + "EBTI-FR-FR-RTC-2015-008284", + "EBTI-FR-FRBTIFR-BTI-2019-17693" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Photoelectric sensor supplied as a replacement part for ingot and wafer handling machinery on a solar module production line. The optoelectronic device detects the presence, position or edge of objects by emitting and receiving a light beam, generating an electrical signal for automated control and measurement within the machine. Industrial-grade component identified by a manufacturer", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Wuxi Autowell", + "part_name": "sensor photoelectric (parts for solar" + } + }, + { + "bol_metadata": null, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90). HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "903141", + "903180", + "903190", + "903149" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits", + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0887", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903180", + "id": "SH-0887", + "justification_text": "The item is a multi-sensor measuring board with accelerometer, gyroscope, magnetometer, barometer, temperature, and humidity sensing. Heading 9031 covers measuring/checking instruments not elsewher. Classified under HS 9031.80.", + "reference_ruling_ids": [ + "CROSS-N335815", + "CROSS-H244110", + "CROSS-N357964", + "CROSS-N359967", + "CROSS-N308777", + "CROSS-950196", + "CROSS-952235", + "CROSS-H154035", + "EBTI-DE-DEBTI29406/20-1", + "CROSS-961003", + "CROSS-H009364", + "CROSS-H154038", + "CROSS-H240792", + "CROSS-H250531", + "CROSS-N356337", + "EBTI-DE-DE20855/16-1", + "EBTI-DE-DEB/1839/06-1", + "EBTI-DE-DEBTI14470/23-1", + "CROSS-H035572", + "CROSS-H112722", + "CROSS-H315264", + "CROSS-N348625", + "EBTI-CZ-CZ30-0470-2014", + "EBTI-DE-DE27963/16-1", + "EBTI-DE-DEBTI18562/24-1", + "EBTI-DE-DEBTI28937/24-1", + "EBTI-FR-FR-RTC-2014-001975", + "EBTI-FR-FR-RTC-2014-003018", + "EBTI-FR-FR-RTC-2014-005643", + "EBTI-FR-FR-RTC-2016-002653", + "EBTI-FR-FRBTIFR-BTI-2022-07664", + "EBTI-FR-FRBTIFR-BTI-2022-07695", + "EBTI-FR-FRBTIFR-BTI-2023-01720", + "EBTI-FR-FRBTIFR-BTI-2024-04000", + "EBTI-FR-FRBTIFR-BTI-2025-04624", + "EBTI-IT-ITBTI2018-0489M-274100", + "EBTI-IT-ITBTI2020-0049M-022300", + "EBTI-IT-ITBTIIT-2017-0602M-222100", + "CROSS-952778", + "CROSS-953551", + "CROSS-954657", + "CROSS-957070", + "CROSS-958886", + "CROSS-C89056", + "CROSS-N332455", + "EBTI-DE-DE996/16-1", + "EBTI-FR-FRBTIFR-BTI-2023-01888", + "EBTI-FR-FRBTIFR-BTI-2023-08091", + "EBTI-IT-ITBTIIT-2017-0482M-134100" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Multi-sensor expansion board for a 40-pin single-board computer with I2C interface at 3.3V (65mm x 30.5mm), integrating a 16-bit accelerometer (+/-2/4/8/16g), 16-bit gyroscope (+/-250-2000 deg/s), magnetometer (+/-4900uT), barometer, temperature/humidity and colour sensor plus an onboard ADC for additional external sensors (MPN: WAV-16864)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Waveshare", + "part_name": "WAV-16864" + } + }, + { + "bol_metadata": { + "bol_description": "LINEAR ENCODER SCALE", + "origin_country": "DE", + "shipper": "heidenhain pacific pte ltd" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903141", + "903190", + "903180", + "903149" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0888", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903190", + "id": "SH-0888", + "justification_text": "A linear encoder scale is a part/accessory of position-measuring equipment under 9031.90, not semiconductor electrical test apparatus of 9030.82. Classified under HS 9031.90.", + "reference_ruling_ids": [ + "CROSS-952000", + "CROSS-958015", + "EBTI-DE-DEBTI43811/19-1", + "EBTI-DE-DE27570/16-1", + "EBTI-DE-DE4953/13-1", + "EBTI-DE-DEB/2263/07-1", + "EBTI-DE-DEBTI7642/23-1", + "EBTI-IT-ITIT-2016-0436M-274100", + "EBTI-NL-NLBTI2023-1256", + "EBTI-NL-NLBTI2025-0054", + "EBTI-DE-DE6342/16-1" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Linear position-measuring scale for a precision linear encoder. The graduated scale, mounted along a linear axis, is scanned to determine absolute or incremental position with high accuracy and is used in precision positioning stages such as those found in semiconductor production and metrology equipment", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Heidenhain", + "part_name": "linear encoder scale" + } + }, + { + "bol_metadata": { + "bol_description": "609.10.M1.009.00 VACUUM POROUS INSPECTION JIG (2)", + "origin_country": "SG", + "shipper": "futani engineering pte ltd" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903149", + "903180", + "903190", + "903141" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0889", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903190", + "id": "SH-0889", + "justification_text": "A vacuum porous inspection jig is an accessory/part of measuring equipment under 9031.90, not a complete optical inspection instrument. Classified under HS 9031.90.", + "reference_ruling_ids": [ + "CROSS-N285228", + "CROSS-952000", + "CROSS-958015", + "EBTI-DE-DEBTI7642/23-1" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A vacuum porous inspection jig: a precision fixture used to hold and present a workpiece during quality inspection. Incorporating a porous vacuum platen that draws the part flat and secure via applied vacuum, it provides a stable, planar reference surface for optical or dimensional checking of components. Supplied as tooling hardware in a quantity of two, comprising a machined body and porous chuck", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Futani Engineering", + "part_name": "609.10.M1.009.00 vacuum porous" + } + }, + { + "bol_metadata": { + "bol_description": "MPS2 SIDE GRIP PHOTOMASK", + "origin_country": "SG", + "shipper": "power team technologies s" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903180", + "903190", + "903141", + "903149" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0890", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903190", + "id": "SH-0890", + "justification_text": "A photomask side-grip handling fixture is an accessory/fixture under 9031.90 if dedicated to inspection equipment, not a complete 9031.41 instrument. Classified under HS 9031.90.", + "reference_ruling_ids": [ + "CROSS-952000", + "CROSS-N285228", + "CROSS-958015", + "EBTI-DE-DE27570/16-1" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Side-grip photomask handling fixture for a reticle or photomask storage and transport system. The device holds a photomask securely along its edges to prevent contamination of the patterned surface during automated handling within semiconductor lithography environments. It is a precision mechanical accessory, typically of metal and polymer construction, used to grip and protect masks during transfer and inspection", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Power Team Technologies", + "part_name": "MPS2 side grip photomask" + } + }, + { + "bol_metadata": { + "bol_description": "Optical ruler of XY moving table (accessory of measuring microscope / profile projector) (Code 09BAA405-B). Manufacturer: Mitutoyo. 100% new", + "origin_country": "JP", + "shipper": "mitutoyo asia pacific pte ltd" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903149", + "903180", + "903141", + "903190" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0891", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903190", + "id": "SH-0891", + "justification_text": "An optical linear scale or ruler for a measuring microscope/profile projector is a part/accessory of 9031 instruments under 9031.90. Classified under HS 9031.90.", + "reference_ruling_ids": [ + "CROSS-952000", + "EBTI-DE-DE27570/16-1", + "EBTI-DE-DE4953/13-1", + "EBTI-DE-DEB/2263/07-1", + "EBTI-DE-DEBTI43811/19-1", + "EBTI-DE-DEBTI7642/23-1", + "EBTI-IT-ITIT-2016-0436M-274100", + "EBTI-NL-NLBTI2023-1256", + "EBTI-NL-NLBTI2025-0054", + "CROSS-958015", + "CROSS-N285228" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "An optical linear scale (glass ruler) serving as a positioning component for the XY moving stage of a measuring microscope or profile projector. The graduated optical element provides precise coordinate read-out of stage travel along one axis and is fitted into the measuring instrument as a replacement or spare element. It is an accessory dedicated to optical metrology equipment rather than a standalone instrument", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Mitutoyo", + "part_name": "Optical ruler of XY moving table" + } + }, + { + "bol_metadata": { + "bol_description": "RE-IMPORT - REPAIR & RETURN) - REPLACEMENT PART FOR GP8800 FOR GP8800 - GP88-001-0011", + "origin_country": "CH", + "shipper": "screening eagle singapore pte ltd" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903180", + "903149", + "903141", + "903190" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0892", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903190", + "id": "SH-0892", + "justification_text": "Replacement parts for ground-penetrating radar or cover-meter measuring equipment are 9031.90 parts/accessories, not complete optical instruments. Classified under HS 9031.90.", + "reference_ruling_ids": [ + "CROSS-958015", + "EBTI-DE-DE27570/16-1", + "EBTI-DE-DE4953/13-1", + "EBTI-DE-DEB/2263/07-1", + "EBTI-DE-DEBTI43811/19-1", + "EBTI-DE-DEBTI7642/23-1", + "EBTI-IT-ITIT-2016-0436M-274100", + "EBTI-NL-NLBTI2023-1256", + "EBTI-NL-NLBTI2025-0054" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A replacement component for a handheld ground-penetrating radar instrument used in non-destructive testing of concrete and built structures. The part is a dedicated spare for the portable scanning unit that detects and maps reinforcement, voids, and subsurface features. Imported as a repair-and-return item, it is an accessory specific to the measuring instrument rather than a standalone device", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Screening Eagle Technologies", + "part_name": "RE-import - repair & return)" + } + }, + { + "bol_metadata": { + "bol_description": "RE-IMPORT - REPAIR & RETURN) - WORK TIME FOR PM630 - UP01-008-0013 - SD", + "origin_country": "CH", + "shipper": "screening eagle singapore pte ltd" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903149", + "903180", + "903190", + "903141" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0893", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903190", + "id": "SH-0893", + "justification_text": "Replacement parts for ground-penetrating radar or cover-meter measuring equipment are 9031.90 parts/accessories, not complete optical instruments. Classified under HS 9031.90.", + "reference_ruling_ids": [ + "CROSS-958015", + "EBTI-DE-DE27570/16-1", + "EBTI-DE-DE4953/13-1", + "EBTI-DE-DEB/2263/07-1", + "EBTI-DE-DEBTI43811/19-1", + "EBTI-DE-DEBTI7642/23-1", + "EBTI-IT-ITIT-2016-0436M-274100", + "EBTI-NL-NLBTI2023-1256", + "EBTI-NL-NLBTI2025-0054" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A replacement component associated with a portable concrete cover meter / rebar locator used in structural non-destructive testing. The advanced cover meter measures concrete cover depth and reinforcement diameter over lines and areas. The item is a dedicated spare part for that measuring instrument, imported under a repair-and-return arrangement, and is not a complete functioning device on its own", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Screening Eagle Technologies", + "part_name": "RE-import - repair & return) - work" + } + }, + { + "bol_metadata": { + "bol_description": "COMPONENTS FOR MEASURING MACHINES HTS", + "origin_country": "DE", + "shipper": "carl zeiss industrielle messtechnik" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903141", + "903190", + "903149", + "903180" + ], + "gold_rank_in_candidates": 1, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0894", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903190", + "id": "SH-0894", + "justification_text": "Components for measuring machines are parts/accessories of heading 9031 under 9031.90, not complete instruments of 9031.80. Classified under HS 9031.90.", + "reference_ruling_ids": [ + "CROSS-952000", + "CROSS-N285228", + "CROSS-958015", + "EBTI-DE-DE27570/16-1", + "EBTI-DE-DEBTI7642/23-1", + "EBTI-NL-NLBTI2025-0054", + "EBTI-DE-DE4953/13-1", + "EBTI-DE-DEB/2263/07-1", + "EBTI-DE-DEBTI43811/19-1", + "EBTI-IT-ITIT-2016-0436M-274100", + "EBTI-NL-NLBTI2023-1256" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Components and parts for coordinate measuring machines, comprising mechanical and structural elements used in dimensional systems. These parts support the probing, guideway and frame assemblies that enable precise acquisition of surface coordinates during inspection of machined workpieces. Supplied for assembly, maintenance or upgrade of measuring machines in industrial quality-control applications", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Carl Zeiss Industrial Metrology", + "part_name": "components for measuring machines HTS" + } + }, + { + "bol_metadata": { + "bol_description": "ASSY 8810/2810 WSTG 780UM CALIBRATION (6)", + "origin_country": "US", + "shipper": "kla-tencor singapore pte ltd" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903180", + "903141", + "903149", + "903190" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0895", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903190", + "id": "SH-0895", + "justification_text": "A calibration wafer standard assembly is an accessory/reference standard for 9031 metrology equipment under 9031.90, not a complete 9031.80 instrument. Classified under HS 9031.90.", + "reference_ruling_ids": [ + "CROSS-952000", + "EBTI-DE-DE27570/16-1", + "EBTI-DE-DE4953/13-1", + "EBTI-DE-DEB/2263/07-1", + "EBTI-DE-DEBTI43811/19-1", + "EBTI-DE-DEBTI7642/23-1", + "EBTI-IT-ITIT-2016-0436M-274100", + "EBTI-NL-NLBTI2023-1256", + "EBTI-NL-NLBTI2025-0054", + "CROSS-958015" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Calibration wafer standard assembly with a controlled film stack approximately 780 micrometres thick, supplied as a set of pieces for use with semiconductor surface-inspection and metrology equipment. The reference artifact provides a known dimensional or film characteristic against which automated wafer-inspection tools are calibrated and verified during process control in semiconductor fabrication", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "KLA-Tencor", + "part_name": "assy 8810/2810 wstg 780UM calibration" + } + }, + { + "bol_metadata": { + "bol_description": "PARTS FOR PLC : 0TP240.05 MEASURING INST. FOR SEMICONDUCTORS: COO : DE", + "origin_country": "AT", + "shipper": "b & r industrial automation gmbh" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90).", + "candidate_set": { + "codes": [ + "903180", + "903149", + "903141", + "903190" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits" + ], + "frozen_id": "v2.0.train.0896", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903190", + "id": "SH-0896", + "justification_text": "Parts and accessories of measuring or checking instruments of heading 9031 fall under 9031.90. Classified under HS 9031.90.", + "reference_ruling_ids": [ + "CROSS-952000", + "EBTI-DE-DE4953/13-1", + "EBTI-DE-DEB/2263/07-1", + "EBTI-NL-NLBTI2023-1256", + "EBTI-NL-NLBTI2025-0054", + "EBTI-DE-DE27570/16-1", + "EBTI-DE-DEBTI43811/19-1", + "EBTI-DE-DEBTI7642/23-1", + "EBTI-IT-ITIT-2016-0436M-274100", + "CROSS-958015" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "Electronic control/processor module supplied as a part for a programmable logic controller integrated into measuring instrumentation for semiconductor manufacturing. The industrial module provides processing, input/output or control functions within the measuring or checking equipment, identified by a manufacturer part number. Supplied as a replacement component", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "B&R Industrial Automation", + "part_name": "parts for PLC : 0TP240.05 measuring" + } + }, + { + "bol_metadata": { + "bol_description": "UNIVERSAL IO DAISY CAHIN OPTION V5.2", + "origin_country": "IL", + "shipper": "camtek south east asia pte ltd" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90). HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "903190", + "903149", + "903180", + "903141" + ], + "gold_rank_in_candidates": 0, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits", + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0897", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903190", + "id": "SH-0897", + "justification_text": "Parts and accessories of measuring or checking instruments of heading 9031 fall under 9031.90. Classified under HS 9031.90.", + "reference_ruling_ids": [ + "CROSS-952000", + "CROSS-N285228", + "EBTI-NL-NLBTI2023-1256", + "EBTI-DE-DEB/2263/07-1", + "EBTI-DE-ATBTI2017/000496", + "EBTI-DE-DE4953/13-1", + "EBTI-DE-DE9947/10-1", + "EBTI-DE-DEBTI43811/19-1", + "CROSS-958015", + "EBTI-DE-DE27570/16-1", + "EBTI-DE-DEBTI7642/23-1" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A universal input/output daisy-chain interface option for an automated semiconductor wafer inspection and metrology system. This electronic add-on module enables serial signal distribution and connection of multiple peripheral devices to the host inspection tool, expanding I/O capacity for sensors and actuators. Supplied as a configurable hardware/firmware option (version 5.2) for integration into the parent checking apparatus used in semiconductor production", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Camtek", + "part_name": "universal IO daisy cahin option V5.2" + } + }, + { + "bol_metadata": { + "bol_description": "DIGITAL INDICATOR 1.00EA", + "origin_country": "IL", + "shipper": "camtek south east asia pte ltd" + }, + "boundary_note": "Heading 9031 splits measuring and checking instruments by technology and target: optical instruments for semiconductor wafers or devices (9031.41), other optical instruments (9031.49), non-optical instruments (9031.80), and parts (9031.90). HS2022 semiconductor transducer (8541.51) vs thermometer or similar instrument (9025.19) vs the measuring instruments of Chapter 90; a sensor packaged alone classifies as a device, while one built into an instrument follows the instrument.", + "candidate_set": { + "codes": [ + "903141", + "903149", + "903180", + "903190" + ], + "gold_rank_in_candidates": 3, + "size": 4 + }, + "confidence_tier": "medium", + "difficulty_tags": [ + "9031_inspection_splits", + "sensor_boundary" + ], + "frozen_id": "v2.0.train.0898", + "hs2_label": "90", + "hs4_label": "9031", + "hs6_label": "903190", + "id": "SH-0898", + "justification_text": "Parts and accessories of measuring or checking instruments of heading 9031 fall under 9031.90. Classified under HS 9031.90.", + "reference_ruling_ids": [ + "CROSS-952000", + "EBTI-DE-DE4953/13-1", + "CROSS-N285228", + "EBTI-DE-DEB/2263/07-1", + "EBTI-NL-NLBTI2023-1256", + "EBTI-DE-DE27570/16-1", + "EBTI-DE-DEBTI43811/19-1", + "EBTI-DE-DEBTI7642/23-1", + "EBTI-IT-ITIT-2016-0436M-274100", + "EBTI-NL-NLBTI2025-0054", + "CROSS-958015" + ], + "segment": "metrology", + "split": "train", + "tier1_description": "A digital indicator unit, an electronic display gauge used within precision measuring and inspection equipment to read out dimensional or positional values. It converts sensor signals into a numeric digital readout for the operator. Supplied as a single component for integration into a semiconductor inspection or metrology system, functioning as a measuring/checking accessory rather than a standalone instrument", + "tier1_source": "BOL", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Camtek", + "part_name": "digital indicator 1" + } + }, + { + "bol_metadata": null, + "boundary_note": "LED as a semiconductor device or module (8541.41) vs a finished luminaire or light fitting (9405.42); completeness as a lighting article decides.", + "candidate_set": { + "codes": [ + "844332", + "854160", + "940542", + "854159" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "led_device_vs_luminaire" + ], + "frozen_id": "v2.0.train.0899", + "hs2_label": "94", + "hs4_label": "9405", + "hs6_label": "940542", + "id": "SH-0899", + "justification_text": "The item is an LED electric lamp or lighting fitting, such as a decorative or accent LED strip. Heading 9405, subheading 940542 covers LED lighting fittings. Classified under HS 9405.42.", + "reference_ruling_ids": [], + "segment": "end_product", + "split": "train", + "tier1_description": "Flexible addressable LED light strip, 60 LEDs per metre spacing, 0.5 m length with 30 RGB LEDs total, terminated with three 100 mm alligator clip leads (power/data/ground) for solder-free connection. Used for decorative and accent lighting in electronics projects (MPN: ADA3811)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "Adafruit", + "part_name": "ADA3811" + } + }, + { + "bol_metadata": null, + "boundary_note": "LED as a semiconductor device or module (8541.41) vs a finished luminaire or light fitting (9405.42); completeness as a lighting article decides.", + "candidate_set": { + "codes": [ + "851762", + "854151", + "940542", + "710499" + ], + "gold_rank_in_candidates": 2, + "size": 4 + }, + "confidence_tier": "high", + "difficulty_tags": [ + "led_device_vs_luminaire" + ], + "frozen_id": "v2.0.train.0900", + "hs2_label": "94", + "hs4_label": "9405", + "hs6_label": "940542", + "id": "SH-0900", + "justification_text": "The item is an LED electric lamp or lighting fitting, such as a decorative or accent LED strip. Heading 9405, subheading 940542 covers LED lighting fittings. Classified under HS 9405.42.", + "reference_ruling_ids": [], + "segment": "end_product", + "split": "train", + "tier1_description": "Flexible COB (chip-on-board) LED light strip with 16 LEDs and silicone encapsulation for chip protection, operating at DC 5 V / 600 mA. Compact strip with uniform luminosity and high brightness; connectable via clips or soldered wires and usable in series or parallel for general lighting (MPN: FIT0875)", + "tier1_source": "catalog", + "tier2_classifiable": "yes", + "tier2_minimal": { + "manufacturer": "DFRobot", + "part_name": "FIT0875" + } + } +]